Sheet overturning and arranging device
By designing the flip-up device, the flip-up mechanism, the limit mechanism and the tapping mechanism are used to solve the problems of misalignment and negative pressure gaps during the handling and stacking of silicon wafers, and the efficient and neat silicon wafer finishing effect is achieved.
Patent Information
- Application Number
- CN202420044413.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-04
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-01-04
AI Technical Summary
During the handling and stacking of silicon wafers, inaccurate positioning of the mechanical devices leads to misalignment of the silicon wafers, and the smoothness between the silicon wafers is high, which easily creates negative pressure gaps, making it difficult for the silicon wafers to push or break.
A flip-up whole piece device is designed, including a flip-up mechanism, a material loading platform, a limiting mechanism and a slap mechanism. The flip mechanism switches the carrier platform between the horizontal plane and the vertical plane, the limiting mechanism ensures that the silicon wafer is in the placement position, and the tapping mechanism helps the silicon wafers be arranged neatly through low frequency and small amplitude vibrations.
By flipping the entire piece device, the silicon wafer can be sorted in a vertical state that weakens the interaction force, avoid negative pressure gaps, improve finishing efficiency and effect, ensure that the silicon wafers are arranged neatly and avoid breaking.
Smart Images
Figure CN222699526U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer arrangement, in particular to a whole wafer flipping device. Background Art
[0002] Silicon wafers are needed in the process of manufacturing crystalline silicon solar cells. Silicon wafers need to be tested from manufacturing to use. In the above process, the handling of silicon wafers is involved. Generally, multiple silicon wafers are stacked into groups and then transported to improve efficiency. Silicon wafers are picked up and stacked by mechanical devices, but the mechanical device may not be accurate in positioning when placing silicon wafers. The stacked silicon wafers are in a misaligned state, so the stacked silicon wafers need to be sorted and arranged neatly.
[0003] Currently, the edges of silicon wafers can be pushed to trim them, but the smoothness between the silicon wafers is high, which easily creates multiple gaps between the two silicon wafers to form negative pressure, making the silicon wafer difficult to push or even breaking when pushed. Utility Model Content
[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a whole-wafer flipping device for arranging misaligned stacked silicon wafers in an orderly manner, with high arranging efficiency and good effect.
[0005] The whole-sheet flipping device according to the embodiment of the utility model comprises: a flipping mechanism;
[0006] A loading platform, the loading platform is connected to the flip mechanism, and the flip mechanism can drive the loading platform to switch between a horizontal plane and a vertical plane;
[0007] A limiting mechanism, the limiting mechanism is arranged on the loading platform, the limiting mechanism can form a placement position, and the placement position is used to place silicon wafers;
[0008] A beating mechanism, wherein the beating mechanism is arranged around the placement position, and the beating mechanism can move toward the placement position to perform beating.
[0009] The whole-wafer flipping device according to the embodiment of the utility model has at least the following beneficial effects: the loading platform is used to hold multiple stacked silicon wafers, the limiting mechanism is arranged on the loading platform, and a placement position is arranged on the loading platform. The silicon wafer is in the placement position and is restricted by the limiting mechanism to prevent the silicon wafer from escaping from the loading platform. The flipping mechanism is used to switch the loading platform from a horizontal plane to a vertical plane. In the vertical plane state, the interaction force between the silicon wafers is weakened, and a gap with negative pressure is no longer generated between the two silicon wafers. After being beaten by the beating mechanism, the silicon wafers can be gradually arranged neatly.
[0010] According to some embodiments of the present utility model, the limiting mechanism includes at least two groups of limiting clamps, and the limiting clamps are arranged crosswise with each other, and the limiting clamps can change the size of the projection surface of the placement position.
[0011] According to some embodiments of the utility model, the limit clamp includes a first limit block, a second limit block and a first driving member, the first limit block and the second limit block are relatively arranged to enclose the placement position, and the first driving member is connected to the second limit block and can drive the second limit block to move toward the first limit block.
[0012] According to some embodiments of the utility model, the flapping mechanism includes a second driving member and a flapping block, the flapping block is connected to the second driving member, and the second driving member can drive the flapping block to reciprocate toward the inner side of the placement position.
[0013] According to some embodiments of the utility model, the loading platform is provided with an air blowing mechanism, and the air outlet of the air blowing mechanism faces the placement position.
[0014] According to some embodiments of the utility model, the blowing mechanism includes a third driving member and an air guide block, the air guide block is provided with a plurality of the air outlets, the air guide block is connected to the third driving member, and the third driving member can drive the air guide block to move in a direction perpendicular to the surface of the loading platform.
[0015] According to some embodiments of the present invention, the material loading platform is provided with a baffle mechanism, and the baffle mechanism can be moved into the projection plane of the placement position and face the surface of the material loading platform.
[0016] According to some embodiments of the utility model, the baffle mechanism includes a baffle plate and a fourth driving member, the baffle plate is spaced apart from and arranged facing the loading platform, the fourth driving member is connected to the baffle plate, and the fourth driving member can drive the baffle plate to move toward the placement position.
[0017] According to some embodiments of the utility model, the fourth driving member includes a first driving cylinder and a second driving cylinder, the first driving cylinder is arranged on the loading platform, the first driving cylinder has a driving stroke parallel to the surface of the loading platform, the second driving cylinder is connected to the first driving cylinder, the second driving cylinder has a driving stroke perpendicular to the surface of the loading platform, and the material baffle is connected to the second driving cylinder.
[0018] According to some embodiments of the present invention, the loading platform is provided with a plurality of cushion blocks, the plurality of cushion blocks are all located in the placement position, and the surfaces of the plurality of cushion blocks are in the same plane.
[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:
[0021] Figure 1 This is a schematic structural diagram of a whole-sheet flipping device according to an embodiment of the utility model;
[0022] Figure 2 This is a schematic diagram of the structure of the limit clamp in the embodiment of the utility model;
[0023] Figure 3 This is a schematic diagram of the structure of the flapping mechanism in the embodiment of the utility model;
[0024] Figure 4 It is a schematic structural diagram of the blowing mechanism and the baffle mechanism in the embodiment of the utility model.
[0025] Figure Number:
[0026] Flipping mechanism 100, loading platform 200, pad block 210, limiting mechanism 300, limiting clamp 310, first limiting block 311, second limiting block 312, first driving member 313, flapping mechanism 400, second driving member 410, flapping block 420, blowing mechanism 500, third driving member 510, air guide block 520, baffle mechanism 600, baffle plate 610, fourth driving member 620, first driving cylinder 621, second driving cylinder 622. DETAILED DESCRIPTION
[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0028] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0029] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0031] Reference Figure 1 As shown, a whole-sheet flipping device according to an embodiment of the utility model comprises a flipping mechanism 100 , a loading platform 200 , a limiting mechanism 300 and a beating mechanism 400 .
[0032] The loading platform 200 is connected to the flip mechanism 100, and the flip mechanism 100 can drive the loading platform 200 to switch between the horizontal plane and the vertical plane;
[0033] The limiting mechanism 300 is disposed on the loading platform 200, and the limiting mechanism 300 can form a placement position, and the placement position is used to place silicon wafers;
[0034] The beating mechanism 400 is disposed around the placement position, and the beating mechanism 400 can move toward the placement position to perform beating.
[0035] In the initial state, the loading platform 200 is in a horizontal plane, that is, the surface of the loading platform 200 is in a horizontal state. The stacked silicon wafers are placed in the placement position of the loading platform 200. For the placement of the silicon wafers, a mechanical device such as a clamp can be used to stack the silicon wafers one by one in the placement position, or a stack of misaligned silicon wafers can be directly placed in the placement position.
[0036] The placement position is surrounded by the limiting mechanism 300 . The silicon wafer is in the placement position and is restricted by the limiting mechanism 300 . When the loading platform 200 is in a vertical plane, the silicon wafer will not fall off the loading platform 200 .
[0037] The flip mechanism 100 can be driven by a flip motor, which is connected to the loading platform 200 through a transmission member, and drives the loading platform 200 to rotate, so as to drive the loading platform 200 to switch between the horizontal plane and the vertical plane. Of course, the flip mechanism 100 can also be other driving structures that can realize rotation.
[0038] When the loading platform 200 is in a vertical plane, the silicon wafers are changed from a horizontal stacking state to a side-placed state, the interaction force between the silicon wafers is weakened, and a gap with negative pressure is no longer formed between the two silicon wafers. Finally, through the action of the flapping mechanism 400, the sides of the silicon wafers are flapped to simulate manual flapping and sorting, so that the silicon wafers can be arranged neatly, with high sorting efficiency and good effect. It should be understood that the flapping mechanism 400 mainly vibrates the silicon wafers gently at a low frequency and a small amplitude to prevent the flapping force from being too large and causing the silicon wafers to break. Since the flapping force of the flapping mechanism 400 is flexibly adjusted according to the actual situation, the flapping force of the flapping mechanism 400 is not limited.
[0039] Reference Figure 2 As shown, it can be understood that the limiting mechanism 300 includes at least two groups of limiting clamps 310, and the limiting clamps 310 are arranged crosswise with each other. The limiting clamps 310 can change the size of the projection surface of the placement position.
[0040] The two groups of limit clamps 310 are arranged crosswise. Taking a square silicon wafer as an example, the cross limit clamps 310 can correspond to two groups of opposite sides of the silicon wafer to achieve position restriction of the silicon wafer. The limit clamps 310 can change the size of the projection surface of the placement position, that is, before placing the silicon wafer, the limit clamps 310 increase the placement position, and the limit clamps 310 will not be touched when the silicon wafer is placed. After the silicon wafer is placed, the limit clamps 310 will reduce the projection surface of the placement position, that is, the limit clamps 310 gradually approach the silicon wafer to contact the silicon wafer, so as to avoid a large gap between the limit clamps 310 and the silicon wafer and fail to achieve the restriction effect.
[0041] It can be understood that the limit clamp 310 includes a first limit block 311, a second limit block 312 and a first driving member 313. The first limit block 311 and the second limit block 312 are relatively arranged to enclose a placement position. The first driving member 313 is connected to the second limit block 312 and can drive the second limit block 312 to move toward the first limit block 311.
[0042] Each of the limit clamps 310 includes a first limit block 311 and a second limit block 312. The first limit block 311 is disposed on the loading platform 200 and may be fixedly connected. The second limit block 312 is connected to the first driving member 313 and is driven to move by the first driving member 313 to achieve movement of the second limit block 312 toward the first limit block 311, that is, the distance between the first limit block 311 and the second limit block 312 can be shortened to be close to the silicon wafer.
[0043] Reference Figure 3 As shown, it can be understood that the flapping mechanism 400 includes a second driving member 410 and a flapping block 420, the flapping block 420 is connected to the second driving member 410, and the second driving member 410 can drive the flapping block 420 to reciprocate toward the inner side of the placement position.
[0044] The second driving member 410 drives the beating block 420 to move toward the inner side of the placement position, simulating the beating action of a human hand on the side of the silicon wafer, and assisting the silicon wafers to be arranged neatly. By controlling the driving stroke and driving force of the second driving member 410, the force of the beating block 420 on the silicon wafer can be adjusted to prevent the silicon wafer from being damaged by excessive force. The second driving member 410 preferably uses a film cylinder.
[0045] Reference Figure 4 As shown, it can be understood that the material loading platform 200 is provided with a blowing mechanism 500, and the air outlet of the blowing mechanism 500 faces the placement position.
[0046] Generally, a piece of sulfur-free paper is placed between the silicon wafers to protect the surface between the two silicon wafers and prevent the silicon wafers from rubbing against each other and causing scratches on the surface. The blowing mechanism 500 can blow air to the stacked silicon wafers and the sulfur-free paper to form an air layer between the silicon wafers, further reducing the force between the silicon wafers and assisting the patting mechanism 400 in arranging the silicon wafers.
[0047] It can be understood that the blowing mechanism 500 includes a third driving member 510 and an air guide block 520. The air guide block 520 has multiple air outlets. The air guide block 520 is connected to the third driving member 510. The third driving member 510 can drive the air guide block 520 to move in a direction perpendicular to the surface of the loading platform 200.
[0048] The third driving member 510 can drive the air guide block 520 to move, and the air outlet of the air guide block 520 faces the silicon wafer. When the air guide block 520 moves, a floating air layer can be formed between the silicon wafers, and the distance from each silicon wafer to the air outlet and the angle of the air flow can be consistent, so that each silicon wafer can be accurately sorted to achieve a better whole-wafer effect. If the air guide block 520 does not move, the distance and angle from each silicon wafer to the air outlet are different, and the sorting effect is poor.
[0049] It is understandable that the material loading platform 200 is provided with a baffle mechanism 600 , and the baffle mechanism 600 can be moved into the projection plane of the placement position and face the surface of the material loading platform 200 .
[0050] When the loading platform 200 is in a vertical plane and the blowing mechanism 500 is performing a blowing operation, the sulfur-free paper is light and can be easily blown off the loading platform 200. The baffle mechanism 600 is moved to the projection surface of the placement position, that is, the baffle mechanism 600 and the loading platform 200 together play a role of enclosing the stacked silicon wafers, preventing the sulfur-free paper from being blown out, and also preventing the silicon wafers from falling sideways and falling off the loading platform 200.
[0051] It can be understood that in a specific embodiment, the baffle mechanism 600 includes a baffle plate 610 and a fourth driving member 620, the baffle plate 610 is spaced apart from and arranged opposite to the loading platform 200, and the fourth driving member 620 is connected to the baffle plate 610, and the fourth driving member 620 can drive the baffle plate 610 to move toward the placement position.
[0052] The fourth driving member 620 drives the material blocking plate 610 to move, so that the material blocking plate 610 blocks the sulfur-free paper and the silicon wafer at the placement position.
[0053] It can be understood that the fourth driving member 620 includes a first driving cylinder 621 and a second driving cylinder 622. The first driving cylinder 621 is arranged on the loading platform 200. The first driving cylinder 621 has a driving stroke parallel to the surface of the loading platform 200. The second driving cylinder 622 is connected to the first driving cylinder 621. The second driving cylinder 622 has a driving stroke perpendicular to the surface of the loading platform 200. The material baffle plate 610 is connected to the second driving cylinder 622.
[0054] The first drive cylinder 621 and the second drive cylinder 622 can be pneumatic cylinders or hydraulic cylinders, and the appropriate type can be selected according to the actual situation. The first drive cylinder 621 is used to drive the baffle plate 610 to move along the surface parallel to the material loading platform 200. When placing silicon wafers, the baffle plate 610 is moved to the outside of the placement position to avoid interference; after placing the silicon wafers, the first drive cylinder 621 moves the baffle plate 610 to the placement position. The second drive cylinder 622 is used to drive the baffle plate 610 to move perpendicular to the surface of the material loading platform 200 to adjust the distance between the baffle plate 610 and the silicon wafers on the outside.
[0055] It can be understood that the loading platform 200 is provided with a plurality of cushion blocks 210 , and the plurality of cushion blocks 210 are all located in the placement position, and the surfaces of the plurality of cushion blocks 210 are in the same plane.
[0056] The pad 210 is in the placement position, and the silicon wafer is in direct contact with the pad 210 , which can reduce the contact area of the silicon wafer and retain a gap between the silicon wafer and the loading platform 200 , facilitating the subsequent handling of the silicon wafer.
[0057] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A whole-sheet flipping device, characterized in that: include: Flipping mechanism (100); A loading platform (200), the loading platform (200) being connected to the flipping mechanism (100), and the flipping mechanism (100) being capable of driving the loading platform (200) to switch between a horizontal plane and a vertical plane; A limiting mechanism (300), the limiting mechanism (300) being arranged on the material loading platform (200), the limiting mechanism (300) being capable of forming a placement position, the placement position being used for placing silicon wafers; A beating mechanism (400), the beating mechanism (400) is arranged around the placement position, and the beating mechanism (400) can move toward the placement position to perform beating.
2. The whole-sheet flipping device according to claim 1, characterized in that: The limiting mechanism (300) comprises at least two groups of limiting clamps (310), the limiting clamps (310) are arranged crosswise with each other, and the limiting clamps (310) are capable of changing the size of the projection surface of the placement position.
3. The whole sheet flipping device according to claim 2, characterized in that: The limiting clamp (310) comprises a first limiting block (311), a second limiting block (312) and a first driving member (313); the first limiting block (311) and the second limiting block (312) are arranged relative to each other to enclose the placement position; the first driving member (313) is connected to the second limiting block (312) and is capable of driving the second limiting block (312) to move toward the first limiting block (311).
4. The whole-sheet flipping device according to claim 1, characterized in that: The flapping mechanism (400) comprises a second driving member (410) and a flapping block (420), wherein the flapping block (420) is connected to the second driving member (410), and the second driving member (410) is capable of driving the flapping block (420) to reciprocate toward the inner side of the placement position.
5. The whole-sheet flipping device according to claim 1, characterized in that: The material loading platform (200) is provided with an air blowing mechanism (500), and the air outlet of the air blowing mechanism (500) faces the placement position.
6. The whole-sheet flipping device according to claim 5, characterized in that: The air blowing mechanism (500) comprises a third driving member (510) and an air guiding block (520), wherein the air guiding block (520) is provided with a plurality of air outlets, and the air guiding block (520) is connected to the third driving member (510), and the third driving member (510) is capable of driving the air guiding block (520) to move in a direction perpendicular to the surface of the loading platform (200).
7. The whole-sheet flipping device according to claim 1, characterized in that: The material loading platform (200) is provided with a baffle mechanism (600), and the baffle mechanism (600) can be moved into the projection plane of the placement position and face the surface of the material loading platform (200).
8. The whole-sheet flipping device according to claim 7, characterized in that: The baffle mechanism (600) comprises a baffle plate (610) and a fourth driving member (620); the baffle plate (610) is spaced apart from and arranged facing the loading platform (200); the fourth driving member (620) is connected to the baffle plate (610); and the fourth driving member (620) can drive the baffle plate (610) to move toward the placement position.
9. The whole-sheet flipping device according to claim 8, characterized in that: The fourth driving member (620) comprises a first driving cylinder (621) and a second driving cylinder (622), wherein the first driving cylinder (621) is arranged on the loading platform (200), and the first driving cylinder (621) has a driving stroke parallel to the surface of the loading platform (200), the second driving cylinder (622) is connected to the first driving cylinder (621), and the second driving cylinder (622) has a driving stroke perpendicular to the surface of the loading platform (200), and the baffle plate (610) is connected to the second driving cylinder (622).
10. The whole-sheet flipping device according to claim 1, characterized in that: The material loading platform (200) is provided with a plurality of cushion blocks (210), the plurality of cushion blocks (210) are all located in the placement position, and the surfaces of the plurality of cushion blocks (210) are located in the same plane.