Double-color lamp bead

Abstract

The utility model relates to the technical field of LED lamp beads, and discloses a double-color lamp bead which comprises a support, the support is provided with a material containing groove A and a material containing groove B which are used for containing an LED chip A and an LED chip B, the positive electrode and the negative electrode of the LED chip A are electrically connected with a positive electrode bonding pad A and a negative electrode bonding pad A respectively, and the positive electrode and the negative electrode of the LED chip B are electrically connected with a positive electrode bonding pad B and a negative electrode bonding pad B respectively; the bottom of the support is provided with a heat dissipation area used for conducting bilateral electric heating separation on the positive electrode bonding pad A and the positive electrode bonding pad B and the negative electrode bonding pad A and the negative electrode bonding pad B. Due to the existence of the heat dissipation area, the stable temperature of the LED chip can be kept, poor welding or damage caused by overheating is avoided, and therefore the welding quality and the product reliability are improved. According to the double-color lamp bead, the double-side electric heating separated heat dissipation area is adopted, and the layout of the bonding pad is adjusted, so that double-side separation can be performed on the electrode, the stability and efficiency of the circuit are improved, and the reliability and the service life of the double-color lamp bead are guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lamp beads, and specifically relates to a double-color lamp bead. Background Art

[0002] The main function of the two-color lamp beads is to provide light sources of different colors for lighting and decoration. By selecting LED chips of different colors, the two-color lamp beads can emit different light colors. For example, the combination of pure white light and warm white light can achieve neutral white light, providing users with more lighting options and lighting effects.

[0003] The pads of two-color lamp beads in traditional technology often consist of a common negative pad and two positive pads. Such two-color lamp beads make it impossible to separate the electrodes on both sides, which will cause the current paths to interfere with each other, which is not conducive to the stable transmission and distribution of the current. Since the electrodes cannot be completely separated, there are situations where the current paths cross, which will increase the complexity and resistance of the circuit. Incomplete electrode separation may cause uneven current transmission, affecting the brightness and light efficiency of the lamp beads. The electrodes share a pad and cannot be electrically and thermally separated on both sides, which may cause overheating of some electrodes. This will affect the heat dissipation performance of the LED chip, shorten the life of the lamp beads, and even cause failures and damage. Due to the layout of the pads, the difficulty of welding operations will increase during welding, especially for the assembly of precision lamp beads and scenes with high requirements for welding processes. Summary of the invention

[0004] In order to make up for the deficiencies of the prior art, the utility model provides a two-color lamp bead.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a two-color lamp bead, comprising a bracket, the bracket is provided with a bowl-shaped material placement groove A and a material placement groove B for accommodating LED chip A and LED chip B, the positive electrode and the negative electrode of the LED chip A are electrically connected to the positive electrode pad A and the negative electrode pad A respectively, and the positive electrode and the negative electrode of the LED chip B are electrically connected to the positive electrode pad B and the negative electrode pad B respectively;

[0006] The bottom of the bracket is provided with a heat dissipation area for electrically and thermally separating the positive electrode pads A and B from the negative electrode pads A and B on both sides.

[0007] The existence of the heat dissipation zone can help maintain a stable temperature of the LED chip, avoid overheating and cause poor welding or damage, thereby improving the welding quality and product reliability. The heat dissipation zone with bilateral electrical and thermal separation is adopted, and the layout of the pad is adjusted so that the electrodes can be separated on both sides, improving the stability and efficiency of the circuit, as well as the heat dissipation performance, and providing a guarantee for the reliability and service life of the two-color lamp beads.

[0008] Preferably, the positive electrode pad A and the positive electrode pad B are located on the same side of the bracket, and the negative electrode pad A and the negative electrode pad B are located on the same side of the bracket and are arranged opposite to the positive electrode pad A and the positive electrode pad B. Providing the positive and negative electrode pads on the same side can effectively utilize the bracket space, make the overall structure more compact, and facilitate the design and assembly of the lamp beads.

[0009] Preferably, the material placing groove A and the material placing groove B are respectively provided with a fluorescent glue layer A and a fluorescent glue layer B for encapsulating the LED chip A and the LED chip B.

[0010] Preferably, the light emitting area angle of the fluorescent glue layer A is 20°, and the light emitting area angle of the fluorescent glue layer B is also 20°, so that the light is more concentrated, and the light effect and brightness are improved.

[0011] Preferably, the fluorescent adhesive layer A and the fluorescent adhesive layer B are respectively located in the reflective cup A and the reflective cup B, and the reflective cup A and the reflective cup B have the same size and structure, and the mouth of the reflective cup A and the reflective cup B are both 4.8 mm long and the bottom of the cup is 1.53 mm long.

[0012] Compared with the prior art, the technical effects and advantages of the utility model are:

[0013] The two-color lamp bead has a heat dissipation zone at the bottom of the bracket. The existence of the heat dissipation zone can help maintain the stable temperature of the LED chip, avoid overheating and cause poor welding or damage, thereby improving the welding quality and product reliability, helping to disperse and dissipate the heat generated during the welding process, reduce the temperature of the lamp bead, and extend the service life. In addition, the small size of the lamp bead is also conducive to heat dissipation, reducing heat accumulation, improving heat dissipation efficiency, and maintaining the stable temperature of the LED chip.

[0014] The luminous area angle of the fluorescent glue layer is 20°, which can effectively control the emission angle of light, make the light more concentrated, and improve the lighting effect and brightness. Through the design of the fluorescent glue layer, the light emitted by the LED chip can be more uniform, reducing light scattering and leakage, improving the uniformity of the lighting effect, and improving the lighting effect and visual comfort. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view of the utility model;

[0016] Figure 2 It is a bottom view of the utility model;

[0017] Figure 3 It is a cross-sectional view of the utility model.

[0018] In the figure: 1. bracket; 2. LED chip A; 3. LED chip B; 4. material placement slot A; 5. material placement slot B; 6. positive electrode pad A; 7. negative electrode pad A; 8. positive electrode pad B; 9. negative electrode pad B; 10. heat dissipation area; 11. fluorescent glue layer A; 12. fluorescent glue layer B. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] The following is combined with Figure 1-3 To further explain this application in detail,

[0021] The embodiment of the present application discloses a two-color lamp bead, including a bracket 1, which is made of plastic material, such as polypropylene (PP), polycarbonate (PC), etc. The plastic bracket 1 is light and low in cost, and is suitable for some light lamps or lamps requiring special design.

[0022] LED chip A2 and LED chip B3 are placed in two bowl-shaped slots A4 and B5 of the bracket 1. LED chip A2 and LED chip B3 are used to emit two different colors of light. For example, the LED chip A2 is selected as a positive white light chip; the LED chip B3 is a warm white light chip. When the LED chip A2 and the LED chip B3 are turned on together, the LED lamp beads emit neutral white light. The three-color light-emitting type of a single LED main lamp is realized. This design realizes the three-color light-emitting type of a single LED main lamp, so that the lamp has more color choices and flexibility;

[0023] The positive electrode and negative electrode of LED chip A2 are electrically connected to positive electrode pad A6 and negative electrode pad A7 respectively, and the positive electrode and negative electrode of LED chip B3 are electrically connected to positive electrode pad B8 and negative electrode pad B9 respectively; positive electrode pad A6 and positive electrode pad B8 are located on the same side of bracket 1, and negative electrode pad A7 and negative electrode pad B9 are located on the same side of bracket 1 and are arranged opposite to positive electrode pad A6 and positive electrode pad B8.

[0024] Welding the positive and negative pads on the same side can simplify the welding operation, reduce the risk of misoperation during welding, and improve welding efficiency. The positive and negative pads are located on the same side and are arranged opposite to each other, which is beneficial to the layout design of the circuit connection, and can better control the current transmission path, reduce the resistance in the circuit, and improve the stability and efficiency of the circuit. Compared with the need to configure the positive and negative pads on both sides of the lamp bead bracket 1 respectively, arranging the positive and negative pads on the same side can effectively utilize the space of the bracket 1, making the overall structure more compact, which is beneficial to the design and assembly of the lamp beads.

[0025] A heat dissipation area 10 is provided at the bottom of the bracket 1 for electrically and thermally separating the positive electrode pads A6 and B8 from the negative electrode pads A7 and B9 on both sides;

[0026] LED chip A2 and LED chip B3 are placed in material placement groove A4 and material placement groove B5 on bracket 1 respectively, which helps to effectively accommodate and fix LED chip A2 and LED chip B3, and improves the stability and reliability of assembly. The positive and negative electrodes of LED chip A2 and LED chip B3 are connected to pad A and pad B respectively, ensuring the reliability and stability of electrical connection. The heat dissipation area 10 at the bottom of bracket 1 helps to separate positive electrode pad A6 and positive electrode pad B8 from negative electrode pad A7 and negative electrode pad B9 by bilateral electrical heating, which can effectively disperse and dissipate the heat generated during welding and prevent the LED chip from being damaged due to overheating. In the operation of spot soldering, the presence of heat dissipation area 10 can help maintain a stable temperature of the LED chip, avoid poor welding or damage caused by overheating, and thus improve welding quality and product reliability.

[0027] The material placement groove A4 and the material placement groove B5 are respectively provided with a fluorescent glue layer A11 and a fluorescent glue layer B12 for packaging the LED chip A2 and the LED chip B3.

[0028] The light emitting area angle of the fluorescent glue layer A11 is 20°, and the light emitting area angle of the fluorescent glue layer B12 is also 20°.

[0029] The 20° angle of the light-emitting area of ​​the fluorescent glue layer can effectively control the emission angle of light, make the light more concentrated, and improve the lighting efficiency and brightness. Through the design of the fluorescent glue layer, the light emitted by the LED chip can be more uniform, reducing light scattering and leakage, and improving the uniformity of the lighting effect. The design of a 20° angle of the light-emitting area can reduce glare and light pollution, improve the visual comfort of the lamp beads, and make people feel more comfortable and natural in the lighting environment.

[0030] The fluorescent adhesive layer A11 and the fluorescent adhesive layer B12 are respectively located in the reflective cup A and the reflective cup B, and the reflective cup A and the reflective cup B have the same size and structure, with a cup mouth length of 4.8 mm and a cup bottom length of 1.53 mm. Such a design can ensure the matching degree between the lamp bead and the reflective cup, making the reflection effect more uniform and efficient, and improving the light utilization rate of the lamp bead.

[0031] The heat dissipation area 10 is 43.2 mm long and 3.9 mm wide. It is located at the bottom of the lamp bead and is used as a heat dissipation area. Such a heat dissipation area 10 design helps to effectively disperse and dissipate the heat generated during the welding process, reduce the temperature of the lamp bead, and extend the service life of the lamp bead. In addition, the smaller size of the lamp bead is also conducive to heat dissipation, because a smaller surface area means less heat accumulation and higher heat dissipation efficiency.

[0032] The dual-color lamp bead is 5.7mm long, 3.5mm wide, and 0.7mm high. Compared with other types of lamp beads, the size is relatively small, making it more flexible and convenient in application.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A two-color lamp bead, comprising a bracket (1), characterized in that: The support (1) is provided with a bowl-shaped material placement groove A (4) and a material placement groove B (5) for accommodating LED chip A (2) and LED chip B (3), respectively; the positive electrode and the negative electrode of the LED chip A (2) are electrically connected to the positive electrode pad A (6) and the negative electrode pad A (7), respectively; the positive electrode and the negative electrode of the LED chip B (3) are electrically connected to the positive electrode pad B (8) and the negative electrode pad B (9), respectively; The bottom of the bracket (1) is provided with a heat dissipation area (10) for performing bilateral electrical and thermal separation of the positive electrode pads A (6), positive electrode pads B (8) and the negative electrode pads A (7), negative electrode pads B (9).

2. A two-color lamp bead according to claim 1, characterized in that: The positive electrode pad A (6) and the positive electrode pad B (8) are located on the same side of the bracket (1), and the negative electrode pad A (7) and the negative electrode pad B (9) are located on the same side of the bracket (1) and are arranged opposite to the positive electrode pad A (6) and the positive electrode pad B (8).

3. A two-color lamp bead according to claim 1, characterized in that: The material placement groove A (4) and the material placement groove B (5) are respectively provided with a fluorescent glue layer A (11) and a fluorescent glue layer B (12) for encapsulating the LED chip A (2) and the LED chip B (3).

4. A two-color lamp bead according to claim 3, characterized in that: The light-emitting area angle of the fluorescent glue layer A (11) is 20°, and the light-emitting area angle of the fluorescent glue layer B (12) is also 20°.

5. A two-color lamp bead according to claim 3 or 4, characterized in that: The fluorescent adhesive layer A (11) and the fluorescent adhesive layer B (12) are respectively located in the reflective cup A and the reflective cup B, and the reflective cup A and the reflective cup B have the same size and structure. The mouth of the reflective cup A and the reflective cup B are both 4.8 mm long and the bottom of the cup is 1.53 mm long.

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