Package structure

Abstract

The utility model discloses a plastic packaging layer structure with an electromagnetic shielding function and a packaging structure, and the plastic packaging layer structure with the electromagnetic shielding function comprises an inner side plastic packaging layer which is used for being arranged on a substrate and wrapping a chip on the substrate; the electromagnetic shielding layer coats the outer side of the inner side plastic package layer; and the outer side plastic package layer is coated on the outer side of the electromagnetic shielding layer. According to the plastic packaging layer structure, the electromagnetic shielding layer is located between the inner side plastic packaging layer and the outer side plastic packaging layer, and therefore the risk of peeling does not exist. In addition, the electromagnetic shielding layer is packaged by the outer plastic packaging layer, so that oxidation can be prevented.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, and in particular to a plastic sealing layer structure and a packaging structure with electromagnetic shielding functions. Background Art

[0002] The packaging structure usually includes a substrate, a chip disposed on the substrate, and a plastic layer structure covering the chip. In order to achieve the electromagnetic shielding function and improve the anti-interference ability, the outermost side of the plastic layer structure has a metal layer, which plays the role of electromagnetic shielding. This plastic layer structure has the following problems: 1. There is a risk of the metal layer peeling off; 2. The metal layer will be oxidized. Utility Model Content

[0003] The utility model aims at the above-mentioned problems, overcomes at least one disadvantage, and proposes a plastic sealing layer structure and a packaging structure with electromagnetic shielding function.

[0004] The technical solution adopted by the utility model is as follows:

[0005] A plastic sealing layer structure with electromagnetic shielding function, comprising:

[0006] The inner plastic sealing layer is used to be arranged on the substrate to cover the chip on the substrate;

[0007] An electromagnetic shielding layer, covering the outer side of the inner plastic sealing layer;

[0008] The outer plastic sealing layer is coated on the outer side of the electromagnetic shielding layer.

[0009] In the plastic sealing layer structure of the present application, the electromagnetic shielding layer is located between the inner plastic sealing layer and the outer plastic sealing layer, so there is no risk of peeling. In addition, the electromagnetic shielding layer is encapsulated by the outer plastic sealing layer to prevent oxidation.

[0010] In actual use, because the electromagnetic shielding layer is located between the inner plastic sealing layer and the outer plastic sealing layer, it is no longer necessary to use materials that are not easily oxidized, and there are more material options for the electromagnetic shielding layer.

[0011] In one embodiment of the present invention, the electromagnetic shielding layer is made of metal.

[0012] In one embodiment of the present invention, a filling space is formed between the inner plastic sealing layer and the outer plastic sealing layer, and the electromagnetic shielding layer is located in the filling space.

[0013] In one embodiment of the present invention, the filling space includes a horizontal portion and vertical portions located at two sides of the horizontal portion.

[0014] The present application also discloses a packaging structure, including a substrate, a chip arranged on the substrate, and the above-mentioned plastic packaging layer structure.

[0015] In one embodiment of the present invention, the outer plastic packaging layer is fixed to the substrate.

[0016] In one embodiment of the present invention, the outer ring of the substrate has a conductive structure, and the electromagnetic shielding layer is connected to the conductive structure.

[0017] The electromagnetic shielding layer is connected to the conductive structure of the outer circle of the substrate, which can increase the electromagnetic shielding space and improve the effect of the entire electromagnetic shielding.

[0018] The present application also discloses a method for processing a packaging structure, comprising the following steps:

[0019] Providing a package, the package comprising a substrate, a chip disposed on the substrate, and a first molding material disposed on the substrate, wherein the molding layer is used to cover the chip;

[0020] Grooving the first plastic encapsulation material according to the set dividing line, so that the first plastic encapsulation material forms a plurality of inner plastic encapsulation layers;

[0021] Filling the outer surface of the inner plastic sealing layer with electromagnetic shielding material so that the outer surface of the inner plastic sealing layer forms an electromagnetic shielding layer, and there is a gap between two adjacent electromagnetic shielding layers;

[0022] Forming a second molding compound on the outer surface of the electromagnetic shielding layer and the substrate, wherein the second molding compound covers the gap;

[0023] The second plastic encapsulation material and the substrate are cut to obtain a single packaging structure. The second plastic encapsulation material is cut to form a plurality of outer plastic encapsulation layers, and the outer plastic encapsulation layers are coated on the outer side of the electromagnetic shielding layer.

[0024] In actual application, the filled electromagnetic shielding material can be applied in the form of sputtering, spray, aerosol, etc.

[0025] In actual application, the substrate may be a strip substrate, in which case there is no risk of metal burrs and excessive sputtering when processing the electromagnetic shielding layer.

[0026] In actual use, the first plastic packaging material can be grooved by mechanical cutting (such as saw blade) or laser cutting.

[0027] In actual application, the second plastic packaging material and the substrate can be cut by mechanical cutting (such as saw blade) or laser cutting.

[0028] The beneficial effects of the utility model are as follows: in the plastic sealing layer structure of the present application, the electromagnetic shielding layer is located between the inner plastic sealing layer and the outer plastic sealing layer, so there is no risk of peeling. In addition, the electromagnetic shielding layer is encapsulated by the outer plastic sealing layer to prevent oxidation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of a packaging structure;

[0030] Figure 2 is a schematic diagram of the package;

[0031] Figure 3 is a schematic diagram of a first plastic encapsulation material of a package after slotting;

[0032] Figure 4 This is a schematic diagram of the outer surface of the inner plastic sealing layer after being filled with electromagnetic shielding material;

[0033] Figure 5 It is a schematic diagram of the second plastic packaging material covering the electromagnetic shielding layer and the substrate.

[0034] The reference numerals in the figures are:

[0035] 1. Substrate; 11. Conductive structure; 2. Chip; 3. Plastic layer structure; 31. Inner plastic layer; 32. Electromagnetic shielding layer; 33. Outer plastic layer; 34. Filling space; 341. Horizontal part; 342. Vertical part; 4. Package; 5. First plastic compound; 6. Gap; 7. Second plastic compound. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0038] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] The utility model is described in detail below in conjunction with the accompanying drawings.

[0040] like Figure 1 As shown, this embodiment discloses a packaging structure, including a substrate 1, a chip 2 disposed on the substrate 1, and a plastic encapsulation layer structure 3 with an electromagnetic shielding function disposed on the substrate 1, wherein the plastic encapsulation layer structure 3 includes:

[0041] The inner plastic sealing layer 31 is used to be disposed on the substrate 1 to cover the chip 2 on the substrate 1;

[0042] The electromagnetic shielding layer 32 is coated on the outer side of the inner plastic sealing layer 31;

[0043] The outer plastic packaging layer 33 is coated on the outer side of the electromagnetic shielding layer 32 and fixed to the substrate 1 .

[0044] In the plastic sealing layer structure 3 of the present application, the electromagnetic shielding layer 32 is located between the inner plastic sealing layer 31 and the outer plastic sealing layer 33, so there is no risk of peeling. In addition, the electromagnetic shielding layer 32 is encapsulated by the outer plastic sealing layer 33 to prevent oxidation.

[0045] In this embodiment, the electromagnetic shielding layer 32 is made of metal. In actual use, because the electromagnetic shielding layer 32 is located between the inner plastic layer 31 and the outer plastic layer 33, it is no longer necessary to use a material that is not easily oxidized, and the electromagnetic shielding layer 32 has more material options.

[0046] like Figure 1 As shown, in this embodiment, a filling space 34 is formed between the inner plastic encapsulation layer 31 and the outer plastic encapsulation layer 33, and the electromagnetic shielding layer 32 is located in the filling space 34. The filling space 34 includes a horizontal portion 341 and vertical portions 342 located at both sides of the horizontal portion 341.

[0047] like Figure 1 As shown, in this embodiment, the outer ring of the substrate 1 has a conductive structure 11, and the electromagnetic shielding layer 32 is connected to the conductive structure 11. The electromagnetic shielding layer 32 is connected to the conductive structure 11 of the outer ring of the substrate 1, which can increase the electromagnetic shielding space and improve the overall electromagnetic shielding effect.

[0048] This embodiment also discloses a method for processing the packaging structure of this embodiment, comprising the following steps:

[0049] like Figure 2 As shown, a package 4 is provided, the package 4 includes a substrate 1, a chip 2 arranged on the substrate 1, and a first molding material 5 arranged on the substrate 1, and the molding layer is used to cover the chip 2;

[0050] like Figure 3 As shown, the first plastic encapsulation material 5 is grooved according to the set dividing line, and the first plastic encapsulation material 5 forms a plurality of inner plastic encapsulation layers 31;

[0051] like Figure 4 As shown, the outer surface of the inner plastic sealing layer 31 is filled with electromagnetic shielding material, so that the outer surface of the inner plastic sealing layer 31 forms an electromagnetic shielding layer 32, and there is a gap 6 between two adjacent electromagnetic shielding layers 32;

[0052] like Figure 5 As shown, a second molding compound 7 is formed on the outer surface of the electromagnetic shielding layer 32 and the substrate 1, and the second molding compound 7 covers the gap 6;

[0053] See Figure 5 and 1 The second plastic encapsulation material 7 and the substrate 1 are cut to obtain a single packaging structure. After the second plastic encapsulation material 7 is cut, a plurality of outer plastic encapsulation layers 33 are formed. The outer plastic encapsulation layers 33 are coated on the outer side of the electromagnetic shielding layer 32 .

[0054] In actual application, the filled electromagnetic shielding material can be applied in the form of sputtering, spray, aerosol, etc.

[0055] In actual use, the substrate 1 may be a strip-shaped substrate 1 , in which case there is no risk of metal burrs and excessive sputtering when processing the electromagnetic shielding layer 32 .

[0056] In actual use, the first plastic packaging material 5 can be grooved by mechanical cutting (such as saw blade) or laser cutting, and the second plastic packaging material and the substrate 1 can be cut by mechanical cutting (such as saw blade) or laser cutting.

[0057] The plastic packaging layer structure 3 of this embodiment is a three-layer structure. By arranging the electromagnetic shielding layer 32 between the inner plastic packaging layer 31 and the outer plastic packaging layer 33 , a more stable and reliable electromagnetic shielding effect can be achieved.

[0058] The above description is only a preferred embodiment of the utility model, and does not limit the patent protection scope of the utility model. Any equivalent structural transformation made using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also included in the protection scope of the utility model.

Claims

1. A packaging structure, characterized in that: The invention comprises a substrate, a chip arranged on the substrate and a plastic sealing layer structure having an electromagnetic shielding function, wherein the plastic sealing layer structure having an electromagnetic shielding function comprises: The inner plastic sealing layer is used to be arranged on the substrate to cover the chip on the substrate; An electromagnetic shielding layer, covering the outer side of the inner plastic sealing layer; An outer plastic sealing layer, covering the outer side of the electromagnetic shielding layer; The outer ring of the substrate has a conductive structure, and the electromagnetic shielding layer is connected to the conductive structure.

2. The packaging structure according to claim 1, characterized in that: The outer plastic sealing layer is fixed to the substrate.

3. The packaging structure according to claim 1, characterized in that: The electromagnetic shielding layer is made of metal.

4. The packaging structure according to claim 1, characterized in that: A filling space is formed between the inner plastic sealing layer and the outer plastic sealing layer, and the electromagnetic shielding layer is located in the filling space.

5. The packaging structure according to claim 4, characterized in that: The filling space includes a horizontal portion and vertical portions respectively located on both sides of the horizontal portion.

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