Micro-electro-mechanical galvanometer
By setting a reinforced connector in the microelectromechanical galvanometer to form an insulating channel, the problems of high power consumption and thermal deformation of the microelectromechanical galvanometer in the prior art are solved, and higher mechanical reliability and efficiency are achieved.
Patent Information
- Application Number
- CN202421556760.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-07-02
AI Technical Summary
In the low-frequency quasi-static drive, existing microelectromechanical galvanometers require a large driving current or magnetic field to overcome the stiffness of the torsion beam, resulting in high power consumption, obvious heat generation and mirror deformation. The low-rigid torsion beam may reduce the resonance frequency and affect reliability.
A microelectromechanical galvanometer is designed to form a heat insulation channel by setting a reinforcement connector between the torsional support structure and the reflector to reduce heat conduction; at the same time, the arrangement of the torsional support structure and the reinforcement connector helps to reduce the mass and moment of inertia of the chip part and improve mechanical reliability.
It effectively suppresses the thermal deformation of the reflector, ensures the flatness of the mirror, and improves the mechanical reliability and power consumption efficiency of the microelectromechanical galvanometer.
Smart Images
Figure CN222672049U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of micro-opto-electromechanical technology, and in particular to a micro-electromechanical galvanometer. Background Art
[0002] A micro electro mechanical system (MEMS) galvanometer is a device manufactured using MEMS technology, in which a reflector is deflected according to a certain rule under the action of a driver. In this application, it is called a micro electro mechanical galvanometer. The micro electro mechanical galvanometer controls the torsional reciprocating motion of a tiny mirror surface to reflect the laser incident on the mirror surface to different angles, thereby achieving scanning perpendicular to the torsional axis of the mirror surface. Based on the above characteristics, the micro electro mechanical galvanometer has a wide range of application value in laser printing, optical communication, laser radar, virtual reality, augmented reality and other fields.
[0003] At present, known MEMS galvanometers usually have two driving modes: high-frequency resonant scanning and low-frequency quasi-static scanning. For low-frequency quasi-statically driven MEMS galvanometers, the driving force must overcome the stiffness of the torsion beam to rotate the mirror. In order to obtain a larger torsion angle, the MEMS galvanometer usually needs to use a larger driving current or a stronger driving magnetic field, which results in higher power consumption of the galvanometer, significant heat generation and deformation of the mirror. In addition, reducing the stiffness of the torsion beam can meet the needs of large torsion angles, but a low-rigidity torsion beam may reduce the resonant frequency, making the galvanometer susceptible to damage from vibration or impact, resulting in poor reliability. Utility Model Content
[0004] In order to solve the existing technical problems, the present application provides a micro-electromechanical galvanometer that can effectively avoid mirror deformation and improve reliability.
[0005] The present application provides a micro-electromechanical galvanometer, comprising:
[0006] Reflector;
[0007] A galvanometer chip, comprising a torsion support structure spaced apart from the reflector and a reinforcing connector connected between the torsion support structure and the reflector, wherein the reinforcing connector forms a heat-insulating channel between the torsion support structure and the reflector, and a driving coil is disposed on the torsion support structure;
[0008] A fixed frame connected to the torsion support structure via a rotating shaft beam structure;
[0009] The centers of mass of the reflector and the galvanometer chip are on the same axis, and the driving coil is subjected to electromagnetic force in the magnetic field after being energized, so as to drive the torsion support structure to drive the reflector to rotate around the rotating shaft beam structure.
[0010] Optionally, the reinforcing connector is provided with a bonding area at one end connected to the reflector, and the bonding area includes at least one bonding point bonded to the reflector.
[0011] Optionally, there are multiple bonding points, and the multiple bonding points are symmetrically arranged relative to the center of the reflector, and the bonding points are bonded and fixed to the reflector by adhesive.
[0012] Optionally, the bonding area corresponds to a central area of the reflector.
[0013] Optionally, a hollow area is provided in the center of the torsion support structure; and the drive coil is arranged around the periphery of the hollow area.
[0014] Optionally, the drive coil is formed by stacking enameled wires and is bonded to the outer edge region of the torsion support structure; or, the drive coil is fixed to the outer edge region of the torsion support structure by electroplating or sputtering.
[0015] Optionally, the reflector includes a mirror substrate and a reflective film provided on the mirror substrate, and the reinforcing connector is connected to a side of the mirror substrate away from the reflective film.
[0016] Optionally, the outer dimensions of the movable structure of the galvanometer chip are smaller than or equal to the outer dimensions of the reflector.
[0017] Optionally, the reinforcing connecting member is in a grid shape, and the thickness of the torsion support structure is smaller than the thickness of the reinforcing connecting member.
[0018] Optionally, the micro-electromechanical galvanometer further includes a magnetic component and a limiting component, the galvanometer chip is fixed to the limiting component via the fixed frame, and the magnetic component includes a plurality of groups of magnets fixed to the limiting component and used to provide a magnetic field for the driving coil.
[0019] The micro-electromechanical galvanometer provided in the above-mentioned embodiment has a torsion support structure arranged at a distance from the reflector and a reinforcing connection piece connected between the torsion support structure and the reflector, and a heat insulation channel is formed between the reinforcing connection piece and the torsion support structure and the reflector. In this way, the heat generated by the driving coil during operation is transferred to the reflector through the torsion support structure and the reinforcing connection piece. The heat insulation channel can reduce the heat conducted to the reflector, thereby effectively suppressing the thermal deformation of the reflector. In addition, the chip part of the micro-electromechanical galvanometer is composed of a reflector and a galvanometer chip. The setting of the torsion support structure and the reinforcing connection piece in the galvanometer chip is conducive to ensuring that the overall strength of the chip part meets the requirements while reducing the mass, thereby reducing the moment of inertia, and helping to improve the mechanical reliability of the chip part. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 Schematic diagram of the structure of the chip part of the micro-electromechanical galvanometer in one embodiment.
[0021] Figure 2 for Figure 1 A schematic top view of the chip portion of the MEMS galvanometer is shown.
[0022] Figure 3 Schematic diagram of the structure of the reinforcing connector in the galvanometer chip in one embodiment.
[0023] Figure 4 Schematic diagram of the structure of the reinforcing connector in the galvanometer chip in another embodiment.
[0024] Figure 5 It is a schematic diagram of the structure of the reinforcing connector in the galvanometer chip in another embodiment.
[0025] Figure 6 for Figure 1 A bottom-up schematic diagram of the chip portion of the MEMS galvanometer is shown.
[0026] Figure 7 Schematic diagram of the structure of a known micro-electromechanical galvanometer.
[0027] Figure 8 FIG. 4 is a schematic diagram of the structure of another known micro-electromechanical galvanometer.
[0028] Fig. 9 Schematic diagram of the structure of a micro-electromechanical galvanometer in one embodiment.
[0029] Component Symbols:
[0030] Galvanometer chip 110, fixed frame 111, torsion support structure 112, reinforcing connector 113, shaft beam structure 114, bonding area 115, drive coil 116, movable frame 117, heat insulation channel 118, hollow area 119, reflector 120, mirror base 121, reflective film 122, limit assembly 13, magnetic assembly 14 DETAILED DESCRIPTION
[0031] The technical solution of the utility model is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.
[0032] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The described embodiments should not be regarded as limiting the present application. All other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0033] In the following description, the expression "some embodiments" is involved, which describes a subset of all possible embodiments. It should be noted that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.
[0034] In the following description, the terms "first, second, third" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first, second, third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0035] See also Figure 1 and Figure 2 , a micro-electromechanical galvanometer provided in an embodiment of the present application, the micro-electromechanical galvanometer comprising: a reflector 120; a galvanometer chip 110, comprising a torsion support structure 112 spaced apart from the reflector 120 and a reinforcing connector 113 connected between the torsion support structure 112 and the reflector 120, the reinforcing connector 113 forming a heat insulation channel 118 between the torsion support structure 112 and the reflector 120, a driving coil 116 being provided on the torsion support structure 112; a fixed frame 111, connected to the torsion support structure 112 via a rotating shaft beam structure 114; wherein the center of mass of the reflector 120 and the galvanometer chip 110 are on the same axis, the driving coil 116 is subjected to electromagnetic force in the magnetic field after being energized, and the torsion support structure 112 is driven to drive the reflector 120 to rotate around the rotating shaft beam structure 114.
[0036] Among them, the driving coil 116 is arranged on the torsional support structure 112, and the torsional support structure 112 and the reflector 120 are spaced apart from each other and connected to the reflector 120 through a reinforcing connector 113. Therefore, the chip part of the micro-electromechanical galvanometer is designed to be a structure in which the torsional support structure 112 and the reflector 120 are separated, and the torsional support structure 112 is used to directly contact the driving coil 116. Since the materials of the driving coil 116 and the torsional support structure 112 are different and the thermal expansion coefficients are different, the two are deformed under the action of thermal expansion stress, which may cause the torsional support structure 112 to deform. The heat generated by the driving coil 116 is indirectly transferred to the reflector 120 through the torsional support structure 112 and the reinforcing connector 113, which can effectively avoid deformation on the reflector 120, thereby ensuring the flatness of the mirror surface. The torsion support structure 112 is connected to the reflector 120 through the reinforcing connector 113 to form the chip portion of the micro-electromechanical galvanometer, and the heat-insulating channel 118 refers to the portion of the space between the torsion support structure 112 and the reflector 120 where the reinforcing connector 113 is not provided. The existence of the heat-insulating channel 118 can further effectively block the heat on the torsion support structure 112 from being transferred to the reflector 120, thereby preventing the heat generated by the driving coil 116 during operation from causing the reflector 120 to be easily thermally deformed.
[0037] Among them, the centers of mass of the reflector 120 and the galvanometer chip 110 are on the same axis, which helps to maintain overall synchronization during the torsional movement of the reflector 120 driven by the torsional support structure 112, and the angle of the torsional movement of the reflector 120 under the action of the driving force is more controllable.
[0038] The micro-electromechanical galvanometer provided in the above-mentioned embodiment has a torsion support structure 112 spaced apart from the reflector 120 and a reinforcing connector 113 connected between the torsion support structure 112 and the reflector 120. The reinforcing connector 113 forms a heat insulation channel 118 between the torsion support structure 112 and the reflector 120. The driving coil 116 is arranged on the torsion support structure 112. In this way, the heat generated by the driving coil 116 during operation is transferred to the reflector 120 through the torsion support structure 112 and the reinforcing connector 113. The heat insulation channel 118 can reduce the heat conducted to the reflector 120, thereby effectively suppressing the thermal deformation of the reflector 120. In addition, the chip part of the micro-electromechanical galvanometer is composed of the reflector 120 and the galvanometer chip 110. The arrangement of the torsion support structure 112 and the reinforcing connector 113 in the galvanometer chip 110 is conducive to ensuring that the overall strength of the chip part meets the requirements while reducing the mass, thereby reducing the moment of inertia, and helping to improve the mechanical reliability of the chip part.
[0039] Among them, the pivot beam structure 114 refers to a structure that connects the torsion support structure 112 to the fixed frame 111 and supports the torsion support structure 112 to be able to perform torsion motion along its axis relative to the fixed frame 111, such as a straight beam, a serpentine beam, etc., and this application does not limit this. In this embodiment, the outer contours of the reflector 120 and the torsion support structure 112 are respectively rectangular, the pivot beam structure 114 is a straight beam connected to the opposite sides of the torsion support structure 112 and the fixed frame 111, the galvanometer chip 110 drives the reflector 120 to perform torsion motion in one-dimensional direction along the axis of the pivot beam structure 114, and the micro-electromechanical galvanometer is a one-dimensional torsion galvanometer.
[0040] In some embodiments, see Figures 3 to 5 The reinforcing connector 113 is provided with a bonding area 115 at one end connected to the reflector 120, and the bonding area 115 includes at least one bonding point bonded to the reflector 120. The bonding area 115 may be provided only in a partial area of the end of the reinforcing connector 113 connected to the reflector 120, that is, the area of the bonding area 115 is smaller than the end surface area of the end of the reinforcing connector 113 connected to the reflector 120. The bonding area 115 may include only one independent bonding point or multiple separate bonding points, and the shape and size of each bonding point may be different according to the required bonding strength, which is not limited in the present application.
[0041] The bonding area 115 corresponds to the central area of the reflector 120. Thus, only the central area of the reflector 120 is fixedly connected to the torsion support structure 112 through the bonding area 115, thereby helping to reduce the efficiency of heat transfer from the torsion support structure 112 to the reflector 120 and ensuring the mirror flatness of the reflector 120. Figure 3 As shown, the bonding point is cross-shaped, the number is one, and it is arranged at the center of the reinforcing connector 113 and corresponds to the central area of the reflector 120. In another optional example, the number of bonding points is multiple, and the multiple bonding points are symmetrically arranged relative to the center of the reflector 120, such as Figure 4 As shown, there are four bonding points, which are symmetrical in pairs and are arranged at the center of the reinforcing connector 113 and correspond to the central area of the reflector 120. Figure 5 As shown, the bonding points include two symmetrically arranged, which are arranged at the top of the reinforcing connector 113 and correspond to the central area of the reflector 120. The reinforcing connector 113 and the bonding points can be integrally formed by MEMS technology, and each bonding point can be bonded and fixed to the reflector 120 by adhesive. The mass center of the torsion support structure 112, the reinforcing connector 113, all the bonding points and the reflector 120 are all located on the same axis.
[0042] In some embodiments, see Figure 6 , a hollow area 119 is provided in the center of the torsion support structure 112; and the driving coil 116 is arranged around the periphery of the hollow area 119. The chip part of the micro-electromechanical galvanometer is designed to be a structure in which the torsion support structure 112 and the reflector 120 are separated, and the hollow area 119 is provided on the torsion support structure 112, which can significantly reduce the mass of the chip part. In addition, the reinforcing connector 113 is connected between the torsion support structure 112 and the reflector 120 and only occupies part of the space between the torsion support structure 112 and the reflector 120 (the space not occupied by the reinforcing connector 113 is the heat insulation channel 118), which is also conducive to reducing the mass of the chip part. The reduction of the mass of the chip part can reduce the moment of inertia and help improve the mechanical reliability of the chip part. In addition, the hollow area 119 can increase convection when the torsion support structure 112 drives the reflector 120 to torsion, thereby accelerating heat dissipation, which is further beneficial to reduce the heat conducted to the reflector 120 by the torsion support structure 112, thereby suppressing thermal deformation of the reflector 120.
[0043] It should be noted that the inventors of the present application have compared and analyzed the design of forming the chip portion of the micro-electromechanical galvanometer into a separate structure composed of a reflector 120 and a galvanometer chip 110 with the known one-dimensional micro-mirror structure, such as Figure 7 As shown in FIG. 1 , a one-dimensional micromirror structure of a known example is composed of a fixed frame 111, a driving coil 116, and a reflector 120 of an integral structure. A mirror reflective film layer 122 is provided on one side of the reflector 120. The driving coil 116 is directly fixed on a side of the reflector 120 away from the reflective film 122. Since the driving coil 116 generates heat during operation, the mirror surface of the reflector 120 of the integral structure is very susceptible to thermal deformation. Figure 8As shown, another known example of a one-dimensional micromirror structure is composed of a fixed frame 111, a driving coil 116, a movable frame 117, and a reflector 120 of an integral structure. A mirror reflective film layer 122 is provided on one side of the reflector 120. The driving coil 116 is fixed on the movable frame 117. The driving coil 116 drives the movable frame 117 under the action of electromagnetic force, and the movable frame 117 then drives the reflector 120 to torsion movement. This solution can reduce the mirror deformation caused by the heating of the driving coil 116, but the increase of the movable frame 117 requires a larger chip area to obtain the same mirror size. In the present application, the chip part of the micro-electromechanical galvanometer is formed into a separate structure composed of a reflector 120 and a galvanometer chip 110, which can meet the needs of a large mirror area and significantly reduce the chip mass, thereby reducing the moment of inertia, which helps to improve the mechanical reliability of the chip. In addition, during the torsional movement of the reflector 120, the heat generated by the drive coil 116 is transmitted from the drive coil 116 to the torsional support structure 112, the reinforcing connector 113, and the reflector 120 in sequence, so that the thermal deformation on the reflector 120 can be greatly reduced, thereby ensuring the flatness of the mirror surface.
[0044] Optionally, the drive coil 116 is formed by winding an enameled wire and is bonded to the outer edge area of the torsion support structure 112, or the drive coil 116 is fixed to the outer edge area of the torsion support structure 112 by electroplating or sputtering. The drive coil 116 is generally made of gold, copper, or alloy and is fixed to the outer edge area of the torsion support structure 112 by electroplating, sputtering, or bonding. After the drive coil 116 is energized, a Lorentz force is generated under the action of a driving magnetic field parallel to the galvanometer chip 110 and perpendicular to the axis of the shaft beam structure 114, so as to drive the torsion support structure 112 to drive the reflector 120 to rotate around the axis of the shaft beam. Among them, the drive coil 116 uses a stacked multi-layer winding coil, which helps to increase the number of coil turns, and a stronger driving force can be obtained with relatively small power consumption.
[0045] Optional, please refer again Figure 1The reflector 120 includes a mirror substrate 121 and a reflective film 122 disposed on the mirror substrate 121, and the reinforcing connector 113 is connected to a side of the mirror substrate 121 away from the reflective film 122. The reflector 120 is fixed by bonding the mirror substrate 121 to the bonding area on the reinforcing connector 113 through adhesive, and the reflective film 122 is located on a side of the reflector 120 away from the bonding area, and is used to reflect the scanning light beam. In this way, the entire micro-electromechanical galvanometer can be processed in one piece, and the process is simpler. Among them, the torsion support structure 112, the reinforcing connection 113 and the driving coil 116 on the galvanometer chip 110 are all located directly below the reflector 120. The torsion support structure 112, the reinforcing connection 113 and the driving coil 116 constitute the movable structure of the galvanometer chip 110. The outer dimensions of the movable structure of the galvanometer chip 110 are less than or equal to the outer dimensions of the reflector 120. That is, the torsion support structure 112, the reinforcing connection 113 and the driving coil 116 in the galvanometer chip 110 do not exceed the area range of the reflector 120 in the plane layout, so that a large mirror surface of the reflector 120 with the largest possible area can be obtained within the same size range of the micro-electromechanical galvanometer to meet the design requirements of small volume and large mirror surface.
[0046] Optional, please refer again Figures 3 to 5 , the reinforcing connector 113 is in a grid shape, and the thickness of the torsion support structure 112 is less than the thickness of the reinforcing connector 113. The reinforcing connector 113 is formed into a grid-shaped whole, and is arranged above the torsion support structure 112. When the grid-shaped reinforcing connector 113 is arranged on the torsion support structure 112, the central part of the reinforcing connector 113 corresponding to the central area of the reflector 120 is solid, so as to facilitate the setting of the bonding area 115. In an optional example, the outer contour shape of the reinforcing connector 113 can be the same as or different from the outer contour shape of the torsion support structure 112, and the interior of the reinforcing connector 113 includes a plurality of through holes penetrating the upper and lower ends thereof, and these through holes can form a heat insulation channel 118 between the torsion support structure 112 and the reflector 120.
[0047] In some embodiments, see Fig. 9The micro-electromechanical galvanometer also includes a magnetic component 14 and a limiting component 13. The galvanometer chip 110 is fixed to the limiting component 13 through a fixed frame 111. The magnetic component 14 includes a plurality of groups of magnets fixed to the limiting component 13 and used to provide a magnetic field for the driving coil 116. The limiting component 13 can be used as a main frame supporting the micro-electromechanical galvanometer. The fixed frame 111, the galvanometer chip 110 and the reflector 120 are formed as a whole and are arranged at the top of the limiting component 13. The fixed frame 111 is connected to the limiting component 13. The magnetic component 14 is arranged on the limiting component 13 and is located in the area directly below the driving coil 116. In the magnetic field of the magnetic component 14, the driving coil 116 is energized to generate a Lorentz force to drive the torsion support structure 112 to perform a torsion motion around the axis of the rotating shaft beam structure 114. Then, the torsion support structure 112 drives the reflector 120 to perform a synchronous torsion motion through the reinforcing connector 113, thereby realizing a one-dimensional scan around the axis of the rotating shaft beam structure 114.
[0048] In general, the MEMS galvanometer provided in the embodiments of the present application has at least the following characteristics:
[0049] First, the chip part of the MEMS galvanometer is formed into a separate structure composed of a reflector 120 and a galvanometer chip 110. The galvanometer chip 110 includes a torsion support structure 112, a reinforcing connector 113, and a drive coil 116. These three parts are all located directly below the reflector 120, and in terms of the plane layout, they do not exceed the mirror area of the reflector 120. In this way, while the MEMS galvanometer increases the mirror area, the overall total area is relatively small, and it has the advantages of small size and large mirror.
[0050] Second, during the operation of the MEMS galvanometer, the drive coil 116 will generate heat. Since the thermal expansion coefficients of the metal material commonly used in the drive coil 116 and the silicon material commonly used in the chip are inconsistent, the reflector 120 is prone to thermal deformation. The reflector 120 is only connected and fixed to the center of the galvanometer chip 110 by bonding, which greatly reduces the thermal deformation of the reflector 120 and ensures the flatness of the mirror surface. In addition, a hollow area 119 can be formed in the center of the torsion support structure 112, which can enhance heat dissipation during the torsion process, reduce the temperature rise of the reflector 120, and further effectively suppress the thermal deformation between the reflective film 122 layer of the reflector 120 and the mirror substrate 121.
[0051] Third, the torsion support structure 112 and the reinforcing connector 113 can be processed into a hollow structure, which can significantly reduce the moment of inertia for the design of the chip part of the micro-electromechanical galvanometer composed of the torsion support structure 112, the reinforcing connector 113 and the reflector 120. Under the condition of the same beam stiffness of the rotating shaft beam structure 114 , the fundamental resonance frequency of the reflector 120 is higher, so the micro-electromechanical galvanometer can obtain better mechanical reliability.
[0052] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A micro-electromechanical galvanometer, characterized in that: include: Reflector; A galvanometer chip, comprising a torsion support structure spaced apart from the reflector and a reinforcing connector connected between the torsion support structure and the reflector, wherein the reinforcing connector forms a heat-insulating channel between the torsion support structure and the reflector, and a driving coil is disposed on the torsion support structure; A fixed frame connected to the torsion support structure via a rotating shaft beam structure; The centers of mass of the reflector and the galvanometer chip are on the same axis, and the driving coil is subjected to electromagnetic force in the magnetic field after being energized, so as to drive the torsion support structure to drive the reflector to rotate around the rotating shaft beam structure.
2. The micro-electromechanical galvanometer according to claim 1, characterized in that: The reinforcing connector is provided with a bonding area at one end connected to the reflector, and the bonding area includes at least one bonding point bonded to the reflector.
3. The micro-electromechanical galvanometer according to claim 2, characterized in that: There are multiple bonding points, and the multiple bonding points are symmetrically arranged relative to the center of the reflector. The bonding points are bonded and fixed to the reflector by adhesive.
4. The micro-electromechanical galvanometer according to claim 3, characterized in that: The bonding area corresponds to a central area of the reflector.
5. The micro-electromechanical galvanometer according to claim 1, characterized in that: A hollow area is provided in the center of the torsion support structure; The driving coil is disposed around the periphery of the hollow area.
6. The micro-electromechanical galvanometer according to claim 5, characterized in that: The driving coil is formed by winding an enameled wire and is bonded to the outer edge area of the torsion support structure; Alternatively, the drive coil is fixed to the outer edge region of the torsion support structure by electroplating or sputtering.
7. The micro-electromechanical galvanometer according to claim 1, characterized in that: The reflector comprises a mirror substrate and a reflective film arranged on the mirror substrate, and the reinforcing connector is connected to a side of the mirror substrate away from the reflective film.
8. The micro-electromechanical galvanometer according to claim 1, characterized in that: The outer dimension of the movable structure of the galvanometer chip is smaller than or equal to the outer dimension of the reflector.
9. The micro-electromechanical galvanometer according to claim 1, characterized in that: The reinforcing connecting member is in a grid shape, and the thickness of the torsion support structure is smaller than the thickness of the reinforcing connecting member.
10. The micro-electromechanical galvanometer according to claim 1, characterized in that: The micro-electromechanical galvanometer also includes a magnetic component and a limit component. The galvanometer chip is fixed to the limit component through the fixed frame. The magnetic component includes multiple groups of magnets fixed to the limit component and used to provide a magnetic field for the drive coil.