Cutting auxiliary tool for high refractive index wafer for optical waveguide

Abstract

The application relates to the technical field of high-refractive wafer cutting assisting for optical waveguides, in particular to a cutting assisting tool for high-refractive wafers of optical waveguides, which comprises an operation platform, an electric control overturning extrusion frame movably assembled on the operation platform, an electric control translation type clamping seat movably assembled on the side wall of the electric control overturning extrusion frame, and a pressure self-adapting lifting module arranged on the clamping surface of the electric control translation type clamping seat. The cutting assisting tool for high-refractive wafers of optical waveguides realizes the adaptation of the tool to high-refractive wafers of optical waveguides with different sizes and specifications through a double regulation mode, without the need of replacing special clamps, so that the machining cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of auxiliary cutting technology for high refractive index wafers for optical waveguides, and in particular to an auxiliary cutting tooling for high refractive index wafers for optical waveguides. Background Technology

[0002] High-refractive-index wafers for optical waveguides are the core material for AR / MR optical systems. They possess excellent properties such as high refractive index, high transmittance, and good optical consistency, making them a key substrate for lightweight AR glasses waveguide devices. Their processing precision directly determines the imaging quality, field of view, and other core performance characteristics of AR / MR devices. These wafers are hard and brittle optical materials, with stringent requirements for surface quality, flatness, and TTV control. Cutting is generally performed using diamond wire saw multi-wire cutting. During the cutting process, wafers are prone to chipping, dark cracks, uneven thickness, and positional deviations due to unstable clamping, uneven stress, and vibration offset. These issues can affect the processing results of subsequent polishing and coating processes, and even lead to wafer scrap. Therefore, stable and reliable auxiliary tooling is essential for achieving high-precision positioning and low-stress fastening.

[0003] Currently, commonly used stabilizing fixtures for optical wafer dicing mainly include the following categories:

[0004] Mechanical clamping plate positioning fixture: The base is slotted and a metal clamping plate is used to clamp the wafer. The structure is simple and the cost is low. However, it is difficult to control the clamping force evenly, which can easily cause local stress concentration and lead to the cracking of high refractive index wafers. The clamping plate and the wafer are in rigid contact, which can easily scratch the optical surface of the wafer and affect the subsequent coating effect. The positioning accuracy depends on the slot processing accuracy. It has poor versatility and cannot be adapted to 8-12 inch optical waveguide wafers of different specifications.

[0005] Wax / resin bonding fixtures: These fixtures use high-temperature wax or resin to bond wafers to a carrier tray, resulting in uniform bonding and high adhesion. However, the bonding and debonding processes are cumbersome, and adhesive residue can easily remain on the surface of high-refractive-index wafers, making thorough cleaning difficult. Debonding requires heating or solvent cleaning, which can easily lead to thermal deformation of the wafer, affecting flatness and TTV (Total Television Value) indicators. Thin-film bonding is prone to warping and deformation, failing to meet the high-precision requirements of wafers used in optical waveguides.

[0006] Vacuum adsorption fixtures rely on vacuum suction to adsorb wafers onto a porous platform. They offer fast clamping, no mechanical stress, and no surface damage. However, they have extremely high requirements for the flatness and sealing of high-refractive-index wafers. Thin or large wafers are prone to unstable adsorption. The vacuum passage is easily blocked by chips, which leads to a decrease in suction and displacement. They are not suitable for thick wafers and multi-wafer simultaneous cutting scenarios, resulting in low processing efficiency.

[0007] Positioning frame + limiting block combination fixture: It uses a frame and slider to achieve lateral limiting, which is suitable for wafers of various specifications. However, relying solely on lateral constraints, there is still vertical movement and twisting during the cutting process. Dust easily accumulates in the limiting gap, affecting positioning consistency and requiring frequent cleaning. Furthermore, there is no pressure adjustment structure, which can easily damage high-refractive-index wafers due to excessive clamping force.

[0008] The aforementioned tooling all suffer from problems such as excessive clamping stress, optical surface damage, insufficient positioning accuracy, poor versatility, or complex processes. They are unable to simultaneously meet the large-scale cutting requirements of high yield, high efficiency, and low damage for high-refractive-index wafers used in optical waveguides, thus restricting the processing quality and production capacity improvement of AR / MR optical waveguide devices. Summary of the Invention

[0009] The technical problem to be solved by this invention is that the current tooling for high refractive index wafers for optical waveguides suffers from problems such as excessive clamping stress, optical surface damage, insufficient positioning accuracy, poor versatility, or complex processes. It is difficult to adapt to the cutting requirements of 8-12 inch high refractive index wafers and cannot simultaneously meet the large-scale cutting requirements of high yield, high efficiency, and low damage, thus restricting the improvement of processing quality and production capacity in the AR / MR optical waveguide industry chain.

[0010] The technical solution adopted by the present invention to solve its technical problem is: a cutting auxiliary tooling for high refractive index wafers for optical waveguides, including an operating platform. Two horizontally arranged embedded guide grooves are symmetrically opened on the upper surface of the operating platform. Laterally adjustable sliders are slidably mounted on both sides of the upper surface of the operating platform. An electrically controlled flip-type extrusion frame is movably mounted on the upper surface of the lateral adjustment slider. An electrically controlled translational clamping seat is movably mounted on the side wall of the electrically controlled flip-type extrusion frame. A pressure adaptive lifting module is provided on the clamping surface of the electrically controlled translational clamping seat.

[0011] An embedded electrically controlled translation screw is movably assembled inside the embedded guide groove. The lateral adjustment slider has a first internal thread adjustment through hole that cooperates with the embedded electrically controlled translation screw. The lateral adjustment slider is sleeved on the embedded electrically controlled translation screw through the first internal thread adjustment through hole and is threadedly assembled with the embedded electrically controlled translation screw.

[0012] The upper surface of the lateral adjustment slider has an upwardly protruding top mounting bracket. The electrically controlled flip-type extrusion frame includes a flip locking frame hinged to the top mounting bracket and an electrically controlled extrusion support rod for controlling the flip locking frame. A horizontal adjustment frame is snapped and fixed inside the lateral assembly groove of the flip locking frame.

[0013] The electrically controlled translation clamping seat includes an external electrically controlled translation screw movably installed inside the horizontal adjustment frame and an external translation adjustment seat threaded onto the external electrically controlled translation screw.

[0014] The external translation adjustment seat has a lateral adjustment groove on its side wall for assembling the pressure adaptive lifting module.

[0015] The main pressure sensor is installed inside the lateral adjustment groove, and the main pressure sensor is electrically connected to the pressure adaptive lifting module.

[0016] The pressure adaptive lifting module includes a lifting clamp arm slidably mounted inside the lateral adjustment groove, an embedded support rod for controlling the lifting clamp arm, and an adaptive pressure sensor mounted on the clamping surface of the lifting clamp arm. The embedded support rod and the adaptive pressure sensor are both electrically connected to the main pressure sensor.

[0017] Each of the lifting clamps is equipped with a side-mounted optical recognition probe, which is electrically connected to the main pressure sensor.

[0018] Each externally controlled translation screw has two externally mounted translation adjustment seats threaded onto it, and each externally mounted translation adjustment seat has an integrally formed lateral bending plate on its outer end.

[0019] The upper end of the flip-locking frame is fixedly equipped with a horizontal expansion guide rail, on which accessories for cutting high-refractive-index wafers for auxiliary optical waveguides can be detachably installed.

[0020] The beneficial effects of this invention are:

[0021] (1) The cutting auxiliary fixture for high refractive index wafers for optical waveguides of the present invention achieves the adaptation of the fixture to high refractive index wafers for optical waveguides of different sizes and specifications through the dual adjustment of embedded electronically controlled translation screw and external electronically controlled translation screw, which greatly improves the versatility of the fixture, eliminates the need to replace special fixtures, and reduces processing costs.

[0022] (2) Set up a pressure adaptive lifting module. Through the dual detection of the main pressure sensor and the adaptive pressure sensor, the clamping force and lifting height are adjusted in real time to effectively disperse the clamping stress and avoid wafer chipping and dark cracks caused by local stress concentration. At the same time, the flexible clamping can prevent the wafer surface from being scratched.

[0023] (3) Equipped with a side-mounted optical recognition probe, which can accurately identify the position of the wafer, improve the positioning accuracy, and avoid positional deviation during the cutting process;

[0024] (4) The electrically controlled flip-type extrusion frame can achieve rapid flip-clamping, and with the horizontal movement of the side adjustment slider, it simplifies the clamping process and improves the cutting efficiency.

[0025] (5) A horizontal extension guide rail is set at the upper end of the flip-locking frame. Auxiliary accessories can be added according to the cutting requirements to expand the tooling functions and adapt to various high refractive index wafer cutting processes for optical waveguides. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a schematic diagram of the structure of the present invention.

[0028] Figure 2 This is a schematic diagram of the structure of the electrically controlled flip-type extrusion frame in this invention.

[0029] Figure 3 This is a schematic diagram of the external translation adjustment seat in this invention.

[0030] Figure 4 This is a schematic diagram of the internal structure of the external translation adjustment seat in this invention.

[0031] 1. Operating platform; 2. Embedded guide groove; 3. Lateral adjustment slider; 4. Electrically controlled flip-type extrusion frame; 5. Electrically controlled translational clamping seat; 6. Pressure adaptive lifting module; 7. Embedded electrically controlled translational lead screw; 8. First internal thread adjustment through hole; 9. Top mounting bracket; 10. Flip-locking frame; 11. Electrically controlled extrusion support rod; 12. Lateral assembly groove; 13. Horizontal adjustment frame; 14. External electrically controlled translational lead screw; 15. External translational adjustment seat; 16. Lateral adjustment groove; 17. Main pressure sensor; 18. Lifting clamping arm; 19. Embedded support rod; 20. Adaptive pressure sensor; 21. Side-mounted optical recognition probe; 22. Lateral bending plate; 23. Horizontal extension guide rail. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] Figure 1 , Figure 2 , Figure 3 and Figure 4The dicing auxiliary fixture for high-refractive-index wafers for optical waveguides shown uses an operating platform 1 as the basic supporting component. Through the cooperation of a multi-level electronic control adjustment structure and an adaptive sensing structure, it achieves precise positioning and flexible clamping of the high-refractive-index wafers for optical waveguides, adapting to the dicing requirements of high-refractive-index wafers for optical waveguides of different specifications. The assembly relationship and working cooperation of its various components are as follows:

[0035] The operating platform 1 is a flat plate structure made of hard alloy. Its surface is polished and anti-slip to prevent slippage when placing the wafer. The upper surface of the operating platform 1 has two horizontally arranged embedded guide grooves 2 symmetrically opened along the length direction. The embedded guide groove 2 is a concave rectangular groove, and an embedded electrically controlled translation screw 7 is movably installed inside it. The embedded electrically controlled translation screw 7 is a bidirectional screw. The two ends of the embedded electrically controlled translation screw 7 are rotatably connected to the groove wall of the embedded guide groove 2 through bearings, and one end extends out of the operating platform 1 and is connected to an external servo motor for transmission. The servo motor drives the forward and reverse rotation. A symmetrically arranged lateral adjustment slider 3 is slidably mounted on the embedded guide groove 2. The lateral adjustment slider 3 is a block structure adapted to the embedded guide groove 2. It has a first internal thread adjustment through hole 8 inside. The internal thread of the first internal thread adjustment through hole 8 is engaged with the external thread of the embedded electric translation screw 7. The lateral adjustment slider 3 is sleeved on the embedded electric translation screw 7 through the first internal thread adjustment through hole 8 to achieve threaded assembly with the embedded electric translation screw 7. When the embedded electric translation screw 7 rotates, it can drive the lateral adjustment sliders 3 on both sides to move horizontally in the opposite direction along the embedded guide groove 2 in a synchronous manner, so as to realize flexible adjustment of the lateral distance.

[0036] The upper surface of the lateral adjustment slider 3 is integrally formed with an upwardly protruding top mounting bracket 9. An electrically controlled flip-type extrusion frame 4 is hinged to the upper end of the top mounting bracket 9. The electrically controlled flip-type extrusion frame 4 includes a flip-locking frame 10 and an electrically controlled extrusion strut 11. The flip-locking frame 10 is a rectangular frame structure, with one side hinged to the top mounting bracket 9, allowing it to flip around the hinge point from 0 to 90 degrees. The electrically controlled extrusion strut 11 is an electro-hydraulic strut, with one side hinged to the top mounting bracket 9 and the other end hinged to the side wall of the flip-locking frame 10. Its extension and retraction are controlled by an electronic control system, thereby pushing or pulling the flip-locking frame 10 to complete the flipping and locking action. A lateral mounting groove 12 is provided on the inner side wall of the flip-locking frame 10. The lateral mounting groove 12 is a concave slot structure, in which a horizontal adjustment frame 13 is fixedly engaged. The horizontal adjustment frame 13 is a hollow rectangular frame, and its engagement with the flip-locking frame 10 is detachable, facilitating future maintenance and replacement.

[0037] The transverse adjustment frame 13 is internally fitted with an electrically controlled translational clamping seat 5. The electrically controlled translational clamping seat 5 includes an external electrically controlled translational lead screw 14 and an external translational adjustment seat 15. The two ends of the external electrically controlled translational lead screw 14 are rotatably connected to the frame wall of the transverse adjustment frame 13 through bearings. One end extends out of the transverse adjustment frame 13 and is connected to an external servo motor for drive rotation. Two external translational adjustment seats 15 are symmetrically threaded on the external electrically controlled translational lead screw 14. The external translational adjustment seats 15 are block-shaped structures that slide in the inner cavity of the transverse adjustment frame 13. When the external electrically controlled translational lead screw 14 rotates, it can drive the two external translational adjustment seats 15 to move synchronously towards or away from each other along the transverse adjustment frame 13. The unidirectional or bidirectional lead screw can be freely changed according to actual needs. The outer end of the external translation adjustment seat 15 is integrally formed with a lateral bending plate 22. The lateral bending plate 22 is a horizontally bent plate structure, which can assist in limiting the side of the high refractive index wafer for optical waveguides and prevent the wafer from twisting and shifting during the cutting process.

[0038] The external translation adjustment seat 15 has a lateral adjustment groove 16 on the side wall facing the wafer. The lateral adjustment groove 16 is a vertically arranged concave groove, and a main pressure sensor 17 is fixedly installed inside it. The main pressure sensor 17 is the core control and sensing component of the tooling. It is electrically connected to the external electrical control system and is used to detect whether the horizontal adjustment frame 13 and the electrically controlled translation clamping seat 5 are squeezed to the outside of the wafer after flipping and translating. A pressure adaptive lifting module 6 is also slidably mounted inside the lateral adjustment slot 16. The pressure adaptive lifting module 6 includes a lifting clamping arm 18, an embedded support rod 19, and an adaptive pressure sensor 20. The lifting clamping arm 18 is a vertically arranged plate structure that slides in conjunction with the lateral adjustment slot 16. The lower end is rounded to avoid scratching the wafer surface. The embedded support rod 19 is a miniature electric telescopic rod, which is fixedly installed at the bottom of the lateral adjustment slot 16. The end of the telescopic rod is fixedly connected to the lower end of the lifting clamping arm 18, and is used to drive the lifting clamping arm 18 to move vertically up and down along the lateral adjustment slot 16. The adaptive pressure sensor 20 is attached and fixed to the clamping surface of the lifting clamping arm 18 and is electrically connected to the main pressure sensor 17. It can detect the clamping pressure between the lifting clamping arm 18 and the wafer in real time and transmit the pressure signal to the main pressure sensor 17.

[0039] A side-mounted optical recognition probe 21 is fixedly installed on the side wall of the lifting clamp arm 18 via a bracket. The side-mounted optical recognition probe 21 is a high-definition visual recognition sensor. Its detection end faces the center of the operating platform 1 and is electrically connected to the main pressure sensor 17. It can identify the shape, size and placement of the high refractive index wafer to be cut in real time and transmit the position signal to the main pressure sensor 17. The main pressure sensor 17 then transmits the signal to the external electronic control system as the basis for the operation of each adjustment component.

[0040] The side-mounted optical recognition probe 21 is a high-definition visual recognition sensor, symmetrically installed on the side wall of the lifting clamping arm 18, with the detection end facing the wafer placement area in the center of the operating platform 1. It is the core basis for judging the wafer position. The adaptive pressure sensor 20 is attached to the clamping surface of the lifting clamping arm 18. It is the core detection element for the wafer clamping contact state and stress distribution state. Both are electrically connected to the main pressure sensor 17. The detection data is transmitted to the main pressure sensor 17 in real time for analysis and judgment. The specific judgment logic is divided into the initial positioning stage and the real-time monitoring stage during the cutting process.

[0041] After the wafer is loaded, the side-mounted optical recognition probe 21 immediately performs a visual scan of the operating platform 1 area, collecting optical information such as the wafer's outline, geometric dimensions, center coordinates, and actual placement angle. It compares this information with the standard wafer position parameters and standard shape parameters preset in the electronic control system to determine whether the wafer has horizontal offset or angular deflection. At the same time, it identifies the actual specifications of the wafer, providing basic data for subsequent adjustments.

[0042] When the lifting clamping arm 18 begins to move downward and makes initial contact with the wafer surface, the adaptive pressure sensor 20 detects that the pressure value changes from 0 to non-zero and immediately transmits the contact signal to the main pressure sensor 17. Based on this, the main pressure sensor 17 determines that the wafer has entered the clamping contact state and controls the embedded support rod 19 to reduce the downward movement speed of the lifting clamping arm 18 to avoid hard contact that could cause damage to the wafer surface or chipping.

[0043] Position offset judgment: During the cutting process, the side-mounted optical recognition probe 21 continuously scans the wafer at a fixed frequency to collect the wafer's position coordinate information in real time. It is compared with the reference position parameters after the initial clamping. If the coordinate deviation exceeds the preset threshold, it is immediately determined that the wafer has horizontal movement or torsional offset. At the same time, if the pressure value of the single-sided adaptive pressure sensor 20 suddenly increases / decreases, while the pressure value on the other side changes in the opposite direction, the main pressure sensor 17, combined with optical information, can help determine that the wafer has local warping or lateral displacement.

[0044] Clamping status judgment: The adaptive pressure sensor 20 detects the pressure value between the clamping surface and the wafer in real time. If the pressure value is within the preset stable threshold range, the wafer clamping is determined to be stable. If the pressure value continues to increase, the wafer is determined to be over-clamped, which is prone to local stress concentration. If the pressure value continues to decrease, the wafer is determined to be loosely clamped, which may be due to displacement caused by cutting vibration. If the pressure value of different areas of the clamping surface of the same lifting clamping arm 18 is too different, the wafer is determined to be under uneven force, which poses a risk of dark cracking.

[0045] The automatic control of clamping force is based on the main pressure sensor 17 as the core control unit and the real-time pressure signal of the adaptive pressure sensor 20 as the feedback basis. The embedded support rod 19 is linked to complete the closed-loop adjustment. At the same time, the position information of the side-mounted optical recognition probe 21 provides auxiliary reference for clamping force adjustment. The entire adjustment process is divided into initial clamping force adjustment and dynamic clamping force adjustment during the cutting process. It can automatically match the preset optimal clamping force threshold according to the different specifications of the wafer.

[0046] After the lifting clamping arm 18 makes initial contact with the chip, the embedded support rod 19 continues to extend slowly, driving the lifting clamping arm 18 to apply clamping force. The adaptive pressure sensor 20 continuously transmits the real-time pressure value to the main pressure sensor 17.

[0047] The main pressure sensor 17 compares the detected actual pressure value with the preset optimal clamping force threshold in the electronic control system: if the actual pressure value is lower than the threshold, the main pressure sensor 17 sends a command to control the embedded support rod 19 to continue to extend slightly, increasing the clamping force; if the actual pressure value is higher than the threshold, the main pressure sensor 17 sends a command to control the embedded support rod 19 to retract slightly, reducing the clamping force; if the actual pressure value is equal to the threshold, the main pressure sensor 17 sends a command to control the embedded support rod 19 to stop moving, completing the precise setting of the initial clamping force.

[0048] During the cutting process, if the adaptive pressure sensor 20 detects that the pressure value is lower than the preset threshold, the main pressure sensor 17 immediately controls the embedded support rod 19 to extend slightly to supplement the clamping force until the pressure value returns to the threshold range.

[0049] If the detected pressure value is higher than the preset threshold, the main pressure sensor 17 controls the embedded support rod 19 to retract slightly, releasing part of the clamping force and avoiding stress concentration;

[0050] If uneven force is detected on the wafer, the main pressure sensor 17 controls the embedded support rod 19 at the corresponding position to perform independent extension and retraction adjustment according to the pressure distribution data, so as to achieve local precise compensation of clamping force and make the wafer surface uniformly stressed.

[0051] If the side-mounted optical recognition probe 21 detects local warping of the wafer, the main pressure sensor 17, in conjunction with the pressure signal, controls the lifting clamping arm 18 in the warped area to appropriately reduce the clamping force, while maintaining the normal clamping force in the non-warped area, until the wafer returns to a horizontally attached state, and then readjusts the clamping force to the threshold range.

[0052] The horizontal position adjustment of the wafer is divided into translation adjustment in the X / Y axis direction and angle correction adjustment around the Z axis. The optical information of the side-mounted optical recognition probe 21 is used as the core adjustment basis. The main pressure sensor 17, based on the position deviation data, links the embedded electronically controlled translation screw 7 and the external electronically controlled translation screw 14 to complete the adjustment. The pressure signal of the adaptive pressure sensor 20 provides status feedback for the adjustment process, ensuring that the wafer is not damaged during the adjustment process.

[0053] When the side-mounted optical recognition probe 21 detects a deviation in the X-axis or Y-axis direction between the chip center coordinates and the standard coordinates, it transmits the deviation distance and deviation direction data to the main pressure sensor 17.

[0054] The main pressure sensor 17 sends a command based on the deviation data to control the embedded electronically controlled translation screw 7 to rotate forward / reverse, thereby driving the lateral adjustment sliders 3 on both sides to move horizontally synchronously along the embedded guide groove 2, thus achieving position calibration of the wafer in the Y-axis direction.

[0055] If there is a deviation in the X-axis direction, the main pressure sensor 17 sends a command to control the external electronically controlled translation screw 14 to rotate forward / reverse, driving the external translation adjustment seat 15 to move synchronously along the horizontal adjustment frame 13, and the wafer is driven to complete the X-axis position calibration through the clamping of the lifting clamp arm 18.

[0056] During the adjustment process, the adaptive pressure sensor 20 continuously detects the pressure value. If the pressure value exceeds the preset temporary threshold, the main pressure sensor 17 immediately controls the lead screw to stop rotating, reduces the clamping force, and then continues the adjustment to avoid excessive clamping force damaging the wafer during the adjustment process.

[0057] When the side-mounted optical recognition probe 21 detects that the chip placement angle deviates from the standard angle, it transmits the deflection angle and deflection direction data to the main pressure sensor 17.

[0058] The main pressure sensor 17 sends a command to control the external electrically controlled translation screws 14 on both sides to rotate at different speeds: one external electrically controlled translation screw 14 rotates forward, driving the external translation adjustment seat 15 on that side to move closer to the center of the wafer, while the other external electrically controlled translation screw 14 rotates in reverse, driving the external translation adjustment seat 15 on that side to move further away from the center of the wafer. Through the differential lateral movement of the lifting clamps 18 on both sides, the wafer is driven to rotate around the Z-axis to complete the angle correction.

[0059] During the angle correction process, the side-mounted optical recognition probe 21 collects the chip angle information in real time. When the deflection angle returns to the preset error range, the main pressure sensor 17 controls the external electronically controlled translation screw 14 to stop rotating, and at the same time controls the embedded support rod 19 to fine-tune the clamping force to return to the optimal threshold range.

[0060] During the cutting process, if the side-mounted optical recognition probe 21 detects a slight horizontal shift or twist in the wafer, the main pressure sensor 17 will control the embedded electronically controlled translation screw 7 and the external electronically controlled translation screw 14 to make minute and slow adjustments according to the magnitude of the shift, so as to achieve real-time position compensation. At the same time, the pressure signal of the adaptive pressure sensor 20 is fed back in real time to ensure that the clamping force is always within a stable range during the compensation adjustment process, so as to avoid secondary damage or loosening of the wafer due to adjustment.

[0061] The upper end face of the flip-locking frame 10 is fixedly equipped with a horizontal expansion guide rail 23. The horizontal expansion guide rail 23 is a T-shaped guide rail structure, which is set along the length direction of the flip-locking frame 10. According to the cutting process requirements of high refractive index wafers for optical waveguides, auxiliary accessories such as cutting positioning rulers, debris collection covers, and laser positioners can be detachably installed on the horizontal expansion guide rail 23 to expand the use function of the tooling and adapt to various cutting processes such as diamond wire saw multi-wire cutting, laser stealth cutting, and abrasive wheel scribing cutting.

[0062] The specific working process of the high-refractive-index wafer dicing auxiliary tooling for this optical waveguide is as follows:

[0063] Loading and positioning: The high-refractive-index wafer to be cut is placed stably in the center of the operating platform 1. The tooling's electrical control system is started, and the side-mounted optical recognition probe 21 immediately performs visual recognition of the wafer's shape, size, and actual placement position. The recognized position signal is transmitted to the main pressure sensor 17 in real time. The main pressure sensor 17 feeds the signal back to the external electrical control system, which automatically generates adjustment commands according to the wafer specifications.

[0064] The flip-pressing limit and lateral spacing adjustment: The electronic control system controls the electronically controlled extrusion strut 11 to start, and the electronically controlled extrusion strut 11 extends, pushing the flip-locking frame 10 to flip downwards around the hinge point with the top mounting bracket 9. After flipping into place, the electronically controlled extrusion strut 11 self-locks and remains locked. The electronic control system controls the servo motor corresponding to the embedded electronically controlled translation screw 7 to start, driving the embedded electronically controlled translation screw 7 to rotate. Through threaded transmission, it drives the lateral adjustment sliders 3 on both sides to move horizontally towards each other along the embedded guide groove 2 until the two electronically controlled flip-type extrusion frames 4 move to the spacing position that matches the edge of the wafer on both sides, completing the initial lateral positioning. After positioning, the servo motor self-locks to prevent the lateral adjustment sliders 3 from moving. The edge of the high-refractive-index wafer of the optical waveguide is attached to the inner wall of the lateral adjustment groove 16 to achieve upper and lower limit of the wafer and avoid the wafer from moving up and down during the cutting process.

[0065] Clamping seat position adjustment: The electrical control system controls the servo motor corresponding to the external electrical control translation screw 14 to start, driving the external electrical control translation screw 14 to rotate. Through the threaded transmission, the two external translation adjustment seats 15 move laterally towards each other along the horizontal adjustment frame 13 until the pressure adaptive lifting module 6 moves to the optimal clamping position of the wafer. At this time, the lateral bending plate 22 fits against the side of the wafer to complete the auxiliary limit. The servo motor self-locks and fixes the position of the external translation adjustment seat 15.

[0066] Adaptive flexible clamping: The electronic control system controls the embedded support rod 19 to start, and the embedded support rod 19 extends, pushing the lifting clamping arm 18 to move downward along the lateral adjustment groove 16 until the clamping surface of the lifting clamping arm 18 is in contact with the surface of the high refractive index wafer for optical waveguide. At this time, the adaptive pressure sensor 20 detects the clamping pressure in real time and transmits the pressure signal to the main pressure sensor 17. If the detected pressure value is lower than the preset threshold, the main pressure sensor 17 feeds back a signal to the electronic control system, and the electronic control system controls the embedded support rod 19 to continue to extend, increasing the clamping force. If the detected pressure value is higher than the preset threshold, the electronic control system controls the embedded support rod 19 to retract slightly, reducing the clamping force, until the clamping pressure reaches the preset optimal threshold, realizing adaptive flexible clamping of the wafer, effectively dispersing the clamping stress, and avoiding local stress concentration that could lead to wafer edge chipping and dark cracks.

[0067] Cutting operation: After the tooling completes the positioning and clamping of the high refractive index wafer for the optical waveguide, the external cutting equipment is started to cut the wafer. During the cutting process, the main pressure sensor 17 continuously receives the pressure signal from the adaptive pressure sensor 20 and the position signal from the side-mounted optical recognition probe 21. If a slight offset of the wafer or a change in clamping pressure is detected, the electronic control system will fine-tune each adjustment component in real time to maintain the clamping stability and positioning accuracy of the wafer. If there are special requirements for the cutting process, corresponding auxiliary accessories can be installed in advance on the horizontal expansion guide rail 23 to cooperate with the cutting operation.

[0068] Material unloading and resetting: After the high refractive index wafer dicing operation for optical waveguides is completed, the electronic control system controls the embedded support rod 19 to retract, driving the lifting clamping arm 18 to move upward and loosen the clamping of the wafer; then, it controls the electronically controlled extrusion support rod 11 to retract, pulling the flip locking frame 10 to flip upward and reset; then it controls the embedded electronically controlled translation screw 7 and the external electronically controlled translation screw 14 to rotate in opposite directions, driving the lateral adjustment slider 3 and the external translation adjustment seat 15 to reset to the initial position; finally, the operator removes the diced wafer from the operating platform 1, completing the entire dicing auxiliary operation process.

[0069] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A cutting auxiliary fixture for high refractive index wafers for optical waveguides, comprising an operating platform (1), characterized in that: The upper surface of the operating platform (1) has two horizontally arranged embedded guide grooves (2) symmetrically opened. The upper surface of the operating platform (1) is slidably equipped with symmetrically arranged lateral adjustment sliders (3). The upper surface of the lateral adjustment sliders (3) is movably equipped with an electrically controlled flip-type extrusion frame (4). The side wall of the electrically controlled flip-type extrusion frame (4) is movably equipped with an electrically controlled translational clamping seat (5). The clamping surface of the electrically controlled translational clamping seat (5) is provided with a pressure adaptive lifting module (6). The embedded guide groove (2) is movably fitted with an embedded electric translation screw (7), and the lateral adjustment slider (3) is provided with a first internal thread adjustment through hole (8) that cooperates with the embedded electric translation screw (7). The lateral adjustment slider (3) is sleeved on the embedded electric translation screw (7) through the first internal thread adjustment through hole (8) and threadedly assembled with the embedded electric translation screw (7). The upper surface of the lateral adjustment slider (3) has an upwardly protruding top mounting bracket (9), and the electrically controlled flip-type extrusion frame (4) includes a flip locking frame (10) hinged to the top mounting bracket (9) and an electrically controlled extrusion support rod (11) for controlling the flip locking frame (10). The lateral assembly groove (12) of the flip locking frame (10) is fitted with a horizontal adjustment frame (13). The electrically controlled translation clamping seat (5) includes an external electrically controlled translation screw (14) movably installed inside the horizontal adjustment frame (13) and an external translation adjustment seat (15) threaded onto the external electrically controlled translation screw (14); The external translation adjustment seat (15) has a lateral adjustment groove (16) on its side wall for assembling the pressure adaptive lifting module (6); The lateral adjustment groove (16) is equipped with a main pressure sensor (17), which is electrically connected to the pressure adaptive lifting module (6). The pressure adaptive lifting module (6) includes a lifting clamping arm (18) slidably mounted inside the lateral adjustment groove (16), an embedded support rod (19) for controlling the lifting clamping arm (18), and an adaptive pressure sensor (20) mounted on the clamping surface of the lifting clamping arm (18). The embedded support rod (19) and the adaptive pressure sensor (20) are both electrically connected to the main pressure sensor (17). Each of the lifting clamps (18) is equipped with a side-mounted optical recognition probe (21), which is electrically connected to the main pressure sensor (17).

2. The dicing auxiliary fixture for high-refractive-index wafers for optical waveguides according to claim 1, characterized in that: Each externally controlled translation screw (14) has two externally mounted translation adjustment seats (15) threaded on it. Each externally mounted translation adjustment seat (15) has an integrally formed lateral bending plate (22) on its outer end.

3. The dicing auxiliary tooling for high-refractive-index wafers for optical waveguides according to claim 1, characterized in that: The upper end of the flip-locking frame (10) is fixedly equipped with a horizontal expansion guide rail (23), and accessories for cutting high-refractive-index wafers for auxiliary optical waveguides can be detachably installed on the horizontal expansion guide rail (23).

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