A silicon wafer cutting coolant distribution structure

Abstract

The utility model relates to the field of silicon wafer cutting cooling technology, and discloses a silicon wafer cutting coolant distribution structure, including: a liquid delivery mechanism, a cutting frame is installed below the liquid delivery mechanism, a base is installed at the bottom of the cutting frame, a silicon wafer is placed on the base for cutting, a cutting mechanism is installed at the center of the bottom of the cutting frame, a liquid spraying mechanism is arranged on the cutting mechanism, and a tensioning mechanism is arranged on the side of the cutting mechanism. The silicon wafer cutting coolant distribution structure solves the problem in the prior art that the rotation speed of the cutting equipment has a certain relationship with its cutting speed. When the cutting speed changes, the rotation speed is inevitably affected and changes to a certain extent, and the flow rate of the coolant will be maintained in a fixed range after half of the adjustment, and cannot be reduced or increased accordingly with the change of the cutting speed, so that the flow rate of the cutting liquid deviates from the flow rate that meets the required cutting cooling and cleaning.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting cooling, in particular to a silicon slice cutting cooling liquid distribution structure. Background Art

[0002] During the silicon wafer cutting process, the main function of the coolant is to cool the grinding wheel and silicon wafer, reduce the temperature, and prevent cracks and deformation during cutting. It can also clean the grinding wheel, unload sand, and maintain cutting quality. When using coolant, the coolant flow rate needs to be kept in a certain proportion to the speed of the cutting equipment according to the formula.

[0003] When using silicon wafer cutting coolant, the liquid should first be injected into the cooling system to allow it to circulate. In the prior art, the rotation speed of the cutting equipment has a certain relationship with its cutting speed. When the cutting speed changes, the rotation speed is inevitably affected and changes to a certain extent. The flow rate of the coolant will be maintained in a fixed range after half of the adjustment, and cannot be reduced or increased accordingly with the change in cutting speed, so that the flow rate of the cutting fluid deviates from the flow rate that meets the required cutting cooling and cleaning. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a silicon wafer cutting coolant distribution structure, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical solution: a silicon wafer cutting coolant distribution structure, comprising: a liquid delivery mechanism, a cutting frame is installed below the liquid delivery mechanism, a base is installed at the bottom of the cutting frame, a silicon wafer is placed on the base for cutting, a cutting mechanism is installed at the center of the bottom of the cutting frame, a liquid spraying mechanism is arranged on the cutting mechanism, a tensioning mechanism is arranged on the side of the cutting mechanism, the tensioning mechanism is installed on the cutting frame, a pressure reducing mechanism is installed on the side of the cutting frame, the structures among the pressure reducing mechanism, the cutting mechanism and the tensioning mechanism are linked, a cooling box is arranged on the back of the cutting frame, and a water pressure valve is installed between the pressure reducing mechanism and the cooling box through a pipeline.

[0006] Preferably, the liquid delivery mechanism comprises a water pump, the liquid inlet of the water pump protrudes into the interior of the cooling box through a pipeline, and the liquid outlet of the water pump is equipped with a diverter cylinder.

[0007] Preferably, the diameter of the inner wall of the diverter tube is much larger than the diameter of the inner wall of the pipe, and two water outlets are provided at one end of the diverter tube away from the water pump, one of the water outlets is installed with the pressure reducing mechanism through a pipe, and the other water outlet is installed with the liquid spraying mechanism through a pipe.

[0008] Preferably, the pressure reducing mechanism, the cutting mechanism and the tensioning mechanism are all provided with structures located on the same vertical plane, and a belt is provided between the pressure reducing mechanism, the cutting mechanism and the tensioning mechanism through the structures on the same vertical plane.

[0009] Preferably, the tensioning mechanism includes a tensioning box, a sliding rod is vertically installed at the center of the inner wall of the tensioning box, a sliding block is slidably connected to the surface of the sliding rod, a compression spring is overlapped at the bottom of the sliding block, and the compression spring is movably sleeved on the sliding rod, a strip groove is opened on the side of the tensioning box, a second shaft rod is integrally provided on the side of the sliding block, and the second shaft rod passes through the surface of one end of the strip groove and is screwed to a second pulley.

[0010] Preferably, the pressure reducing mechanism includes an end frame, which is installed on the cutting frame, and a pressure cylinder is arranged on the surface of the end frame, a first shaft rod is screwed inside the pressure cylinder, one end of the first shaft rod passes through the pressure cylinder and the end frame respectively and is sleeved with a first pulley, a vortex blade is arranged on the surface of the first shaft rod located inside the pressure cylinder, a bracket is sleeved on the outer edge of the pressure cylinder, and the bracket is installed on the side of the cutting frame.

[0011] Preferably, the cutting mechanism includes a mounting plate, a cutting frame is integrally provided at the end of the mounting plate, a hydraulic cylinder and a dual-axis motor are respectively installed on the top and bottom of the mounting plate, the top of the hydraulic cylinder is installed on the cutting frame, the output shaft at one end of the dual-axis motor passes through the cutting frame and is sleeved with a grinding wheel, and a third pulley is sleeved on the output shaft at the other end of the dual-axis motor.

[0012] Preferably, a spray rack is installed on the side of the cutting rack, and the liquid spraying mechanism is installed on the spray rack.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. The cooling liquid distribution structure for silicon wafer cutting is provided with a liquid delivery mechanism to divert the pumped cooling liquid, thereby reducing the flow rate of the delivered cooling liquid, and then a pressure reducing mechanism is provided to cooperate with the water pressure valve to control the flow rate of one of the pipes leading back to the cooling box. When the cutting mechanism cuts the silicon wafer, its rotation speed is reflected to the pressure reducing mechanism by a belt, and then the closing state of the water pressure valve is controlled by controlling the water flow rate, which has the effect of increasing or decreasing the hydraulic pressure of another cooling pipe, so as to control the spraying flow rate of the cooling liquid, thereby achieving the effect of associating the spraying flow rate of the cooling liquid with the rotation speed of the cutting mechanism.

[0015] 2. The silicon wafer cutting coolant distribution structure is provided with a tensioning mechanism, and the rotation of the tensioning mechanism, the pressure reducing mechanism and the cutting mechanism are linked through a belt. When the cutting mechanism descends for cutting, the belt simultaneously presses the structure in the tensioning mechanism to descend, so that the belt is always in a tensioned state, which can drive the pressure reducing mechanism to operate, and ensure that the pressure reducing mechanism changes the coolant flow rate with the rotation speed of the cutting mechanism, thereby achieving the effect of automatically distributing the coolant flow rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a rear view structural diagram of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the belt linkage of the utility model;

[0019] Figure 4 This is a schematic diagram of the side section structure of the tensioning mechanism of the utility model;

[0020] Figure 5 It is a schematic diagram of the side section structure of the pressure reducing mechanism of the utility model;

[0021] Figure 6 This is a schematic diagram of the cutting mechanism structure of the utility model.

[0022] In the figure: 1. base; 2. cutting frame; 3. liquid feeding mechanism; 31. water pump; 32. diverter cylinder; 4. pressure reducing mechanism; 41. end frame; 42. pressurizing cylinder; 43. first shaft rod; 44. first pulley; 45. vortex blade; 46. bracket; 5. liquid spraying mechanism; 6. tensioning mechanism; 61. tensioning box; 62. slide bar; 63. slide block; 64. compression spring; 65. strip groove; 66. second shaft rod; 67. second pulley; 7. cooling box; 8. cutting mechanism; 81. mounting plate; 82. cutter frame; 83. grinding wheel; 84. spray frame; 85. double-axis motor; 86. third pulley; 87. hydraulic cylinder; 9. water pressure valve; 10. belt. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-6A silicon wafer cutting coolant distribution structure includes: a liquid feeding mechanism 3, a cutting frame 2 is installed below the liquid feeding mechanism 3, a base 1 is installed at the bottom of the cutting frame 2, a silicon wafer is placed on the base 1 for cutting, a cutting mechanism 8 is installed at the center of the bottom of the cutting frame 2, a liquid spraying mechanism 5 is arranged on the cutting mechanism 8, a tensioning mechanism 6 is arranged on the side of the cutting mechanism 8, the tensioning mechanism 6 is installed on the cutting frame 2, a pressure reducing mechanism 4 is installed on the side of the cutting frame 2, the pressure reducing mechanism 4, the cutting mechanism 8 and the tensioning mechanism 6 are linked, a cooling box 7 is arranged on the back of the cutting frame 2, and a water pressure valve 9 is installed between the pressure reducing mechanism 4 and the cooling box 7 through a pipeline.

[0025] Among them, the liquid delivery mechanism 3 includes a water pump 31, the liquid inlet of the water pump 31 is inserted into the interior of the cooling box 7 through a pipeline, and the liquid outlet of the water pump 31 is installed with a diverter tube 32. The water pump 31 is used to suck the coolant in the cooling box 7, and the coolant is introduced into the diverter tube 32, and the diverter tube 32 is used to send it to the liquid spray mechanism 5 and the pressure reducing mechanism 4 respectively, so as to reduce the flow rate of the sucked coolant.

[0026] Among them, the diameter of the inner wall of the diverter tube 32 is much larger than the diameter of the inner wall of the pipe. Two water outlets are arranged at one end of the diverter tube 32 away from the water pump 31. One water outlet is installed with the pressure reducing mechanism 4 through a pipe, and the other water outlet is installed with the liquid spraying mechanism 5 through a pipe. The diverter tube 32 is used to store a small amount of coolant drawn out by the water pump 31, so that the coolant can be diverted at a certain flow rate in the subsequent suction. At the same time, the inner diameter of the pipe installed at the liquid inlet of the water pump 31 is larger than the inner diameter of the pipe after diversion by the diverter tube 32, so that the coolant sucked in by the water pump 31 can keep up with the consumption of the diversion.

[0027] Among them, the pressure reducing mechanism 4, the cutting mechanism 8 and the tensioning mechanism 6 are all provided with structures located on the same vertical plane, and a belt 10 is provided between the pressure reducing mechanism 4, the cutting mechanism 8 and the tensioning mechanism 6 through the structure on the same vertical plane. By setting the tensioning mechanism, the rotation conditions of the pressure reducing mechanism 4, the cutting mechanism 8 and the tensioning mechanism 6 are linked through the belt 10. When the cutting mechanism 8 descends for cutting, the belt 10 simultaneously presses the structure in the tensioning mechanism 6 to descend, thereby making the belt 10 always in a tensioned state.

[0028] Among them, the tensioning mechanism 6 includes a tensioning box 61, a sliding rod 62 is vertically installed at the center of the inner wall of the tensioning box 61, a slider 63 is slidably connected to the surface of the sliding rod 62, and a compression spring 64 is overlapped at the bottom of the slider 63. The compression spring 64 is movably sleeved on the sliding rod 62. A strip groove 65 is opened on the side of the tensioning box 61, and a second shaft rod 66 is integrally arranged on the side of the slider 63. The second shaft rod 66 passes through the surface of one end of the strip groove 65 and is screwed with a second pulley 67. The tensioning mechanism 6 is operated as the cutting mechanism 8 is pressed down to protect the belt 10, thereby reducing the situation where the cutting mechanism 8 presses down to tighten the belt 10 and causes damage to it.

[0029] Among them, the pressure reducing mechanism 4 includes an end frame 41, which is installed on the cutting frame 2. A pressure cylinder 42 is arranged on the surface of the end frame 41. A first shaft rod 43 is screwed inside the pressure cylinder 42. One end of the first shaft rod 43 passes through the pressure cylinder 42 and the end frame 41 respectively and is sleeved with a first pulley 44. A vortex blade 45 is arranged on the surface of the first shaft rod 43 inside the pressure cylinder 42. A bracket 46 is sleeved on the outer edge of the pressure cylinder 42. The bracket 46 is installed on the side of the cutting frame 2. The belt 10 is used to link the running speed of the pressure reducing mechanism 4 with the cutting mechanism 8. When the speed of the cutting mechanism 8 is faster, it can synchronously drive the pressure reducing mechanism 4 to rotate rapidly, increase the flow rate of the coolant in the pressure reducing mechanism 4, and then make the water pressure valve 9 close to a certain extent when the water flow becomes faster, control the flow rate of the coolant passing through the pressure reducing mechanism 4, increase the flow rate of the coolant in another pipeline, and then improve the spraying flow rate of its spray mechanism 5.

[0030] Among them, the cutting mechanism 8 includes a mounting plate 81, and a cutting frame 82 is integrally arranged at the end of the mounting plate 81. A hydraulic cylinder 87 and a dual-axis motor 85 are respectively installed on the top and bottom of the mounting plate 81. The top of the hydraulic cylinder 87 is installed on the cutting frame 2. The output shaft at one end of the dual-axis motor 85 passes through the cutting frame 82 and is sleeved with a grinding wheel 83. The output shaft at the other end of the dual-axis motor 85 is sleeved with a third pulley 86. The hydraulic cylinder 87 is used to control the grinding wheel 83 to descend to cut the silicon wafer. Then the output shaft at the other end of the dual-axis motor 85 reflects its rotation speed to the step-down mechanism 4, thereby synchronously controlling the coolant spraying flow rate.

[0031] Among them, a spray rack 84 is installed on the side of the cutting rack 82, and the spray mechanism 5 is installed on the spray rack 84. The spray mechanism 5 is fixed above the grinding wheel 83 by using the spray rack 84, so that the spray mechanism 5 continuously sprays coolant on the grinding wheel 83 to achieve the effect of cooling and cleaning.

[0032] Working principle: when cutting the silicon wafer, first set the silicon wafer on the base 1 through the clamp, then start the cutting mechanism 8 and press down to cut, at this time 6 will adapt to change to protect the belt 10, and then start the liquid delivery mechanism 3, when the coolant absorbed in the liquid delivery mechanism 3 is respectively sent to the pressure reducing mechanism 4 and the liquid spraying mechanism 5, the pressure reducing mechanism 4 controls the flow rate therein through the belt 10 along with the rotation speed of the cutting mechanism 8, and then controls the closing condition of the water pressure valve 9, so that the flow rate of the coolant passing through the pressure reducing mechanism 4 is reduced or increased, and the coolant separated by the liquid delivery mechanism 3 is correspondingly distributed to the liquid spraying mechanism 5 according to the flow condition in the pressure reducing mechanism 4, so as to achieve the effect of automatically controlling the distribution of the coolant.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cutting coolant distribution structure, characterized in that: include: A liquid delivery mechanism (3), a cutting frame (2) is installed below the liquid delivery mechanism (3), a base (1) is installed at the bottom of the cutting frame (2), a silicon wafer is placed on the base (1) for cutting, a cutting mechanism (8) is installed at the center of the bottom of the cutting frame (2), a liquid spraying mechanism (5) is arranged on the cutting mechanism (8), a tensioning mechanism (6) is arranged on the side of the cutting mechanism (8), the tensioning mechanism (6) is installed on the cutting frame (2), a pressure reduction mechanism (4) is installed on the side of the cutting frame (2), the pressure reduction mechanism (4), the cutting mechanism (8) and the tensioning mechanism (6) are structurally linked, a cooling box (7) is arranged on the back of the cutting frame (2), and a water pressure valve (9) is installed between the pressure reduction mechanism (4) and the cooling box (7) through a pipeline; The liquid delivery mechanism (3) comprises a water pump (31), the liquid inlet of the water pump (31) protrudes into the interior of the cooling box (7) through a pipeline, and the liquid outlet of the water pump (31) is equipped with a diverter tube (32); The diameter of the inner wall of the diverter tube (32) is much larger than the diameter of the inner wall of the pipe. The diverter tube (32) is provided with two water outlets at one end away from the water pump (31), one of the water outlets being connected to the pressure reducing mechanism (4) through a pipe, and the other water outlet being connected to the liquid spraying mechanism (5) through a pipe. The pressure reducing mechanism (4), the cutting mechanism (8) and the tensioning mechanism (6) are all provided with structures located on the same vertical plane, and a belt (10) is provided between the pressure reducing mechanism (4), the cutting mechanism (8) and the tensioning mechanism (6) via the structures located on the same vertical plane; The pressure reducing mechanism (4) comprises an end frame (41), the end frame (41) being mounted on the cutting frame (2), a pressure cylinder (42) being arranged on the surface of the end frame (41), a first shaft (43) being screwed inside the pressure cylinder (42), one end of the first shaft (43) respectively passing through the pressure cylinder (42) and the end frame (41) and being sleeved with a first pulley (44), a vortex blade (45) being arranged on the surface of the first shaft (43) inside the pressure cylinder (42), a bracket (46) being sleeved on the outer edge of the pressure cylinder (42), and the bracket (46) being mounted on the side of the cutting frame (2).

2. The silicon wafer cutting coolant distribution structure according to claim 1, characterized in that: The tensioning mechanism (6) comprises a tensioning box (61), a sliding rod (62) is vertically installed at the center of the inner wall of the tensioning box (61), a sliding block (63) is slidably connected to the surface of the sliding rod (62), a compression spring (64) is overlapped at the bottom of the sliding block (63), and the compression spring (64) is movably sleeved on the sliding rod (62), a strip groove (65) is opened on the side of the tensioning box (61), a second shaft rod (66) is integrally arranged on the side of the sliding block (63), and the second shaft rod (66) passes through the surface of one end of the strip groove (65) and is screwed to a second pulley (67).

3. The silicon wafer cutting coolant distribution structure according to claim 1, characterized in that: The cutting mechanism (8) comprises a mounting plate (81), a cutter frame (82) being integrally provided at the end of the mounting plate (81), a hydraulic cylinder (87) and a double-axis motor (85) being respectively mounted on the top and bottom of the mounting plate (81), the top of the hydraulic cylinder (87) being mounted on the cutting frame (2), an output shaft at one end of the double-axis motor (85) passing through the cutter frame (82) and being sleeved with a grinding wheel (83), and a third pulley (86) being sleeved on the output shaft at the other end of the double-axis motor (85).

4. The silicon wafer cutting coolant distribution structure according to claim 3, characterized in that: A spray rack (84) is installed on the side of the cutting rack (82), and the liquid spraying mechanism (5) is installed on the spray rack (84).

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