SMC packaging support
By designing an inclined buffer portion and setting up a buffer assembly on the isolation belt of the SMC packaged bracket, the problem of SMC bracket being susceptible to external forces during the preparation process in the prior art is solved, and the yield of the product is significantly improved.
Patent Information
- Application Number
- CN202421352743.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-14
AI Technical Summary
During the preparation process of existing SMC backlight LED bracket packaging products, the pad isolation tape in the bracket bowl and cup is straight, and it is susceptible to external forces to cause dark cracks, which leads to dead lights at the end customers.
An SMC package bracket is designed, and its isolation belt is divided into an isolation part and two buffer parts. The buffer part is arranged inclined. The buffer assembly is between the buffer part and the isolation part, increasing the stress area, dispersing internal force, reducing stress, and avoiding the occurrence of dark cracks.
Through the combination design of the buffer portion and the isolation portion and the setting of the buffer assembly, the probability of dark cracking on the SMC package bracket is significantly reduced, and the yield of the product after assembly is improved.
Smart Images
Figure CN222655677U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED production and manufacturing, in particular to an SMC packaging bracket. Background Art
[0002] LED new light sources have been applied to the lighting and backlight markets. In the LED lighting market, high-brightness, high-efficiency, low-cost lamps are the main products in future market demand. In the backlight market, benefiting from the rapid growth of demand for LED LCD TVs and display screens, the size of LED brackets has shown the characteristics of miniaturization and medium and high power.
[0003] In the existing technology, the preparation process of SMC backlight LED bracket packaging products generally includes crystal bonding, wire welding, glue dispensing, light splitting and taping. Since the pad isolation belt in the bracket bowl is designed to be straight, the SMC bracket will be affected by external forces during the preparation process, causing dark cracks in the bracket. When it reaches the end customer, the backlight will be adjusted to the TV set and the problem of dead light will occur. Utility Model Content
[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide an SMC packaging bracket, aiming to solve the technical problem in the prior art that, because the pad isolation zone in the bracket bowl is designed to be straight, the SMC bracket will be subjected to external force during the preparation process, resulting in dark cracks in the bracket, and when it reaches the end customer, the backlight will be adjusted to the TV set and a dead light will appear.
[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:
[0006] A SMC packaging bracket includes a placement plate, the surface of the placement plate is recessed to form a placement hole, the placement hole is provided with a positive electrode pad, a negative electrode pad, and an isolation belt located between the positive electrode pad and the negative electrode pad, the two ends of the isolation belt are connected to the hole wall of the placement hole, the isolation belt includes an isolation part, and two buffer parts located at the two ends of the isolation part, the buffer part and the isolation part are integrally formed, the buffer part is inclined from the isolation part toward the placement plate and from the center of the placement hole toward the edge of the placement hole, the two buffer parts are respectively located on different sides of the isolation part, and a buffer component is provided between the buffer part and the isolation part.
[0007] According to one aspect of the above technical solution, the two buffer parts are symmetrical about the center of the placement hole.
[0008] According to one aspect of the above technical solution, the buffer assembly includes a spring with two ends respectively connected to the isolation portion and the buffer portion.
[0009] According to one aspect of the above technical solution, the buffer portion is provided with a first fixing ring near the isolating portion, and the isolating portion is provided with a second fixing ring near the buffer portion, and both ends of the spring are fixedly connected to the first fixing ring and the second fixing ring.
[0010] According to one aspect of the above technical solution, the buffer assembly includes a spring sheet with two ends respectively connected to the isolation portion and the buffer portion.
[0011] According to one aspect of the above technical solution, two ends of the spring sheet are fixedly connected to the isolation portion and the buffer portion respectively by fastening screws.
[0012] According to one aspect of the above technical solution, a protective cover is provided on the buffer assembly, a cavity is provided in the protective cover, and the cavity is used to accommodate the buffer assembly.
[0013] According to one aspect of the above technical solution, the protective cover is adhesively connected to the isolation tape.
[0014] According to one aspect of the above technical solution, the upper surfaces of the positive electrode pad, the negative electrode pad, and the isolation zone are all located at the same level.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] By dividing the isolation belt into an isolation part and two buffer parts located at both ends of the isolation part, wherein the buffer part is inclined from the isolation part toward the placement plate and from the center of the placement hole toward the edge of the placement hole, when preparing the LED package product, the placement plate is subjected to external force, resulting in internal force generated inside the placement plate. When the internal force acts on the isolation belt, due to the existence of the buffer part and the buffer part and the isolation part being integrally formed, the force-bearing area of the combination of the buffer part and the isolation part is first increased, so that the stress is reduced, and then the internal force acting on the buffer part extends toward the middle of the isolation belt. Due to the shape of the inclined setting of the buffer part, the internal force is dispersed at the corner at the junction of the buffer part and the isolation part, further reducing the internal force at the isolation belt. At the same time, a buffer component is provided between the buffer part and the isolation part, further reducing the internal force at the corner at the junction of the buffer part and the isolation part, thereby avoiding the generation of dark cracks on the SMC package bracket;
[0017] The utility model can greatly reduce the probability of hidden cracks on the SMC packaging bracket, thereby improving the yield rate of the assembled product. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the structure of the SMC packaging bracket in the first embodiment of the utility model;
[0019] Figure 2 for Figure 1 A schematic diagram of the structure of the middle buffer component;
[0020] Figure 3 for Figure 2 Schematic diagram of the structure when the protective cover is installed;
[0021] Figure 4 for Figure 1 A schematic diagram of the structure of the positive electrode pad and the negative electrode pad;
[0022] Figure 5 This is a schematic structural diagram of the buffer component of the SMC packaging bracket in the second embodiment of the utility model;
[0023] Description of main component symbols:
[0024] Place the board 10 Place Hole 11 Isolation belt 20 Isolation Department 21 Buffer 22 Positive pad 30 Negative pad 40 Buffer components 50 spring 51 First fixing ring 52 Second fixing ring 53 Protective case 60 shrapnel 54 Fastening screws 55
[0025] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0029] See also Figures 1 to 3, shown is an SMC packaging bracket in the first embodiment of the utility model, characterized in that it includes a placement plate 10, the surface of the placement plate 10 is recessed to form a placement hole 11, the placement hole 11 is provided with a positive electrode pad 30, a negative electrode pad 40, and an isolation belt 20 located between the positive electrode pad 30 and the negative electrode pad 40, the two ends of the isolation belt 20 are connected to the hole wall of the placement hole 11, the isolation belt 20 includes an isolation part 21, and two buffer parts 22 located at both ends of the isolation part 21, the buffer part 22 is integrally formed with the isolation part 21, the buffer part 22 is inclined from the isolation part 21 toward the placement plate 10, and from the center of the placement hole 11 toward the edge of the placement hole 11, the two buffer parts 22 are respectively located on different sides of the isolation part 21, and a buffer component 50 is provided between the buffer part 22 and the isolation part 21.
[0030] It can be understood that the utility model divides the isolation belt 20 into an isolation part 21 and two buffer parts 22 located at both ends of the isolation part 21, wherein the buffer part 22 is inclined from the isolation part 21 toward the placement plate 10 and from the center of the placement hole 11 toward the edge of the placement hole 11. When the LED package product is prepared, the placement plate 10 is subjected to external force, resulting in internal force generated inside the placement plate 10. When the internal force acts on the isolation belt 20, due to the existence of the buffer part 22 and the fact that the buffer part 22 and the isolation part 21 are integrally formed, the buffer part 22 is firstly made 2 and the isolation part 21 increase the force-bearing area of the combination, so that the stress is reduced, and then the internal force acting on the buffer part 22 extends toward the middle of the isolation belt 20. Due to the inclined shape of the buffer part 22, the internal force is dispersed at the corner at the junction of the buffer part 22 and the isolation part 21, further reducing the internal force at the isolation belt 20. At the same time, a buffer component 50 is provided between the buffer part 22 and the isolation part 21, further reducing the internal force of the corner at the junction of the buffer part 22 and the isolation part 21, thereby avoiding the generation of dark cracks on the SMC packaging bracket;
[0031] The utility model can greatly reduce the probability of hidden cracks on the SMC packaging bracket, thereby improving the yield rate of the assembled product.
[0032] Preferably, the two buffer portions 22 are symmetrical about the center of the placement hole 11 .
[0033] It can be understood that the two buffer parts 22 are symmetrical about the center of the placement hole 11, which can make the entire isolation belt 20 symmetrical about the center of the placement hole 11, thereby ensuring that the stress at various locations of the SMC packaging bracket is very uniform, avoiding new dark cracks due to uneven stress.
[0034] Specifically, in this embodiment, the buffer assembly 50 includes a spring 51 whose two ends are respectively connected to the isolation portion 21 and the buffer portion 22; the buffer portion 22 is provided with a first fixing ring 52 near the isolation portion 21, and the isolation portion 21 is provided with a second fixing ring 53 near the buffer portion 22, and the two ends of the spring 51 are fixedly connected to the first fixing ring 52 and the second fixing ring 53.
[0035] It can be understood that when the internal force causes micro-deformation between the buffer portion 22 and the isolation portion 21, the presence of the spring 51 can slow down the relative displacement between the buffer portion 22 and the isolation portion 21, thereby preventing the occurrence of hidden cracks.
[0036] Furthermore, a protective cover 60 is provided on the buffer component 50 , and a cavity is provided in the protective cover 60 , and the cavity is used to accommodate the buffer component 50 ; the protective cover 60 is adhesively connected to the isolation belt 20 .
[0037] It can be understood that in order to protect the buffer component 50 from environmental influences, a protective cover 60 with a cavity is covered on the buffer component 50, and then the protective cover 60 is bonded to the isolation belt 20. It should be noted that the protective cover 60 should be made of flexible material to prevent excessive rigidity, which may cause brittle failure between the protective cover 60 and the isolation belt 20.
[0038] See also Figure 4 It should be noted that the upper surfaces of the positive electrode pad 30, the negative electrode pad 40, and the isolation tape 20 are all located at the same horizontal height, and a piece of the positive electrode pad 30 and the negative electrode pad 40 needs to be cut off at the position of the buffer portion 22 and the protective cover 60 accordingly, so that the positive electrode pad 30 and the negative electrode pad 40 can fit closely with the isolation tape 20 to prevent the bracket from cracking in the gap between the two, and at the same time, the opposite side of the missing part of the positive electrode pad 30 and the negative electrode pad 40 can protrude a part, and A piece needs to be missing at the corresponding position of the separating tape, so that the positive electrode pad 30 and the negative electrode pad 40 can fit tightly with the separating tape 20. The protruding parts of the positive electrode pad 30 and the negative electrode pad 40 act as reinforcing ribs, thereby increasing the strength among the positive electrode pad 30, the negative electrode pad 40 and the separating tape, further preventing the occurrence of dark cracks. After the positive electrode pad 30, the negative electrode pad 40 and the separating tape 20 are prepared, the LED chip can be fixed on the positive electrode pad 30 and the negative electrode pad 40.
[0039] In summary, the SMC packaging bracket in the above embodiment of the utility model is divided into an isolation belt 20 into an isolation part 21 and two buffer parts 22 located at both ends of the isolation part 21, wherein the buffer part 22 is inclined from the isolation part 21 toward the placement plate 10 and from the center of the placement hole 11 toward the edge of the placement hole 11. When the LED packaging product is prepared, the placement plate 10 is subjected to external force, resulting in internal force generated inside the placement plate 10. When the internal force acts on the isolation belt 20, due to the existence of the buffer part 22, and the buffer part 22 and the isolation part 21 are integrally formed, first The force-bearing area of the combination of the buffer portion 22 and the isolation portion 21 is increased, so that the stress is reduced, and then the internal force acting on the buffer portion 22 extends toward the middle of the isolation zone 20. Due to the inclined shape of the buffer portion 22, the internal force is dispersed at the corner at the junction of the buffer portion 22 and the isolation portion 21, further reducing the internal force at the isolation zone 20. At the same time, a buffer component 50 is provided between the buffer portion 22 and the isolation portion 21, further reducing the internal force at the corner at the junction of the buffer portion 22 and the isolation portion 21, thereby avoiding the generation of dark cracks on the SMC packaging bracket;
[0040] The utility model can greatly reduce the probability of hidden cracks on the SMC packaging bracket, thereby improving the yield rate of the assembled product.
[0041] Please refer to Figure 5 , shown is the SMC packaging bracket in the second embodiment of the utility model. The difference between the SMC packaging bracket in this embodiment and the SMC packaging bracket in the first embodiment is that: the buffer component 50 includes a spring 54 whose two ends are respectively connected to the isolation part 21 and the buffer part 22; the two ends of the spring 54 are respectively fixedly connected to the isolation part 21 and the buffer part 22 by fastening screws 55.
[0042] Similarly, when the internal force causes micro-deformation between the buffer portion 22 and the isolation portion 21 , the presence of the spring piece 54 can also slow down the relative displacement between the buffer portion 22 and the isolation portion 21 , thereby preventing the occurrence of hidden cracks.
[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0044] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. An SMC packaging bracket, characterized in that: It includes a placement plate, the surface of the placement plate is recessed to form a placement hole, the placement hole is provided with a positive electrode pad, a negative electrode pad, and an isolation belt located between the positive electrode pad and the negative electrode pad, the two ends of the isolation belt are connected to the hole wall of the placement hole, the isolation belt includes an isolation part, and two buffer parts located at the two ends of the isolation part, the buffer part and the isolation part are integrally formed, the buffer part is inclined from the isolation part toward the placement plate and from the center of the placement hole toward the edge of the placement hole, the two buffer parts are respectively located on different sides of the isolation part, and a buffer component is provided between the buffer part and the isolation part.
2. The SMC packaging bracket according to claim 1, characterized in that: The two buffer parts are symmetrical about the center of the placement hole.
3. The SMC packaging bracket according to claim 1, characterized in that: The buffer assembly includes a spring with two ends respectively connected to the isolation portion and the buffer portion.
4. The SMC packaging bracket according to claim 3, characterized in that: The buffer part is provided with a first fixing ring near the isolating part, and the isolating part is provided with a second fixing ring near the buffer part. Both ends of the spring are fixedly connected to the first fixing ring and the second fixing ring.
5. The SMC packaging bracket according to claim 1, characterized in that: The buffer assembly includes a spring sheet with two ends respectively connected to the isolation portion and the buffer portion.
6. The SMC packaging bracket according to claim 5, characterized in that: The two ends of the spring sheet are respectively fixedly connected to the isolation part and the buffer part through fastening screws.
7. The SMC packaging bracket according to claim 1, characterized in that: A protective cover is provided on the buffer component, a cavity is provided in the protective cover, and the cavity is used to accommodate the buffer component.
8. The SMC packaging bracket according to claim 7, characterized in that: The protective cover is adhesively connected to the isolation tape.
9. The SMC packaging bracket according to claim 1, characterized in that: The upper surfaces of the positive electrode pad, the negative electrode pad, and the isolation zone are all located at the same level.