Turnover device for double-sided coated silicon wafer

Abstract

The utility model relates to the field of silicon wafer coating, in particular to a turnover device for a double-sided coated silicon wafer, which comprises a turnover tray, a bearing pack, a transmission structure and a plurality of clamping structures, and is characterized in that the turnover tray is fixedly connected with a rotating shaft of the bearing pack and a rotating shaft of the transmission structure through two connecting seats respectively; according to the device, the overturning tray, the bearing set, the transmission structure and the multiple clamping structures are arranged, the multiple clamping structures can be matched with the multiple limiting bases on the overturning tray to clamp and limit a silicon wafer on the tray, and the overturning tray can be driven to overturn by 180 degrees through operation of the transmission structure and matching of the bearing set; in this way, the two faces of the silicon wafer can be coated in the vacuum cavity, the silicon wafer does not need to enter the external atmospheric environment, and the situation that the surface of the silicon wafer is polluted by the external atmosphere can be avoided. And meanwhile, the overturning step is simple and convenient to operate, the steps are few, and the double-sided coating efficiency of the silicon wafer can be improved.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer coating, in particular to a turning device for double-sided coated silicon wafers. Background Art

[0002] In the production process of solar cells, coating of silicon wafers is a key technology to improve the power generation efficiency of solar cells. According to the photoelectric conversion power generation principle of silicon wafers, light will be reflected when it hits the silicon wafer. The optical loss of the silicon wafer will make the output of the solar cell lower than the ideal value. Silicon wafer coating technology is a mature technology to improve the absorption efficiency of solar cells. It has been widely used in the industrial production of solar cells. Some special coating processes require the front and back sides of the silicon wafer to be coated separately.

[0003] In the prior art, when double-sided coating is performed on a silicon wafer, the coating process on one side is usually completed in a vacuum coating chamber before coating the other side. When coating the other side, the silicon wafer needs to leave the vacuum chamber and enter the atmosphere, and the silicon wafer is flipped by an automated device. This will cause the uncoated side of the silicon wafer to be contaminated by the atmosphere. In addition, such an operation requires a long transportation path, many steps, and low coating efficiency. Utility Model Content

[0004] The utility model aims to provide a turning device for double-sided coated silicon wafers.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] Provided is a flipping device for double-sided coated silicon wafers, comprising a flipping tray, a bearing group, a transmission structure and multiple clamping structures, wherein the multiple clamping structures are fixedly mounted on the top of the flipping tray, the top of the flipping tray is fixedly provided with multiple limit seats, the bearing group and the transmission structure are respectively fixedly mounted on both sides of the outside of a vacuum chamber, the flipping tray is located inside the vacuum chamber, two connecting seats are fixedly provided on both sides of the top of the flipping tray, and the flipping tray is fixedly connected to the rotating shafts of the bearing group and the transmission structure through the two connecting seats.

[0007] Furthermore, the clamping structure includes a wafer clamping block, a cam follower and multiple bases, and the multiple bases are fixedly installed on the top of the flip tray. The top of the wafer clamping block passes through the flip tray. The outermost top of the wafer clamping block is rotatably connected to the two outer bases through a rotating connecting shaft. The cam follower is fixedly installed on the inner top of the wafer clamping block. A tension spring shaft is fixedly arranged between the other two bases, and a tension spring is arranged between the tension spring shaft and the bottom end of the wafer clamping block.

[0008] Furthermore, the transmission structure includes a magnetic fluid and a servo motor, both of which are fixedly mounted on an outer wall of one side of the vacuum chamber, the output end of the servo motor is connected to one end of the magnetic fluid through two gears, and the rotating shaft of the other end of the magnetic fluid is fixedly connected to one of the connecting seats.

[0009] Furthermore, it also includes a lifting structure and a downward pressure control structure. The lifting structure is fixedly installed at the bottom end of the vacuum cavity, and the top end of the lifting structure is located inside the vacuum cavity. The downward pressure control structure is fixedly installed at the top end of the vacuum cavity, and the bottom end of the downward pressure control structure is located inside the vacuum cavity.

[0010] Furthermore, the lifting structure includes a cylinder 1, a servo motor 2 and a lifting main seat. The lifting main seat can be slidably installed on the bottom end of the vacuum chamber. The cylinder 1 is fixedly installed on the bottom end of the lifting main seat. A plurality of ejector pins are provided at the output end of the cylinder 1. The servo motor 2 is fixedly installed on the bottom end of the vacuum chamber through a fixed mounting frame. A ball screw is provided on the fixed mounting frame. The bottom end of the lifting main seat and the output end of the servo motor 2 are connected through a ball screw.

[0011] Furthermore, the downward pressure control structure includes cylinder 2, a pre-pressure plate, a lower pressure plate and two guide shafts. Cylinder 2 and the two guide shafts are fixedly installed on the top of the vacuum chamber. The lower pressure plate is fixedly installed on the bottom end of the extended end of cylinder 2. The pre-pressure plate is slidably installed on the bottom end of the extended end of cylinder 2. The pre-pressure plate is located below the lower pressure plate. A compression spring is provided at the connection between the pre-pressure plate and cylinder 2.

[0012] The beneficial effects of the utility model are as follows: the device is provided with a flip tray, a bearing group, a transmission structure and a plurality of clamping structures; the plurality of clamping structures can cooperate with the plurality of limit seats on the flip tray to clamp and limit the silicon wafer on the tray; and by operating the transmission structure and cooperating with the bearing group, the flip tray can be driven to flip 180 degrees, thereby achieving the purpose of flipping the silicon wafer 180 degrees. In this way, the two sides of the silicon wafer can be coated inside the vacuum chamber without entering the external atmospheric environment, thereby avoiding the situation where the surface of the silicon wafer is polluted by the external atmosphere; at the same time, the flipping step is simple to operate, with fewer steps, which can improve the efficiency of double-sided coating of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the following is a brief introduction to the drawings required to be used in the embodiment of the utility model.

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0015] Figure 2 It is a partial three-dimensional structural schematic diagram of the utility model;

[0016] Figure 3 It is a schematic cross-sectional view of a local three-dimensional structure of the utility model;

[0017] Figure 4 is a schematic diagram of the three-dimensional structure of the clamping structure;

[0018] Figure 5 It is a three-dimensional structural schematic diagram of the lifting structure;

[0019] Figure 6 It is a schematic cross-sectional view of the three-dimensional structure of the downward pressure control structure;

[0020] In the figure: 1. flip tray; 1a. limit seat; 1b. connecting seat; 2. clamping structure; 2a. base; 2b. rotating connecting shaft; 2c. wafer clamping block; 2d. cam follower; 2e. tension spring shaft; 2f. tension spring; 3. bearing group; 4. transmission structure; 4a. magnetic fluid; 4b. servo motor one; 4c. gear; 5. vacuum chamber; 6. silicon wafer; 7. lifting structure; 7a. cylinder one; 7b. servo motor two; 7c. ejector pin; 7d. fixed mounting frame; 7e. lifting main seat; 7f. ball screw; 8. downward pressure control structure; 8a. cylinder two; 8b. guide shaft; 8c. downward pressure plate; 8d. pre-pressure plate. DETAILED DESCRIPTION

[0021] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0022] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product.

[0023] Reference Figures 1 to 6The flipping device for double-sided coated silicon wafers shown in the figure comprises a flip tray 1, a bearing group 3, a transmission structure 4 and a plurality of clamping structures 2, wherein the plurality of clamping structures 2 are fixedly mounted on the top of the flip tray 1, and the bottom ends of the plurality of clamping structures 2 are located below the flip tray 1. A plurality of limiting seats 1a are fixedly arranged on the top of the flip tray 1, and when the plurality of clamping structures 2 are in a clamping state, the lower surfaces of the plurality of limiting seats 1a can cooperate with the upper surfaces of the bottom ends of the plurality of clamping structures 2 to clamp and limit the silicon wafer 6. The bearing group 3 and the transmission structure 4 are fixedly installed on both sides of the outside of the vacuum chamber 5, respectively. The flip tray 1 is located inside the vacuum chamber 5. Two connecting seats 1b are fixedly provided on both sides of the top of the flip tray 1. The flip tray 1 is fixedly connected to the rotating shafts of the bearing group 3 and the transmission structure 4 through the two connecting seats 1b. When the transmission structure 4 is running, the rotating shaft of the transmission structure 4 and the rotating shaft of the bearing group 3 will rotate synchronously, and can synchronously drive the flip tray 1 to rotate 180 degrees, thereby achieving the purpose of flipping the silicon wafer 6, so as to facilitate coating on the other side of the silicon wafer 6.

[0024] The clamping structure 2 includes a wafer clamping block 2c, a cam follower 2d and a plurality of bases 2a, which are all fixedly mounted on the top of the flip tray 1 and are in a ring shape. The top of the wafer clamping block 2c penetrates the flip tray 1, and the outermost top of the wafer clamping block 2c is rotatably connected to the two outer bases 2a through a rotating connecting shaft 2b. The cam follower 2d is fixedly mounted on the inner top of the wafer clamping block 2c. When the cam follower 2d is subjected to downward pressure, the cam follower 2d can drive the wafer clamping block 2c to move, so that the wafer clamping block 2c rotates along the central axis of the rotating connecting shaft 2b, so that the clamping structure 2 is in a released state, and the clamping of the silicon wafer 6 is released, so that the silicon wafer 6 is easily removed. A tension spring shaft 2e is fixedly arranged between the other two bases 2a, and a tension spring 2f is arranged between the tension spring shaft 2e and the bottom end of the wafer clamping block 2c. When the cam follower 2d is not subjected to force, the wafer clamping block 2c will keep clamping the silicon wafer 6 under the action of the tension spring 2f.

[0025] The transmission structure 4 includes a magnetic fluid 4a and a servo motor 4b. The magnetic fluid 4a and the servo motor 4b are fixedly mounted on the outer wall of one side of the vacuum chamber 5. The magnetic fluid 4a is used to seal the rotating shaft between the vacuum chamber and the atmosphere. The output end of the servo motor 4b is connected to one end of the magnetic fluid 4a through two gears 4c. The rotating shaft of the other end of the magnetic fluid 4a is fixedly connected to one of the connecting seats 1b. The staff can control the operation of the servo motor 4b so that the rotating shaft of the servo motor 4b drives the two gears 4c to move, and synchronously drives the rotating shaft of the magnetic fluid 4a to move, thereby enabling the flip tray 1 to be flipped synchronously, so as to facilitate the coating of both sides of the silicon wafer 6 inside the vacuum chamber 5.

[0026] It also includes a lifting structure 7 and a downward pressure control structure 8. The lifting structure 7 is fixedly installed at the bottom end of the vacuum chamber 5, and the top end of the lifting structure 7 is located inside the vacuum chamber 5. The lifting structure 7 is used to vertically transport the silicon wafer 6 so that the silicon wafer 6 can reach the bottom end of the flip tray 1 and be clamped by multiple clamping structures 2, so as to facilitate coating on both sides of the silicon wafer 6. The downward pressure control structure 8 is fixedly installed at the top end of the vacuum chamber 5, and the bottom end of the downward pressure control structure 8 is located inside the vacuum chamber 5. When the downward pressure control structure 8 is in operation, the bottom end of the downward pressure control structure 8 can contact the cam follower 2d and apply pressure to it, so that the multiple clamping structures 2 release the clamping state of the silicon wafer 6, so that the top end of the lifting structure 7 can move the coated silicon wafer 6 away.

[0027] The lifting structure 7 includes a cylinder 7a, a servo motor 7b and a lifting main seat 7e. The lifting main seat 7e is slidably installed on the bottom end of the vacuum chamber 5. The cylinder 7a is fixedly installed on the bottom end of the lifting main seat 7e. A plurality of ejector pins 7c are provided at the output end of the cylinder 7a. The cylinder 7a can control the extension or contraction of the plurality of ejector pins 7c to support or release the silicon wafer 6. The servo motor 2 7b is fixedly mounted on the bottom end of the vacuum chamber 5 through a fixed mounting frame 7d, and a ball screw 7f is arranged on the fixed mounting frame 7d. The bottom end of the lifting main seat 7e is connected to the output end of the servo motor 2 7b through the ball screw 7f. When the servo motor 2 7b is running, the output end of the servo motor 2 7b rotates, which can synchronously drive the ball screw 7f to operate, so that the ball screw 7f can drive the lifting main seat 7e to slide upward or downward, thereby making the top end of the lifting main seat 7e close to or away from the flip tray 1, and then by cooperating with the cylinder 1 7a, the movement of multiple ejector pins 7c is controlled, so that multiple clamping structures 2 can clamp and release the silicon wafer 6.

[0028] The downward pressure control structure 8 includes a second cylinder 8a, a pre-pressure plate 8d, a downward pressure plate 8c and two guide shafts 8b. The second cylinder 8a and the two guide shafts 8b are fixedly installed on the top of the vacuum chamber 5. The two guide shafts 8b are used to guide the movement of the second cylinder 8a to make its movement smoother. The lower pressure plate 8c is fixedly installed on the bottom end of the extended end of the cylinder 8a, and the pre-pressure plate 8d is slidably installed on the bottom end of the extended end of the cylinder 8a. The pre-pressure plate 8d is located below the lower pressure plate 8c, and a compression spring is provided at the connection between the pre-pressure plate 8d and the cylinder 8a. When the cylinder 8a is running, the extended end of the cylinder 8a extends, driving the lower pressure plate 8c and the pre-pressure plate 8d to move downward, the pre-pressure plate 8d will first contact the upper surface of the flip tray 1 to pre-press the flip tray 1 to make the flip tray 1 stable as a whole, and during the pre-pressing process, the pre-pressure plate will slide upward under the action of the compression spring until the lower pressure plate 8c contacts the top ends of the multiple cam followers 2d and applies force to them, so that the multiple clamping structures 2 release the clamping of the silicon wafer 6, and the multiple clamping structures 2 open space so that the lifting structure 7 can move the silicon wafer 6 out.

[0029] Working principle: First, by operating the downward pressure control structure 8, the pre-pressing plate 8d presses the flip tray 1 to keep it stable, until the downward pressure plate 8c applies force to the top ends of the multiple cam followers 2d, so that the multiple clamping structures 2 are opened to an angle that can accommodate the silicon wafer 6 to enter; then the lifting structure 7 is operated to make the lifting main seat 7e rise close to the bottom ends of the multiple clamping structures 2, and control the cylinder 7a to extend the multiple ejector pins 7c to send the silicon wafer 6 into the flip tray 1; then the downward pressure control structure 8 is operated to make the downward pressure plate 8c Separate from the top ends of the multiple cam followers 2d, so that the multiple clamping structures 2 return to the clamping state; then operate the lifting structure 7 to retract the multiple ejector pins 7c and lower the lifting main seat 7e, so that the upward side of the silicon wafer 6 can be coated; when the coating of the upward side of the silicon wafer 6 is completed, operate the transmission structure 4, cooperate with the bearing group 3, drive the flip tray 1 to rotate 180 degrees, and coat the other side of the silicon wafer 6, so that the coating of both sides of the silicon wafer 6 can be completed inside the vacuum chamber 5, which can prevent the silicon wafer 6 from being polluted by the external atmosphere.

[0030] The device is provided with a flip tray, a bearing group, a transmission structure and multiple clamping structures. The multiple clamping structures can cooperate with the multiple limit seats on the flip tray to clamp and limit the silicon wafer on the tray, and by operating the transmission structure and cooperating with the bearing group, the flip tray can be driven to flip 180 degrees, so as to achieve the purpose of flipping the silicon wafer 180 degrees. In this way, the two sides of the silicon wafer can be coated inside the vacuum chamber without entering the external atmospheric environment, which can prevent the surface of the silicon wafer from being polluted by the external atmosphere. At the same time, the flipping step is simple to operate, with fewer steps, which can improve the efficiency of double-sided coating of the silicon wafer.

[0031] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A turning device for double-sided coated silicon wafers, characterized in that: The invention comprises a flip tray (1), a bearing group (3), a transmission structure (4) and a plurality of clamping structures (2); the plurality of clamping structures (2) are fixedly mounted on the top of the flip tray (1); a plurality of limit seats (1a) are fixedly arranged on the top of the flip tray (1); the bearing group (3) and the transmission structure (4) are respectively fixedly mounted on two sides of the outside of a vacuum chamber (5); the flip tray (1) is located inside the vacuum chamber (5); two connecting seats (1b) are fixedly arranged on two sides of the top of the flip tray (1); the flip tray (1) is respectively fixedly connected to the rotating shafts of the bearing group (3) and the transmission structure (4) via the two connecting seats (1b).

2. The turning device for double-sided coated silicon wafer according to claim 1, characterized in that: The clamping structure (2) comprises a wafer clamping block (2c), a cam follower (2d) and a plurality of bases (2a); the plurality of bases (2a) are fixedly mounted on the top of a flip tray (1); the top of the wafer clamping block (2c) passes through the flip tray (1); the outermost top of the wafer clamping block (2c) is rotatably connected to two outer bases (2a) via a rotating connecting shaft (2b); the cam follower (2d) is fixedly mounted on the inner top of the wafer clamping block (2c); a tension spring shaft (2e) is fixedly arranged between the other two bases (2a); and a tension spring (2f) is arranged between the tension spring shaft (2e) and the bottom of the wafer clamping block (2c).

3. The turning device for double-sided coated silicon wafer according to claim 2, characterized in that: The transmission structure (4) comprises a magnetic fluid (4a) and a servo motor (4b). The magnetic fluid (4a) and the servo motor (4b) are both fixedly mounted on an outer wall of one side of a vacuum chamber (5). The output end of the servo motor (4b) is connected to one end of the magnetic fluid (4a) via two gears (4c). The rotating shaft at the other end of the magnetic fluid (4a) is fixedly connected to one of the connecting seats (1b).

4. The turning device for double-sided coated silicon wafer according to claim 3, characterized in that: The invention also comprises a lifting structure (7) and a downward pressure control structure (8), wherein the lifting structure (7) is fixedly mounted on the bottom end of the vacuum chamber (5), and the top end of the lifting structure (7) is located inside the vacuum chamber (5); the downward pressure control structure (8) is fixedly mounted on the top end of the vacuum chamber (5), and the bottom end of the downward pressure control structure (8) is located inside the vacuum chamber (5).

5. The turning device for double-sided coated silicon wafer according to claim 4, characterized in that: The lifting structure (7) comprises a cylinder 1 (7a), a servo motor 2 (7b) and a lifting main seat (7e); the lifting main seat (7e) is slidably mounted on the bottom end of the vacuum chamber (5); the cylinder 1 (7a) is fixedly mounted on the bottom end of the lifting main seat (7e); a plurality of ejector pins (7c) are arranged at the output end of the cylinder 1 (7a); the servo motor 2 (7b) is fixedly mounted on the bottom end of the vacuum chamber (5) via a fixed mounting frame (7d); a ball screw (7f) is arranged on the fixed mounting frame (7d); and the bottom end of the lifting main seat (7e) and the output end of the servo motor 2 (7b) are connected via the ball screw (7f).

6. The turning device for double-sided coated silicon wafer according to claim 5, characterized in that: The downward pressure control structure (8) comprises a second cylinder (8a), a pre-pressure plate (8d), a downward pressure plate (8c) and two guide shafts (8b). The second cylinder (8a) and the two guide shafts (8b) are fixedly mounted on the top of the vacuum chamber (5). The downward pressure plate (8c) is fixedly mounted on the bottom end of the extended end of the second cylinder (8a). The pre-pressure plate (8d) is slidably mounted on the bottom end of the extended end of the second cylinder (8a). The pre-pressure plate (8d) is located below the downward pressure plate (8c). A compression spring is provided at the connection between the pre-pressure plate (8d) and the second cylinder (8a).

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