Integrated pressure and temperature sensor

Abstract

The utility model relates to an integrated pressure and temperature sensor for an electric vehicle. The integrated pressure and temperature sensor comprises a shell; a connector; a sensor port; a pressure detection module; the temperature detection module is packaged in the inner cavity of the sensor and comprises a bracket, a temperature detection element and a transfer printed circuit board; and an electronic module assembly. The temperature detection element is electrically connected to the transfer printed circuit board, and the transfer printed circuit board is electrically connected to the electronic module assembly, thereby achieving an electrical connection between the temperature detection module and the electronic module assembly.

Description

Technical Field

[0001] The present disclosure relates to the field of vehicle sensors, and more particularly to an integrated pressure and temperature sensor for electric vehicles. Background Art

[0002] In recent years, integrated pressure and temperature sensors have gained widespread application in electric vehicle heat pump systems due to their compact size, long service life, and high compatibility with control systems. However, existing integrated pressure and temperature sensors suffer from poor electrical connection reliability between the temperature sensing element (such as a thermistor) and the electronic module assembly (EMA), as well as high cost. Utility Model Content

[0003] In response to the problems existing in the prior art, the present disclosure provides an integrated pressure and temperature sensor for electric vehicles. The integrated pressure and temperature sensor, based on the integration of temperature measurement function and pressure measurement function, can provide a more reliable electrical connection between the temperature detection element (such as a thermistor) and the electronic module assembly (EMA), and can reduce costs.

[0004] According to one aspect of the present disclosure, an integrated pressure and temperature sensor for an electric vehicle is provided, the integrated pressure and temperature sensor comprising:

[0005] case;

[0006] a connector attached to a top portion of the housing;

[0007] a sensor port attached to the bottom of the housing and configured to receive a fluid, the housing, the connector, and the sensor port collectively defining an interior cavity of a sensor;

[0008] a pressure detection module, the pressure detection module being encapsulated in the inner cavity and comprising a pressure detection element, the pressure detection module being configured to detect the pressure of the fluid and generate a pressure signal;

[0009] a temperature detection module encapsulated in the inner cavity and comprising a bracket, a temperature detection element, and a transfer printed circuit board, wherein the temperature detection module is configured to detect the temperature of the fluid and generate a temperature signal; and

[0010] an electronic module assembly encapsulated in the inner cavity, the electronic module assembly being configured to generate a pressure detection electrical signal based on the pressure signal and to generate a temperature detection electrical signal based on the temperature signal,

[0011] The temperature detection element is electrically connected to the transfer printed circuit board, and the transfer printed circuit board is electrically connected to the electronic module assembly, thereby achieving electrical connection between the temperature detection module and the electronic module assembly.

[0012] In one embodiment of the integrated pressure and temperature sensor, the EMA includes a main printed circuit board, and the relay printed circuit board is electrically connected to the main printed circuit board.

[0013] In one embodiment of the integrated pressure and temperature sensor, the main printed circuit board includes a main conductive pad, the intermediate printed circuit board includes a intermediate conductive pad, and the intermediate printed circuit board is electrically connected to the main printed circuit board via leads connected between the main conductive pad and the intermediate conductive pad.

[0014] In one embodiment of the integrated pressure and temperature sensor, the main conductive pad and the intermediate conductive pad are made of the same conductive material.

[0015] In one embodiment of the integrated pressure and temperature sensor, the main conductive pad and the intermediate conductive pad are made of gold or aluminum.

[0016] In one embodiment of the integrated pressure and temperature sensor, the intermediate printed circuit board includes a soldering portion, and the temperature detection element is soldered to the soldering portion.

[0017] In one embodiment of the integrated pressure and temperature sensor, the temperature detection element is welded to the welding portion by soldering, resistance welding, or laser welding.

[0018] In one embodiment of the integrated pressure and temperature sensor, the intermediate printed circuit board includes a connecting portion, and the bracket is fixed to the connecting portion by heat riveting or snap-fitting.

[0019] In one embodiment of the integrated pressure and temperature sensor, the transfer conductive pad is disposed on the transfer printed circuit board in a manner away from the soldering portion and the connecting portion.

[0020] In one embodiment of the integrated pressure and temperature sensor, the temperature detection module is fixed to the sensor port by interference fit and bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Various objects, features, and advantages of the present disclosure will become more apparent upon consideration of the following description of preferred embodiments of the present disclosure in conjunction with the accompanying drawings. The accompanying drawings are merely illustrative illustrations of the present disclosure and are not necessarily drawn to scale. In the drawings, like reference numerals designate identical or similar parts throughout.

[0022] Figure 1 1 is an overall schematic diagram of an integrated pressure and temperature sensor for electric vehicles according to the present disclosure.

[0023] Figure 2 is an exploded view of an integrated pressure and temperature sensor for an electric vehicle according to the present disclosure.

[0024] Figure 3 1 is an exploded view of a temperature detection module in an integrated pressure and temperature sensor according to the present disclosure.

[0025] Figure 4 Schematic diagram of the temperature detection module in the integrated pressure and temperature sensor according to the present disclosure. DETAILED DESCRIPTION

[0026] The present disclosure will be described below with reference to the accompanying drawings, wherein the accompanying drawings illustrate preferred embodiments of the present disclosure. However, it should be understood that the present disclosure can be presented in a variety of different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present disclosure more complete and to fully illustrate the scope of protection of the present disclosure to those skilled in the art. It should also be understood that the technical features in the embodiments disclosed herein can be combined in various ways to provide more additional embodiments. Those skilled in the art may appropriately modify the detailed configuration without departing from the scope of the present disclosure.

[0027] It should be understood that like reference numerals refer to like elements throughout the drawings. In the drawings, the dimensions of some features may be distorted for clarity.

[0028] Unless otherwise specified, the terms used herein (including technical and scientific terms) shall have the meanings that are commonly understood by those of ordinary skill in the art to which this disclosure relates. Unless otherwise specified, the terms "include" and "comprising" as used in the specification and claims shall be interpreted as open-ended, that is, "include" and "comprising" shall be interpreted as synonymous with the terms "include at least" or "include at least."

[0029] Unless otherwise specified, the terms “upper”, “lower”, “top”, “bottom”, etc. used in this disclosure refer only to the relative orientations of the device and its related components in the state as shown in the drawings.

[0030] It should be understood that the terms used in the specification are only used to describe specific embodiments and are not intended to limit the present disclosure. For the sake of brevity and / or clarity, well-known functions or structures may not be described in detail.

[0031] In view of the above-mentioned defects in the prior art, the present disclosure provides an integrated pressure and temperature sensor for electric vehicles.

[0032] like Figure 1 and Figure 2 As shown, according to an embodiment of the present disclosure, an integrated pressure and temperature sensor for electric vehicles is provided. The sensor includes a connector 1, a housing 2, and a sensor port 3. The connector 1 is attached to the top of the housing 2, and the sensor port 3 is attached to the bottom of the housing 2 and is configured to receive a fluid. Thus, the connector 1, the housing 2, and the sensor port 3 collectively define an internal cavity of the sensor.

[0033] In addition, an electronic module assembly (EMA) 4, a temperature detection module 5, and a pressure detection module are encapsulated in the inner cavity of the sensor. The temperature detection module 5 is configured to detect the temperature of the fluid and generate a temperature signal. The pressure detection module includes a pressure detection element 6 and is configured to detect the pressure of the fluid and generate a pressure signal. The electronic module assembly 4 is configured to generate a pressure detection electrical signal based on the pressure signal and a temperature detection electrical signal based on the temperature signal. The pressure detection electrical signal and the temperature detection electrical signal generated by the electronic module assembly 4 can be output to the client host computer for subsequent processing.

[0034] In this embodiment, if Figure 1 and Figure 2 As shown, the integrated pressure and temperature sensor may further include auxiliary components such as a spring 7, a sealing ring 8, a gasket 9, a sealing washer 10 and a support ring 11, so as to facilitate the assembly of the sensor and ensure good sealing performance.

[0035] like Figure 3 and Figure 4As shown, the temperature detection module 5 includes a temperature detection element 50, a bracket 52 and a transfer printed circuit board 53. The temperature detection element 50 is configured to be electrically connected to the transfer printed circuit board 53, and the transfer printed circuit board 53 is configured to be electrically connected to the electronic module assembly 4, thereby realizing the electrical connection between the electronic module assembly 4 and the temperature detection module 5. The temperature detection element 50 can be a thermistor, for example, a negative temperature coefficient thermistor (NTC). The bracket 52 can be made of plastic. Preferably, the electronic module assembly 4 includes a main printed circuit board, and the transfer printed circuit board 53 is electrically connected to the main printed circuit board. Both the main printed circuit board and the transfer printed circuit board 53 can be made of FR4 material. Since the transfer printed circuit board 53 is provided in the temperature detection module 5 of the sensor, and the electrical connection between the electronic module assembly 4 (main printed circuit board) and the temperature detection module 5 is realized by means of the transfer printed circuit board 53, the problem of poor electrical connection reliability between the temperature detection element 50 and the electronic module assembly 4 can be avoided.

[0036] Specifically, the main printed circuit board of the electronic module assembly 4 may include a main conductive pad (not shown). Figure 4 As shown, the transfer printed circuit board 53 may include a transfer conductive pad 55. The transfer printed circuit board 53 can be electrically connected to the main printed circuit board by connecting the lead (binding wire) between the main conductive pad of the main printed circuit board and the transfer conductive pad 55 of the transfer printed circuit board 53, thereby achieving a high-reliability electrical connection between the electronic module assembly 4 (main printed circuit board) and the temperature detection module 5. Preferably, the main conductive pad of the main printed circuit board and the transfer conductive pad 55 of the transfer printed circuit board 53 are made of the same conductive material (such as gold or aluminum). Further preferably, the lead (binding wire) connected between the main conductive pad and the transfer conductive pad 55 can be made of the same conductive material (such as gold or aluminum) as the main conductive pad and the transfer conductive pad 55. Alternatively, the lead (binding wire) connected between the main conductive pad and the transfer conductive pad 55 can also be made of other materials with excellent welding performance. Through the above-mentioned arrangement, the reliability of the electrical connection between the electronic module assembly 4 (main printed circuit board) and the temperature detection module 5 can be further improved.

[0037] In addition, if Figure 3 and Figure 4As shown, the transfer printed circuit board 53 includes a welding portion 54, and the temperature detection element 50 can be welded to the welding portion 54 (via the wire 51), thereby realizing the electrical connection between the temperature detection element 50 and the transfer printed circuit board 53. Preferably, the temperature detection element 50 can be welded to the welding portion 54 by soldering, resistance welding or laser welding. Further, the transfer printed circuit board 53 also includes a connecting portion 56, and the bracket 52 can be fixed to the connecting portion 56 by thermal riveting or snap-fitting. Preferably, the transfer conductive pad 55 is arranged on the transfer printed circuit board 53 in a manner away from the welding portion 54 and the connecting portion 56 to avoid affecting the connection quality of the lead (binding wire) due to contamination of the transfer conductive pad 55. Further preferably, the temperature detection module 5 can be fixed to the sensor port 3 by interference fit and bonding.

[0038] Compared with existing sensors, the integrated pressure and temperature sensor described in the present disclosure integrates temperature measurement and pressure measurement functions. By setting a transfer printed circuit board in the temperature detection module, it can provide a more reliable electrical connection between the temperature detection element (such as thermistor NTC) and the electronic module assembly (EMA), and can effectively reduce costs.

[0039] Although the present disclosure has been described with reference to exemplary embodiments, it should be understood that the present disclosure is not limited to the exemplary embodiments described above. Various modifications and variations of the exemplary embodiments described above may be made without departing from the scope and scope of the present disclosure. The scope of the appended claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. An integrated pressure and temperature sensor for electric vehicles, characterized in that: The integrated pressure and temperature sensor comprises: case; a connector attached to a top portion of the housing; a sensor port attached to the bottom of the housing and configured to receive a fluid, the housing, the connector, and the sensor port collectively defining an interior cavity of a sensor; a pressure detection module, the pressure detection module being encapsulated in the inner cavity and comprising a pressure detection element, the pressure detection module being configured to detect the pressure of the fluid and generate a pressure signal; a temperature detection module, which is encapsulated in the inner cavity and includes a bracket, a temperature detection element and a transfer printed circuit board, and is configured to detect the temperature of the fluid and generate a temperature signal; and an electronic module assembly encapsulated in the inner cavity, the electronic module assembly being configured to generate a pressure detection electrical signal based on the pressure signal and to generate a temperature detection electrical signal based on the temperature signal, The temperature detection element is electrically connected to the transfer printed circuit board, and the transfer printed circuit board is electrically connected to the electronic module assembly, thereby achieving electrical connection between the temperature detection module and the electronic module assembly.

2. The integrated pressure and temperature sensor according to claim 1, characterized in that: The EMA includes a main printed circuit board, and the relay printed circuit board is electrically connected to the main printed circuit board.

3. The integrated pressure and temperature sensor according to claim 2, characterized in that: The main printed circuit board includes a main conductive pad, the transit printed circuit board includes a transit conductive pad, and the transit printed circuit board is electrically connected to the main printed circuit board through a lead wire connected between the main conductive pad and the transit conductive pad.

4. The integrated pressure and temperature sensor according to claim 3, characterized in that: The main conductive pad and the transfer conductive pad are made of the same conductive material.

5. The integrated pressure and temperature sensor according to claim 4, characterized in that: The main conductive pad and the intermediate conductive pad are made of gold or aluminum.

6. The integrated pressure and temperature sensor according to any one of claims 1 to 5, characterized in that: The transfer printed circuit board includes a transfer conductive pad and a soldering portion, and the temperature detection element is soldered to the soldering portion.

7. The integrated pressure and temperature sensor according to claim 6, characterized in that: The temperature detection element is welded to the welding portion by soldering, resistance welding, or laser welding.

8. The integrated pressure and temperature sensor according to claim 7, characterized in that: The transfer printed circuit board includes a connection portion, and the bracket is fixed to the connection portion by heat riveting or snap-fitting.

9. The integrated pressure and temperature sensor according to claim 8, characterized in that: The transfer conductive pad is disposed on the transfer printed circuit board in a manner of being away from the soldering portion and the connecting portion.

10. The integrated pressure and temperature sensor according to claim 9, characterized in that: The temperature detection module is fixed to the sensor port by means of interference fit and bonding.

Images