Mobile phone middle frame and intelligent mobile phone

Abstract

The utility model provides a mobile phone middle frame and a smart phone. The mobile phone middle frame comprises a bottom plate, a frame and a heat-conducting sheet, the frame is connected to the periphery of the bottom plate, the frame is arranged around the bottom plate, the bottom plate is provided with a mounting groove and a hollow groove, the mounting groove is adjacent to the hollow groove, the mounting groove is used for placing a mobile phone mainboard, and the heat-conducting sheet is arranged in the hollow groove. The frame is provided with a mounting groove, the bottom plate is provided with a hollow-out groove, the heat conducting sheet is located in the mounting groove and connected with the bottom plate, the hollow-out groove is used for a battery to penetrate through so that the battery can abut against a mobile phone metal rear shell, the inner side face of the frame is provided with a containing groove, the containing groove is used for containing an antenna, and an anti-shielding layer is formed on the groove wall of the containing groove. The mobile phone mainboard is abutted against the heat-conducting fin, so that heat is transferred to the bottom plate from the heat-conducting fin when the mobile phone mainboard works, the heat dissipation efficiency of the mobile phone mainboard is improved, the heat-conducting fin is simple in structure, the light and thin design of a mobile phone is facilitated, the mobile phone antenna is abutted against the anti-shielding layer, and the anti-shielding effect of the mobile phone middle frame is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of mobile phone middle frames, and in particular to a mobile phone middle frame and a smart phone. Background Art

[0002] The mobile phone middle frame refers to the frame located between the screen and the back cover of the mobile phone. It carries various components inside the mobile phone, such as the battery, motherboard, camera, cable, various sensors, microphone, receiver and other parts. At present, the mobile phone middle frame generally consists of two parts, one is the outer frame, and the other is the inner panel surrounded by the frame. Since the inner panel needs to be assembled with chips, batteries and other electrical components, the heat dissipation performance of the inner panel is required to be high.

[0003] For example, a Chinese patent with application number CN202320954610.X discloses an explosion-proof metal middle frame for a mobile phone that is conducive to heat dissipation, including a middle frame body, the bottom of which is fixedly connected to a bottom plate, explosion-proof components for explosion-proof and anti-fall are provided on both sides of the middle frame body, a fixed frame is fixedly connected to the top of the bottom plate, and a heat dissipation component for dissipating heat is provided in the fixed frame.

[0004] However, the structural design of the mobile phone middle frame has the following problems during use:

[0005] The mobile phone middle frame is provided with a heat dissipation component in the fixed frame, and the heat dissipation component includes a motor, exhaust fan blades and a base to dissipate heat from the bottom plate. Although the exhaust component solves the heat dissipation problem on the bottom plate, the structure of the exhaust component is relatively complex and requires a large space, which is not conducive to the thin and light design of the mobile phone; on the other hand, the mobile phone middle frame is made of metal, and when the antenna or various sensors of the mobile phone are installed in the middle frame, the metal will interfere with the signal, that is, the anti-shielding effect is poor.

[0006] Therefore, there is an urgent need for a mobile phone middle frame with good heat dissipation performance, simple structure and good anti-shielding effect. Utility Model Content

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a mobile phone middle frame and a smart phone with good heat dissipation performance, simple structure and good anti-shielding effect.

[0008] The purpose of this disclosure is achieved through the following technical solutions:

[0009] A mobile phone middle frame, comprising:

[0010] A bottom plate and a frame, wherein the frame is connected to the periphery of the bottom plate and is disposed around the bottom plate.

[0011] The mobile phone middle frame also includes a heat conducting sheet, the bottom plate is provided with a mounting groove and a hollow groove, the mounting groove is arranged adjacent to the hollow groove, the mounting groove is used to place the mobile phone motherboard, the heat conducting sheet is located in the mounting groove and is connected to the bottom plate, the hollow groove is used for the battery to pass through so that the battery abuts against the metal back shell of the mobile phone, the inner side surface of the frame is provided with a accommodating groove, the accommodating groove is used to accommodate the antenna, and an anti-shielding layer is formed on the groove wall of the accommodating groove.

[0012] In one embodiment, the anti-shielding layer is a plastic anti-shielding layer.

[0013] In one embodiment, the thickness of the anti-shielding layer is 2mm-3mm.

[0014] In one of the embodiments, the mobile phone middle frame further includes heat dissipation adhesive, and the heat conductive sheet is bonded to the groove wall of the mounting groove through the heat dissipation adhesive.

[0015] In one embodiment, the heat conductive sheet is a graphite heat conductive sheet.

[0016] In one embodiment, the bottom plate and the frame are an integrally formed structure.

[0017] In one of the embodiments, a plurality of connection columns are protruding from the bottom plate, and the plurality of connection columns are arranged at intervals, each of the connection columns is provided with a connection hole, and each of the connection holes is used for a fastener to pass through.

[0018] In one of the embodiments, the bottom plate is provided with a camera hole, the camera hole is arranged adjacent to the mounting groove, and the camera hole is used for a camera to pass through.

[0019] In one of the embodiments, at least two button holes are spaced apart from each other on one side of the frame.

[0020] A smart phone comprises the mobile phone middle frame described in any one of the above embodiments.

[0021] Compared with the prior art, the present invention has at least the following advantages:

[0022] 1. The frame of the mobile phone middle frame is connected to the periphery of the bottom plate, the bottom plate is provided with a mounting groove and a hollow groove, the heat conducting sheet is located in the mounting groove and connected to the bottom plate, the mobile phone mainboard is located in the mounting groove and abuts against the heat conducting sheet, so that when the mobile phone mainboard is working, the heat is transferred from the heat conducting sheet to the bottom plate, so as to improve the heat dissipation efficiency of the mobile phone mainboard, and at the same time, the structure of the heat conducting sheet and the bottom plate is simple, which is conducive to the light and thin design of the mobile phone.

[0023] 2. The above-mentioned mobile phone middle frame has a receiving groove on the inner side of the frame, and an anti-shielding layer is formed on the groove wall of the receiving groove. The mobile phone antenna is located in the receiving groove and abuts against the anti-shielding layer, that is, the mobile phone antenna will not directly contact the frame, thereby improving the anti-shielding effect of the mobile phone middle frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is a schematic structural diagram of a mobile phone middle frame according to an embodiment;

[0026] Figure 2 for Figure 1 Another structural schematic diagram of the mobile phone middle frame shown;

[0027] Figure 3 for Figure 2 A structural cross-sectional view of a mobile phone middle frame shown;

[0028] Figure 4 for Figure 3 The shown diagram is a partial enlarged schematic diagram of the mobile phone middle frame at point A. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] The present disclosure provides a mobile phone middle frame, including a bottom plate, a frame and a heat conductive sheet, wherein the frame is connected to the periphery of the bottom plate and is arranged around the bottom plate, the bottom plate is provided with a mounting groove and a hollow groove, the mounting groove is arranged adjacent to the hollow groove, the mounting groove is used to place a mobile phone motherboard, the heat conductive sheet is located in the mounting groove and connected to the bottom plate, the hollow groove is used for a battery to pass through so that the battery abuts against a metal rear shell of the mobile phone, an accommodating groove is provided on the inner side surface of the frame, the accommodating groove is used to accommodate an antenna, and an anti-shielding layer is formed on the groove wall of the accommodating groove.

[0033] The above-mentioned mobile phone middle frame has a frame connected to the periphery of the bottom plate, the bottom plate is provided with a mounting groove and a hollow groove, the heat conducting sheet is located in the mounting groove and connected to the bottom plate, the mobile phone motherboard is located in the mounting groove and abuts against the heat conducting sheet, so that when the mobile phone motherboard is working, the heat is transferred from the heat conducting sheet to the bottom plate, so as to improve the heat dissipation efficiency of the mobile phone motherboard. At the same time, the structure of the heat conducting sheet and the bottom plate is simple, which is conducive to the lightweight design of the mobile phone; on the other hand, an accommodating groove is provided on the inner side surface of the frame, and an anti-shielding layer is formed on the groove wall of the accommodating groove. The mobile phone antenna is located in the accommodating groove and abuts against the anti-shielding layer, that is, the mobile phone antenna will not directly contact the frame, thereby improving the anti-shielding effect of the mobile phone middle frame.

[0034] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0035] like Figures 1 to 4 As shown, a mobile phone middle frame 10 of an embodiment includes a base plate 100, a frame 200 and a heat conductive sheet 300, wherein the frame 200 is connected to the periphery of the base plate 100, and the frame 200 is arranged around the base plate 100, the base plate 100 is provided with a mounting groove 110 and a hollow groove 120, the mounting groove 110 is arranged adjacent to the hollow groove 120, the mounting groove 110 is used to place a mobile phone motherboard, the heat conductive sheet 300 is located in the mounting groove 110 and connected to the base plate 100, the hollow groove 120 is used for a battery to pass through so that the battery abuts against a metal back shell of the mobile phone, and a receiving groove 210 is provided on the inner side surface of the frame 200, the receiving groove 210 is used to receive an antenna, and an anti-shielding layer (not shown) is formed on the groove wall of the receiving groove 210.

[0036] In this embodiment, the heat conductive sheet 300 is located in the mounting groove 110 and connected to the base plate 100, and the mobile phone mainboard is installed in the mounting groove 110, so that the two sides of the heat conductive sheet 300 are respectively abutted against the mobile phone mainboard and the base plate 100, and the thermal conductivity of the heat conductive sheet 300 is higher than that of the base plate 100. When the mobile phone mainboard is working, the heat can be transferred to the heat conductive sheet 300 faster, and then transferred to the base plate 100 by the heat conductive sheet 300, so as to improve the heat dissipation efficiency of the mobile phone mainboard, and the mobile phone battery passes through the hollow groove and abuts against the metal back shell of the mobile phone, that is, the mobile phone battery directly abuts against the metal back shell of the mobile phone, so that the heat generated by the mobile phone battery is transferred to the metal back shell of the mobile phone to dissipate the heat of the battery. Furthermore, a receiving groove 210 is provided on the inner side surface of the frame 200, and an anti-shielding layer is formed on the groove wall of the receiving groove 210 during injection molding. When the mobile phone is assembled, the mobile phone antenna is installed in the receiving groove 210 and abuts against the anti-shielding layer to prevent the signal of the mobile phone antenna from being blocked by the metal shell, thereby improving the anti-shielding effect of the mobile phone middle frame 10.

[0037] In the above-mentioned mobile phone middle frame 10, the frame 200 is connected to the periphery of the bottom plate 100, the bottom plate 100 is provided with a mounting groove 110 and a hollow groove, the heat conductive sheet 300 is located in the mounting groove 110 and connected to the bottom plate 100, the mobile phone motherboard is located in the mounting groove 110 and abuts against the heat conductive sheet 300, so that when the mobile phone motherboard is working, the heat is transferred from the heat conductive sheet 300 to the bottom plate 100, so as to improve the heat dissipation efficiency of the mobile phone motherboard, and at the same time, the structure of the heat conductive sheet 300 and the bottom plate 100 is simple, which is conducive to the lightweight design of the mobile phone; on the other hand, the inner side surface of the frame 200 is provided with a receiving groove 210, and an anti-shielding layer is formed on the groove wall of the receiving groove 210, and the mobile phone antenna is located in the receiving groove 210 and abuts against the anti-shielding layer, that is, the mobile phone antenna will not directly contact the frame 200, thereby improving the anti-shielding effect of the mobile phone middle frame 10.

[0038] In one embodiment, the anti-shielding layer is a plastic anti-shielding layer. In this embodiment, the anti-shielding layer is made of plastic (PC) and is formed on the wall of the accommodating groove 210 during the injection molding process of the mobile phone middle frame 10, so that the signal of the mobile phone antenna on the accommodating groove 210 will not be shielded by the metal shell.

[0039] In one embodiment, the thickness of the anti-shielding layer is 2 mm-3 mm. In this embodiment, the thickness of the anti-shielding layer is 2 mm.

[0040] In one embodiment, the mobile phone middle frame 10 further includes heat dissipation adhesive (not shown), and the heat conductive sheet 300 is bonded to the groove wall of the mounting groove 110 through the heat dissipation adhesive, so that the heat conductive sheet 300 is fixed to the bottom plate 100. It can be understood that while the heat dissipation adhesive fixes the heat conductive sheet 300 to the bottom plate 100, the heat of the heat conductive sheet 300 is also transferred from the heat dissipation adhesive to the bottom plate 100 more quickly, further improving the heat dissipation efficiency.

[0041] In one embodiment, the heat conductive sheet 300 is a graphite heat conductive sheet 300. In this embodiment, the heat conductive sheet 300 is made of graphite, and the thermal conductivity of graphite is higher than that of metals such as aluminum and copper, and the graphite heat conductive sheet 300 is in contact with the mobile phone motherboard, so that the heat on the mobile phone motherboard is quickly transferred to the graphite heat conductive sheet 300.

[0042] In one embodiment, the bottom plate 100 and the frame 200 are integrally formed. In this embodiment, the bottom plate 100 and the frame 200 are integrally formed by die-casting, so that the structural strength between the bottom plate 100 and the frame 200 is higher.

[0043] like Figure 1 As shown, in one embodiment, a plurality of connection posts 130 are convexly provided on the bottom plate 100, and the plurality of connection posts 130 are arranged at intervals, and each of the connection posts 130 is provided with a connection hole 131, and each of the connection holes 131 is used for fasteners to pass through. In this embodiment, the fasteners are screws, and the mobile phone motherboard, camera, earpiece and other parts are fixed to the bottom plate 100 by screws.

[0044] like Figure 1 As shown, in one embodiment, the bottom plate 100 is provided with a camera hole 140, and the camera hole 140 is arranged adjacent to the mounting slot 110, and the camera hole 140 is used for the camera to pass through. It can be understood that the camera is installed on the bottom plate 100, and the lens of the camera passes through the camera hole 140 to avoid interference of the bottom plate 100 with the lens.

[0045] like Figure 2 As shown, in one embodiment, at least two spaced-apart button holes 220 are provided on one side of the frame 200. In this embodiment, there are two button holes 220, which are used for the volume button and the power button to pass through respectively.

[0046] The present application also provides a smart phone, comprising the mobile phone middle frame 10 described in any of the above embodiments.

[0047] Compared with the prior art, the present invention has at least the following advantages:

[0048] In the above-mentioned mobile phone middle frame 10, the frame 200 is connected to the periphery of the bottom plate 100, the bottom plate 100 is provided with a mounting groove 110 and a hollow groove, the heat conductive sheet 300 is located in the mounting groove 110 and connected to the bottom plate 100, the mobile phone motherboard is located in the mounting groove 110 and abuts against the heat conductive sheet 300, so that when the mobile phone motherboard is working, the heat is transferred from the heat conductive sheet 300 to the bottom plate 100, so as to improve the heat dissipation efficiency of the mobile phone motherboard, and at the same time, the structure of the heat conductive sheet 300 and the bottom plate 100 is simple, which is conducive to the lightweight design of the mobile phone; on the other hand, the inner side surface of the frame 200 is provided with a receiving groove 210, and an anti-shielding layer is formed on the groove wall of the receiving groove 210, and the mobile phone antenna is located in the receiving groove 210 and abuts against the anti-shielding layer, that is, the mobile phone antenna will not directly contact the frame 200, thereby improving the anti-shielding effect of the mobile phone middle frame 10.

[0049] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A mobile phone middle frame, comprising a bottom plate and a frame, wherein the frame is connected to the periphery of the bottom plate and is disposed around the bottom plate, characterized in that: The mobile phone middle frame also includes a heat conducting sheet, the bottom plate is provided with a mounting groove and a hollow groove, the mounting groove is arranged adjacent to the hollow groove, the mounting groove is used to place the mobile phone motherboard, the heat conducting sheet is located in the mounting groove and is connected to the bottom plate, the hollow groove is used for the battery to pass through so that the battery abuts against the metal back shell of the mobile phone, the inner side surface of the frame is provided with a accommodating groove, the accommodating groove is used to accommodate the antenna, and an anti-shielding layer is formed on the groove wall of the accommodating groove.

2. The mobile phone middle frame according to claim 1, characterized in that: The anti-shielding layer is a plastic anti-shielding layer.

3. The mobile phone middle frame according to claim 1, characterized in that: The thickness of the anti-shielding layer is 2mm-3mm.

4. The mobile phone middle frame according to claim 1, characterized in that: The mobile phone middle frame also includes heat dissipation adhesive, and the heat conductive sheet is bonded to the groove wall of the mounting groove through the heat dissipation adhesive.

5. The mobile phone middle frame according to claim 1, characterized in that: The heat conducting sheet is a graphite heat conducting sheet.

6. The mobile phone middle frame according to claim 1, characterized in that: The bottom plate and the frame are an integrally formed structure.

7. The mobile phone middle frame according to claim 1, characterized in that: A plurality of connection columns are protruding from the bottom plate, and the plurality of connection columns are arranged at intervals. Each of the connection columns is provided with a connection hole, and each of the connection holes is used for a fastener to pass through.

8. The mobile phone middle frame according to claim 1, characterized in that: The bottom plate is provided with a camera hole, which is arranged adjacent to the mounting groove and is used for a camera to pass through.

9. The mobile phone middle frame according to claim 1, characterized in that: At least two key holes arranged at intervals are also formed on one side of the frame.

10. A smart phone, characterized in that: A mobile phone middle frame comprising any one of claims 1 to 9.

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