Radiators, refrigeration units and electrical equipment

Abstract

The utility model discloses a radiator, a refrigeration device and an electrical device, and relates to the technical field of electrical devices. The radiator includes a first heat dissipation substrate, a plurality of heat dissipation fins and a second heat dissipation substrate; the plurality of heat dissipation fins are connected to one side of the first heat dissipation substrate; the second heat dissipation substrate is connected to the side of the first heat dissipation substrate away from the heat dissipation fins, and is used for heat conduction connection with a refrigeration chip, and the thermal conductivity coefficient of the second heat dissipation substrate is greater than the thermal conductivity coefficient of the first heat dissipation substrate. The utility model arranges a second heat dissipation substrate on the basis of the first heat dissipation substrate, and the thermal conductivity coefficient of the second heat dissipation substrate is greater than the thermal conductivity coefficient of the first heat dissipation substrate. By connecting the second heat dissipation substrate with the refrigeration chip to be dissipated, the heat of the refrigeration chip can be transferred to the second heat dissipation substrate more quickly, and then transferred from the second heat dissipation substrate to the first heat dissipation substrate and the heat dissipation fins, which has better heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, and in particular to a radiator, a refrigeration device and electrical equipment. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] Refrigerators and other electrical equipment generate a lot of heat during operation. Taking semiconductor refrigeration refrigerators as an example, the refrigeration chip of semiconductor refrigeration refrigerators needs to remove heat through a radiator to ensure the stability of the refrigeration chip.

[0004] Existing cooling chips mostly use fin heat sinks to transfer the generated heat to the external environment. However, due to the small heat dissipation area of ​​the cooling chip itself, the traditional fin heat sink often cannot dissipate heat quickly and effectively, resulting in poor heat dissipation efficiency of the cooling chip, affecting the operating stability and service life of the cooling chip. Utility Model Content

[0005] The purpose of the utility model is to at least solve the problem of poor heat dissipation efficiency of the existing radiator. This purpose is achieved through the following technical solutions:

[0006] In the first aspect, the utility model proposes a heat sink for dissipating heat from a refrigeration chip, comprising a first heat dissipation substrate, a plurality of heat dissipation fins and a second heat dissipation substrate; the plurality of heat dissipation fins are connected to one side of the first heat dissipation substrate; the second heat dissipation substrate is connected to a side of the first heat dissipation substrate away from the plurality of heat dissipation fins, and is used for thermally connecting the refrigeration chip, and the thermal conductivity coefficient of the second heat dissipation substrate is greater than the thermal conductivity coefficient of the first heat dissipation substrate.

[0007] According to the radiator provided by the utility model, a second heat dissipation substrate is arranged on the basis of the first heat dissipation substrate, the thermal conductivity coefficient of the second heat dissipation substrate is greater than the thermal conductivity coefficient of the first heat dissipation substrate, and the second heat dissipation substrate is connected to the refrigeration chip to be dissipated, so that the heat of the refrigeration chip can be transferred to the second heat dissipation substrate more quickly, and then transferred to the first heat dissipation substrate and the heat dissipation fins by the second heat dissipation substrate, which has better heat dissipation efficiency and can improve the stability and service life of the refrigeration chip to a certain extent.

[0008] In addition, the radiator provided by the utility model may also have the following additional technical features:

[0009] In some embodiments of the present invention, the first heat dissipation substrate has a first surface and a second surface that are opposite to each other, the plurality of heat dissipation fins are located on the first surface, and the second heat dissipation substrate is stacked and connected to the second surface.

[0010] In some embodiments of the present invention, along the arrangement direction of the first surface and the second surface, the size of the first heat dissipation substrate is greater than or equal to the size of the second heat dissipation substrate.

[0011] In some embodiments of the present invention, in a direction perpendicular to an arrangement direction of the first surface and the second surface, a size of the first heat dissipation substrate is greater than or equal to a size of the second heat dissipation substrate.

[0012] In some embodiments of the present invention, the first heat dissipation substrate has a first surface and a second surface opposite to each other, the plurality of heat dissipation fins are connected to the first surface, the second surface is provided with a receiving groove, and the second heat dissipation substrate is embedded in the receiving groove.

[0013] In some embodiments of the present invention, in one of the directions perpendicular to the arrangement directions of the first surface and the second surface, the accommodating groove is opened in the middle of the second surface.

[0014] In some embodiments of the present invention, in a direction perpendicular to the arrangement direction of the first surface and the second surface, a size of the second heat dissipation substrate is greater than or equal to one half of a size of the first heat dissipation substrate.

[0015] In some embodiments of the present invention, the first heat dissipation substrate includes an aluminum plate, and the second heat dissipation substrate includes a copper plate.

[0016] In some embodiments of the present invention, the heat sink further includes a thermally conductive connection layer, and the thermally conductive connection layer is connected between the first heat dissipation substrate and the second heat dissipation substrate.

[0017] In some embodiments of the present invention, the thermally conductive connection layer includes a thermally conductive silicone grease layer.

[0018] In a second aspect, the utility model provides a refrigeration device, which includes a refrigeration chip and a heat sink as described in any one of the above technical solutions, wherein the refrigeration chip is thermally connected to the second heat dissipation substrate.

[0019] In a third aspect, the utility model provides an electrical device, which includes the refrigeration device described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limiting of the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0021] Figure 1 A schematic diagram of the structure of a radiator provided according to an embodiment of the utility model is schematically shown;

[0022] Figure 2 The schematic diagram shows a structure of a heat sink and a cooling chip provided according to an embodiment of the utility model;

[0023] Figure 3 The structure diagram of a refrigeration device provided according to an embodiment of the utility model is schematically shown;

[0024] Figure 4 A schematic diagram of the structure of another radiator provided according to an embodiment of the utility model is schematically shown;

[0025] Figure 5 The schematic diagram of the structure of another heat sink and cooling chip provided according to the embodiment of the utility model is schematically shown;

[0026] Figure 6 The structure diagram of a first heat dissipation substrate of another heat sink provided according to an embodiment of the utility model is schematically shown;

[0027] Figure 7 The schematic diagram of the structure of the second first heat dissipation substrate of another heat sink provided according to the embodiment of the utility model is shown;

[0028] Figure 8 The structure diagram of another refrigeration device provided according to the embodiment of the utility model is schematically shown;

[0029] Fig. 9 The figure schematically shows a connection diagram of a first heat-conducting substrate, a heat-conducting connecting layer and a second heat-conducting substrate of a heat sink provided according to an embodiment of the utility model.

[0030] The reference numerals are as follows:

[0031] 100. Refrigeration equipment;

[0032] 10. radiator; 11. first heat dissipation substrate; 111. first surface; 112. second surface; 1121. receiving groove; 12. heat dissipation fins; 13. second heat dissipation substrate; 14. thermal conductive connection layer;

[0033] 20. Refrigeration chip;

[0034] 30. Fan;

[0035] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0036] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0037] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0038] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0039] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0040] The semiconductor refrigeration chip in the semiconductor refrigeration refrigerator uses the Peltier effect to achieve refrigeration. By connecting electricity to form a thermocouple, a temperature difference is generated on both sides, with one side absorbing heat and the other side releasing heat. However, the refrigeration chip generates a lot of heat during operation because it needs to absorb external heat and discharge it to the other side, causing a temperature difference. In order to ensure the stability and efficiency of the entire refrigeration system, the refrigeration chip is usually equipped with a radiator. The radiator helps the refrigeration chip to quickly and effectively dissipate the generated heat to the environment by increasing the heat dissipation surface area and accelerating the heat transfer rate, thereby avoiding heat accumulation that affects the refrigeration effect and improving the efficiency and performance of the refrigeration system.

[0041] The existing fin heat sinks for cooling chips are mostly fin heat sinks. Considering the cost, fin heat sinks are mostly made of aluminum. Although they can achieve a certain heat dissipation effect, the structural design of the cooling chip is usually small and its heat dissipation area is also small. After connecting the fin heat sink, this single aluminum fin heat sink cannot dissipate the heat of the cooling chip faster, and the heat dissipation efficiency and effect need to be improved.

[0042] In view of this, the present embodiment provides a heat sink, which aims to improve the heat dissipation efficiency by improving the structure of the heat sink, making the heat sink with two materials with different thermal conductivity coefficients, and directly connecting the material with higher thermal conductivity coefficient to the cooling chip for thermal conductivity.

[0043] The following is combined with Figure 1-9 The structure of the heat sink of this embodiment is introduced.

[0044] Combined with Figure 1 -Attached Figure 3 As shown in ( Figure 3The arrow in the figure indicates the airflow direction of the fan 30), an embodiment of the present application provides a heat sink 10, which is used for dissipating heat from a cooling chip 20. Specifically, a heat release side (the upper side in the figure) of the cooling chip 20 is connected to the heat sink 10, and a heat absorption side (the lower side in the figure) of the cooling chip 20 absorbs heat and transfers it to the heat release side, and the heat sink 10 is used to dissipate the heat from the heat release side.

[0045] In some examples, optionally, the refrigeration chip 20 in this embodiment can be a semiconductor refrigeration chip 20. The semiconductor refrigeration chip 20 has the advantages of simple structure, small size, fast response speed, no pollution, low energy consumption, etc. Since it has been described before, the principle of the semiconductor refrigeration chip 20 is not described in detail in this embodiment.

[0046] The heat sink 10 of this embodiment is a fin heat sink 10, which includes a first heat dissipation substrate 11 and a plurality of heat dissipation fins 12. The first heat dissipation substrate 11 has a first surface 111 and a second surface 112 relative to each other. The first heat dissipation substrate 11 can be rectangular, elliptical, polygonal, etc., which are not listed one by one in this embodiment.

[0047] The plurality of heat dissipation fins 12 of the present embodiment are connected to the first surface 111 of the first heat dissipation substrate 11. The plurality of heat dissipation fins 12 may be arranged at intervals along the length direction or the width direction of the first heat dissipation substrate 11. In some examples, the plurality of heat dissipation fins 12 may be arranged at even intervals, that is, the interval between two adjacent heat dissipation fins 12 is constant. When the fin intervals are equal, the heat transfer between the fins is more uniform, thus avoiding the occurrence of local hot spots and improving the overall heat dissipation efficiency.

[0048] The heat dissipation fins 12 of this embodiment may be plate-shaped members, and their shapes may be rectangular, triangular, polygonal, etc., which are not listed one by one in this embodiment.

[0049] There are many ways to connect the heat dissipation fins 12 and the first heat dissipation substrate 11 in this embodiment. For example, the heat dissipation fins 12 and the first heat dissipation substrate 11 can be integrally formed by mold injection during processing, or the heat dissipation fins 12 and the first heat dissipation substrate 11 are fixedly connected by welding or bonding. This embodiment does not list them one by one.

[0050] The material of the first heat dissipation substrate 11 and the material of the heat dissipation fins 12 of this embodiment can be the same, for example, both are made of aluminum or aluminum alloy and other materials. Aluminum has certain heat dissipation properties and is relatively low in cost. The thermal conductivity coefficient of aluminum is approximately 237W / (m·K), and the thermal conductivity coefficient indicates the ability of heat per unit area per unit thickness to pass through the material per unit time. The thermal conductivity coefficient is usually defined by unit thermal power and unit temperature gradient, and the unit is watt per meter Kelvin (W / (m·K)). The larger the thermal conductivity coefficient, the better the material's ability to conduct heat, that is, the faster the heat passes through the material.

[0051] In order to improve the heat dissipation efficiency of the radiator 10, the radiator 10 of this embodiment is further configured with a second heat dissipation substrate 13 in addition to the above-mentioned first heat dissipation substrate 11 and heat dissipation fins 12. The second heat dissipation substrate 13 is connected to the first heat dissipation substrate 11, and the second heat dissipation substrate 13 is located on the side of the first heat dissipation substrate 11 away from the multiple heat dissipation fins 12.

[0052] The thermal conductivity of the second heat dissipation substrate 13 of the present embodiment is greater than the thermal conductivity of the first heat dissipation substrate 11. For example, when the material of the first heat dissipation substrate 11 of the present embodiment is aluminum, the material of the second heat dissipation substrate 13 of the present embodiment may be copper, and the thermal conductivity of copper is about 401W / (m·K). Of course, the material selection of the second heat dissipation substrate 13 of the present embodiment is not limited thereto. For example, the material of the second heat dissipation substrate 13 may also be silver. However, considering the production cost, the material of the second heat dissipation substrate 13 of the present embodiment is preferably copper.

[0053] The heat sink 10 provided in this embodiment is provided with a second heat sink 13 on the basis of a first heat sink 11 of a single material. The thermal conductivity coefficient of the second heat sink 13 is greater than the thermal conductivity coefficient of the first heat sink 11. The second heat sink 13 is thermally connected to the refrigeration chip 20 to be dissipated, so that the heat of the refrigeration chip 20 can be transferred to the second heat sink 13 more quickly, and then transferred to the first heat sink 11 and the heat dissipation fins 12 by the second heat sink 13, which has better heat dissipation efficiency and can improve the stability and service life of the refrigeration chip 20 to a certain extent.

[0054] The “thermal conductive connection” between two components in this embodiment means that the two components are mechanically connected and heat transfer can be performed.

[0055] In some examples, optionally, the first heat dissipation substrate 11 of this embodiment has a first surface 111 and a second surface 112 opposite to each other, the plurality of heat dissipation fins 12 of this embodiment are located on the first surface 111 , and the second heat dissipation substrate 13 of this embodiment is stacked and connected to the second surface 112 .

[0056] In this embodiment, the second heat dissipation substrate 13 and the first heat dissipation substrate 11 can be connected by fixed connection such as welding and bonding, or holes can be punched in the first heat dissipation substrate 11 and the second heat dissipation substrate 13 (this embodiment is not shown in the figure) and the two can be connected by bolts.

[0057] Taking into account that the greater the thermal conductivity coefficient, the higher the material cost, the thickness of the stacked first heat dissipation substrate 11 and the second heat dissipation substrate 13 can be made roughly equal to the thickness of a single heat dissipation substrate in the related art. For example, the thickness of the first heat dissipation substrate 11 and the second heat dissipation substrate 13 of the present embodiment is designed to be 1-10mm, and further, can be 2-5mm, to ensure that the thickness of the two after stacking is not greater than the thickness of a single heat dissipation substrate in the related art, thereby ensuring the spatiality of the radiator 10 and reducing costs.

[0058] It should be noted that, in this embodiment, the thickness of the first heat dissipation substrate 11 is the size of the first heat dissipation substrate 11 along the arrangement direction of the first surface 111 and the second surface 112 (the first direction X in the figure), and the thickness of the second heat dissipation substrate 13 is the size of the second heat dissipation substrate 13 along the arrangement direction of the first surface 111 and the second surface 112.

[0059] In some examples, optionally, along the arrangement direction of the first surface 111 and the second surface 112 (the first direction X in the figure), the size of the first heat dissipation substrate 11 of this embodiment is greater than or equal to the size of the second heat dissipation substrate 13, that is, the thickness of the first heat dissipation substrate 11 is greater than the thickness of the second heat dissipation substrate 13, for example, when the first heat dissipation substrate 11 is 5 mm, the second heat dissipation substrate 13 is 4 mm, when the first heat dissipation substrate 11 is 4 mm, the third heat dissipation substrate is 3 mm, etc. The purpose of this design is to save consumables of the second heat dissipation substrate 13, so as to further save costs.

[0060] In some examples, optionally, in a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112 , the size of the first heat dissipation substrate 11 of this embodiment is greater than or equal to the size of the second heat dissipation substrate 13 of this embodiment.

[0061] In a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112, the size of the first heat dissipation substrate 11 of this embodiment is the width or length. Therefore, the above technical solution should be understood as the length of the first heat dissipation substrate 11 is greater than or equal to the length of the second heat dissipation substrate 13, and the width of the second heat dissipation substrate 13 may also be greater than or equal to the width of the second heat dissipation substrate 13. When the length or width of the first heat dissipation substrate 11 is greater than the length or width of the second heat dissipation substrate 13, the size of the second heat dissipation substrate 13 is smaller, which can further save consumables of the second heat dissipation substrate 13 and achieve the purpose of cost saving.

[0062] Combined with Figure 4 -Attached Figure 6 As shown in the figure, in some examples, optionally, the second surface 112 of the present embodiment is provided with a receiving groove 1121, and the second heat dissipation substrate 13 of the present embodiment is embedded in the receiving groove 1121, and the upper surface of the second heat dissipation substrate 13 in the figure is in contact with the bottom wall of the receiving groove 1121, and the lower surface of the second heat dissipation substrate 13 is used to connect the cooling chip 20.

[0063] The connection between the second heat dissipation substrate 13 and the receiving groove 1121 of this embodiment can be any one of bonding, welding, bolt connection, interference connection, etc., which are not listed one by one in this embodiment.

[0064] The size of the receiving groove 1121 of this embodiment can match the size of the second heat dissipation substrate 13, so that after the second heat dissipation substrate 13 is placed inside the receiving groove 1121, the lower surface of the second heat dissipation substrate 13 and the second surface 112 opened behind the receiving groove 1121 form a plane, and the side walls of the second heat dissipation substrate 13 in a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112 can fit tightly with the side walls of the receiving groove 1121 to facilitate heat transfer between the second heat dissipation substrate 13 and the first heat dissipation substrate 11.

[0065] In some examples, optionally, in a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112 (the second direction Y in the figure), the accommodating groove 1121 is opened in the middle of the second surface 112, so that the second heat dissipation substrate 13 of this embodiment can be located in the middle position of the first heat dissipation substrate 11. Compared with the second heat dissipation substrate 13 being located on both sides of the first heat dissipation substrate 11, the second heat dissipation substrate 13 located in the middle can evenly transfer heat from the middle of the first heat dissipation substrate 11 to both sides, thereby allowing the first heat dissipation substrate 11 to quickly dissipate heat through multiple heat dissipation fins 12, which can improve the heat dissipation efficiency to a certain extent.

[0066] In some examples, optionally, in a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112, the size of the second heat dissipation substrate 13 is greater than or equal to half the size of the first heat dissipation substrate 11, and there are two directions perpendicular to the arrangement direction of the first surface 111 and the second surface 112, taking the second heat dissipation substrate 13 as a rectangle as an example, one of them is the width direction of the second heat dissipation substrate 13, and the other is the length direction, that is, the width of the second heat dissipation plate in this embodiment is greater than or equal to half the size of the heat dissipation substrate, thereby avoiding the inability to improve the heat dissipation efficiency of the radiator 10 due to the small size of the second heat dissipation plate.

[0067] Of course, the structural form of the second heat dissipation substrate 13 of this embodiment and the connection method with the first heat dissipation substrate 11 are not limited to this. For example, the shape of the second heat dissipation substrate 13 can also be E-shaped, I-shaped or other shapes. For another example, the connection between the second heat dissipation substrate 13 and the first heat dissipation substrate 11 can be formed as an integrally molded connection during processing.

[0068] like Figure 7 As shown in , in some examples, optionally, the receiving groove 1121 of this embodiment is a closed groove body along the arrangement direction perpendicular to the first surface 111 and the second surface 112. After the second heat dissipation substrate 13 is installed, the receiving groove 1121 with such a structure can improve the stability of the second heat dissipation substrate 13 after installation, and prevent the second heat dissipation substrate 13 from moving in the receiving groove 1121 along the direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112, which is the second direction Y or the third direction Z in the figure.

[0069] like Figure 8 As shown in FIG. 1 , in some examples, optionally, in a direction perpendicular to the arrangement direction of the first surface 111 and the second surface 112 (the third direction Z in the figure), the receiving groove 1121 of this embodiment can also be as follows: Figure 7 In the structure with both ends open as shown in the figure, the receiving groove 1121 is closed in another direction (the second direction Y in the figure) perpendicular to the arrangement direction of the first surface 111 and the second surface 112. This structure can facilitate the installation of the second heat dissipation substrate 13 from the opening into the receiving groove 1121. Of course, the receiving groove 1121 can also be open at both ends along the second direction Y in the figure, and closed at both ends along the third direction Z (this embodiment is not shown in the figure).

[0070] Combined with Fig. 9 As shown, in some examples, optionally, the heat sink of this embodiment also includes a thermally conductive connection layer 14 arranged between the first heat dissipation substrate 11 and the second heat dissipation substrate 13, and the thermally conductive connection layer 14 is thermally connected to the first heat dissipation substrate 11 and the second heat dissipation substrate 13 respectively to improve the heat transfer efficiency between the two.

[0071] The heat-conducting connection layer 14 of this embodiment should have good heat-conducting performance, so its thermal conductivity can be greater than the second heat dissipation substrate 13. In some examples, the heat-conducting connection layer 14 of this embodiment includes a thermal grease layer. Of course, other good thermal conductive materials, such as thermal conductive paste, thermal conductive film, etc., can also be used as the heat-conducting connection layer 14 of this embodiment.

[0072] Combined with Figure 3 and attached Figure 6As shown, based on the above two types of refrigeration chips 20, this embodiment also provides two refrigeration devices 100, which include a refrigeration chip 20, a fan 30 and a radiator 10, the refrigeration chip 20 is connected to the second heat dissipation substrate 13, the fan 30 is located on the side of the radiator 10 away from the refrigeration chip 20, and the fan 30 is spaced apart from the heat dissipation fins 12, and the airflow through the fan 30 can drive the heat dissipation of the heat dissipation fins 12 to be faster.

[0073] When this embodiment adopts Figure 1 and Figure 2 When the heat sink 10 is used, the refrigeration device 100 provided in this embodiment is as follows Figure 3 As shown in the figure, the heat sink 10 has a first heat dissipation substrate 11 and a second heat dissipation substrate 13 which are stacked together. The first surface 111 of the first heat dissipation substrate 11 is provided with a plurality of heat dissipation fins 12. The second surface 112 of the first heat dissipation substrate 11 is fixedly connected to the second heat dissipation substrate 13 by bonding, welding or the like. The lower surface of the second heat dissipation substrate 13 is connected to the cooling chip 20.

[0074] When this embodiment adopts Figure 4 and Figure 5 When the heat sink 10 is used, the refrigeration device 100 provided in this embodiment is as follows Figure 6 As shown in the figure, it includes a fan 30, a heat sink 10 and a cooling chip 20. The heat sink 10 has a second heat dissipation substrate 13 with a receiving groove 1121 embedded in the second surface 112 of the first heat dissipation substrate 11. The first surface 111 of the first heat dissipation substrate 11 is provided with a plurality of heat dissipation fins 12. The receiving groove 1121 of the first heat dissipation substrate 11 is fixedly connected to the second heat dissipation substrate 13 by bonding, welding, etc., and the lower surface of the second heat dissipation substrate 13 is connected to the cooling chip 20.

[0075] On the third aspect, the utility model provides an electrical device, which includes any one of the refrigeration devices 100 of the above two technical solutions. The electrical device can be a household refrigerator, an aerospace refrigerator, a car refrigerator, a freezer and other equipment. For the structure of other parts of the above equipment, please refer to the prior art, and this application will not go into details here.

[0076] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A heat sink for cooling a refrigeration chip, characterized in that: include: a first heat dissipation substrate; A plurality of heat dissipation fins connected to one side of the first heat dissipation substrate; as well as The second heat dissipation substrate is connected to a side of the first heat dissipation substrate away from the plurality of heat dissipation fins and is used for heat conduction connection to the refrigeration chip. The heat conductivity coefficient of the second heat dissipation substrate is greater than the heat conductivity coefficient of the first heat dissipation substrate.

2. The heat sink according to claim 1, characterized in that: The first heat dissipation substrate has a first surface and a second surface that are opposite to each other. The plurality of heat dissipation fins are located on the first surface, and the second heat dissipation substrate is laminated and connected to the second surface.

3. The heat sink according to claim 2, characterized in that: In a direction perpendicular to an arrangement direction of the first surface and the second surface, a size of the first heat dissipation substrate is greater than or equal to a size of the second heat dissipation substrate.

4. The heat sink according to claim 1, characterized in that: The first heat dissipation substrate has a first surface and a second surface that are opposite to each other. The plurality of heat dissipation fins are connected to the first surface. The second surface is provided with a receiving groove. The second heat dissipation substrate is embedded in the receiving groove.

5. The heat sink according to claim 4, characterized in that: The receiving groove is disposed in the middle of the second surface.

6. The heat sink according to claim 4, characterized in that: In a direction perpendicular to an arrangement direction of the first surface and the second surface, a size of the second heat dissipation substrate is greater than or equal to one half of a size of the first heat dissipation substrate.

7. The radiator according to any one of claims 1 to 6, characterized in that: The first heat dissipation substrate includes an aluminum plate, and the second heat dissipation substrate includes a copper plate.

8. The radiator according to any one of claims 1 to 6, characterized in that: The heat sink further includes a heat conductive connection layer connected between the first heat dissipation substrate and the second heat dissipation substrate.

9. A refrigeration device, characterized in that: It comprises a refrigeration chip and the heat sink according to any one of claims 1 to 8, wherein the refrigeration chip is thermally connected to the second heat dissipation substrate.

10. An electrical device, characterized in that: Comprising the refrigeration device as claimed in claim 9.

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