Hot-dip coating device for high-corrosion-resistance coating
By designing a placement basket and a small fan in a hot-dip device, blowing the surface of the tin liquid, the problem of the tin liquid contacting with oxygen is solved, simplifying the welding process and improving corrosion resistance.
Patent Information
- Application Number
- CN202421333013.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-12
AI Technical Summary
In existing hot-dip devices, when tin liquid comes into contact with oxygen, it is easy to produce an oxide film, and people need to manually push it away, which is troublesome to use.
A hot-dip device including a square solder furnace and a placement basket is designed. There are multiple leaking grooves and air outlets at the bottom of the placement basket. A small fan blows wind power from the air outlet to blow the surface of the tin liquid to avoid the formation of an oxide film.
The surface of the tin liquid is blown by a fan to avoid the formation of an oxide film, simplifying the welding process, improving the welding efficiency and corrosion resistance of the circuit board.
Smart Images
Figure CN222665962U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of hot-dip devices, in particular to a hot-dip device for high-corrosion-resistant coatings. Background Art
[0002] Circuit board welding requires auxiliary tools such as soldering irons, pliers, and solder, which are suitable for some small-scale circuit board welding. The existing technology has a small tin melting furnace. A tin bar is placed in the tin melting furnace, and the tin bar is heated into liquid. The side of the circuit board that needs a solder point is immersed in the tin liquid to complete the welding of one side. A layer of metal is plated on the surface of the circuit board, which can effectively reduce the occurrence of oxidation and corrosion, thereby improving the corrosion resistance and conductivity of the circuit board, making the equipment more stable.
[0003] However, since the trough where the tin bar is placed is exposed to the air, the tin liquid comes into contact with oxygen, which easily produces an oxide film. It is necessary for personnel to manually remove the oxide film before welding can be carried out, which is more inconvenient to use.
[0004] Therefore, it is necessary to propose a hot-dip coating device for high corrosion-resistant coating to solve the above problems. Utility Model Content
[0005] The utility model aims to provide a hot-dip device for high corrosion-resistant coatings to solve the problem that since the trough for placing tin bars is exposed to the air, tin liquid comes into contact with oxygen, an oxide film is easily generated, and personnel need to manually remove the oxide film before welding can be carried out, which is troublesome to use.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a hot-dip device for high-corrosion-resistant coatings, comprising a square soldering furnace, a tin melting tank is provided at the top of the square soldering furnace, a placement basket is provided inside the tin melting tank, a plurality of leakage slots are provided at the bottom end of the placement basket, a first air outlet is provided at the bottom end of one side of the interior of the placement basket, a small fan is fixed to one side of the top of the placement basket, a cavity is provided between the outer side and the inner wall of the placement basket, a fixing block is connected to one side of the short side direction of the bottom end of the placement basket, a second air outlet is provided on the side of the fixing block close to the center of the placement basket, the second air outlet is arranged to be tilted downward, the air outlet of the small fan is connected to the cavity, and the first air outlet and the second air outlet are both connected to the cavity.
[0007] Preferably, telescopic parts are fixed on both sides of the inner long side of the placement basket, and side extrusion plates are fixed on opposite sides of the two telescopic parts. The two telescopic parts include a telescopic rod and a spring, and the spring is sleeved on the outside of the telescopic rod.
[0008] Preferably, blocking plates are fixed to the top ends of both sides of the placement basket, and lifting handles are fixed to the top ends of the two blocking plates.
[0009] Preferably, an electric heating wire is provided at the bottom end of the tin melting tank, and the electric heating wire is fixed inside the square soldering furnace.
[0010] Preferably, a plurality of drain grooves simultaneously penetrate the bottom end of the placement basket, the lengths of the plurality of drain grooves are consistent, and the plurality of drain grooves are distributed along the long side direction of the placement basket.
[0011] Preferably, a circuit board is clamped and fixed between the two side extrusion plates, and the soldering part of the circuit board faces the drain groove.
[0012] Technical effects and advantages of the utility model:
[0013] 1. Personnel can lower the placement basket into the tin melting tank by pulling the handle so that the molten tin can adhere to the bottom surface of the circuit board. At the same time, the small fan can be started. The wind generated by the small fan can be discharged from the second air outlet, thereby blowing the surface of the molten tin to prevent the surface of the molten tin from contacting the air and forming an oxide film. The oxide film can be blown aside to allow the bottom surface of the circuit board to contact the molten tin smoothly.
[0014] 2. At the same time, the wind generated by the small fan will also be discharged from the first air outlet to blow the part of the circuit board that contacts the tin liquid, accelerate the solidification speed of the tin liquid, and at the same time play a role in cooling. Furthermore, the fixed block can support the bottom of the placement basket to prevent the bottom of the placement basket from directly contacting the bottom of the molten tin tank, thereby playing a role of isolation. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a schematic structural diagram of a hot-dip device for high corrosion-resistant coating.
[0016] Figure 2 It is a structural schematic diagram of the placement basket of the utility model.
[0017] Figure 3 It is a structural schematic diagram of the second air outlet and the fixing block of the utility model.
[0018] In the figure: 1. Square soldering furnace; 2. Placement basket; 3. Blocking plate; 4. Lifting handle; 5. Small fan; 6. Drain trough; 7. First air outlet; 8. Melting tin tank; 9. Side extrusion plate; 10. Telescopic part; 11. Second air outlet; 12. Fixing block. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clarify the technical solutions in the embodiments of the utility model; it is completely described. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] The utility model provides Figure 1 - Figure 3 A hot-dip plating device for high corrosion-resistant coatings is shown, comprising a square soldering furnace 1, a tin melting tank 8 is provided at the top of the square soldering furnace 1, an electric heating wire is provided at the bottom of the tin melting tank 8, and the electric heating wire is fixed inside the square soldering furnace 1. In the actual operation of the utility model, a tin bar can be placed inside the tin melting tank 8, and the tin bar is melted into tin liquid by heating by the electric heating wire of the tin melting tank 8. At the same time, other metals can also be placed inside the tin melting tank 8 to improve the corrosion resistance and conductivity of the circuit board solder, such as metal materials such as copper or silver, which can be placed as needed.
[0021] A placement basket 2 is arranged inside the tin melting tank 8, and a plurality of leakage grooves 6 are opened at the bottom end of the placement basket 2, a first air outlet 7 is opened at the bottom end of one side of the interior of the placement basket 2, a small fan 5 is fixed to one side of the top of the placement basket 2, a cavity is opened between the outer side and the inner wall of the placement basket 2, a fixing block 12 is connected to one side in the short side direction of the bottom end of the placement basket 2, a second air outlet 11 is opened on the side of the fixing block 12 close to the center of the placement basket 2, and the second air outlet 11 is arranged to be inclined downward, the air outlet of the small fan 5 is connected to the cavity, and the first air outlet 7 and the second air outlet 11 are both connected to the cavity.
[0022] Telescopic parts 10 are fixed on both sides of the long side of the placement basket 2, and side extrusion plates 9 are fixed on the opposite sides of the two telescopic parts 10. The two telescopic parts 10 include telescopic rods and springs, and the springs are sleeved on the outside of the telescopic rods. A circuit board is clamped and fixed between the two side extrusion plates 9, and the soldering part of the circuit board faces the drain groove 6. Blocking plates 3 are fixed on the top of both sides of the placement basket 2, and lifting handles 4 are fixed on the top of the two blocking plates 3. The blocking plates 3 can support the placement basket 2 above the molten tin tank 8.
[0023] In the actual operation of the utility model, the circuit board can be placed between the two side extrusion plates 9, and the circuit board can be clamped and fixed by the elasticity of the telescopic member 10. The personnel can lower the placement basket 2 to the inside of the tin melting tank 8 by pulling the handle 4, so that the tin liquid can adhere to the bottom surface of the circuit board. At the same time, the small fan 5 can be started, and the wind force generated by the small fan 5 can be discharged from the second air outlet 11, so as to blow the surface of the tin liquid to prevent the tin liquid surface from contacting with the air and forming an oxide film. The oxide film can be blown to one side, so that the bottom surface of the circuit board can smoothly contact the tin liquid.
[0024] At the same time, the wind generated by the small fan 5 will also be discharged from the first air outlet 7 to blow the part of the circuit board that contacts the tin liquid, thereby accelerating the solidification speed of the tin liquid and having a cooling effect.
[0025] Furthermore, the fixing block 12 can support the bottom end of the placement basket 2 to prevent the bottom end of the placement basket 2 from directly contacting the bottom end of the molten tin tank 8, thereby playing an isolation role.
[0026] Multiple drain grooves 6 simultaneously penetrate the bottom end of the placement basket 2, the lengths of the multiple drain grooves 6 are consistent, and the multiple drain grooves 6 are distributed along the long side direction of the placement basket 2. The multiple drain grooves 6 can discharge excess tin liquid.
Claims
1. A hot-dip device for high corrosion-resistant coating, comprising a square soldering furnace (1), characterized in that: The square soldering furnace (1) is provided with a tin melting tank (8) at the top, a placing basket (2) is provided inside the tin melting tank (8), a plurality of drain slots (6) are provided at the bottom of the placing basket (2), a first air outlet (7) is provided at the bottom of one side of the inside of the placing basket (2), a small fan (5) is fixed to one side of the top of the placing basket (2), a cavity is provided between the outer side and the inner wall of the placing basket (2), a fixing block (12) is connected to one side of the short side direction of the bottom of the placing basket (2), a second air outlet (11) is provided on the side of the fixing block (12) close to the center of the placing basket (2), the second air outlet (11) is arranged to be tilted downward, the air outlet of the small fan (5) is connected to the cavity, and the first air outlet (7) and the second air outlet (11) are both connected to the cavity.
2. A hot-dip coating device for high corrosion-resistant coating according to claim 1, characterized in that: Telescopic parts (10) are fixed on both sides of the long side of the placement basket (2), and side extrusion plates (9) are fixed on the opposite sides of the two telescopic parts (10). The two telescopic parts (10) include a telescopic rod and a spring, and the spring is sleeved on the outside of the telescopic rod.
3. A hot-dip coating device for high corrosion-resistant coating according to claim 2, characterized in that: Blocking plates (3) are fixed to the top ends of both sides of the placement basket (2), and lifting handles (4) are fixed to the top ends of the two blocking plates (3).
4. A hot-dip coating device for high corrosion resistance coating according to claim 1, characterized in that: An electric heating wire is arranged at the bottom end of the molten tin tank (8), and the electric heating wire is fixed inside the square soldering furnace (1).
5. A hot-dip coating device for high corrosion-resistant coating according to claim 1, characterized in that: A plurality of drain grooves (6) simultaneously penetrate the bottom end of the placement basket (2); the lengths of the plurality of drain grooves (6) are consistent, and the plurality of drain grooves (6) are distributed along the long side direction of the placement basket (2).
6. A hot-dip coating device for high corrosion-resistant coating according to claim 2, characterized in that: A circuit board is clamped and fixed between the two side extrusion plates (9), with the soldering part of the circuit board facing the drain groove (6).