Processor mounting device

Abstract

The utility model provides a processor mounting device. The processor installation device comprises a bottom plate, a circuit board and a back plate which are arranged in a stacked mode, the back plate is provided with a bare hollow groove, the processor installation device further comprises a pressing plate and an installation base, the installation base is provided with a plurality of terminals, and the installation base is located in the bare hollow groove so that the terminals can be electrically connected with the circuit board; the processor installation device further comprises a dustproof cover and a buckling plate, the dustproof cover covers the upper surface of the installation base, the pressing plate and the buckling plate are both rotationally connected to the back plate, the pressing plate tightly presses the processor to the upper surface of the dustproof cover through the buckling plate, a buckling groove is formed in the buckling plate, and the processor is arranged in the buckling groove. And the buckling groove is used for buckling the processor. The processor is placed in the buckling groove, the buckling plate is rotated to enable the processor to enter the mounting base and abut against the terminal, and the problem that the terminal is damaged due to the fact that the terminal is subjected to large acting force is solved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of processor installation, and in particular to a processor installation device. Background Art

[0002] The central processing unit (CPU) is the computing and control core of the computer system and the final execution unit for information processing and program operation. The processor connector is a connector component that mounts the processor on the circuit board. The processor connector generally includes a seat, a fixing plate and a rocker. The processor is installed in the seat and electrically connected to the circuit board through the terminal. The rocker is used to press the fixing plate to fix the processor between the seat and the fixing plate.

[0003] For example, Chinese patent application number CN200620133298.4 discloses a processor electrical connector, including a base, on which a plurality of terminal slots arranged in a matrix and a support seat are provided, on which a pivot portion is provided; an upper cover, which is engaged with the base and can slide relative to the base, and on which a plurality of through holes arranged in a matrix and corresponding to the plurality of terminal slots of the base; a plurality of terminals, which are arranged in the plurality of terminal slots of the base; a rocker, which is provided with a rocking portion and a pivot portion, and the pivot portion is provided with at least a first axis and a second axis that are eccentric to each other, the first axis is pivotally connected to the pivot portion of the base, and the second axis is engaged with one end of the inner surface of the upper cover, the rocking portion is connected to the first axis and is provided with a handle, and when the rocker is pivoted, it drives the upper cover to slide relative to the base.

[0004] When installing the processor, the processor electrical connector slides the upper cover through the rocker so that the upper cover and the base are in an open state. At this time, the processor is manually placed between the upper cover and the base, and the terminals are located in the base and electrically connected to the processor. However, for processors with large weight and volume, interference will occur when the processor is placed in the bottom shell manually, making it difficult to control the force when placing the processor into the base. If the force exerted on the terminals by the processor when entering the base is large, it is easy to crush the terminals in the base, thereby causing damage to the entire connector. On the other hand, the terminals are not blocked by the shell, and dust can easily fall into the terminals, resulting in poor contact between the terminals and the processor.

[0005] Therefore, there is an urgent need for a mounting device that can prevent terminals from being crushed when assembling a processor. Utility Model Content

[0006] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a processor mounting device that prevents terminals from being crushed when assembling a processor.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A processor installation device, comprising:

[0009] A bottom plate, a circuit board and a back plate are stacked, the back plate is provided with an open slot, and the conductive area of ​​the circuit board is arranged corresponding to the open slot; the processor installation device also includes a pressing plate and a mounting base, the mounting base is provided with a plurality of terminals, and the mounting base is located in the open slot so that the plurality of terminals and the circuit board are electrically connected to the circuit board;

[0010] The processor mounting device also includes a dust cover and a snap-fit ​​plate, wherein the dust cover covers the upper surface of the mounting base, and the pressure plate and the snap-fit ​​plate are both rotatably connected to the back plate. The pressure plate presses the processor against the upper surface of the dust cover through the snap-fit ​​plate, and the snap-fit ​​plate is provided with a snap-fit ​​groove, which is used to snap the processor.

[0011] In one embodiment, a pivot shaft is protruded from the back plate, and the pressure plate and the buckle plate are both rotatably connected to the pivot shaft.

[0012] In one embodiment, the pressing plate is provided with a first rotating hole, and the pivot shaft is rotatably connected to the pressing plate through the first rotating hole.

[0013] In one embodiment, the buckle plate is provided with a second rotation hole, and the pivot shaft is rotatably connected to the buckle plate through the second rotation hole.

[0014] In one embodiment, the buckle plate is detachably and rotatably connected to the pivot shaft.

[0015] In one embodiment, the buckling plate is provided with a shaft opening connected to the first rotating hole, and the pivot shaft is assembled in the second rotating hole through the shaft opening.

[0016] In one of the embodiments, a barb is protruding from the periphery of the buckling plate, and a buckle position is formed on the pressure plate, and the barb is buckled into the buckle position.

[0017] In one of the embodiments, a plurality of snap-fitting posts are protruding from a side surface of the snap-fitting plate close to the back plate, and the plurality of snap-fitting posts are used to snap-fit ​​the processor.

[0018] Compared with the prior art, the present invention has at least the following advantages:

[0019] In the above-mentioned processor installation device, the circuit board is clamped and installed between the bottom plate and the back plate, and the installation base is located in the bare slot, so that several terminals in the installation base are electrically connected to the circuit board, the dust cover covers the upper surface of the installation base, and the snap-fit ​​plate is provided with a snap-fit ​​slot. When installing the processor, the pressure plate is rotated and raised to separate the pressure plate and the snap-fit ​​plate. At this time, the processor is snapped in the snap-fit ​​slot, and then the processor and the snap-fit ​​plate are rotated and raised together. At this time, the dust cover is removed from the installation base, and finally the pressure plate, the snap-fit ​​plate and the processor are rotated and pressed down to make the processor enter the installation base and abut against the terminal, thereby completing the assembly of the processor. Specifically, by placing the processor in the snap-fit ​​slot and rotating the snap-fit ​​plate so that the processor enters the installation base and abuts against the terminal, the interference of the installation base when the processor is placed manually is avoided, and the force exerted on the terminal by the processor when entering the installation base can be better controlled to avoid the problem of damage to the terminal due to a large force. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a processor installation device according to an embodiment;

[0022] Figure 2 for Figure 1 Another structural schematic diagram of the processor mounting device shown;

[0023] Figure 3 for Figure 1 Another structural schematic diagram of the processor installation device shown;

[0024] Figure 4 for Figure 1 Another structural schematic diagram of the processor installation device shown;

[0025] Figure 5 for Figure 1 A schematic structural diagram of a pressure plate of a processor mounting device shown;

[0026] Figure 6 for Figure 1 A schematic diagram of the structure of the snap-fit ​​plate of the processor mounting device shown;

[0027] Figure 7 FIG. 4 is a schematic structural diagram of a buckle plate according to another embodiment. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] The present disclosure provides a processor installation device, comprising a stacked bottom plate, a circuit board and a back plate, the back plate is provided with an open slot, and the conductive area of ​​the circuit board is arranged corresponding to the open slot; the processor installation device also includes a pressing plate and a mounting base, the mounting base is provided with a plurality of terminals, the mounting base is located in the open slot, so that the plurality of terminals are electrically connected to the circuit board; the processor installation device also includes a dust cover and a snap-fit ​​plate, the dust cover covers the upper surface of the mounting base, the pressing plate and the snap-fit ​​plate are both rotatably connected to the back plate, the pressing plate presses the processor against the upper surface of the dust cover through the snap-fit ​​plate, the snap-fit ​​plate is provided with a snap-fit ​​groove, and the snap-fit ​​groove is used to snap the processor.

[0032] In the above-mentioned processor installation device, the circuit board is clamped and installed between the bottom plate and the back plate, and the installation base is located in the bare slot, so that several terminals in the installation base are electrically connected to the circuit board, the dust cover covers the upper surface of the installation base, and the snap-fit ​​plate is provided with a snap-fit ​​slot. When installing the processor, the pressure plate is rotated and raised to separate the pressure plate and the snap-fit ​​plate. At this time, the processor is snapped in the snap-fit ​​slot, and then the processor and the snap-fit ​​plate are rotated and raised together. At this time, the dust cover is removed from the installation base, and finally the pressure plate, the snap-fit ​​plate and the processor are rotated and pressed down to make the processor enter the installation base and abut against the terminal, thereby completing the assembly of the processor. Specifically, by placing the processor in the snap-fit ​​slot and rotating the snap-fit ​​plate so that the processor enters the installation base and abuts against the terminal, the interference of the installation base when the processor is placed manually is avoided, and the force exerted on the terminal by the processor when entering the installation base can be better controlled to avoid the problem of damage to the terminal due to a large force.

[0033] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0034] like Figures 1 to 6 As shown, a processor installation device 10 of an embodiment includes a stacked bottom plate 100, a circuit board 200 and a back plate 300, that is, the circuit board 200 is clamped and installed between the bottom plate 100 and the back plate 300, the back plate 300 is provided with an open slot 320, and the conductive area of ​​the circuit board 200 is arranged corresponding to the open slot 320. The processor installation device 10 also includes a pressing plate 400 and a mounting base 500, the mounting base 500 is provided with a plurality of terminals, and the mounting base 500 is located in the open slot 320 so that the plurality of terminals are electrically connected to the circuit board 200.

[0035] Furthermore, the processor installation device 10 also includes a dust cover 600 and a snap-fit ​​plate 700, the dust cover 600 covers the upper surface of the installation base 500, the pressure plate 400 and the snap-fit ​​plate 700 are both rotatably connected to the back plate 300, the pressure plate 400 presses the processor 10a against the upper surface of the dust cover 600 through the snap-fit ​​plate 700, the snap-fit ​​plate 700 is provided with a snap-fit ​​groove 710, the snap-fit ​​groove 710 is used to snap the processor 10a, that is, the processor 10a is placed in the snap-fit ​​groove 710 when installed.

[0036] It can be understood that since the size of the cavity for placing the processor 10a in the mounting base 500 is adapted to the size of the processor 10a, so that the mounting base 500 covers the processor 10a, for the processor 10a with larger weight and volume, if traditional technology is used, that is, when the processor 10a is placed into the mounting base 500 by manual hands, the surrounding walls of the mounting base 500 interfere with the hands, and it is difficult to control the force when placing the processor 10a. If the force exerted on the terminals by the processor 10a when entering the mounting base 500 is large, the terminals in the mounting base 500 may be easily crushed, causing the entire device to be damaged and unable to be used normally.

[0037] In order to solve the above problem, in this embodiment, the back plate 300, the circuit board 200 and the bottom plate 100 are first stacked and installed, that is, the back plate 300 is located on the top of the circuit board 200, and the bottom plate 100 is located at the bottom of the circuit board 200. The circuit board 200, the back plate 300 and the bottom plate 100 are locked by screws, so that the circuit board 200 is clamped and connected between the bottom plate 100 and the back plate 300, thereby improving the structural strength of the circuit board 200 to prevent the circuit board 200 from being crushed when the heavier processor 10a is pressed down. Furthermore, the mounting base 500 is installed in the bare slot 320 of the back plate 300, so that the terminals in the mounting base 500 are electrically connected to the circuit board 200. The upper surface of the mounting base 500 is covered with a dust cover 600, and the dust cover 600 is removable. When the processor 10a enters the mounting base 500, the dust cover 600 is removed to protect the dust cover 600 from dust, thereby preventing dust from entering the terminals in the mounting base 500 and causing short circuit problems. Furthermore, the snap-fitting plate 700 and the pressure plate 400 are both rotatably connected to the back plate 300, and the snap-fitting plate 700 is provided with a snap-fitting groove 710. When assembling the processor 10a, the pressure plate 400 is first rotated open to separate the pressure plate 400 from the snap-fitting plate 700. At this time, the processor is placed in the snap-fitting groove 710 of the snap-fitting plate 700, so that the snap-fitting plate 700 snaps the processor 10a, and then the snap-fitting plate 700 is rotated in a direction away from the back plate 300. At this time, the dust cover 600 is removed from the upper surface of the mounting base 500, and finally the snap-fitting plate 700, the processor 10a and the pressure plate 400 are rotated in a direction close to the back plate 300, so that the processor 10a enters the mounting base 500 and abuts against the terminal. Specifically, the processor 10a is driven to rotate into the mounting base 500 and abut against the terminal by the rotation of the snap-fit ​​plate 700, thereby avoiding interference of the surrounding walls of the mounting base 500 with both hands and better controlling the force when the processor 10a abuts against the terminal, thereby avoiding the problem of damage to the terminal caused by assembling the processor 10a.

[0038] In the above-mentioned processor installation device 10, the circuit board 200 is clamped and installed between the base plate 100 and the back plate 300, and the installation base 500 is located in the bare slot, so that several terminals in the installation base 500 are electrically connected to the circuit board 200, and the dust cover 600 covers the upper surface of the installation base 500, and the snap-fit ​​plate 700 is provided with a snap-fit ​​groove 710. When the processor 10a is installed, the rotating pressure plate 400 is raised to separate the pressure plate 400 from the snap-fit ​​plate 700. At this time, the processor 10a is snap-fitted into the snap-fit ​​groove 710, and then the processor 10a and the snap-fit ​​plate 700 are rotated and raised together. At this time, the dust cover 600 is removed from the installation base 500, and finally the pressure plate 400, the snap-fit ​​plate 700 and the processor 10a are rotated and pressed down, so that the processor 10a enters the installation base 500 and abuts against the terminals, thereby completing the assembly of the processor 10a. Specifically, by placing the processor 10a in the snap-fit ​​groove 710 and rotating the snap-fit ​​plate 700 so that the processor 10a enters the mounting base 500 and abuts against the terminal, interference caused by the mounting base 500 when the processor 10a is placed manually can be avoided, and the force exerted on the terminal by the processor 10a when entering the mounting base 500 can be better controlled to avoid damage to the terminal due to the large force.

[0039] like Figure 3 As shown, in one embodiment, the back plate 300 is provided with a pivot shaft 310, and the pressing plate 400 and the buckle plate 700 are both rotatably connected to the pivot shaft 310. It can be understood that the back plate 300 is also provided with a mounting seat, the number of which is two, and the two mounting seats are arranged opposite to each other, and each mounting seat is provided with a mounting hole, and the two ends of the pivot shaft 310 are located in the mounting holes, so that the pivot shaft 310 is fixed on the two mounting seats, and the pressing plate 400 and the buckle plate 700 can rotate relative to the pivot shaft 310.

[0040] like Figure 3 and Figure 5 As shown, in one embodiment, the pressing plate 400 is provided with a first rotating hole 410, and the pivot shaft 310 is rotatably connected to the pressing plate 400 through the first rotating hole 410. In this embodiment, there are two first rotating holes 410, and the pivot shaft 310 passes through the two first rotating holes 410, so that the pressing plate 400 can rotate relative to the pivot shaft 310.

[0041] like Figure 3 and Figure 6 As shown, in one embodiment, the buckle plate 700 is provided with a second rotation hole 720, and the pivot shaft 310 is rotatably connected to the buckle plate 700 through the second rotation hole 720. In this embodiment, there are two second rotation holes 720, and the pivot shaft 310 passes through the two second rotation holes 720, so that the buckle plate 700 can rotate relative to the pivot shaft 310.

[0042] In one embodiment, the buckle plate 700 is detachably rotatably connected to the pivot shaft 310. It can be understood that the two second rotation holes 720 of the buckle plate 700 are respectively located on the outsides of the two mounting seats, and the two ends of the pivot shaft 310 are respectively passed through the two mounting seats and are rotatably connected to the buckle plate 700. In this way, when the buckle plate 700 needs to be removed, the buckle plate 700 is pulled outward to remove the buckle plate 700 from the pivot shaft 310.

[0043] like Figure 6 As shown, in one embodiment, the snap plate 700 is provided with a shaft opening 730 communicating with the first rotating hole 410, and the pivot shaft 310 is assembled in the second rotating hole 720 through the shaft opening 730. It can be understood that the snap plate 700 is made of plastic material and has a certain elastic deformation ability. The snap plate 700 is opened to both sides through the shaft opening 730 so that the snap plate 700 can be removed from the pivot shaft 310. Further, in order to make the operation of placing the processor 10a in the snap groove 710 more convenient, before placing the processor 10a, the snap plate 700 can be removed from the pivot shaft 310, and then the processor 10a is placed in the snap groove 710, and finally the snap plate 700 is assembled on the pivot shaft 310, so that the snap plate 700 rotates relative to the pivot shaft 310 and enters the mounting base 500.

[0044] like Figure 7 As shown, in another embodiment, the periphery of the buckling plate 700 is provided with a barb 750, the pressing plate 400 is provided with a buckle position 420, and the barb 750 is buckled into the buckle position 420. In this embodiment, the buckling plate 700 can be buckled with the pressing plate 400 through the barb 750, so that the buckling plate 700 and the pressing plate 400 can rotate together.

[0045] like Figure 7 As shown, in one embodiment, the number of the barbs 750 is at least two, so that the buckling stability between the buckling plate 700 and the pressing plate 400 is higher.

[0046] like Figure 6 As shown, in one embodiment, a plurality of snap-fitting columns 740 are convexly provided on a side of the snap-fitting plate 700 close to the back plate 300, and the plurality of snap-fitting columns 740 are used to snap-fit ​​the processor 10a. It can be understood that the plurality of snap-fitting columns 740 are evenly distributed on a side of the snap-fitting plate 700 close to the back plate 300, and when the processor 10a is placed in the snap-fitting groove 710, the plurality of snap-fitting columns 740 snap-fit ​​the processor 10a, so that the snap-fitting stability between the processor 10a and the snap-fitting plate 700 is higher.

[0047] like Figure 6As shown, in one embodiment, a plurality of the snap-fitting columns 740 are evenly distributed on the edge of the snap-fitting plate 700, so that the snap-fitting stability between the snap-fitting plate 700 and the processor 10a is higher and the structure of the snap-fitting plate 700 is more compact.

[0048] Compared with the prior art, the present invention has at least the following advantages:

[0049] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A processor installation device, comprising a stacked bottom plate, a circuit board and a back plate, wherein the back plate is provided with an open slot, and the conductive area of ​​the circuit board is provided corresponding to the open slot; the processor installation device also comprises a pressing plate and a mounting base, wherein the mounting base is provided with a plurality of terminals, and the mounting base is located in the open slot so that the plurality of terminals are electrically connected to the circuit board; characterized in that: The processor mounting device also includes a dust cover and a snap-fit ​​plate, wherein the dust cover covers the upper surface of the mounting base, and the pressure plate and the snap-fit ​​plate are both rotatably connected to the back plate. The pressure plate presses the processor against the upper surface of the dust cover through the snap-fit ​​plate, and the snap-fit ​​plate is provided with a snap-fit ​​groove, which is used to snap the processor.

2. The processor mounting device according to claim 1, characterized in that: A pivot shaft is convexly provided on the back plate, and the pressing plate and the buckling plate are both rotatably connected to the pivot shaft.

3. The processor mounting device according to claim 2, characterized in that: The pressing plate is provided with a first rotating hole, and the pivot shaft is rotatably connected to the pressing plate through the first rotating hole.

4. The processor mounting device according to claim 3, characterized in that: The buckle plate is provided with a second rotation hole, and the pivot shaft is rotatably connected to the buckle plate through the second rotation hole.

5. The processor mounting device according to claim 4, characterized in that: The buckle plate is detachably and rotatably connected to the pivot shaft.

6. The processor mounting device according to claim 5, characterized in that: The buckling plate is provided with a shaft opening connected with the first rotating hole, and the pivot shaft is assembled in the second rotating hole through the shaft opening.

7. The processor mounting device according to claim 1, characterized in that: The periphery of the buckling plate is convexly provided with a barb, and the pressing plate is provided with a buckle position, and the barb is buckled into the buckle position.

8. The processor mounting device according to claim 7, characterized in that: The number of the undercuts is at least two.

9. The processor mounting device according to claim 1, characterized in that: A plurality of buckling posts are convexly disposed on a side surface of the buckling plate close to the back plate, and the plurality of buckling posts are used to buckle the processor.

10. The processor mounting device according to claim 9, characterized in that: The plurality of snap-fit ​​columns are evenly distributed on the edge of the snap-fit ​​plate.

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