A multi-thickness automatic flux supply device

Abstract

The utility model discloses a multi-thickness automatic flux supply device, comprising a first mounting frame, a first bearing seat is mounted on the top of the first mounting frame, and a first bearing groove is provided on the top of the first bearing seat along its length direction; a scraper, the scraper is detachably mounted in the first bearing groove; a plurality of flux scraping grooves of different depths are also provided on the top of the scraper in the length direction; a scraper assembly, the scraper assembly is arranged above the first bearing groove; a scraper translation mechanism, the scraper translation mechanism is mounted on the first mounting frame along the length direction of the first bearing groove, and the scraper translation mechanism is connected to the scraper assembly. The utility model can adjust the thickness of the flux according to the use requirements when implanting solder balls of different ball diameters, so as to cooperate in realizing the precise single-point ball implantation and ball supplementation processes, and its overall design is reasonable, the structure is compact, it is easy to use, and it is highly practical.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip ball planting, in particular to a multi-thickness automatic soldering flux supply device. Background Art

[0002] With the rapid development of the electronics industry, the integration capability of electronic products is constantly improving, and the requirements for the packaging and ball planting process of BGA chips are also increasing. The diameter of the solder balls is required to be smaller and smaller, so there is a certain probability of defective products such as bridges, large and small balls, missing balls, multiple balls, cold solder joints, and misalignment in the process of mass production. These defective BGA chips need to be repaired for the defective points to remove the defective solder balls and then perform ball planting corrections. There are two main traditional conventional repair methods in the industry:

[0003] 1) Use an electric soldering iron and a soldering wire to remove all the solder balls from the entire BGA chip, and then use a ball planting table to manually plant the balls;

[0004] 2) Manually under a microscope, use tweezers to scrape off the defective solder ball, and then use tweezers to place a new solder ball.

[0005] However, both methods have obvious defects. When using a traditional electric soldering iron to clean the solder balls, the surface of the solder wick is very rough, which will greatly reduce the adhesion of the metal pads on the circuit board. If you are not careful, the pads will be removed, resulting in direct product scrapping. Moreover, this method is to remove all the solder balls on the entire BGA and then re-plant the entire piece. This method will greatly waste materials such as solder balls and it is difficult to reduce maintenance costs.

[0006] The second method requires extremely high manual proficiency, and the overall repair yield is relatively low, generally only about 60%. It also requires employees to work under a microscope for a long time, causing irreversible damage to their eyes. As BGA chips become increasingly miniaturized, the diameter of the solder balls is also getting smaller, and the difficulty of repair is increasing exponentially. Manual labor is no longer able to meet the needs of rework of BGA chips with solder ball diameters below 0.3mm.

[0007] Therefore, it is necessary to design a precise online ball filling equipment to solve the above-mentioned problems existing in manual ball planting and ball filling. In this equipment, it is necessary to transfer flux to the BGA chip after ball removal to improve the ball planting efficiency. Therefore, a multi-thickness automatic flux supply device is designed for use in this equipment. Utility Model Content

[0008] The utility model aims to provide a multi-thickness automatic soldering flux supply device, which can adjust the thickness of the soldering flux according to the use requirements when implanting solder balls with different ball diameters, so as to cooperate to realize the precise single-point ball implantation and ball replenishment process. The overall design is reasonable, the structure is compact, the use is convenient, and the practicability is strong.

[0009] To achieve the above objectives, the following technical solutions are adopted:

[0010] A multi-thickness automatic soldering flux supply device, comprising:

[0011] A first mounting frame, wherein a first bearing seat is mounted on the top of the first mounting frame, and a first bearing groove is formed on the top of the first bearing seat along its length direction;

[0012] A scraper, the scraper is detachably mounted in the first bearing groove; a plurality of flux scraping grooves of different depths are also provided on the top of the scraper in the length direction;

[0013] A scraper assembly, wherein the scraper assembly is arranged above the first bearing groove;

[0014] The scraper translation mechanism is installed on the first mounting frame along the length direction of the first bearing groove, and the scraper translation mechanism is connected to the scraper assembly.

[0015] Furthermore, the first mounting frame includes a first bottom plate and a first top plate; the top ends of the first bottom plate are respectively connected to a first vertical plate, and the two ends of the first top plate are respectively connected to the top of a first vertical plate; the first bearing seat is installed on the first top plate, and the scraper translation mechanism is installed on the first bottom plate.

[0016] Furthermore, there are two scraper assemblies; the scraper translation mechanism is also driven to connect to a scraper translation seat, and a scraper lifting cylinder is arranged at each end of the scraper translation seat; each of the scraper lifting cylinders is respectively connected to a scraper assembly.

[0017] Furthermore, a first sliding hole is respectively provided on both sides of the top of the first top plate along its length direction, and the first bearing seat is arranged between the two first sliding holes; the scraper assembly includes a scraper connecting seat and a scraper plate; the scraper connecting seat is in a U-shaped structure, and one side of the U-shaped horizontal end of the scraper connecting seat is connected to the scraper lifting cylinder, and the two vertical ends of the U-shaped scraper connecting seat are respectively movable through a first sliding hole arrangement; the scraper plate is connected to the top of the two vertical ends of the U-shaped scraper connecting seat.

[0018] Furthermore, it also includes a first X-axis translation mechanism, which is arranged along the length direction of the first bearing seat and is connected to the first mounting frame.

[0019] Furthermore, it also includes a spot flux mechanism; the spot flux mechanism includes a first Y-axis translation mechanism, a first Z-axis lifting mechanism connected to the first Y-axis translation mechanism, a first lifting plate connected to the first Z-axis lifting mechanism, and a spot flux assembly installed on one side of the first lifting plate.

[0020] Furthermore, the spot flux assembly includes a first slide plate, a flux dipping needle, and a dipping needle lifting motor; one side of the first slide plate is slidably connected to the first lifting plate, and the upper and lower parts of the other side of the first slide plate are respectively connected to a first connecting plate and a second connecting plate; the first connecting plate and the second connecting plate are both arranged in the horizontal direction; the dipping needle lifting motor is installed on the first lifting plate, and the output shaft of the dipping needle lifting motor is connected to the first connecting plate; the flux dipping needle is arranged in the vertical direction and installed on the second connecting plate.

[0021] Furthermore, the spot flux assembly is provided with a plurality of groups, and the plurality of groups of spot flux assemblies are installed in parallel on one side of the first lifting plate.

[0022] Furthermore, a first visual mechanism is installed on one side of the first lifting plate.

[0023] By adopting the above scheme, the beneficial effects of the utility model are:

[0024] The flux supply device based on the utility model can adjust the thickness of the flux according to the use requirements when planting solder balls with different ball diameters, so as to cooperate to realize the precise single-point ball planting and ball replenishing processes. The overall design is reasonable, the structure is compact, and it is easy to use. At the same time, the device is not only limited to the field of ball planting, but also can be used for other colloidal pastes such as flux or solder paste in this structure, and it has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the utility model;

[0026] Figure 2 for Figure 1 sectional view of

[0027] Figure 3 It is a structural schematic diagram of the soldering flux mechanism of the utility model;

[0028] Figure 4 for Figure 3 A local enlarged schematic diagram of point A;

[0029] The accompanying drawings illustrate:

[0030] 1. First mounting frame; 2. First bearing seat; 3. Scraper; 4. Scraper assembly; 5. Scraper translation mechanism; 6. First X-axis translation mechanism; 7. Flux application mechanism; 11. First slide hole; 21. First bearing slot; 41. Scraper connecting seat; 42. Scraper plate; 51. Scraper lifting cylinder; 71. First Y-axis translation mechanism; 72. First Z-axis lifting mechanism; 73. First lifting plate; 74. First slide plate; 75. Flux dipping needle; 76. Dipping needle lifting motor; 77. First connecting plate; 78. Second connecting plate; 79. First visual mechanism. DETAILED DESCRIPTION

[0031] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0032] Reference Figures 1 to 4 As shown, the utility model provides a multi-thickness automatic soldering flux supply device, in one embodiment, comprising

[0033] A first mounting frame 1, a first bearing seat 2 is mounted on the top of the first mounting frame 1, and a first bearing groove 21 is formed on the top of the first bearing seat 2 along its length direction;

[0034] A scraper 3, the scraper 3 is detachably mounted in the first bearing groove 21; a plurality of flux scraping grooves of different depths are also provided on the top of the scraper in the length direction;

[0035] A scraper assembly 4, wherein the scraper assembly 4 is arranged above the first bearing groove 21;

[0036] The scraper translation mechanism 5 is installed on the first mounting frame 1 along the length direction of the first bearing groove 21 , and the scraper translation mechanism 5 is connected to the scraper assembly 4 .

[0037] Continue to refer to Figures 1 to 4 As shown, in this embodiment, the first mounting frame 1 includes a first bottom plate and a first top plate; the top ends of the first bottom plate are respectively connected to a first vertical plate, and the two ends of the first top plate are respectively connected to the top of a first vertical plate; the first bearing seat 2 is mounted on the first top plate, and the scraper translation mechanism 5 is mounted on the first bottom plate. The scraper translation mechanism 5 can be a linear cylinder. When in use, the flux is placed in the bearing groove, and the scraper assembly 4 can slide left and right along the length direction of the first bearing groove 21 under the drive of the scraper translation mechanism 5, and then scrape the flux into the flux scraping groove in the scraper 3. A number of flux scraping grooves of different depths are also opened in the length direction of the top of the scraper 3, so as to provide flux of different thicknesses.

[0038] In one embodiment, the number of the scraper assemblies 4 is two; the scraper translation mechanism 5 is also driven to connect a scraper translation seat, and a scraper lifting cylinder 51 is arranged at each end of the scraper translation seat; each of the scraper lifting cylinders 51 is respectively connected to a scraper assembly 4; a first sliding hole 11 is respectively opened on both sides of the top of the first top plate along its length direction, and the first bearing seat 2 is arranged between the two first sliding holes 11; the scraper assembly 4 includes a scraper connecting seat 41 and a scraper plate 42; the scraper connecting seat 41 is U-shaped, and one side of the U-shaped horizontal end of the scraper connecting seat 41 is connected to the scraper lifting cylinder 51, and the two vertical ends of the U-shaped scraper connecting seat 41 are respectively movable through a first sliding hole 11; the scraper plate 42 is connected to the top of the two vertical ends of the U-shaped scraper connecting seat 41.

[0039] In this embodiment, the scraper connecting seat 41 is designed to be a U-shaped structure, and the two vertical ends of the U-shape of the scraper connecting seat 41 are respectively arranged through a first sliding hole 11, so as to realize the function of scraping flux while ensuring the compactness of the structure. In addition, under the drive of the scraper lifting cylinder 51, the scraper plate 42 can be driven to rise and fall to adaptively adjust its height according to the use environment.

[0040] In addition, it also includes a first X-axis translation mechanism 6, which is arranged along the length direction of the first bearing seat 2, and the first X-axis translation mechanism 6 is connected to the first mounting frame 1. The first X-axis translation mechanism 6 adopts a linear motor module, and the first X-axis translation mechanism 6 can drive the first mounting frame 1 to translate, so as to move the scraped flux to the bottom of the flux application mechanism 7, so that it can apply the flux and transfer the flux to the corresponding pads of the BGA chip.

[0041] In one embodiment, a flux point mechanism 7 is also included; the flux point mechanism 7 includes a first Y-axis translation mechanism 71, a first Z-axis lifting mechanism 72 connected to the first Y-axis translation mechanism 71, a first lifting plate 73 connected to the first Z-axis lifting mechanism 72, and a flux point assembly installed on one side of the first lifting plate 73. In this embodiment, the flux point mechanism 7 is arranged above one end of the first X-axis translation mechanism 6, and the first Y-axis translation mechanism 71 and the first Z-axis lifting mechanism 72 both use linear motor modules. With the mutual cooperation of the two, the flux point assembly can be driven to perform translation and lifting movements so that the flux point assembly can transfer the flux. At the same time, in order to improve work efficiency, the flux point assembly is provided with multiple groups, and the multiple groups of flux point assemblies are installed in parallel on one side of the first lifting plate 73.

[0042] In one embodiment, the flux application assembly includes a first slide plate 74, a flux dipping needle 75, and a dipping needle lifting motor 76; one side of the first slide plate 74 is slidably connected to the first lifting plate 73, and the upper and lower parts of the other side of the first slide plate 74 are respectively connected to a first connecting plate 77 and a second connecting plate 78; the first connecting plate 77 and the second connecting plate 78 are both arranged in the horizontal direction; the dipping needle lifting motor 76 is installed on the first lifting plate 73, and the output shaft of the dipping needle lifting motor 76 is connected to the first connecting plate 77; the flux dipping needle 75 is arranged in the vertical direction and installed on the second connecting plate 78. In this embodiment, the dipping needle lifting motor 76 adopts a lifting torque motor, which can drive the flux dipping needle 75 to lift and lower so that it can apply flux. At the same time, a first visual mechanism 79 is also installed on one side of the first lifting plate 73. The first visual mechanism 79 includes a camera and a light source, which can take pictures and locate the corresponding pads of the BGA chip so as to perform the process of transferring the flux.

[0043] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-thickness automatic flux supply device, characterized in that: include A first mounting frame, wherein a first bearing seat is mounted on the top of the first mounting frame, and a first bearing groove is formed on the top of the first bearing seat along its length direction; A scraper, the scraper is detachably mounted in the first bearing groove; a plurality of flux scraping grooves of different depths are also provided on the top of the scraper in the length direction; A scraper assembly, wherein the scraper assembly is arranged above the first bearing groove; The scraper translation mechanism is installed on the first mounting frame along the length direction of the first bearing groove, and the scraper translation mechanism is connected to the scraper assembly.

2. The multi-thickness automatic flux supply device according to claim 1, characterized in that: The first mounting frame includes a first bottom plate and a first top plate; the top ends of the first bottom plate are respectively connected to a first vertical plate, and the two ends of the first top plate are respectively connected to the top of a first vertical plate; the first bearing seat is installed on the first top plate, and the scraper translation mechanism is installed on the first bottom plate.

3. The multi-thickness automatic flux supply device according to claim 2, characterized in that: There are two scraper assemblies; the scraper translation mechanism is also driven to connect a scraper translation seat, and a scraper lifting cylinder is arranged at each end of the scraper translation seat; each of the scraper lifting cylinders is connected to a scraper assembly.

4. The multi-thickness automatic soldering flux supply device according to claim 3, characterized in that: A first sliding hole is respectively provided on both sides of the top of the first top plate along its length direction, and the first bearing seat is arranged between the two first sliding holes; the scraper assembly includes a scraper connecting seat and a scraper plate; the scraper connecting seat is in a U-shaped structure, and one side of the U-shaped horizontal end of the scraper connecting seat is connected to the scraper lifting cylinder, and the two vertical ends of the U-shaped scraper connecting seat are movable through a first sliding hole arrangement respectively; the scraper plate is connected to the top of the two vertical ends of the U-shaped scraper connecting seat.

5. The multi-thickness automatic flux supply device according to any one of claims 1 to 4, characterized in that: It also includes a first X-axis translation mechanism, which is arranged along the length direction of the first bearing seat and is connected to the first mounting frame.

6. The multi-thickness automatic flux supply device according to claim 5, characterized in that: It also includes a spot flux mechanism; the spot flux mechanism includes a first Y-axis translation mechanism, a first Z-axis lifting mechanism connected to the first Y-axis translation mechanism, a first lifting plate connected to the first Z-axis lifting mechanism, and a spot flux assembly installed on one side of the first lifting plate.

7. The multi-thickness automatic soldering flux supply device according to claim 6, characterized in that: The spot flux assembly includes a first slide plate, a flux dipping needle, and a dipping needle lifting motor; one side of the first slide plate is slidably connected to the first lifting plate, and the upper and lower parts of the other side of the first slide plate are respectively connected to a first connecting plate and a second connecting plate; the first connecting plate and the second connecting plate are both arranged in the horizontal direction; the dipping needle lifting motor is installed on the first lifting plate, and the output shaft of the dipping needle lifting motor is connected to the first connecting plate; the flux dipping needle is arranged in the vertical direction and is installed on the second connecting plate.

8. The multi-thickness automatic soldering flux supply device according to claim 7, characterized in that: The point flux components are provided with a plurality of groups, and the plurality of groups of point flux components are installed in parallel on one side of the first lifting plate.

9. The multi-thickness automatic soldering flux supply device according to claim 6, characterized in that: A first visual mechanism is also installed on one side of the first lifting plate.

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