High-power backlight module with characteristics of high integration and uniform light emission
By adopting an integrated LED structure and a finely controlled LED point light source, the problem of backlight module affecting printing accuracy and product thickness in the prior art is solved, and higher integration and light output uniformity are achieved.
Patent Information
- Application Number
- CN202420821599.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-19
AI Technical Summary
In the prior art, the backlight module using a single package structure of the whole board affects the printing accuracy, and the product is thicker and heavier.
Adopting an integrated LED structure, LED point light sources with higher density can be finely controlled by driving, adopt a chip arrangement structure of 25 and 50 strings, and are arranged and distributed through cross-dislocation to improve the uniformity and intensity of light output.
It improves the accuracy of the 3D printing model, reduces the volume and weight of the backlight module, and achieves higher integration and light output uniformity.
Smart Images
Figure CN222674880U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, and in particular to a high-power backlight module with high integration and uniform light output characteristics. Background Art
[0002] 3D printers based on photosensitive resins have become very popular in recent years. We usually call them "photocuring". In the prior art, the backlight module of 3D printing equipment is usually a single lamp bead and a lens corresponding to each single lamp bead integrated on a whole package board. When lit, the whole package emits light together.
[0003] The problems brought by this type of packaging structure are: 1. The light source is not fine enough, because this type of backlight module uses a large-particle lens corresponding to the lamp beads on one side, and due to the overall luminous characteristics, light also exists in parts that do not need light, which directly affects the accuracy of the final printed model; 2. Lack of control of individual light source points. At present, this type of overall luminous backlight module has a small number of lamp beads, so only one control switch is used to control the overall lighting and closing, which further causes the low accuracy of the printed model.
[0004] In view of this, this technical solution proposes a high-power backlight module with high integration and uniform light output characteristics. It adopts an integrated LED structure, and the high-density LED point light sources can be finely controlled by driving (accurate to one pixel switch control, which can be turned off in the parts that do not need light), which can further increase the accuracy of the printed model. The overall structure is simple, and after installation, the overall volume and thickness of the backlight module are reduced, and the weight is lightened. Utility Model Content
[0005] The technical solution of the utility model aims to solve at least one of the technical problems in the related art to a certain extent. To this end, the main purpose of the utility model is to provide a high-power backlight module with high integration and uniform light output characteristics, aiming to solve the problems of the backlight module using a whole-board single-chip packaging structure in the prior art affecting the printing accuracy, and the product thickness and weight being relatively thick.
[0006] To achieve the above-mentioned purpose, the utility model provides a high-power backlight module with high integration and uniform light output characteristics, including a base bracket, and a first light source module and a second light source module arranged on one side of the base bracket, the first light source module and the second light source module are symmetrically arranged on the base bracket, the chip arrangement structure of the first light source module and the second light source module is 25 parallel and 50 series, and adjacent chips are arranged and distributed in a cross-staggered manner.
[0007] As a further solution of the utility model, a honeycomb solder pad is provided on the other side of the base bracket. The honeycomb solder pad is distributed on both sides of the edge of the base bracket with a larger solder pad area, and the solder pad spans the central axis of symmetry.
[0008] As a further solution of the present invention, the base bracket is an aluminum nitride ceramic bracket structure.
[0009] As a further solution of the present invention, the number of chips in each of the first light source module and the second light source module is 1250.
[0010] The beneficial effects of the utility model are as follows:
[0011] The high-power backlight module with highly integrated and uniform light output characteristics proposed by the utility model replaces the traditional single-particle chip and lens (LCD solution) with an integrated LED packaging solution. The overall structure is simple, and after installation, the overall volume and thickness of the backlight module are reduced, the weight is lightened, and the high-density LED point light sources can be finely controlled by driving (switch control accurate to one pixel, which can be turned off in areas where light is not needed), further increasing the accuracy of the printed model. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the embodiments of the utility model technical solution or the utility model technical solution in the prior art, the drawings required for use in the embodiments or the prior art descriptions will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model technical solution. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0013] Figure 1 It is the overall and enlarged schematic diagram of the light source module on the front of the utility model product after mounting.
[0014] Figure 2 It is a schematic diagram of the arrangement of the honeycomb welding pad in the utility model.
[0015] Figure 3 This is a schematic diagram of the support structure of the utility model product when no chip is mounted.
[0016] Figure 4 It is a partial schematic diagram of the circuit structure of the utility model product.
[0017] Figure 5 This is a schematic diagram of the application of the product of the utility model as a plane lens.
[0018] Figure 6 This is a schematic diagram of another application of the curved lens screen of the utility model.
[0019] [Main parts / assembly reference numerals]
[0020] Label name Label name 1 Base bracket 21 First light source module 10 Honeycomb pad 22 Second light source module DETAILED DESCRIPTION
[0021] as follows:
[0022] Please see attached Figure 1-6 ,
[0023] The main structure includes a base bracket 1, and a first light source module 21 and a second light source module 22 arranged on one side of the base bracket 1. The first light source module 21 and the second light source module 22 are symmetrically arranged on the base bracket 1. The chip arrangement structure in the first light source module 21 and the second light source module 22 is 25 parallel and 50 series, and adjacent chips are arranged in a cross-staggered manner.
[0024] Here’s how it works:
[0025] By adopting an LED-type integrated packaging structure, the illumination area is made more refined, further improving the precision of the 3D printed model. A control structure that can be used for individual light source points is adopted, so that each chip can be turned off in the area where illumination is not required. A module with 25 parallel and 50 series and 1250 chips on one side is adopted, which can adapt to and replace the traditional module solutions that are currently used more. The cross-staggered arrangement distribution can improve the uniformity and intensity of light output.
[0026] A preferred embodiment of the present invention: a honeycomb pad 10 is provided on the other side of the base bracket 1. The honeycomb pad 10 is distributed on both sides of the edge of the base bracket 1 with a larger pad area, and the pad spans the symmetry axis.
[0027] The honeycomb back pads are distributed on the edge side of the bracket with a larger pad area, and the pads span the symmetrical central axis, both of which can improve the mechanical strength of the bracket.
[0028] A preferred embodiment of the present invention: the base support 1 is an aluminum nitride ceramic support structure. The number of chips in the first light source module 21 and the second light source module 22 is 1250.
[0029] A piece of aluminum nitride ceramic bracket is used to distribute the chips symmetrically on the left and right sides, with 1250 chips on one side and a total of 2500 chips on both sides.
[0030] The above are only preferred embodiments of the technical solution of the utility model, and do not limit the patent scope of the technical solution of the utility model. All equivalent structural changes made by using the contents of the technical solution description and drawings of the utility model under the conception of the technical solution of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the technical solution of the utility model.
Claims
1. A high-power backlight module with high integration and uniform light output, characterized in that: include A base bracket, and a first light source module and a second light source module arranged on one side of the base bracket, the first light source module and the second light source module are symmetrically arranged on the base bracket, the chip arrangement structure of the first light source module and the second light source module is 25 parallel and 50 series, and adjacent chips are arranged in a cross-staggered manner.
2. The high-power backlight module with high integration and uniform light output according to claim 1, characterized in that: A honeycomb soldering pad is provided on the other side of the base bracket. The honeycomb soldering pad corresponds to the first light source module and the second light source module area, is distributed on both sides of the edge of the base bracket, and the soldering pad spans the symmetry center axis.
3. The high-power backlight module with high integration and uniform light output according to claim 1, characterized in that: The base support is an aluminum nitride ceramic support structure.
4. The high-power backlight module with high integration and uniform light output according to claim 1, characterized in that: The number of chips in each of the first light source module and the second light source module is 1250.