Wafer electroplating cleaning mechanism
By designing a cleaning mechanism for wafer electroplating, and using cylinders and bubble rods to achieve efficient cleaning, the problems of incomplete cleaning and large water consumption in the prior art are solved, and the burden and cost of sewage treatment are reduced.
Patent Information
- Application Number
- CN202421341643.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-06-13
AI Technical Summary
The existing wafer electroplating post-treatment technology uses pure water to clean, which is long and incomplete, resulting in oxidation of wafer plating, incomplete cleaning of vehicles and covers, and large water consumption leads to wastewater treatment burden and high costs.
A wafer plating cleaning mechanism is designed, including a bottom plate, an intermediate plate, a baffle and a cylinder. The wafer hanging tool is fixed by using the piston rod of the cylinder, and bubble stirring cleaning liquid is generated through the bubble rod, and the cleaning liquid is injected into the water spray port to achieve efficient cleaning.
This device can effectively clean the electroplating solution on the wafer mount, reduce the waste of cleaning liquid, reduce the burden of sewage treatment, improve cleaning efficiency and reduce costs.
Smart Images
Figure CN222695490U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of wafer electroplating, and specifically relates to a wafer electroplating cleaning mechanism. Background Art
[0002] With the rapid development of advanced packaging, many process routes require wafer electroplating. After electroplating, the carrier and the product carry residual electrolyte. The electrolyte contains acid, which is corrosive to the plated metal and will cause abnormalities such as oxidation of the product coating and regional roughness. In addition, the electrolyte remaining on the carrier will crystallize in the gap between the carrier and the cover plate because it contains inorganic salts. Over time, it will damage the carrier and the cover plate, and may cause subsequent product pad cracks. Therefore, after wafer electroplating, the wafer, cover plate and carrier need to be post-processed, that is, the residual electrolyte is removed.
[0003] At present, the existing wafer electroplating post-treatment generally uses pure water for cleaning, which takes a long time to clean, the carrier and cover are not cleaned thoroughly, the wafer surface coating is easy to oxidize, the water consumption is large, and a large amount of heavy metal wastewater is discharged, which puts a burden on sewage treatment and has a high overall cost. In view of this, we provide a wafer electroplating cleaning mechanism. Utility Model Content
[0004] The utility model aims to provide a wafer electroplating cleaning mechanism to solve the problems raised in the above background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A wafer electroplating cleaning mechanism comprises a bottom plate, an intermediate plate and a baffle plate arranged on the bottom plate, the intermediate plate is composed of two support plates, the baffle plates are arranged on both sides of the support plate and form a cleaning tank with the support plates, a guide surface is arranged on the top of the cleaning tank, the guide surface is located on the upper side of the intermediate plate and the baffle plate, a pressure plate is arranged on the side of the baffle plate away from the cleaning tank, a cylinder is arranged between the pressure plate and the baffle plate, a piston rod in the cylinder is located on one side of the cleaning tank, and a bubbling rod connected to the cleaning tank is arranged on the bottom plate.
[0007] The above technical scheme is implemented to facilitate the placement of the wafer hanger into the cleaning tank, and the wafer hanger is fixed by the piston rod on the cylinder so that the wafers on the wafer hanger are cleaned in the cleaning tank. The bubbling rod is used to inject gas into the cleaning tank, and the micropores on the bubbling rod are used to generate bubbles to stir the solution.
[0008] As a preferred solution of the present application, a plurality of pulleys and water spray outlets are provided on one side of the support plate facing the cleaning tank, and the water spray outlets are connected to the bottom plate through a water channel.
[0009] The above technical solution is implemented so that the wafer hanger can enter the cleaning tank through the pulley and the wafer cleaning liquid can be injected into the cleaning tank through the water spray port.
[0010] As a preferred solution of the present application, a water inlet valve is provided at the bottom of the base plate.
[0011] The above technical solution is implemented to supply water to the support plate connected to the base plate to clean the electroplating solution remaining on the wafer.
[0012] As a preferred solution of the present application, an air pipe joint is provided on one side of the baffle, and the air pipe joint is connected to the cylinder through an air path provided on the baffle.
[0013] To implement the above technical solution, a high-pressure air pipe connected to an air pipe joint is used to supply air to the air cylinder to drive the piston rod in the air cylinder to perform telescopic movement.
[0014] Compared with the prior art, the beneficial effects of this application are:
[0015] The present application has a simple structure and is easy to use. It can place a vertically electroplated wafer hanger in a cleaning tank, and use the sprayed liquid on the middle plate and the bubbles generated by the bubbling rod to clean the residual plating liquid on the wafer hanger. The cleaning tank has a compact structure and can effectively reduce the waste of cleaning liquid, thereby reducing the burden of sewage treatment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is the exploded view involved in this application.
[0017] Figure 2 This is a top view of the present application.
[0018] Figure 3 This is a schematic diagram of the intermediate plate involved in this application.
[0019] In the figure: bottom plate 1, middle plate 2, support plate 2001, pulley 201, water spray port 202, baffle 3, air pipe joint 301, cleaning tank 4, guide surface 5, pressure plate 6, cylinder 7, water inlet valve 8. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Example:
[0022] A wafer electroplating cleaning mechanism, referring to Figure 1 , Figure 2 and Figure 3 , including a bottom plate 1 and an intermediate plate 2 and a baffle 3 installed on the bottom plate 1, the intermediate plate 2 is composed of two support plates 2001, and the baffle 3 is arranged on both sides of the support plate 2001, and a cleaning tank 4 is formed between the support plate 2001, and a guide surface 5 is arranged on the top of the cleaning tank 4, the guide surface 5 is located on the upper side of the support plate 2001 and the baffle 3, and is used to guide the wafer hanger when entering the cleaning tank 4, a pressing plate 6 is installed on the side of the baffle 3 away from the cleaning tank 4, a cylinder 7 is installed between the pressing plate 6 and the baffle 3, the piston rod in the cylinder 7 is located on one side of the cleaning tank 4, and is used to support the wafer hanger placed in the cleaning tank 4, and a bubbling rod 9 connected to the cleaning tank 4 is horizontally installed on the bottom plate 1. In this embodiment, the cylinder 7 supports the wafer hanger through the piston rod so that the wafer hanger is fixed in the cleaning tank 4, and the bubbling rod 9 is externally connected to the compressed air pipe. When compressed air or steam is passed into the bubbling rod 9, it escapes from the micropores on the bubbling rod 9 to the cleaning tank 4, generating bubbles in the pure water to stir the liquid, so as to clean the residual electroplating liquid on the wafer hanger.
[0023] Reference Figure 1 and Figure 3 , in order to facilitate the movement of the wafer hanger in the cleaning tank 4 and the injection of wafer cleaning liquid into the cleaning tank 4. In this embodiment, a plurality of pulleys 201 and a water spraying port 202 are installed on the side of the support plate 2001 facing the cleaning tank 4, and the water spraying port 202 is connected to the bottom plate 1 through a water channel.
[0024] Reference Figure 1 In order to facilitate water supply to the support plate 2001 connected to the bottom plate 1 to clean the electroplating solution remaining on the wafer, in this embodiment, a water inlet valve 8 is installed at the bottom of the bottom plate 1.
[0025] Reference Figure 1 In order to facilitate the injection of compressed gas into the cylinder to drive the piston rod in the cylinder 7 to perform telescopic movement. In this embodiment, a gas pipe joint 301 is installed on one side of the baffle 3, and the gas pipe joint 301 is connected to the cylinder 7 through the gas path set on the baffle 3.
[0026] Specifically, in actual use, the wafer hanger is placed in the cleaning tank 4, and the wafer hanger is supported by the piston rod on the cylinder 7 so that the wafer hanger is fixed in the cleaning tank 4. Then, the cleaning liquid is injected into the cleaning tank 4 through the water nozzle 202 on the support plate 2001. At the same time, a large number of micro bubbles are generated at the bottom of the cleaning liquid through the bubbling rod 9 to stir the cleaning liquid to clean the wafer hanger.
[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A wafer electroplating cleaning mechanism, characterized in that: The invention comprises a bottom plate (1), an intermediate plate (2) and a baffle plate (3) arranged on the bottom plate (1), wherein the intermediate plate (2) is composed of two support plates (2001), the baffle plate (3) is arranged on both sides of the support plate (2001) and forms a cleaning groove (4) with the support plate (2001), a guide surface (5) is arranged at the top of the cleaning groove (4), the guide surface (5) is located on the upper side of the intermediate plate (2) and the baffle plate (3), a pressing plate (6) is arranged on the side of the baffle plate (3) facing away from the cleaning groove (4), a cylinder (7) is arranged between the pressing plate (6) and the baffle plate (3), a piston rod in the cylinder (7) is located on one side of the cleaning groove (4), and a bubbling rod (9) connected to the cleaning groove (4) is arranged on the bottom plate.
2. A wafer electroplating cleaning mechanism according to claim 1, characterized in that: A plurality of pulleys (201) and water spray ports (202) are provided on one side of the support plate (2001) facing the cleaning tank (4); the water spray ports (202) are connected to the bottom plate (1) via a water channel.
3. A wafer electroplating cleaning mechanism according to claim 1, characterized in that: A water inlet valve (8) is provided at the bottom of the base plate (1).
4. A wafer electroplating cleaning mechanism according to claim 1, characterized in that: A gas pipe joint (301) is provided on one side of the baffle plate (3), and the gas pipe joint (301) is connected to the gas cylinder (7) via a gas path provided on the baffle plate (3).