Camera module testing device

Abstract

The utility model discloses a camera module testing device which can prevent components from being burnt out when a camera module is disassembled and assembled. The camera module testing device comprises a control terminal used for outputting at least one control signal; an output interface; the driving mainboard is connected with the camera module to be tested through the output interface and is connected with the control terminal, and the driving mainboard responds to the control signal and outputs a plurality of first driving signals to the output interface; and the power management component is connected with the camera module through the output interface, and the power management component is used for outputting at least one of AVDD, DOVDD, DVDD and VAAM signals to the output interface.

Description

Technical Field

[0001] The present application relates to the technical field of camera modules, and in particular to a camera module testing device. Background Art

[0002] The camera module is an important electronic device for capturing images in video shooting equipment and is widely used in various terminal devices.

[0003] In order to ensure the product quality of the camera module, a lighting pre-test link is set in the production process of the camera module; specifically, the second pins (PIN) of the camera module can be connected through a test system or a test device and various working signals can be loaded to complete various module function tests. In order to facilitate the disassembly and assembly of the camera module, the test device is provided with multiple first pins (PIN), and the first pins are connected to the corresponding second pins on the camera module through a probe or other means to establish a communication connection.

[0004] In order to improve the test efficiency, the test device usually adopts the mode of continuous testing with power on and not shutting down, so multiple first pins are in a live state, and disassembly and assembly of the camera module are all live operations. At the same time, the first pin and the second pin are fine integrated components, and the spacing between the pins (or probes) that play a connecting role inside is about 0.1mm. It is very easy to cause a short circuit between the pins (or probes) due to improper operation, which leads to the risk of burning the components on the driver motherboard or the components on the camera. Utility Model Content

[0005] The present application provides a camera module testing device to solve the technical problem in the prior art that during the camera module testing operation, pins (or probes) are easily short-circuited, thereby causing components on the driver mainboard or on the camera to burn out.

[0006] The present application provides a camera module testing device, comprising:

[0007] A control terminal, configured to output at least one control signal;

[0008] Output interface;

[0009] A driving mainboard, connected to the camera module to be tested through the output interface and connected to the control terminal, and the driving mainboard outputs a plurality of first driving signals to the output interface in response to the control signal;

[0010] A power management component is connected to the camera module via the output interface, and the power management component is used to output at least one of AVDD, DOVDD, DVDD and VAAM signals to the output interface.

[0011] In some embodiments, the power management component includes a number of low-dropout regulators corresponding to the output signal of the power management component, and the low-dropout regulators are used to provide the corresponding output signal of the power management component.

[0012] In some embodiments, the power management component further includes:

[0013] The switch subcomponent is used to control the output and stop of the output signal of the power management component.

[0014] In some embodiments, the switch subcomponent includes a transistor.

[0015] In some embodiments, the driving mainboard is further used to provide a plurality of second driving electrical signals to the power management component, and the power management component outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the second driving electrical signals.

[0016] In some embodiments, the power management component includes four low voltage dropout regulators, and the four low voltage dropout regulators are used to output AVDD, DOVDD, DVDD and VAAM signals respectively;

[0017] The switch subcomponent includes a transistor, and the input control ends of the four low-voltage dropout regulators are all connected to the transistor, and the transistor simultaneously controls the signal output and stop of the output ends of the four low-voltage dropout regulators.

[0018] In some embodiments, the camera module testing device further includes:

[0019] The power supplier is connected to the power management component and provides at least one power signal to the power management component. The power management component outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the power signal.

[0020] In some embodiments, the driving mainboard includes: at least one level conversion chip;

[0021] The level conversion chip outputs at least one of D0-D7, RESET, PWDN, XCLK and I2C signals in response to the control signal of the control terminal.

[0022] In some embodiments, the output interface includes a plurality of first pins, and the camera includes a plurality of second pins;

[0023] Wherein, when testing the camera module, the first pin is directly connected to the corresponding second pin, or the first pin is connected to the corresponding second pin through a probe.

[0024] In some embodiments, the driver mainboard communicates with the camera through the output interface based on the IIC protocol.

[0025] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: on the one hand, the power management component is a functional component different from the driving mainboard (for example, the power management component is a circuit board different from the driving mainboard), the structure of the driving mainboard is complex, and after the control terminal stops outputting the control signal, the residual charge or residual current of the driving mainboard will not affect the shutdown of the power management component, thereby not affecting the first pin of the output interface that outputs AVDD, DOVDD, DVDD and VAAM signals to be completely powered off during disassembly and assembly; on the other hand, the signal output by the power management component does not need to undergo complex signal conversion, the structure of the power management component is simple, and residual charge or residual current is not easily generated in the power management component, thereby causing the first pin of the output interface that outputs AVDD, DOVDD, DVDD and VAAM signals to be completely powered off during disassembly and assembly. Through the above two aspects, even if the current or voltage of the AVDD, DOVDD, DVDD and VAAM signals is large, the corresponding first pin is completely powered off when the camera module is disassembled or assembled, or the first pin that outputs a large current or voltage is completely powered off. Even if a short circuit occurs between the pins (or probes) due to improper operation, it will not cause the components on the driving motherboard or the camera to burn out, thereby improving the yield of the camera module test. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application;

[0028] Figure 2 A first detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application;

[0029] Figure 3 A second detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application;

[0030] Figure 4 A third detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of the principle of components connected to the power management component on the driver mainboard provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of a switch sub-component provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of a transistor provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of a power management component provided in an embodiment of the present application;

[0035] Fig. 9 A schematic diagram of a driving mainboard provided in an embodiment of the present application;

[0036] Fig.10 A schematic diagram of an output interface or adapter board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0038] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0039] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0040] In order to improve the test efficiency, the test device usually adopts the mode of continuous testing with power on and without shutdown, so multiple first pins are in a live state, and the disassembly and assembly of the camera module are all live operations. At the same time, the first pin and the second pin belong to a fine integrated component, and the spacing between the pins (or probes) that play a connecting role inside is about 0.1mm. It is very easy to cause a contact short circuit between the pins (or probes) due to improper operation, which in turn leads to the risk of burning the components on the driver motherboard or the components on the camera. For example, the situation where the contact short circuit between the pins (or probes) caused by improper operation is very easy to occur includes: when disassembling and assembling the camera module, due to factors such as hand shaking of the disassembling personnel, a second pin touches the non-corresponding first pin or probe, and a higher voltage or current on the non-corresponding first pin or probe is input into the first pin, causing the components on the camera to burn; when disassembling and assembling the camera module, the probe is offset, so that a second pin touches the non-corresponding first pin or probe, and a higher voltage or current on the non-corresponding first pin or probe is input into the first pin, causing the components on the camera to burn. It should be noted that the contact short circuit between the pins (or probes) caused by improper operation can be caused by other factors.

[0041] Based on this, the inventor provides a camera module testing device that can solve the technical problem in the prior art that during the camera module testing operation, pins (or probes) are easily short-circuited, which in turn leads to burning of components on the driver motherboard or components on the camera.

[0042] The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings.

[0043] See also Figures 1 to 4 , Figure 1 A schematic diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application; Figure 2 A first detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application; Figure 3 A second detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application; Figure 4 A third detailed block diagram of a camera module testing device and a camera module to be tested provided in an embodiment of the present application.

[0044] See also Figures 5 to 10 , Figure 5 A schematic diagram of the principle of components connected to the power management component on the driver mainboard provided in an embodiment of the present application; Figure 6 A schematic diagram of a switch sub-component provided in an embodiment of the present application; Figure 7 A schematic diagram of a transistor provided in an embodiment of the present application; Figure 8 A schematic diagram of a power management component provided in an embodiment of the present application; Fig. 9 A schematic diagram of a driving mainboard provided in an embodiment of the present application; Fig.10 A schematic diagram of an output interface or adapter board provided in an embodiment of the present application.

[0045] The utility model provides a camera module testing device 100, such as Figure 1 As shown, the camera module test device 100 includes: a control terminal 10, an output interface 30, a driving mainboard 20, and a power management component 40. The control terminal 10 is used to output at least one control signal; the driving mainboard 20 is connected to the camera module 50 to be tested through the output interface 30, and the driving mainboard 20 is connected to the control terminal 10, and the driving mainboard 20 responds to the control signal and outputs a plurality of first driving signals to the output interface 30 connected thereto; the power management component 40 is connected to the camera module 50 through the output interface 30, and the power management component 40 is used to output at least one of AVDD, DOVDD, DVDD and VAAM signals to the output interface 30.

[0046] Specifically, the control terminal 10 can be a desktop computer, a tablet computer, or an electronic terminal (such as a mobile phone) to be installed with a camera, a host computer, etc. The control terminal 10 outputs at least one control signal, and the control signal can be transmitted to the camera module 50 after being processed by the driving motherboard 20, so as to control the camera module 50 to light up or turn off.

[0047] Specifically, the driving mainboard 20 may be a circuit board (PCB board), an FPC board, etc., and a plurality of electronic components may be arranged on the driving mainboard 20 to output at least one of D0-D7, RESET, PWDN, XCLK and I2C signals.

[0048] Specifically, the camera module testing device 100 may further include a test fixture, which is used to fix the camera module 50 . The output interface 30 may be a component or structure on the test fixture, which is used to connect the camera module 50 .

[0049] Specifically, the output interface 30 enables the driving mainboard 20 to be communicatively connected or electrically connected to the camera module 50 to be tested, and the output interface 30 enables the power management component 40 to be communicatively connected or electrically connected to the camera module 50 to be tested.

[0050] Specifically, the power management component 40 may be a circuit board or FPC or other components different from the driving mainboard 20 . The power management component 40 may be installed on a test fixture, but is not limited thereto.

[0051] In the related art, the functional components of the power management component 40 are arranged in the driver mainboard 20, and the control terminal 10 can establish communication with the camera module 50 only through the driver mainboard 20. Even if the control terminal 10 stops outputting control signals through the control of functional components such as software on the control terminal 10, since the camera module testing device 100 has undergone a long-lasting continuous testing process, there is still a large amount of residual charge or residual current (for example, static electricity) in the driver mainboard 20, so that there is still charge or current on the output interface 30, and it is also very easy for the contact short circuit between the pins (or probes) to occur due to improper operation, which leads to the risk of burning out the components on the driver mainboard or the components on the camera. In particular, the current or voltage of AVDD, DOVDD, DVDD and VAAM signals is relatively large, and the first pin for outputting AVDD, DOVDD, DVDD and VAAM signals in the output interface 30 is more likely to cause component burning. Therefore, the inventor proposes to set the power management component 40 as a functional component different from the driving main board 20 (for example, the power management component 40 is a circuit board different from the driving main board 20). At this time, even if the camera module testing device 100 undergoes a long-lasting continuous testing process, there is still a large amount of residual charge or residual current in the driving main board 20, but the power management component 40 is a functional component different from the driving main board 20. When the power management component 40 is controlled to stop outputting signals when the camera module 50 is disassembled, the power management component 40 will not be affected by the residual charge or residual current in the driving main board 20, and the signal output by the power management component 40 does not need to undergo complex signal conversion. The structure of the power management component 40 is simple, and residual charge or residual current is not easily generated in the power management component 40, so that the first pin for outputting AVDD, DOVDD, DVDD and VAAM signals in the output interface 30 is powered off during disassembly, thereby avoiding the risk of component burning.

[0052] Therefore, in the present application, on the one hand, the power management component 40 is a functional component different from the driving main board 20, for example, the power management component 40 is a circuit board different from the driving main board 20, the driving main board 20 and the power management component 40 are electrically connected to the camera module respectively, for example, the driving main board 20 is electrically connected between the control terminal 10 and the camera module 50, and the power management component 40 is electrically connected between the power supply 60 and the camera module 50, the structure of the driving main board 20 is complicated, after the control terminal 10 stops outputting the control signal, since the power management component 40 is a functional component different from the driving main board 20, the power management component 40 is not As the driving mainboard 20 is relatively independent, the residual charge or residual current of the driving mainboard 20 will not affect the shutdown of the power management component 40, and thus will not affect the first pin of the output interface 30 that outputs the AVDD, DOVDD, DVDD and VAAM signals to be completely powered off during disassembly; on the other hand, the signal output by the power management component 40 does not need to undergo complex signal conversion, the structure of the power management component 40 is simple, and it is not easy to generate residual charge or residual current in the power management component 40, so that the first pin of the output interface 30 that outputs the AVDD, DOVDD, DVDD and VAAM signals is completely powered off during disassembly. Through the above two aspects, even if the current or voltage of the AVDD, DOVDD, DVDD and VAAM signals is large, when the camera module 50 is disassembled and assembled, the corresponding first pin is completely powered off, or the first pin that outputs a large current or voltage is completely powered off, so that even if there is a contact short circuit between the pins (or probes) due to improper operation, it will not cause the components on the driving mainboard or the components on the camera to burn, thereby improving the yield rate of the camera module 50 test.

[0053] In the present application, it is easy to understand that the more types of AVDD, DOVDD, DVDD and VAAM signals output by the power management component 40, the smaller the number of AVDD, DOVDD, DVDD and VAAM signals that need to be output on the driving mainboard 20, the smaller the impact of static electricity on the driving mainboard 20 on the AVDD, DOVDD, DVDD and VAAM signals, and the lower the risk of burning components on the driving mainboard or the camera. For example, the risk of burning components on the driving mainboard or the camera due to two of the AVDD, DOVDD, DVDD and VAAM signals output by the power management component 40 is low risk; for example, the risk of burning components on the driving mainboard or the camera due to four of the AVDD, DOVDD, DVDD and VAAM signals output by the power management component 40 is zero risk.

[0054] In some embodiments, the power management component 40 includes a number of low-dropout regulators corresponding to the output signal of the power management component 40 , and the low-dropout regulators are used to provide the output signal of the corresponding power management component 40 .

[0055] Specifically, the output signal of the corresponding power management component 40 is provided by a low voltage dropout regulator, that is, at least one of AVDD, DOVDD, DVDD and VAAM signals is provided by the low voltage dropout regulator, so that the power management component 40 has a simple structure and is not prone to residual charge.

[0056] like Figure 8 As shown, a schematic diagram of the principle of the power conversion component 40 or the signal output subcomponent 41 is illustrated. More specifically, Figure 8 A plurality of low-dropout regulators or LDOs are exemplified to convert a plurality of input signals of the power conversion component 40 into AVDD, DOVDD, DVDD and VAAM and transmit them to the output interface.

[0057] In some embodiments, Figure 2 As shown, the power management component 40 further includes a switch subcomponent 42 , and the switch subcomponent 42 is used to control the output and stop of the output signal of the power management component 40 .

[0058] Specifically, the power management component 40 includes a signal output subcomponent 41 and a switch subcomponent 42 . The switch subcomponent 42 can control the output and stop of the output signal of the signal output subcomponent 41 . The signal output subcomponent 41 includes a number of low voltage dropout regulators corresponding to the output signal of the power management component 40 .

[0059] Specifically, in one implementation, the switch subcomponent 42 may be a structural component such as a button or a knob, which may independently control the output and stop of the output signal of the power management component 40 .

[0060] Specifically, in one implementation, the switch subcomponent 42 may be an electronic component, and the switch subcomponent 42 may be controlled by a signal from the control terminal 10 to control the output and stop of the output signal of the power management component 40 .

[0061] like Figure 6 As shown, multiple input pins and multiple output pins of the switch subcomponent 42 are illustrated. The switch subcomponent 42 may be a dip switch, so that different voltages may be selected by the dip switch to provide AVDD, DOVDD, DVDD and VAAM signals.

[0062] In some embodiments, the switch subassembly 42 includes a transistor.

[0063] Specifically, the switch subcomponent 42 includes a transistor, and the transistor can be controlled by a signal from the control terminal 10 to control the output and stop of the output signal of the power management component 40 .

[0064] like Figure 7 As shown, the structure of an example transistor is shown, and the transistor can be a dial transistor. Figure 7 The example in which the transistor is selected is the S8550 model, but the transistor can also be other models. Figure 7 Two triodes are shown in the example, and the switch subcomponent 42 may include two triodes, one of which is a standby triode. When one triode is damaged, the other triode is selected.

[0065] In some embodiments, Figure 2 As shown, the driving mainboard 20 is also used to provide a plurality of second driving electrical signals to the power management component 40, and the power management component 40 outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the second driving electrical signals.

[0066] Specifically, the switch subcomponent 42 may be an electronic component, and the switch subcomponent 42 may be controlled by the second driving electrical signal of the driving mainboard 20 to control the output and stop of the output signal of the power management component 40 .

[0067] like Figure 5 As shown, Figure 5 The schematic diagram of the principle of the components on the driving main board 20 for processing the control signal of the control terminal 10 and outputting multiple second driving electrical signals is illustrated. The power management component 40 is connected Figure 5 The components shown and receive Figure 5 The signals output by the components shown are processed by the power management component 40 to output at least one of the AVDD, DOVDD, DVDD and VAAM signals.

[0068] In some embodiments, the power management component 40 includes four low voltage dropout regulators, which are used to output AVDD, DOVDD, DVDD and VAAM signals respectively; the switch subcomponent 42 includes a transistor, and the input control ends of the four low voltage dropout regulators are all connected to the transistor, which acts as a switch, and the transistor simultaneously controls the output and stop of the signals at the output ends of the four low voltage dropout regulators, which can better simplify the structure of the power management component 40, and when disassembling the camera module 50, avoid the residual current or charge (for example: static electricity) in the power management component 40, which can better avoid the burning of the components on the driving main board or the components on the camera. At the same time, the structure of the power management component 40 can be better simplified to avoid the residual current or charge (for example: static electricity) in the power management component 40.

[0069] In some embodiments, Figure 3 and Figure 4 As shown, the camera module testing device 100 also includes a power supply 60, which is connected to the power management component 40 and provides at least one power signal to the power management component 40. The power management component 40 outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the power signal.

[0070] Specifically, in this implementation, unlike Figure 2 The power management unit 40 of the embodiment outputs at least one of the AVDD, DOVDD, DVDD and VAAM signals in response to the second driving electrical signal. Figure 3 and Figure 4 The power management unit 40 of the embodiment outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the power signal.

[0071] Specifically, in some implementations, the AVDD signal is an analog power signal, the DOVDD signal is a digital I0 power signal, the DVDD signal is a digital power signal, and the VAAM signal is a zoom motor power supply signal.

[0072] In some embodiments, the driving motherboard 20 includes at least one level conversion chip; the level conversion chip responds to the control signal of the control terminal 10 to output at least one of the D0-D7, RESET, PWDN, XCLK and I2C signals.

[0073] Specifically, a level conversion chip is an electronic device used to convert one level to another. It can convert an input level signal into an output level signal so as to connect and communicate with other circuits or devices. Level conversion chips are usually used for interfaces between different levels, such as converting a low-level signal to a high-level signal or converting a high-level signal to a low-level signal.

[0074] Specifically, a level conversion chip is an electronic device used to convert one level to another. It can convert an input level signal into an output level signal so as to connect and communicate with other circuits or devices. Level conversion chips are usually used for interfaces between different levels, such as converting a low-level signal to a high-level signal or converting a high-level signal to a low-level signal.

[0075] Specifically, in some implementations, the D0-D7 signals are image data signals, the RESET signal and the PWDN signal are reset signals, the XCLK is a clock signal, and the I2C signal is a communication protocol signal.

[0076] Specifically, in some other embodiments, the driving mainboard 20 may include other numbers of level conversion chips, for example, 2 or 5 level conversion chips.

[0077] like Fig. 9 As shown, a schematic diagram of the principle of driving the mainboard 20 or the level conversion chip is illustrated. Fig. 9 The level conversion chip of the illustrated principle responds to the control signal of the control terminal 10 and outputs at least one of the signals D0-D7, RESET, PWDN, XCLK and I2C.

[0078] In some embodiments, the output interface 30 includes multiple first pins, and the camera includes multiple second pins; wherein, when testing the camera module 50, the first pin is directly connected to the corresponding second pin, or the first pin is connected to the corresponding second pin through a probe.

[0079] In some embodiments, the driving mainboard 20 communicates with the camera through the output interface 30 based on the IIC protocol.

[0080] like Fig.10 As shown, Fig.10 A schematic diagram showing multiple pins of the output interface, or Fig.10 The schematic diagram of multiple pins (PINs) of the adapter board connected between the driving main board 20 and the output interface 30, and between the power management component 40 and the output interface, the driving main board 20 and the power management component 40 can be connected through Fig.10 The multiple pins shown input corresponding signals to the camera module 50 .

[0081] It should be noted that in Figure 2 In the example, the power management component 40 outputs at least one of the AVDD, DOVDD, DVDD and VAAM signals in response to the second driving electrical signal of the control terminal 10; Figure 3 and Figure 4 For example, the power management unit 40 outputs at least one of the AVDD, DOVDD, DVDD, and VAAM signals in response to the power signal of the power supplier 60 . Figure 2 , Figure 3 and Figure 4 In the example, the power management components 40 may include a signal output subcomponent 41 and a switch subcomponent 42 . The switch subcomponent 42 may include a transistor, and the signal output subcomponent 41 may include a low dropout regulator or LDO.

[0082] It should be noted that in Figure 2 In the example, after Figure 5 The exemplary components process the control signal of the control terminal 10 and output a plurality of second driving electrical signals. The power management component 40 is connected to Figure 5 The components shown and receive Figure 5 The signals output by the components shown are processed by the power management component 40 to output at least one of the AVDD, DOVDD, DVDD and VAAM signals. This can further simplify the structure of the power management component 40, making it less likely for residual charge or residual current to be generated in the power management component 40, thereby making the first pin of the output interface 30 that outputs the AVDD, DOVDD, DVDD and VAAM signals completely powered off during disassembly.

[0083] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0084] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0085] In addition, in this application, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0086] In the description of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0088] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0089] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A camera module testing device, characterized in that: include: A control terminal, configured to output at least one control signal; Output interface; A driving mainboard, connected to the camera module to be tested through the output interface and connected to the control terminal, and the driving mainboard outputs a plurality of first driving signals to the output interface in response to the control signal; A power management component is connected to the camera module via the output interface, and the power management component is used to output at least one of AVDD, DOVDD, DVDD and VAAM signals to the output interface.

2. The camera module testing device according to claim 1, characterized in that: The power management component includes a number of low-voltage dropout regulators corresponding to the output signal of the power management component, and the low-voltage dropout regulators are used to provide the corresponding output signal of the power management component.

3. The camera module testing device according to claim 2, characterized in that: The power management component also includes: The switch subcomponent is used to control the output and stop of the output signal of the power management component.

4. The camera module testing device according to claim 3, characterized in that: The switch subcomponent includes a triode.

5. The camera module testing device according to claim 4, characterized in that: The driving mainboard is further used to provide a plurality of second driving electrical signals to the power management component, and the power management component outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the second driving electrical signals.

6. The camera module testing device according to claim 5, characterized in that: The power management component includes four low voltage dropout regulators, and the four low voltage dropout regulators are used to output AVDD, DOVDD, DVDD and VAAM signals respectively; The switch subcomponent includes a transistor, and the input control ends of the four low-voltage dropout regulators are all connected to the transistor, and the transistor simultaneously controls the signal output and stop of the output ends of the four low-voltage dropout regulators.

7. The camera module testing device according to claim 1, characterized in that: The camera module testing device also includes: The power supplier is connected to the power management component and provides at least one power signal to the power management component. The power management component outputs at least one of AVDD, DOVDD, DVDD and VAAM signals in response to the power signal.

8. The camera module testing device according to claim 1, characterized in that: The driving mainboard includes: at least one level conversion chip; The level conversion chip outputs at least one of the D0-D7, RESET, PWDN, XCLK and I2C signals in response to the control signal of the control terminal.

9. The camera module testing device according to claim 1, characterized in that: The output interface includes a plurality of first pins, and the camera includes a plurality of second pins; Wherein, when testing the camera module, the first pin is directly connected to the corresponding second pin, or the first pin is connected to the corresponding second pin through a probe.

10. The camera module testing device according to claim 9, characterized in that: The driving mainboard communicates with the camera through the output interface based on the IIC protocol.

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