IC suction device

Abstract

The utility model provides an IC suction device, which includes a fixed seat; a plurality of suction nozzles arranged on the fixed seat at intervals along a first direction, at least one of the suction nozzles is movably mounted on the fixed seat and moves along the first direction. The utility model adjusts the distance between two adjacent groups of suction nozzles by moving the suction nozzles movably mounted on the fixed seat, thereby being able to achieve suction and fixation of ICs of different sizes, and having strong versatility.

Description

Technical Field

[0001] The utility model relates to the technical field of IC absorption, in particular to an IC absorption device. Background Art

[0002] For picking up IC, vacuum adsorption is generally used to adsorb the IC onto the suction nozzle. The air outlet of the suction nozzle forms a negative pressure environment under the action of vacuum adsorption, thereby achieving the absorption of the IC.

[0003] When working on large-size ICs, multiple nozzles are used simultaneously. The spacing between the multiple nozzles will be different for IC products of different sizes. The conventional practice is to manufacture suction devices with different nozzle spacings for ICs of different sizes, which lacks versatility.

[0004] In view of this, it is necessary to provide an IC suction device to solve the above technical problems. Utility Model Content

[0005] In order to achieve the above object, the utility model provides an IC suction device, which includes a fixed seat; a plurality of suction nozzles arranged on the fixed seat at intervals along a first direction, at least one of the suction nozzles is movably installed on the fixed seat and moves along the first direction.

[0006] As a further improvement of the utility model, the fixing seat includes a fixing block, a connecting block perpendicular to the fixing block, and an air suction channel opened in the connecting block, and the plurality of suction nozzles are all connected to the air suction channel.

[0007] As a further improvement of the utility model, the air suction channel includes a main channel and a plurality of branch channels connected to the main channel, and the number of the branch channels and the suction nozzles are the same and are connected one-to-one.

[0008] As a further improvement of the present invention, a slide groove extending along the first direction is provided on the fixed block, and at least one of the suction nozzles is movably installed in the slide groove.

[0009] As a further improvement of the present invention, the number of the suction nozzles is two groups, one group is fixed in the slide groove, and the other group is movably installed in the slide groove.

[0010] As a further improvement of the present invention, the number of the suction nozzles is two groups, and the two groups of suction nozzles are movably installed in the slide groove.

[0011] As a further improvement of the present invention, the width of the top of the slide groove is greater than the width of the bottom.

[0012] As a further improvement of the utility model, it also includes a driving rod threadedly connected to the fixed block, and one end of the driving rod is rotatably connected to the suction nozzle movably installed in the sliding groove.

[0013] As a further improvement of the present invention, the suction nozzle includes a suction port, an air suction interface connected to the suction port, and a connecting hose connecting the air suction interface and the air suction channel, and the length of the connecting hose is greater than the distance between the air suction interface and the air suction channel.

[0014] As a further improvement of the present invention, the fixing block is further provided with a through groove, and the connecting hose passes through the through groove and is connected to the air intake channel.

[0015] The beneficial effects of the utility model are as follows: the utility model can adjust the distance between two adjacent groups of the suction nozzles by moving the suction nozzles movably installed on the fixing seat, thereby being able to achieve suction and fixation of ICs of different sizes, and having strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 This is a schematic structural diagram of the IC suction device of the utility model from one perspective;

[0018] Figure 2 This is a schematic structural diagram of the IC suction device of the utility model from another perspective;

[0019] Figure 3 This is a front view of the IC suction device of the utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the IC suction device of the utility model;

[0021] Figure 5 This is an exploded schematic diagram of the IC suction device of the utility model; DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it is necessary to understand that the terms, "up", "down", "front", "back", "vertical", "horizontal", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0026] like Figures 1 to 5 As shown, the IC suction device of the utility model includes a fixing seat 100 and a plurality of suction nozzles 200. The plurality of suction nozzles 200 are arranged on the fixing seat 100 at intervals along a first direction, and at least one of the suction nozzles 200 is movably installed on the fixing seat 100. The suction nozzle 200 can be moved along the first direction, so as to adjust the distance between the suction nozzles 200 adjacent to it to achieve suction and fixation of ICs of different sizes.

[0027] The fixing seat 100 includes a fixing block 101, a connecting block 102 perpendicular to the fixing block 101, and an air suction channel 103 opened in the connecting block 102. The fixing block 101 and the connecting block 102 are in an inverted T shape. A plurality of suction nozzles 200 are connected to the air suction channel 103. The air at the suction nozzle 200 is extracted through the air suction channel 103 to form a negative pressure environment at the suction nozzle 200 to achieve the suction of the IC. In this embodiment, at least one suction nozzle 200 is movably mounted on the fixing block 101.

[0028] Furthermore, the fixing block 101 is provided with a slide groove 101a extending along the first direction, and at least one suction nozzle 200 is movably installed in the slide groove 101a. The suction nozzle 200 moves along the slide groove 101a, thereby adjusting the spacing between the suction nozzles 200 adjacent thereto to achieve suction and fixation of ICs of different sizes. The width of the top of the slide groove 101a is greater than the width of the bottom. Preferably, the slide groove 101a is a dovetail groove, so that the suction nozzle 200 will not fall off from the slide groove 101a when sucking the IC downward.

[0029] The fixed block 101 is also provided with a through groove 101b, which extends along the first direction and is connected to the slide groove 101a. The slide groove 101a and the through groove 101b penetrate the fixed block 101 together in the height direction. Part of the suction nozzle 200 passes through the through groove 101b and is connected to the suction channel 103.

[0030] The two ends of the fixed block 101 along the first direction are also connected with detachable stop blocks 101c, the stop blocks 101c are connected to the fixed block 101 by bolts, and the slide groove 101a extends from the stop block 101c at one end to the stop block 101c at the other end. In this way, when the suction nozzle 200 needs to be replaced, the stop block 101c at the end of the fixed block 101 is removed, and then the suction nozzle 200 is removed from the end of the fixed block 101.

[0031] The air intake channel 103 includes a main channel 103a and a plurality of branch channels 103b connected to the main channel 103a. The number of the branch channels 103b is the same as the number of the suction nozzles 200. The suction nozzles 200 and the branch channels 103b are connected one-to-one, that is, a group of the suction nozzles 200 is connected to a group of the branch channels 103b, and the air in the suction nozzles 200 flows from the branch channels 103b into the main channel 103a.

[0032] Specifically, the main channel 103a extends from one end of the connecting block 102 away from the fixed block 101 to the fixed block 101, and the end of the main channel 103a away from the fixed block 101 is a vacuum interface, which is connected to an external vacuum pump. One end of the branch channel 103b is connected to the main channel 103a, and the other end is a connecting port connected to the suction nozzle 200, so that negative pressure is formed at the suction nozzle 200 by the vacuum pump to adsorb the IC.

[0033] The suction nozzle 200 includes a suction port 201, a suction interface 202 connected to the suction port 201, and a connecting hose 203 connecting the suction interface 202 and the suction channel 103. The suction port 201 is used to suck the IC, one end of the connecting hose 203 is connected to the suction interface 202, and the other end passes through the through groove 101b and is connected to the connecting port of the branch channel 103b, thereby forming a complete flow channel. When the external vacuum pump is started, negative pressure is formed at the suction port 201 to suck the IC.

[0034] It should be noted that the length of the connecting hose 203 is greater than the distance between the air intake interface 202 and the connecting port of the flow channel 103b, so that the connecting hose 203 does not hinder the movement of the suction nozzle 200 and can always maintain the connection between the air intake interface 202 and the flow channel 103b. Preferably, the length of the connecting hose 203 is set to meet the maximum movement distance of the suction nozzle 200.

[0035] This embodiment takes two groups of the suction nozzles 200 as an example. In one implementation, one group is fixed in the slide groove 101a (hereinafter referred to as the first suction nozzle), and the other group is movably installed in the slide groove 101a (hereinafter referred to as the second suction nozzle). Two groups of the diversion channels 103b are provided at the same time, and the two groups of the diversion channels 103b are located at the same height and extend along the first direction through the connecting block 102.

[0036] When the IC size is smaller than the spacing between the two groups of suction nozzles 200, the second suction nozzle is moved toward the first suction nozzle so that the spacing between the two groups of suction nozzles 200 matches the IC size, and then the external vacuum pump is started, and the two groups of suction nozzles 200 achieve stable adsorption of the IC; when the spacing between the two groups of suction nozzles 200 is too small to be conducive to stable adsorption of the IC, the second suction nozzle is moved away from the first suction nozzle so that the spacing between the two groups of suction nozzles 200 matches the IC size, and then the external vacuum pump is started, and the two groups of suction nozzles 200 achieve stable adsorption of the IC.

[0037] It should be particularly noted that, since the position of the first suction nozzle is fixed, when the two groups of suction nozzles 200 simultaneously adsorb the IC, the position of the second suction nozzle is also fixed.

[0038] In another embodiment, the difference from the previous embodiment is that the two groups of suction nozzles 200 are movably installed in the slide groove 101a. Compared with the embodiment in which one group is fixed and the other group is movably installed, it has a larger adjustment range and can adapt to larger and / or smaller ICs.

[0039] When the size of the IC is smaller than the distance between the two groups of suction nozzles 200, the two groups of suction nozzles 200 are moved toward each other so that the distance between the two groups of suction nozzles 200 matches the size of the IC, and then the external vacuum pump is started, so that the two groups of suction nozzles 200 can achieve stable adsorption of the IC; when the distance between the two groups of suction nozzles 200 is too small to be conducive to stable adsorption of the IC, the two groups of suction nozzles 200 are moved in opposite directions so that the distance between the two groups of suction nozzles 200 matches the size of the IC, and then the external vacuum pump is started, so that the two groups of suction nozzles 200 can achieve stable adsorption of the IC. Of course, only one group of suction nozzles 200 can be moved.

[0040] Furthermore, the IC suction device also includes a driving rod 300 threadedly connected to the stop block 101c, one end of the driving rod 300 is rotatably connected to the suction nozzle 200 movably installed in the slide groove 101a, the driving rod 300 extends along the first direction, and a slot is provided on the suction nozzle 200, and the end of the driving rod 300 is located in the slot.

[0041] When the position of the suction nozzle 200 needs to be adjusted, the driving rod 300 is rotated to drive the suction nozzle 200 to move toward another group of the suction nozzles 200 or away from another group of the suction nozzles 200. When the adjustment is completed, the driving rod 300 is self-locking, and the position of the suction nozzle 200 is fixed at the same time, thereby preventing the two groups of suction nozzles 200 from being movably installed in the slide groove 101a. After the IC is adsorbed, the IC and the two groups of suction nozzles 200 slide along the slide groove 101a at the same time.

[0042] Of course, for an implementation in which one group is fixed in the slide groove 101 a and the other group is movably installed in the slide groove 101 a , the suction nozzle 200 can also be adjusted by the driving rod 300 .

[0043] In summary, the utility model can adjust the distance between two adjacent groups of the suction nozzles 200 by moving the suction nozzles 200 movably mounted on the fixing base 100, thereby being able to achieve suction and fixation of ICs of different sizes, and having strong versatility;

[0044] The suction nozzle 200 is always connected to the suction channel 103 in the connecting block 102 through the connecting hose 203, so as to ensure that after the distance between the suction nozzles 200 is adjusted, a negative pressure can still be formed at the suction nozzle 200 by a vacuum pump to adsorb the IC.

[0045] It should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0046] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the utility model and are not intended to limit the protection scope of the utility model. Any equivalent embodiments or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. An IC suction device, characterized in that: include: Fixed seat (100); A plurality of suction nozzles (200) are arranged on the fixing seat (100) at intervals along a first direction, and at least one of the suction nozzles (200) is movably mounted on the fixing seat (100) and moves along the first direction.

2. The IC suction device according to claim 1, characterized in that: The fixing seat (100) comprises a fixing block (101), a connecting block (102) perpendicular to the fixing block (101), and an air suction channel (103) opened in the connecting block (102), and the plurality of suction nozzles (200) are all connected to the air suction channel (103).

3. The IC suction device according to claim 2, characterized in that: The air suction channel (103) comprises a main channel (103a) and a plurality of branch channels (103b) communicating with the main channel (103a); the number of the branch channels (103b) and the suction nozzles (200) are the same and are connected in a one-to-one correspondence.

4. The IC suction device according to claim 2, characterized in that: The fixed block (101) is provided with a slide groove (101a) extending along the first direction, and at least one suction nozzle (200) is movably installed in the slide groove (101a).

5. The IC suction device according to claim 4, characterized in that: The number of the suction nozzles (200) is two groups, one group is fixed in the slide groove (101a), and the other group is movably installed in the slide groove (101a).

6. The IC suction device according to claim 4, characterized in that: The number of the suction nozzles (200) is two groups, and both groups of the suction nozzles (200) are movably installed in the slide groove (101a).

7. The IC suction device according to claim 4, characterized in that: The width of the top of the slide groove (101a) is greater than the width of the bottom.

8. The IC suction device according to claim 4, characterized in that: It also includes a driving rod (300) threadedly connected to the fixed block (101), and one end of the driving rod (300) is rotatably connected to the suction nozzle (200) movably installed in the sliding groove (101a).

9. The IC suction device according to claim 2, characterized in that: The suction nozzle (200) comprises a suction port (201), an air suction interface (202) connected to the suction port (201), and a connecting hose (203) connecting the air suction interface (202) and the air suction channel (103), and the length of the connecting hose (203) is greater than the distance between the air suction interface (202) and the air suction channel (103).

10. The IC suction device according to claim 9, characterized in that: The fixing block (101) is also provided with a through groove (101b), and the connecting hose (203) passes through the through groove (101b) to be connected to the air intake channel (103).

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