Coating carrier and coating equipment

Abstract

The utility model relates to the technical field of semiconductors and photovoltaics, in particular to a film coating carrier and film coating equipment, and solves the problem that a film coating layer is damaged due to the fact that a suction cup needs to be adopted for adsorption from the film coating layer on the front face when a battery is carried in the related technology. The coating carrier comprises a fixing plate, a plurality of first bearing plates, a plurality of second bearing plates and a driving assembly, the upper surface of each first bearing plate is provided with a bearing area and a receding groove at least partially located in the bearing area, each second bearing plate is provided with a hollowed-out containing opening, and the side wall of each second bearing plate is provided with at least one opening communicating with the containing opening; the second bearing plate is provided with at least one supporting part, and the driving assembly is configured to drive the second bearing plate to move in the direction close to or away from the upper surface of the first bearing plate so as to transfer the substrate between the bearing area and the supporting part. According to the coating carrier and the coating equipment provided by the invention, a coating layer on the front surface of the substrate can be prevented from being damaged during carrying, and the coating effect is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor and photovoltaic technology, and in particular to a coating carrier and coating equipment. Background Art

[0002] With the development of photovoltaic technology, solar cells are widely used in various fields. The manufacture of solar cells involves depositing multiple materials on a substrate in succession to form different coating layers on the upper surface of the substrate. Before finally forming a solar cell that can be used, the substrate needs to be moved to different locations for different process treatments.

[0003] During the transportation of the substrate, a suction cup is used to suck the substrate from the upper surface of the substrate for transportation. However, since the upper surface of the substrate has a thin coating layer, the suction cup will come into contact with the coating layer when sucking the substrate, which can easily damage the coating layer during transportation, thereby affecting the use effect of the solar cell. Utility Model Content

[0004] In view of this, the embodiments of the present application provide a coating carrier and a coating device to solve the problem in the related art that when transporting batteries, a suction cup is required to adsorb the coating layer from the front side, resulting in damage to the coating layer.

[0005] In a first aspect, an embodiment of the present application provides a coating carrier for carrying a substrate, the substrate having a bottom surface, the coating carrier comprising: a fixed plate; a plurality of first carrier plates connected to the fixed plate and spaced apart along the thickness direction of the fixed plate, the upper surface of the first carrier plate having a carrying area and a void-avoiding groove at least partially located in the carrying area, the carrying area being configured to carry the substrate, and making the bottom surface contact with the carrying area; a plurality of second carrier plates corresponding one to the plurality of first carrier plates, the second carrier plates being located on one side of the first carrier plates in the thickness direction, the second carrier plates being provided with a hollow placement opening corresponding to the carrying area, and the second carrier plates having a hollow placement opening along the edge of the placement opening. The plate has at least one supporting portion, and the side wall of the second supporting plate is provided with an opening connected to the placement port, wherein the substrate can enter or leave the placement port through the opening, and when the substrate enters the placement port, the substrate can be placed on the supporting portion through the placement port; a driving component is connected to the second supporting plate and is configured to: drive the second supporting plate to move in a direction close to the upper surface of the first supporting plate, so that the supporting portion extends into the avoidance groove to transfer the substrate carried by the supporting portion to the carrying area; and drive the second supporting plate to move in a direction away from the upper surface of the first supporting plate, so that the supporting portion is away from the avoidance groove to transfer the substrate carried by the carrying area to the supporting portion.

[0006] In some embodiments, it also includes: at least one connecting rod, which connects multiple second supporting plates; a driving assembly connected to at least one connecting rod, which can drive the connecting rod to move, so that the connecting rod can drive the multiple second supporting plates to move simultaneously in a direction close to or away from the upper surface of the first supporting plate.

[0007] In some embodiments, the second carrier plate is located above the first carrier plate, and the second carrier plate has a plurality of support portions; the support portions are arranged around the placement opening, and at least part of the support portions extend into the placement opening, and the support portions are configured so that when the first carrier plate carries the substrate, the support portions extend into the avoidance groove and are located below the bottom surface, and when the second carrier plate carries the substrate, the support portions are located above the first carrier plate and carry the substrate.

[0008] In some embodiments, the second supporting plate has a plurality of limiting portions, which form a limiting space; the plurality of limiting portions are respectively arranged on a side of the supporting portion away from the fixed plate, and when the supporting portion carries the substrate, the limiting portions abut against or gap-fit ​​with the side surface of the substrate to limit the substrate to the limiting space.

[0009] In some embodiments, it also includes: at least one fixing rod, which connects multiple first supporting plates to the fixing plate; wherein the first supporting plates are provided with avoidance holes, and the connecting rod passes through the avoidance holes of the multiple first supporting plates to connect multiple second supporting plates.

[0010] In some embodiments, the driving assembly includes: a driving motor, which is arranged on a side of the fixed plate away from the second supporting plate; a cylinder, which is connected to the driving motor; a guide rod, which is connected to the top rod of the cylinder, and the fixed plate is provided with a through hole, and the guide rod passes through the through hole to connect to the second supporting plate, and the guide rod is configured to drive the cylinder to move the guide rod under the drive of the driving motor, thereby driving the second supporting plate to move in a direction close to or away from the upper surface of the first supporting plate.

[0011] In some embodiments, the driving assembly further includes: a sealing portion connected to the guide rod, wherein the sealing portion is configured to seal a gap between the guide rod and the through hole.

[0012] In some embodiments, the first supporting plate is provided with at least one placement groove, and the bottom of the placement groove forms a supporting area.

[0013] In some embodiments, at least one protrusion is provided on the upper surface of the first carrier plate; wherein the placement groove is located on the protrusion, and in the orthographic projection of the second carrier plate onto the first carrier plate in the thickness direction, the protrusion is located in the area enclosed by the placement opening, and when the first carrier plate carries the substrate, the second carrier plate contacts the upper surface of the first carrier plate, and the protrusion at least partially extends into the placement opening along the thickness direction.

[0014] In some embodiments, along the thickness direction, the bottom of the placement groove is higher than the upper surface of the first supporting plate.

[0015] In a second aspect, an embodiment of the present application provides a coating device, including: a main body, having a coating chamber; and the coating carrier described in the first aspect, which can be placed in the coating chamber.

[0016] A coating carrier provided in an embodiment of the present application can lift up the second carrier plate through a driving component, so that the substrate located in the carrying area of ​​the first carrier plate is transferred to the supporting portion of the second carrier plate, and the bottom surface of the substrate is exposed through the placement port. The robot can grab the bottom surface of the substrate from the placement port or place the substrate grabbed from the bottom surface from the placement port to the supporting portion, thereby transporting the substrate to avoid damaging the coating layer on the upper surface of the substrate during transportation.

[0017] In addition, the coating carrier includes a plurality of stacked first carrier plates and a plurality of second carrier plates, which can carry substrates carried on different layers to avoid damage to the film layer on the upper surface of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0019] Figure 1 Shown is a schematic structural diagram of a first carrier plate carrying a substrate of a coating carrier provided in one embodiment of the present application.

[0020] Figure 2 Shown Figure 1 A partial enlarged view of the coating carrier in area A is shown.

[0021] Figure 3 Shown is a schematic structural diagram of a second carrier plate carrying a substrate of a coating carrier provided in one embodiment of the present application.

[0022] Figure 4 Shown Figure 3 The structure schematic diagram of the coating carrier shown is that the second carrying plate does not carry a substrate.

[0023] Figure 5 Shown Figure 4 A partial enlarged view of the coating carrier in area B is shown.

[0024] Figure 6 Shown is a schematic structural diagram of multiple first supporting plates of a coating carrier provided in one embodiment of the present application.

[0025] Figure 7 Shown Figure 6 A partial enlarged view of the coating carrier in the M area is shown.

[0026] Figure 8 Shown is a front view of multiple first carrying plates of a coating carrier provided in one embodiment of the present application.

[0027] Fig. 9 FIG. 1 is a top view of a plurality of first supporting plates of a coating carrier provided in accordance with an embodiment of the present application.

[0028] Fig.10 Shown is a schematic structural diagram of multiple second carrying plates of a coating carrier provided in one embodiment of the present application.

[0029] Fig.11 Shown Fig.10 A partial enlarged view of the coating carrier in area C is shown.

[0030] Fig.12 Shown is a top view of a single second carrier plate of a coating carrier provided in one embodiment of the present application.

[0031] Fig.13 Shown Fig.12 The second carrier plate of the coating carrier is shown as a partial enlarged view of the D area.

[0032] Fig.14 Shown is a front view of a plurality of second carrier plates of a coating carrier provided by an embodiment of the present application cooperating with a driving assembly.

[0033] Fig.15 Shown is a simple schematic diagram of a coating device provided in one embodiment of the present application.

[0034] Reference numerals:

[0035] 100, coating equipment; 110, main body; 110A, coating chamber; 120, manipulator; 10, coating carrier; 1, fixing plate; 2, first supporting plate; 21, supporting area; 22, avoidance groove; 23, placement groove; 24, raised portion; 25, fixing rod; 26, avoidance hole; 3, second supporting plate; 31, placement port; 311, opening; 312, connecting hole; 32, supporting portion; 33, connecting rod; 34, follower plate; 35, limiting portion; 4, driving assembly; 41, driving motor; 42, cylinder; 421, mounting plate; 422, linear bearing; 423, guide plate; 43, guide rod; 44, sealing portion; 20, substrate; 2A, upper surface; 2E, bottom surface; H, thickness direction; h1, first height; h2, second height. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] At present, the substrate is usually transported by adsorption from the upper surface of the substrate. However, the coating layer on the upper surface of the substrate is easily damaged during the transportation process, thereby affecting the quality and use effect of the substrate.

[0038] In view of the above problems, the present application provides a coating carrier for carrying a substrate. It is understood that the substrate includes an upper surface and a bottom surface disposed opposite to each other along the thickness direction, and the upper surface of the substrate can be deposited with different materials to form multiple different coating layers.

[0039] It should be emphasized that the substrate can be, for example, a silicon substrate or a perovskite substrate made of a perovskite material, without specific limitation. In the embodiment of the present application, the substrate is set as a perovskite substrate to prepare a perovskite cell.

[0040] It is understood that the coating carrier can be used as a carrier boat to carry substrates and can enter the reaction chamber of the reaction equipment. The coating carrier can also be used only as a storage device for substrates, and does not need to enter the reaction chamber of a process with the substrates, without specific limitation. For ease of explanation, the coating carrier in the embodiment of the present application can enter the reaction chamber with the substrate when used to carry the substrate.

[0041] In addition, the reaction chamber of the reaction equipment may include an ALD reaction chamber of an atomic layer deposition (ALD) device, or may include a PECVD reaction chamber of a plasma enhanced chemical vapor deposition (PECVD) device, or may be a reaction chamber of other deposition equipment, without specific limitation. For ease of explanation, in the embodiment of the present application, a coating carrier may be used in an ALD reaction chamber for thin film growth, interface regulation, protective layer preparation, and photoelectric conversion material preparation on a perovskite substrate. Taking thin film growth as an example, a coating carrier carrying a substrate is placed in an ALD reaction chamber, and under a vacuum environment, the growth rate and composition of the perovskite film can be precisely controlled, thereby preparing a uniform, dense, and defect-free perovskite film on the upper surface of the substrate, thereby improving the photoelectric conversion efficiency and stability of the perovskite material.

[0042] The specific structure of the coating carrier is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0043] Figure 1 Shown is a schematic structural diagram of a first carrier plate carrying a substrate of a coating carrier provided in one embodiment of the present application. Figure 2 Shown Figure 1 A partial enlarged view of the coating carrier in area A is shown. Figure 3 Shown is a schematic structural diagram of a second carrier plate carrying a substrate of a coating carrier provided in one embodiment of the present application. Figure 4 Shown Figure 3 The structure schematic diagram of the coating carrier shown is that the second carrying plate does not carry a substrate. Figure 5 Shown Figure 4 The shown is a partial enlarged view of the coating carrier in area B. The direction indicated by the arrow H is the thickness direction H of the fixing plate 1, which will not be emphasized separately in the following.

[0044] like Figures 1 to 5 The coating carrier 10 includes a fixed plate 1 and a plurality of first carrier plates 2, the plurality of first carrier plates 2 are connected to the fixed plate 1 and are spaced apart along the thickness direction H of the fixed plate 1, the upper surface of the first carrier plate 2 has a carrier area 21 and a void groove 22 at least partially located in the carrier area 21, the carrier area 21 is configured to carry a substrate 20, and the bottom surface 2E of the substrate 20 is in contact with the carrier area 21; the coating carrier 10 also includes a plurality of second carrier plates 3, the plurality of second carrier plates 3 correspond to the plurality of first carrier plates 2 one by one, the second carrier plates 3 are located on one side of the first carrier plate 2 in the thickness direction H, the second carrier plate 3 is provided with a hollow placement opening 31 corresponding to the carrier area 21, and the second carrier plate 3 has at least one support portion 32 along the edge of the placement opening 31, and the second carrier plate 3 has a plurality of second carrier plates 3. The side wall has an opening 311 connected to the placement port 31, wherein the substrate 20 can enter or leave the placement port 31 through the opening 311, and when the substrate 20 enters the placement port 31, the substrate 20 can be placed on the support portion 32 through the placement port 31; the coating carrier 10 also includes a driving component 4, the driving component 4 is connected to the second supporting plate 3, and the driving component 4 is configured to: drive the second supporting plate 3 to move in a direction close to the upper surface of the first supporting plate 2, so that the supporting portion 32 extends into the avoidance groove 22, so as to transfer the substrate 20 carried by the supporting portion 32 to the supporting area 21, and drive the second supporting plate 3 to move in a direction away from the upper surface of the first supporting plate 2, so that the supporting portion 32 is away from the avoidance groove 22, so as to transfer the substrate 20 carried by the supporting area 21 to the supporting portion 32.

[0045] Exemplarily, the carrying area 21 on the first carrying plate 2 for carrying the substrate 20 may be one or more. For example, there may be two, three, four, etc. carrying areas 21, and the multiple carrying areas 21 are arranged at intervals on the upper surface of the first carrying plate 2, and the multiple carrying areas 21 may be arranged in a straight line at intervals along a certain direction, or may be arranged in a square array, etc., which are not specifically limited here. For ease of description, the embodiment of the present application is described in detail by taking the example that the upper surface of the first carrying plate 2 is provided with two carrying areas 21 arranged at intervals, and each carrying area 21 is used to carry a substrate 20.

[0046] Exemplarily, a plurality of second bearing plates 3 are respectively arranged above the corresponding first bearing plates 2 in the thickness direction H, and the first bearing plates 2 and the second bearing plates 3 are staggered in the thickness direction H. When the driving component 4 drives the second bearing plates 3 to reciprocate along the thickness direction H, the first bearing plates 2 and the second bearing plates 3 will not interfere with each other. Among them, the number of the first bearing plates 2 and the second bearing plates 3 is the same, such as the first bearing plates 2 and the second bearing plates 3 are both set to five, six, seven, etc., without specific limitation. For ease of explanation, in the embodiment of the present application, the number of the first bearing plates 2 and the second bearing plates 3 is set to five, that is, the first bearing plate 2 forms a five-layer structure in the thickness direction H of the fixed plate 1, the second bearing plate 3 is located above the first bearing plate 2, and the second bearing plate 3 located above the first bearing plate 2 is also a five-layer structure staggered with the first bearing plate 2.

[0047] In some embodiments, the first carrier plate 2 is provided with an avoidance hole 26 for avoiding the second carrier plate 3 moving along the thickness direction H. For example, when a plurality of second carrier plates 3 are connected by a connecting rod 33, the avoidance hole 26 may be a through hole provided on the first carrier plate 2 corresponding to the connecting rod 33, so that the plurality of second carrier plates 3 can simultaneously rise or fall in the thickness direction H. Alternatively, the avoidance hole 26 may also be a through pattern provided on the first carrier plate 2 that matches the shape of the second carrier plate 3, so that when the second carrier plate 3 rises or falls along the thickness direction H, the second carrier plate 3 can directly pass through the first carrier plate 2, and the lifting distance of the second carrier plate 3 will not be affected by the first carrier plate 2.

[0048] The coating carrier 10 provided in the embodiment of the present application takes the substrate 20 carried by the first carrier plate 2 located at the top as an example, and utilizes the support portion 32 arranged on the second carrier plate 3, and the air-avoiding groove 22 provided on the first carrier plate 2 and matched with the support portion 32, so that the driving component 4 can drive the second carrier plate 3 to move until the support portion 32 extends into the air-avoiding groove 22, so that when the bearing area 21 of the first carrier plate 2 carries the substrate 20, the support portion 32 is located below the substrate 20. When it is necessary to transport the substrate 20 on the first carrier plate 2, the driving component 4 can drive the second carrier plate 3 to move and then drive the support portion 32 to move in a direction away from the upper surface of the first carrier plate 2, so that the support portion 32 is away from the air-avoiding groove 22. During the movement, the support portion 32 contacts the bottom surface 2E of the substrate 20 on the first carrier plate 2 and drives the substrate 20 away from the first carrier plate 2 along with the second carrier plate 3, so that the bottom surface 2E of the substrate 20 is exposed on the second carrier plate 3 through the hollow placement opening 31. The robot arm used for transportation can extend under the second supporting plate 3 and contact the bottom surface 2E of the substrate 20, thereby lifting or adsorbing the bottom surface 2E of the substrate 20, driving the substrate 20 to leave the coating carrier 10 from the opening 311, thereby realizing the transportation of the substrate 20. During the transportation process, the robot arm will not contact the upper surface 2A of the substrate 20, thereby avoiding damage to the coating layer on the upper surface 2A.

[0049] In addition, in the embodiment of the present application, the matching structure of the above-mentioned coating carrier 10 enables the robot arm to lift and transport substrates 20 of different layers from the bottom surface 2E of the substrate 20, which is conducive to the coating carrier 10 being able to carry more substrates 20 at the same time.

[0050] An exemplary structure of the first supporting plate 2 is described below.

[0051] Figure 6 Shown is a schematic structural diagram of multiple first supporting plates of a coating carrier provided in one embodiment of the present application. Figure 7 Shown Figure 6 A partial enlarged view of the coating carrier in the M area is shown. Figure 8 Shown is a front view of multiple first carrying plates of a coating carrier provided in one embodiment of the present application. Fig. 9 FIG. 1 is a top view of a plurality of first supporting plates of a coating carrier provided in accordance with an embodiment of the present application.

[0052] like Figures 6 to 9, a plurality of first carrier plates 2 are arranged on the fixing plate 1 at equal intervals along the thickness direction H, and the plurality of first carrier plates 2 are connected by at least one fixing rod 25 to connect the plurality of first carrier plates 2 to the fixing plate 1. Specifically, the number of the fixing rods 25 can be six, and fixing holes are respectively provided at the edges of the four corners and the middle position of the first carrier plate 2, and the fixing rods 25 pass through the corresponding fixing holes on the plurality of first carrier plates 2 to achieve the connection of the plurality of first carrier plates 2.

[0053] It is understood that the number of the fixing rods 25 can also be six, four, eight, etc., and a suitable number of fixing rods 25 can be selected according to the actual size of the first load-bearing plate 2 to ensure the stability of the support. In addition, the fixing rod 25 can be a cylinder or a square column, without specific limitation.

[0054] Exemplarily, the fixing rods 25 may be detachably connected to the first bearing plates 2 passing therethrough by bolts, or the fixing rods 25 and the first bearing plates 2 may be fixedly connected by welding, which is not specifically limited.

[0055] It should be emphasized here that the distance between any adjacent first carrier plates 2 in the thickness direction H can be adaptively adjusted according to the distance that the driving component 4 drives the second carrier plate 3 to move, as long as it can be ensured that when the second carrier plate 3 is carrying the substrate 20, the distance between the first carrier plate 2 and the second carrier plate 3 is sufficient for the robot arm that transports the substrate 20 to extend into the bottom surface 2E of the substrate 20, and no specific limitation is made here.

[0056] In some embodiments, the first carrier plate 2 is provided with at least one placement groove 23, and the bottom of the placement groove 23 forms a bearing area 21. Specifically, the upper surface of the first carrier plate 2 is provided with two placement grooves 23 arranged at intervals, and the shape of the placement groove 23 matches the shape of the substrate 20. When the substrate 20 is placed in the placement groove 23, the bottom of the placement groove 23 contacts the bottom surface 2E of the substrate 20, and the bottom of the placement groove 23 serves as the bearing area 21 to carry the substrate 20. When the substrate 20 is placed in the placement groove 23, the upper surface 2A of the substrate 20 is exposed from the notch of the placement groove 23, the bottom surface 2E of the substrate 20 is in contact with the bottom of the placement groove 23, and the side wall of the placement groove 23 blocks at least part of the side wall of the substrate 20 in the direction perpendicular to the thickness direction H. When the coating carrier 10 carrying the substrate 20 is placed in the reaction chamber for coating, the placement groove 23 can prevent the substrate 20 from plating around.

[0057] Exemplarily, the placement groove 23 is matched with the clearance of the side wall of the substrate 20 to improve the stability of the substrate 20 placed on the first carrier plate 2. The groove depth of the placement groove 23 in the thickness direction H is less than or equal to the thickness of the substrate 20. The specific groove depth of the placement groove 23 can be adaptively adjusted according to actual needs, as long as it can ensure that at least part of the side wall of the substrate 20 can be shielded to prevent plating, and no specific limitation is made here.

[0058] In an optional embodiment, at least one protrusion 24 is provided on the upper surface of the first carrier plate 2, and in the orthographic projection of the second carrier plate 3 onto the first carrier plate 2 in the thickness direction H, the protrusion 24 is located in the area enclosed by the placement opening 31, and when the first carrier plate 2 carries the substrate 20, the second carrier plate 3 contacts the upper surface of the first carrier plate 2, and the protrusion 24 at least partially extends into the placement opening 31 along the thickness direction H. The air avoidance groove 22 is provided on the protrusion 24 and at least extends to the bottom of the placement groove 23, and as long as the second carrier plate 3 is moved to contact the upper surface of the first carrier plate 2, the support portion 32 can extend into the air avoidance groove 22, and when the placement area 21 carries the substrate 20, the support portion 32 is located below the bottom surface 2E of the substrate 20.

[0059] Exemplarily, the shape of the air avoidance groove 22 matches the shape of the support portion 32, and the actual shape, size, etc. of the support portion 32 and the air avoidance groove 22 can be adaptively adjusted according to actual needs, as long as the support portion 32 can extend into the air avoidance groove 22 so that the support portion 32 is located below the bottom surface 2E of the substrate 20 carried by the first supporting plate 2, and the support portion 32 can be moved away from the air avoidance groove 22 so that the support portion 32 drives the substrate 20 away from the upper surface of the first supporting plate 2, and no specific limitation is made here.

[0060] It is understandable that Figure 7, along the thickness direction H, the bottom of the placement groove 23 (as the bearing area 21) is higher than the upper surface of the first bearing plate 2. Specifically, the bottom of the placement groove 23 is located above the upper surface of the first bearing plate 2 in the thickness direction H, and the height of the bottom of the placement groove 23 above the upper surface of the first bearing plate 2 is a first height h1, and the first height h1 is greater than 0. The height of the protrusion 24 extending out of the upper surface of the first bearing plate 2 is a second height h2, and the first height h1 is less than the second height h2. When the second carrier plate 3 is fitted with the upper surface of the first carrier plate 2, the protrusion 24 extends into the placement opening 31 along the thickness direction H, and the support portion 32 can extend into the air-avoiding groove 22, and at this time, at least part of the support portion 32 is located directly below the bottom of the placement groove 23 in the thickness direction H, so that when the second carrier plate 3 moves away from the upper surface of the first carrier plate 2, the support portion 32 can drive the substrate 20 in the placement groove 23 to move together, completing the transfer of the substrate 20 from the bottom of the placement groove 23 (i.e., the bearing area 21) to the support portion 32. Optionally, the first height h1 and the second height h2 can be adaptively adjusted according to actual needs, the first height h1 is at least greater than 1mm, the difference between the second height h2 and the first height h1 is less than or equal to the thickness of the substrate 20, or the difference between the second height h2 and the first height h1 is greater than or equal to 1mm, etc., which is not specifically limited here.

[0061] It should be emphasized that the second height h2 of the protrusion 24 extending out of the upper surface of the first supporting plate 2 can match the thickness of the second supporting plate 3, or can also be higher or lower than the thickness of the second supporting plate 3, and can be adaptively adjusted according to actual needs. As long as it can be ensured that when the second supporting plate 3 and the first supporting plate 2 are bonded, the supporting portion 32 can extend from the air avoidance groove 22 to below the bottom surface 2E of the substrate 20, no specific limitation is made here.

[0062] It should be emphasized that the first supporting plate 2 can be made of materials that can enter the reaction chamber, such as aluminum and stainless steel, without specific limitation.

[0063] In summary, the first carrier plate 2 can ensure that the carried substrate 20 has high stability while preventing the substrate 20 from being plated around in the reaction chamber, thereby ensuring the coating quality of the upper surface 2A of the substrate 20 .

[0064] An exemplary structure of the second carrying plate 3 is described below.

[0065] Fig.10 Shown is a schematic structural diagram of multiple second carrying plates of a coating carrier provided in one embodiment of the present application. Fig.11 Shown Fig.10 A partial enlarged view of the coating carrier in area C is shown. Fig.12 Shown is a top view of a single second carrier plate of a coating carrier provided in one embodiment of the present application. Fig.13 Shown Fig.12 The second carrier plate of the coating carrier is shown as a partial enlarged view of the D area.

[0066] like Figures 10 to 13 The plurality of second carrier plates 3 are arranged at intervals along the thickness direction H, at least one connecting rod 33 connects the plurality of second carrier plates 3, the driving assembly 4 is connected to at least one connecting rod 33, and the driving assembly 4 can drive the connecting rod 33 to move, so as to use the connecting rod 33 to drive the plurality of second carrier plates 3 to move simultaneously in a direction close to or away from the upper surface of the first carrier plate 2. The connecting rod 33 is arranged to pass through the connecting holes 312 of the plurality of second carrier plates 3 to connect the plurality of second carrier plates 3, so that the driving assembly 4 can simultaneously drive the second carrier plates 3 to rise or fall, which is conducive to improving the work efficiency of the robot arm in lifting and carrying the bottom surface 2E of the substrate 20.

[0067] In some optional embodiments, the plurality of second carrier plates 3 may be connected to one or more drive assemblies 4 through connecting rods 33, respectively, so that the drive assemblies 4 can respectively drive different second carrier plates 3 to move. When the robot is ready to carry a substrate 20 of a certain layer, the drive assembly 4 may only drive the second carrier plate 3 of the corresponding layer to move, and the support portion 32 transfers the substrate 20 of the layer from the first carrier plate 2 to the second carrier plate 3, while the substrates 20 of other layers remain carried by the first carrier plate 2.

[0068] For example, the number of the connecting rods 33 may be two, four, six, eight, etc. In the embodiment of the present application, four connecting rods 33 are provided as an example, and the four connecting rods 33 are respectively located at the four corners of the second bearing plate 3, and the connecting rods 33 respectively fix and connect the plurality of second bearing plates 3. The shape of the connecting rod 33 may be cylindrical or square, and is not specifically limited.

[0069] Exemplarily, in the orthographic projection of the second carrier plate 3 onto the first carrier plate 2 in the thickness direction H, the second carrier plate 3 is completely located on the first carrier plate 2. Specifically, the second carrier plate 3 is smaller than the first carrier plate 2, and the second carrier plate 3 is located within the space enclosed by a plurality of fixing rods 25. The first carrier plate 2 is provided with an avoidance hole 26, and the connecting rod 33 passes through the avoidance holes 26 of the plurality of first carrier plates 2 to connect the plurality of second carrier plates 3. This is to avoid interference between the plurality of second carrier plates 3 and the fixing rod 25 during simultaneous movement. It can be understood that the connecting rod 33 is clearance-matched with the avoidance hole 26, so that when the connecting rod 33 moves up and down along the thickness direction H when the driving assembly 4 is driven, the first carrier plate 2 can remain stationary. This makes the coating carrier 10 more compact and reduces the occupied space.

[0070] In other examples, the second supporting plate 3 may have an additional plate that partially extends from the side of the first supporting plate 2, and the connecting rod 33 is arranged on the outer peripheral side of the first supporting plate 2. The connecting rod 33 passes through the additional plate of the second supporting plate 3 to achieve the connection of multiple second supporting plates 3, so that the connecting rod 33 can drive the multiple second supporting plates 3 to move up and down at the same time, and the connecting rod 33 will not damage the structure of the first supporting plate 2, thereby improving the structural stability and strength of the first supporting plate 2.

[0071] In some embodiments, the second carrier plate 3 is located above the first carrier plate 2, and the second carrier plate 3 has a plurality of support portions 32, and the plurality of support portions 32 are arranged around the placement opening 31, and at least part of the support portion 32 extends into the placement opening 31, and the support portion 32 is configured so that when the first carrier plate 2 carries the substrate 20, the support portion 32 extends into the air avoidance groove 22 and is located below the bottom surface 2E; when the second carrier plate 3 carries the substrate 20, the support portion 32 is located above the first carrier plate 2 and carries the substrate 20, so as to improve the support stability of the substrate 20 while allowing a larger area of ​​the bottom surface 2E of the substrate 20 to be exposed from the placement opening 31, which is beneficial to the lifting and carrying of the substrate 20 by the robot.

[0072] Exemplarily, the placement opening 31 is set as a square opening that matches the shape of the substrate 20, and the support parts 32 are respectively set at the four corners of the square opening. When the second supporting plate 3 carries the substrate 20, the upper surfaces of the multiple support parts 32 are respectively used to abut against the bottom surface 2E of the substrate 20, and are used to carry the substrate 20 to maintain the stability of the carried substrate 20 and avoid shaking.

[0073] It is understandable that the number of the support parts 32 may also be six, eight, etc., and can be adaptively adjusted according to actual needs, and is not specifically limited here.

[0074] Exemplarily, the support portion 32 may be a support rod structure connected to the second carrier plate 3 , the support rod is connected to the side wall of the placement opening 31 and extends into the placement opening 31 , and the upper surface of the support rod is used to abut against the bottom surface 2E of the substrate 20 .

[0075] It can be understood that the length of the support rod extending into the placement port 31 can be adaptively adjusted according to the size of the substrate 20, as long as it can ensure that the upper surfaces of multiple support rods can abut against the bottom surface 2E of the substrate 20 to move the substrate 20 smoothly upward, and no specific limitation is made here.

[0076] It should be emphasized that the size of the placement opening 31 can match the carrying area 21 of the first carrying plate 2 , so that the substrate 20 can smoothly pass through the placement opening 31 to be placed in the carrying area 21 .

[0077] In some embodiments, the second supporting plate 3 has a plurality of limiting portions 35, and the plurality of limiting portions 35 form a limiting space; the plurality of limiting portions 35 are respectively arranged on a side of the supporting portion 32 away from the fixed plate 1, and when the supporting portion 32 carries the substrate 20, the limiting portions 35 abut against or gap fit with the side surface of the substrate 20 to limit the substrate 20 in the limiting space, thereby improving the stability of the substrate 20 placed on the second supporting plate 3.

[0078] Exemplarily, the position-limiting portion 35 can be a protruding structure disposed on the upper surface of the support rod and close to the placement opening 31, so that the position-limiting portion 35 and the support portion 32 form a stepped structure. When the bottom surface 2E of the substrate 20 abuts against the upper surface of the support rod, the side wall of the protruding structure contacts or has a clearance fit with the side wall of the substrate 20, thereby avoiding a large positional offset when transferring the substrate 20.

[0079] In other embodiments, the limiting portion 35 can also be configured as a retractable snap-fit ​​structure arranged on the support rod, so that the limiting portion 35 can elastically support and limit the side wall of the substrate 20, thereby avoiding the horizontal displacement of the substrate 20, without specific limitation.

[0080] In some embodiments, the side wall of the second supporting plate 3 is provided with an opening 311 connected to the placement port 31. The orientation of the opening 311 can be adjusted according to the position of the robot used to hold the substrate 20. The size of the opening 311 can match the size of the robot inserted, so that when the robot holds the substrate 20 on the second supporting plate 3 in the middle layer, the robot can hold the substrate 20 and smoothly move it out of the coating carrier 10.

[0081] It is understandable that the side wall of the second carrying plate 3 may also be provided with two, three, etc. openings 311 connected to the placement opening 31 , as long as it is convenient for the robot to lift and carry the substrate 20 out of the coating carrier 10 , without specific limitation.

[0082] In some embodiments, a follower plate 34 is provided between the fixed plate 1 and the lowermost second supporting plate 3, and a plurality of connecting rods 33 are fixedly connected to the upper surface of the follower plate 34, which in turn is fixedly connected to a plurality of second supporting plates 3, and a driving component 4 is connected to the follower plate 34. When the driving component 4 drives the follower plate 34 to move along the thickness direction H, the follower plate 34 can drive the plurality of second supporting plates 3 to rise or fall at the same time.

[0083] It should be emphasized that when the support portion 32 of the second carrier plate 3 carries the substrate 20 , the second carrier plate 3 has a minimum distance from the first carrier plate 2 , and the minimum distance is at least greater than the height of the robot extending into the coating carrier 10 .

[0084] In addition, the second supporting plate 3 can be made of materials such as aluminum, stainless steel, etc. that can enter the reaction chamber, without specific limitation.

[0085] In summary, the second carrier plate 3 can be set up to transfer the substrates 20 on multiple first carrier plates 2 and expose the bottom surface 2E of the substrate 20, so that the robot can move the substrates 20 of different layers out of the opening 311 by lifting the bottom surface 2E, thereby realizing the lifting-type transportation of the substrate 20.

[0086] An exemplary structure of the drive assembly 4 is described below.

[0087] Fig.14 Shown is a front view of a plurality of second carrier plates of a coating carrier provided by an embodiment of the present application cooperating with a driving assembly.

[0088] like Fig.14 The driving assembly 4 includes a driving motor 41, a cylinder 42 and a guide rod 43. The driving motor 41 is arranged on a side of the fixing plate 1 away from the second carrying plate 3. The cylinder 42 is connected to the driving motor 41. The guide rod 43 is connected to the top rod of the cylinder 42. The fixing plate 1 is provided with a through hole. The guide rod 43 passes through the through hole and is connected to the second carrying plate 3. The guide rod 43 is configured to make the cylinder 42 drive the guide rod 43 to move under the drive of the driving motor 41, thereby driving the second carrying plate 3 to move in a direction close to or away from the upper surface of the first carrying plate 2.

[0089] Exemplarily, the driving assembly 4 further includes a mounting plate 421, which is located on a side of the fixed plate 1 away from the follower plate 34, and a driving motor 41 and a cylinder 42 are fixedly mounted on the side of the mounting plate 421 away from the fixed plate 1, and an output end of the driving motor 41 is connected to the cylinder 42. The driving assembly 4 further includes a guide plate 423, which is located between the fixed plate 1 and the mounting plate 421, and a guide rod 43 is provided on a side of the guide plate 423 away from the mounting plate 421, and the guide rod 43 passes through the fixed plate 1 to connect to the follower plate 34. The push rod of the cylinder 42 passes through the mounting plate 421 and is connected to the guide plate 423, and a linear bearing 422 passing through the guide plate 423 is also provided between the fixed plate 1 and the mounting plate 421. Driven by the driving motor 41, the push rod of the cylinder 42 is extended and retracted, and cooperates with the linear bearing 422 to adjust the distance between the fixed plate 1 and the guide plate 423, so that the height of the guide rod 43 extending out of the fixed plate 1 increases or decreases, thereby realizing the overall rise or fall of the multiple second supporting plates 3 in the thickness direction H.

[0090] It can be understood that the specific matching structure in the drive component 4 that realizes the rise or fall of multiple second carrier plates 3 in the thickness direction H can also be set to other matching structures, such as a screw nut substructure driven by a drive motor 41 and capable of linear motion along the thickness direction H, a gear set driven by a drive motor 41 that converts rotational motion into linear motion along the thickness direction H, or other structures that can realize the rise or fall of the second carrier plates 3 in the thickness direction H, which are not specifically limited here.

[0091] In some embodiments, the driving assembly 4 also includes a sealing portion 44 connected to the guide rod 43, and the sealing portion 44 is configured to block the gap between the guide rod 43 and the through hole. When the coating carrier 10 is placed in the reaction chamber, with the fixed plate 1 as the boundary, the first carrier plate 2 and the second carrier plate 3 carrying the substrate 20 above the fixed plate 1 need to be placed in a vacuum environment, and the portion of the driving assembly 4 below the fixed plate 1 can be placed in a normal environment. Therefore, the sealing portion 44 is set at the position of the guide rod 43 corresponding to the through hole, while not affecting the guide rod 43 driving the second carrier plate 3 to rise or fall along the thickness direction H, so that the carrier plate and the substrate 20 are in a vacuum environment. It can be understood that the vacuum environment can be a vacuum reaction chamber in the ALD equipment.

[0092] Exemplarily, the fixed plate 1 is provided with a through hole at the position where the guide rod 43 is arranged, and the guide rod 43 is in clearance with the through hole. The sealing portion 44 can be a bellows sleeved on the guide rod 43, and the two ends of the bellows are respectively in contact with and sealed against the fixed plate 1 and the guide plate 423, and the end of the bellows covers the through hole, so as to ensure that the guide rod 43 can be lifted and lowered, and the carrier plate and the substrate 20 above the fixed plate 1 can always be maintained in a vacuum environment.

[0093] In summary, the driving assembly 4 can more accurately control the lifting and lowering of the plurality of second carrier plates 3 relative to the upper surface of the first carrier plate 2, so that the substrate 20 can be transferred between the first carrier plate 2 and the second carrier plate 3. In addition, the coating carrier 10 can be used in a reaction chamber in a vacuum environment, and the robot can carry the substrate 20 in the vacuum reaction chamber by lifting the bottom surface 2E of the substrate 20.

[0094] The following describes the working process of the coating carrier 10 for picking up and placing the substrate 20 .

[0095] In the initial state, the positional relationship between the first carrier plate 2 and the second carrier plate 3 in the coating carrier 10 is as follows: Figure 1 and Figure 2, that is, the lower surface of the second carrier plate 3 is in contact with the upper surface of the first carrier plate 2, and the protrusion 24 of the first carrier plate 2 extends into the placement opening 31 in the thickness direction H. The support portion 32 extends into the first carrier plate 2 through the air avoidance groove 22, and the upper surface of the support portion 32 is located below the bottom of the placement groove 23 or flush with the bottom of the placement groove 23 in the thickness direction H. In this state, the placement areas 21 in the placement grooves 23 of the multi-layer first carrier plate 2 respectively carry substrates 20, and the upper surface 2A of the substrate 20 faces upward, the coating carrier 10 carrying the substrate 20 is located in the vacuum environment of the reaction chamber, and the driving component 4 is located outside the vacuum environment to coat the upper surface 2A of the substrate 20. When it is necessary to carry the substrate 20 away from the coating carrier 10 (i.e., take away the substrate 20): the driving motor 41 is controlled to start, the cylinder 42 drives the distance between the guide plate 423 and the fixed plate 1 to decrease, and the guide rod 43 rises relative to the fixed plate 1 along the thickness direction H, thereby driving the connected multiple second carrier plates 3 to rise relative to the first carrier plate 2, and there is a gap between the first carrier plate 2 and the second carrier plate 3. At this time, when the support part 32 rises together with the second carrier plate 3, the support part 32 abuts against the bottom surface 2E of the substrate 20 in the placement groove 23 and drives the substrate 20 away from the first carrier plate 2, so that the substrate 20 is transferred to be carried by the support part 32, and the setting of the support part 32 allows the substrate 20 to expose the bottom surface 2E from the hollow placement opening 31. The robot extends from the gap between the first carrier plate 2 and the second carrier plate 3 and is located below the bottom surface 2E of the substrate 20. The robot abuts against the bottom surface 2E of the substrate 20 and lifts the substrate 20. The robot drives the lifted substrate 20 to move out of the coating carrier 10 from the placement port 31. When all the substrates 20 of the coating carrier 10 are moved away, the coating carrier 10 is in a state as shown in FIG. Figure 4 and Figure 5working state. When it is necessary to carry the substrate 20 into the coating carrier 10 (i.e. put the substrate 20): the coating carrier 10 is maintained in a working state, in which the second carrier plate 3 is located above the first carrier plate 2, and the manipulator lifts the substrate from the bottom surface 2E of the substrate 20 and extends it from the placement port 31 into the gap between the first carrier plate 2 and the second carrier plate 3 of the corresponding layer, and places the substrate 20 to be supported by the support portion 32. The limit portion 35 can position the substrate 20 to avoid the position of the substrate 20 from shifting. After the manipulator puts the support portions 32 of all layers of the second carrier plates 3 into the substrate 20, the control driving motor 41 is started, the cylinder 42 drives the distance between the guide plate 423 and the fixed plate 1 to increase, and the guide rod 43 descends relative to the fixed plate 1 along the thickness direction H, thereby driving the multiple connected second carrier plates 3 to descend relative to the first carrier plate 2 to the initial state, and the placement of the substrate 20 is completed. In this way, the multi-layer substrate 20 can be taken and placed. During the taking and placing process, a robot is used to lift and transport the bottom surface 2E of the substrate 20 to avoid damaging the coating layer on the upper surface 2A of the substrate 20, thereby ensuring the quality and performance of the substrate 20.

[0096] An embodiment of the present application further provides a coating device 100, such as Fig.15 The coating device 100 includes a main body 110 and a robot 120. The main body 110 has a coating chamber 110A and a coating carrier 10 described in the above embodiments. The coating carrier 10 can be placed in the coating chamber 110A. The robot 120 can cooperate with the bottom surface of the substrate, so as to place the substrate into the coating carrier 10 or take it out from the coating carrier 10 by lifting.

[0097] It is understood that the coating device 100 can be an ALD device for deposition, a PECVD device, etc., without specific limitation. For example, when the coating device 100 is an ALD device, the coating chamber 110A is an ALD reaction chamber, and the ALD reaction chamber needs to be kept vacuum, so when the coating carrier 10 is placed inside, the driving component of the coating carrier 10 needs to be set outside the vacuum reaction chamber to ensure that the second carrier plate can be driven to move.

[0098] In the embodiments of the present application, if not clearly defined, the connection form may be a detachable connection by means of bolts and nuts, screws, buckles, magnetic attraction, etc. In some connections, if there is no special requirement for the detachable form, a non-detachable connection may be made by means of welding, bonding, etc.

[0099] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details of the above application are only for the purpose of illustration and ease of understanding, rather than limitation, and the above details do not limit the present application to the use of the above specific details to be implemented.

[0100] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0101] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0102] The above description of the applied aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features of the present application.

[0103] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the form in which it is applied. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize some variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A coating carrier, characterized in that: Used to carry a substrate, the substrate having a bottom surface, the coating carrier comprising: Fixed plate; A plurality of first carrying plates connected to the fixing plate and arranged at intervals along the thickness direction of the fixing plate, wherein the upper surface of the first carrying plate has a carrying area and a clearance groove at least partially located in the carrying area, the carrying area is configured to carry the substrate, and the bottom surface is in contact with the carrying area; A plurality of second carrier plates, corresponding to the plurality of first carrier plates one by one, the second carrier plates being located on one side of the first carrier plates in the thickness direction, the second carrier plates being provided with a hollow placement opening corresponding to the carrying area, and the second carrier plates having at least one supporting portion along the edge of the placement opening, and a side wall of the second carrier plates being provided with an opening communicating with the placement opening, wherein the substrate can enter or leave the placement opening through the opening, and when the substrate enters the placement opening, the substrate can be placed on the supporting portion through the placement opening; A driving assembly connected to the second carrier plate is configured as follows: driving the second carrying plate to move in a direction close to the upper surface of the first carrying plate, so that the supporting portion extends into the avoiding groove, so as to transfer the substrate carried by the supporting portion to the carrying area; and The second carrying plate is driven to move in a direction away from the upper surface of the first carrying plate, so that the supporting portion is away from the avoiding groove, so as to transfer the substrate carried by the carrying area to the supporting portion.

2. The coating carrier according to claim 1, characterized in that: Also includes: At least one connecting rod connects the plurality of second supporting plates, and the driving assembly is connected to at least one of the connecting rods and can drive the connecting rod to move, so that the connecting rod can be used to drive the plurality of second supporting plates to move simultaneously in a direction close to or away from the upper surface of the first supporting plate.

3. The coating carrier according to claim 2, characterized in that: The second carrying plate is located above the first carrying plate, and the second carrying plate has a plurality of the supporting portions; The support portion is arranged around the placement opening, and at least a portion of the support portion extends into the placement opening. The support portion is configured such that when the first carrier plate carries the substrate, the support portion extends into the avoidance groove and is located below the bottom surface, and when the second carrier plate carries the substrate, the support portion is located above the first carrier plate and carries the substrate.

4. The coating carrier according to claim 3, characterized in that: The second carrying plate has a plurality of limiting parts, and the plurality of limiting parts form a limiting space; The plurality of limiting portions are respectively arranged on a side of the support portion away from the fixing plate. When the support portion carries the substrate, the limiting portions abut against or gap-fit ​​with the side surface of the substrate to limit the substrate in the limiting space.

5. The coating carrier according to claim 2, characterized in that: Also includes: at least one fixing rod, the fixing rod connecting the plurality of the first bearing plates to the fixing plate; Wherein, the first bearing plate is provided with an avoidance hole, and the connecting rod passes through the avoidance holes of a plurality of the first bearing plates to connect a plurality of the second bearing plates.

6. The coating carrier according to claim 1, characterized in that: The drive assembly comprises: A driving motor is arranged on a side of the fixing plate away from the second bearing plate; A cylinder connected to the driving motor; A guide rod is connected to the top rod of the cylinder, the fixing plate is provided with a through hole, the guide rod passes through the through hole to connect to the second supporting plate, and the guide rod is configured to enable the cylinder to drive the guide rod to move under the drive of the driving motor, thereby driving the second supporting plate to move in a direction close to or away from the upper surface of the first supporting plate.

7. The film coating carrier according to claim 6, characterized in that: The drive assembly also includes: A sealing portion is connected to the guide rod, and is configured to seal a gap between the guide rod and the through hole.

8. The coating carrier according to any one of claims 1 to 7, characterized in that: The first supporting plate is provided with at least one placement groove, and the groove bottom of the placement groove forms the supporting area.

9. The film coating carrier according to claim 8, characterized in that: The upper surface of the first carrying plate is provided with at least one protrusion; Wherein, the placement groove is located on the raised portion, and in the orthographic projection of the second supporting plate onto the first supporting plate in the thickness direction, the raised portion is located in the area enclosed by the placement opening, and when the first supporting plate carries the substrate, the second supporting plate contacts the upper surface of the first supporting plate, and the raised portion at least partially extends into the placement opening along the thickness direction.

10. The film coating carrier according to claim 9, characterized in that: Along the thickness direction, the bottom of the placement groove is higher than the upper surface of the first supporting plate.

11. A coating device, characterized in that: include: A main body having a coating chamber; The coating carrier described in any one of claims 1 to 10 can be placed in the coating chamber.

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