Test equipment and systems

Abstract

The present disclosure relates to a testing device and system, including: a connecting plate having a conductive part, the conductive part being used to electrically connect to one end face of a sample to be tested; a base, the base and the connecting plate being a testing area, the base being provided with an electrical connection part, the electrical connection part being provided corresponding to the conductive part; and a testing fixture, including a first contact surface and a second contact surface, the first contact surface and the second contact surface being electrically connected, the first contact surface being used to electrically connect to the other end face of the corresponding sample to be tested, and the second contact surface being electrically connected correspondingly to the electrical connection part. Through the testing device of the present disclosure, a testing area for testing connection auxiliary materials can be formed, the testing area can accommodate connection auxiliary materials, so that the testing device can simulate the application scenarios of connection auxiliary materials in electronic devices, and facilitate the evaluation of the electrical connection performance of the connection auxiliary materials in advance.

Description

Technical Field

[0001] The present disclosure relates to the field of wireless communications, and in particular to a testing device and system. Background Art

[0002] With the rapid development of wireless communication technology, stability and high fidelity in the communication process have become important criteria. In existing wireless communication devices, electrical connection foam or electrical connection springs are generally configured to achieve electrical connection. The inventors found that the nonlinear characteristics of the connection materials in the communication path will directly affect the communication effect.

[0003] However, in the prior art, on the one hand, the influence of connection auxiliary materials on communication effect is not realized; on the other hand, since connection auxiliary materials such as connection foam or connection spring are of many types and in various shapes, there is no device or system for testing the performance of various connection auxiliary materials. Utility Model Content

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a testing device and a system.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a testing device, comprising: a connecting plate, having a conductive portion, the conductive portion being used to be electrically connected to one end face of a sample to be tested; a base, wherein a testing area is provided between the base and the connecting plate, the base being provided with an electrical connection portion, the electrical connection portion being provided corresponding to the conductive portion; and a testing fixture, comprising a first contact surface and a second contact surface, the first contact surface and the second contact surface being electrically connected, the first contact surface being used to be electrically connected to the other end face of the sample to be tested, and the second contact surface being electrically connected correspondingly to the electrical connection portion.

[0006] In some embodiments, the connecting board has a plurality of the conductive parts; the test area includes a plurality of test positions, and the plurality of the test positions correspond one-to-one to the plurality of the conductive parts; there are a plurality of test fixtures, and a test fixture is disposed in each of the test positions.

[0007] In some embodiments, the conductive portion is provided with a first wiring and a second wiring, the first wiring is used to connect to a test signal source, and the second wiring is used to connect to an analysis device.

[0008] In some embodiments, the base has an external terminal, the external terminal is electrically connected to the power connection portion of the base, and the base is connected to a reference voltage signal through the external terminal.

[0009] In some embodiments, it further includes: a fastening assembly connected between the base and the connecting plate, and the fastening assembly is used to press the sample to be tested in the test area.

[0010] In some embodiments, the first contact surface of each of the test fixtures has the same shape as the other end surface of the corresponding sample to be tested.

[0011] In some embodiments, a test spacing is provided between the first contact surface of each of the test fixtures and the corresponding conductive portion, and the test spacing corresponds to a test height of the sample to be tested.

[0012] In some embodiments, the same sample to be tested has multiple test heights, and correspondingly, multiple test fixtures with different test spacings are configured.

[0013] In some embodiments, the first contact surface is provided with a conductive layer; and / or the second contact surface is provided with a conductive layer.

[0014] In some embodiments, the test fixture is made of a conductive material; and / or the base is made of a conductive material.

[0015] According to a second aspect of the present disclosure, a test system is also provided, comprising: a test device as described in any one of the above embodiments; a test signal source, electrically connected to the test fixture through a first connection of the test fixture; and a test analyzer, electrically connected to the test fixture through a second connection of the test fixture.

[0016] In some embodiments, the test signal source is a reflective passive intermodulation tester; and the test analyzer is a PIM analyzer.

[0017] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0018] A test device consisting of a connecting plate, a base and a test fixture can form a test area for testing connection auxiliary materials. The conductive part is electrically connected to one end face of the sample to be tested, the first contact surface of the test fixture is electrically connected to the other end face of the sample to be tested, and the second contact surface is electrically connected to the base. The first contact surface and the second contact surface are electrically connected, so that the test device can simulate the application scenarios of connection auxiliary materials in electronic devices, which is convenient for evaluating the electrical connection performance of the connection auxiliary materials in advance.

[0019] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0021] Figure 1 is a front view of a testing device according to an exemplary embodiment.

[0022] Figure 2 is a top view of a connecting plate according to an exemplary embodiment.

[0023] Figure 3 The figure is a front view of a testing device with multiple testing positions according to an exemplary embodiment.

[0024] Figure 4 FIG. 4 is a top view of a testing device having multiple conductive parts according to an exemplary embodiment.

[0025] Figure 5 is a front view of a testing device with external terminals according to another exemplary embodiment.

[0026] Figure 6 is a side view of a testing system according to an exemplary embodiment.

[0027] Figure 7 It is a schematic diagram of test results showing a sample to be tested being a titanium alloy and a gold-plated material according to an exemplary embodiment.

[0028] Figure 8 It is a schematic diagram of test results showing a sample to be tested being a titanium alloy material without gold plating according to an exemplary embodiment.

[0029] Fig. 9 It is a schematic diagram of test results of an omni-directional foam material with a size of 2.5*10mm for a sample to be tested according to an exemplary embodiment.

[0030] Fig.10 It is a schematic diagram of test results of an omnidirectional foam material with a size of 2.5*10mm for a sample to be tested according to another exemplary embodiment.

[0031] Reference numerals:

[0032] 1. Test device;

[0033] 2. connecting plate; 21. conducting part; 211. first connecting part; 212. second connecting part;

[0034] 3. Base; 31. Test area; 311. Test position; 32. Power connection; 33. External terminal;

[0035] 4. Test fixture; 41. First contact surface; 42. Second contact surface; 43. Test spacing;

[0036] 5. Samples to be tested;

[0037] 6. Fasten components;

[0038] 100. test system; 101. test signal source; 102. test analyzer; DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0040] In related technologies, the design of connecting accessories for wireless communication devices (such as mobile phones, etc.) is the key to ensure that the mobile phone can normally realize the wireless transmission and reception functions and effectively suppress external or internal electromagnetic interference. Common grounding design methods include shrapnel, wrapped foam or omnidirectional foam, etc., which ensures its reliability and stability by grounding metal parts to the reference ground plane of the mobile phone.

[0041] However, improper grounding design can cause high-power antenna transmission signals to generate passive nonlinear effects in the grounded metal, causing harmonics to fall into the receiving band, thus affecting the reception quality of the entire wireless system. More seriously, this may cause the mobile phone to lose the effectiveness of the electromagnetic compatibility EMC certification test item RSE (Radiation spurious emission). In addition, the existing grounding design of communication equipment may have problems with passive nonlinear current and voltage characteristics and inherent nonlinear conductor characteristics, such as contact nonlinearity and material nonlinearity. In addition, there may be nonlinear effects caused by stains or wear on the metal surface, which may have a negative impact on the reception performance of the mobile phone. Therefore, it is necessary to test the grounding design of communication equipment to ensure the quality of the wireless communication system.

[0042] In order to solve the above technical problem, a testing device 1 is provided according to an embodiment of the present disclosure.

[0043] Figure 1 is a front view of a testing device according to an exemplary embodiment. Figure 2 is a top view of a connecting plate according to an exemplary embodiment.

[0044] In some embodiments, Figure 1 As shown, the testing device 1 mainly includes a connecting plate 2 , a base 3 and a testing fixture 4 .

[0045] like Figure 2 As shown, the connecting plate 2 has a conductive portion 21, and the conductive portion 21 is used to electrically connect to one end surface of the sample 5 to be tested. Figure 1-2As shown, the test area 31 is between the base 3 and the connecting plate 2. The base 3 is provided with an electrical connection portion 32, and the electrical connection portion 32 is provided corresponding to the conductive portion 21. The test fixture 4 includes a first contact surface 41 and a second contact surface 42, and the first contact surface 41 and the second contact surface 42 are electrically connected. The first contact surface 41 is used to electrically connect to the other end surface of the corresponding sample 5 to be tested, and the second contact surface 42 is electrically connected to the electrical connection portion 32.

[0046] The test device 1 composed of the connecting plate 2, the base 3 and the test fixture 4 can form a test area 31 for testing the connection auxiliary materials. The conductive part 21 is electrically connected to one end surface of the sample 5 to be tested, the first contact surface 41 of the test fixture 4 is electrically connected to the other end surface of the sample 5 to be tested, and the second contact surface 42 is electrically connected to the base 3. The first contact surface 41 and the second contact surface 42 form an electrical connection, so that the test device 1 can simulate the application scenario of the connection auxiliary materials in the electronic device, which is convenient for evaluating the electrical connection performance of the connection auxiliary materials in advance.

[0047] It is worth noting that, in some embodiments, test fixtures 4 of different heights may be placed in the test area 31 to obtain different test intervals 43 to simulate application scenarios of test samples 5 of different heights.

[0048] However, the present disclosure is not limited to this. In other embodiments, a test fixture 4 made of different materials can be placed in the test area 31, and the first contact surface 41 of the test fixture 4 made of different materials is electrically connected to the sample to be tested 5 to simulate the application scenario of the sample to be tested 5 in contact with the first contact surface 41 of different materials.

[0049] The conductive part 21 can be made of copper plated with gold, carbon ink printed, or conductive paint to achieve conductivity, but the present disclosure does not specifically limit the specific type of the conductive part 21, that is, those skilled in the art can adjust its type according to actual conditions, for example, taking the conductive part 21 as a copper plated with gold as an example. As long as the conductive part 21 can be electrically connected to other conductive materials, it can be used.

[0050] The sample 5 to be tested may be a connection auxiliary material type such as a spring sheet, a gold-plated wrapped foam, or an omni-directional foam, but the present disclosure does not specifically limit the specific type of the sample 5 to be tested, that is, those skilled in the art may adjust its type according to actual conditions, for example, taking the sample 5 to be tested as a spring sheet as an example. Any connection auxiliary material that can be applied to wireless communication equipment can be used as the sample 5 to be tested.

[0051] The power connection part 32 of the base 3 can also be connected to electricity by gold-plated copper sheet, carbon ink printing or conductive paint, but the present disclosure does not specifically limit the specific type of the power connection part 32, that is, those skilled in the art can adjust its type according to actual conditions, for example, taking the power connection part 32 as a gold-plated copper sheet as an example. As long as the base 3 can be electrically connected to the test fixture 4 through the power connection part 32, it can be used.

[0052] In the related art, different connection auxiliary materials in electronic devices or the same connection auxiliary materials used on different contact surfaces will have different effects on the passive intermodulation performance. Therefore, in the above cases, it is not easy to test the passive intermodulation performance of the connection auxiliary materials. It can be understood that the connection auxiliary materials are the sample 5 to be tested.

[0053] In some embodiments, the first contact surface 41 and the second contact surface 42 of the test fixture 4 are electrically connected. The first contact surface 41 is used to electrically connect to the other end of the corresponding sample 5 to be tested, and the second contact surface 42 is electrically connected to the power connection portion 32 .

[0054] That is, in an exemplary case, the first contact surface 41 and the second contact surface 42 of the test fixture 4 are conductive materials. The first contact surface 41 can be realized by materials such as gold-plated copper sheet, carbon ink printing or conductive paint, and the second contact surface 42 can also be realized by materials such as gold-plated copper sheet, carbon ink printing or conductive paint, and there is a wire or conductive material between the first contact surface 41 and the second contact surface 42 to realize electrical connection.

[0055] It is worth noting that the material of the first contact surface 41 can be selected according to the actual application scenario in the electronic device. The present disclosure does not specifically limit the material of the first contact surface 41. Because the passive intermodulation performance of the same sample 5 to be tested under different first contact surfaces 41 may also be different, therefore, those skilled in the art can adjust the material of the first contact surface 41 according to actual conditions.

[0056] In this embodiment, different materials can be used for the first contact surface 41, so that the testing device 1 can provide test scenarios for the passive intermodulation performance generated by different connection auxiliary materials or the same connection auxiliary materials on different contact surfaces, which is convenient for evaluating the passive intermodulation performance of different connection auxiliary materials in electronic equipment in advance.

[0057] In some embodiments, the test fixture 4 may be made of a conductive material, and / or the base 3 may be made of a conductive material, so as to form a complete electrical connection loop. The integrated conductive material generally has a lower cost and is easy to manufacture.

[0058] Among them, the test fixture 4 and / or the base 3 can be a conductive material such as metal, semiconductor, conductive ceramic, carbon material or plasma, but the present disclosure does not specifically limit the specific type of the test fixture 4 and / or the base 3, that is, technical personnel in this field can adjust their types according to actual conditions. For example, taking the test fixture 4 and / or the base 3 as metal as an example, as long as the test fixture 4 and / or the base 3 have conductive properties, it can be used.

[0059] In some embodiments, the first contact surface 41 is used to electrically connect to one end of the sample to be tested 5, and the second contact surface 42 is electrically connected to the power connection portion 32, so that the test device 1 can test and analyze the electrical performance and electrical characteristics of the sample to be tested 5, that is, the test device 1 can measure and analyze the passive intermodulation performance of the sample to be tested 5, thereby evaluating the performance of the sample to be tested 5.

[0060] In the above embodiment, the conductive part 21 is electrically connected to one end face of the sample to be tested 5, the first contact surface 41 of the test fixture 4 is electrically connected to the other end face of the sample to be tested 5, the second contact surface 42 is electrically connected to the base 3, and the first contact surface 41 and the second contact surface 42 form an electrical connection, so that the test device 1 can simulate the application scenario of the connection auxiliary materials in the electronic device, which is convenient for evaluating the passive intermodulation performance of the connection auxiliary materials in advance.

[0061] In the related art, different connection auxiliary materials in electronic devices or the application of the same connection auxiliary materials on different contact surfaces will have different effects on the passive intermodulation performance. Therefore, in the above cases, it is not easy to test the passive intermodulation performance of the connection auxiliary materials. It can be understood that the connection auxiliary materials are the sample 5 to be tested, and the sample 5 to be tested is the connection auxiliary materials.

[0062] Figure 3 The figure is a front view of a testing device with multiple testing positions according to an exemplary embodiment. Figure 4 FIG. 4 is a top view of a testing device having multiple conductive parts according to an exemplary embodiment.

[0063] In some embodiments, Figure 3 As shown in FIG. 4 , the connecting plate 2 may have a plurality of conductive portions 21. Figure 3 As shown, the test area 31 includes a plurality of test positions 311, and the plurality of test positions 311 correspond to the plurality of conductive parts 21 one by one. There are a plurality of test fixtures 4, and a test fixture 4 is disposed in each test position 311. Thus, a plurality of samples 5 to be tested can be fixed at one time for testing, thereby improving the test efficiency. Moreover, it can be ensured that the samples 5 to be tested are tested under the same environmental conditions to ensure the effectiveness of the test results.

[0064] In some embodiments, multiple test positions 311 can provide test scenarios for multiple different samples 5 to be tested at the same time, so that the test device 1 can simulate application scenarios of multiple different samples 5 to be tested at the same time.

[0065] However, the present disclosure is not limited to this. In other embodiments, multiple test positions 311 can also provide different types of first contact surfaces 41 for a sample to be tested 5 at the same time, so as to provide a test scenario for a sample to be tested 5 on different first contact surfaces 41 at the same time, so that the test device 1 can simulate the application scenarios of the sample to be tested 5 on different first contact surfaces 41 at the same time.

[0066] In the above embodiment, multiple test positions 311 are formed between multiple test fixtures 4 and multiple conductive parts 21. Multiple test positions 311 can realize simultaneous detection of different test samples 5 or the application of the same test sample 5 on different contact surfaces, which can provide a relatively complete evaluation method for the application of connecting auxiliary materials in electronic devices.

[0067] In the related art, when the connection auxiliary materials in electronic devices have different shapes, they will have different effects on the passive intermodulation performance. It can be understood that the connection auxiliary materials are the sample 5 to be tested.

[0068] In some embodiments, the first contact surface 41 of each test fixture 4 can have the same shape as the other end surface of the corresponding sample to be tested 5. The first contact surface 41 has the same shape as the other end surface of the corresponding sample to be tested 5, which can fully simulate the effect of the same connection auxiliary material on the passive intermodulation performance when the contact area is different, so that the test device 1 provides a relatively complete risk assessment method for the grounding in the electronic device.

[0069] Among them, the shape of the sample to be tested 5 can be a square, rectangle, triangle or rhombus, etc. Correspondingly, the shape of the first contact surface 41 can also be a square, rectangle, triangle or rhombus, etc., but the present disclosure does not specifically limit the specific shape of the sample to be tested 5 and / or the first contact surface 41, that is, technical personnel in this field can adjust their types according to actual conditions, as long as the shape of the first contact surface 41 is the same as the shape of the sample to be tested 5.

[0070] Among them, the contact area between the sample to be tested 5 and the first contact surface 41 can be 2.5*10mm or 3*10mm, etc., and correspondingly, the area of ​​the first contact surface 41 can also be 2.5*10mm or 3*10mm, etc., but the present disclosure does not specifically limit the specific shape of the sample to be tested 5 and / or the first contact surface 41, that is, technical personnel in this field can adjust their types according to actual conditions, and the area size of the first contact surface 41 can be determined according to the area size of the actual connecting auxiliary material used.

[0071] In the related art, different connection auxiliary materials in electronic devices or the same connection auxiliary materials used at different working heights will have different effects on passive intermodulation performance. Therefore, in the above cases, it is not easy to test the passive intermodulation performance of the connection auxiliary materials. It can be understood that the connection auxiliary materials are the sample 5 to be tested.

[0072] In some embodiments, Figure 3 As shown, there may be a test spacing 43 between the first contact surface 41 of each test fixture 4 and the corresponding conductive portion 21, and the test spacing 43 may correspond to the test height of the sample 5 to be tested. The test spacing 43 is adjusted according to the test height of the sample 5 to ensure that the test device 1 can correctly contact the sample 5 to be tested.

[0073] In some embodiments, Figure 3 As shown, the same sample to be tested 5 can have multiple test heights, and correspondingly, a test fixture 4 with multiple different test spacings 43 is configured. Different test spacings 43 can provide test scenarios for the passive intermodulation performance generated by the sample to be tested 5 at different working heights, so that the test device 1 can facilitate the evaluation of the passive intermodulation performance of the connection auxiliary materials in the electronic device at different working heights in advance.

[0074] The heights of the multiple samples 5 to be tested are different, and correspondingly, the multiple test intervals 43 are also different.

[0075] In some embodiments, Figure 3 As shown, the test fixture 4 can have six test intervals 43, and each test interval 43 corresponds one-to-one to the height of each sample 5 to be tested, so that the test device 1 can simultaneously test the passive intermodulation performance of two different samples 5 to be tested under conditions such as a typical working height, an upper limit working height, or a lower limit working height.

[0076] It is worth noting that the present disclosure does not specifically limit the number of test fixtures 4, nor the number of samples to be tested 5, nor the size of the test spacing 43. The above is only an exemplary case, that is, technical personnel in this field can adjust the number according to the actual test needs.

[0077] Figure 5 is a front view of a testing device with external terminals according to another exemplary embodiment.

[0078] In some embodiments, Figure 5As shown, the base 3 may have an external terminal 33, the external terminal 33 is electrically connected to the power connection portion 32 of the base 3, and the base 3 is connected to the reference voltage signal through the external terminal 33. By providing the external terminal 33, the use of the conductive material of the base 3 can be reduced to a minimum, and an electrical connection is formed between the external terminal 33 and the power connection portion 32, thereby achieving the effect of reducing the manufacturing cost.

[0079] In the related art, different connection auxiliary materials in electronic equipment or the same connection auxiliary materials may have different effects on passive intermodulation performance due to different continuous pressure exposure time.

[0080] In some embodiments, Figure 1 As shown in 3 or 4 or 5 or 6, the test device 1 may further include a fastening assembly 6, which is connected between the base 3 and the connecting plate 2, and the sample 5 to be tested in the test area 31 is pressed by the fastening assembly 6. The test device 1 can press the sample 5 to be tested in the test area 31 by the fastening assembly 6, and can simulate the passive intermodulation performance of the connecting auxiliary materials in the electronic device after long-term crimping. The test device 1 is convenient for evaluating the passive intermodulation performance of the connecting auxiliary materials in the electronic device under different continuous pressure time in advance.

[0081] In some embodiments, a conductive layer may be provided on the first contact surface 41 of the test fixture 4, and / or a conductive layer may be provided on the second contact surface 42 of the test fixture 4. The conductive layer may help current to be transmitted better, ensuring that the test signal is more accurate.

[0082] In some embodiments, Figure 2 As shown in FIG. 4 , the conductive portion 21 may be provided with a first wiring 211 and a second wiring 212, wherein the first wiring 211 is used to connect to a test signal source, and the second wiring 212 is used to connect to an analysis device. The first wiring 211 may be connected to a test signal source, thereby transmitting a test signal through the test device 1, and the second wiring 212 may be connected to an analysis device to achieve reading and analysis of test results.

[0083] Figure 6 is a side view of a testing system according to an exemplary embodiment.

[0084] Based on the same concept, Figure 6 As shown, the embodiment of the present disclosure further provides a test system 100. The test system 100 may include a test device 1, a test signal source 101 and a test analyzer 102.

[0085] like Figure 6 As shown, the test signal source 101 is electrically connected to the test fixture 4 via a first connection 211 of the test fixture 4 , and the test analyzer 102 is electrically connected to the test fixture 4 via a second connection 212 of the test fixture 4 .

[0086] In some embodiments, the test signal source 101 may be a reflective passive intermodulation tester, and the test analyzer 102 may be a PIM analyzer.

[0087] It is worth noting that, with the help of a reflective passive intermodulation tester, the present disclosure measures the passive intermodulation performance of different connection auxiliary materials at different contact surfaces and different compression amounts through a test device 1, providing meaningful guidance for the grounding design of electronic devices (such as mobile phones, tablet computers, etc.). Figure 6 As shown, the reflective passive intermodulation instrument of the test system 100 is connected to one end of the test device 1 through the first connection 211 on the connecting board 2, and the other end of the test device 1 is connected to the PIM analyzer to reduce the reflected signal and minimize the unintentional intermodulation generated by the system's own connection.

[0088] In some embodiments, the working principle of the test system 100 of the present disclosure is as follows:

[0089] like Figure 6 As shown, the D1 path is a high-power RF transmission input signal, and most of the power of the D1 path goes through the D4 path with the lowest impedance, that is, from the connecting board 2 through the first connection 211 to the sample 5 to be tested to the ground plane connected to the test fixture 4, and the remaining small part of the power of the D1 path flows to the PIM analyzer through the D2 path. The energy of the intermodulation product generated by the first contact surface 41 of the sample 5 to be tested and the test fixture 4 is reflected to the interface of the reflective passive intermodulation tester through the D3 path, and reaches the receiver measurement module through the receiving frequency band filter. The measured value of the receiver measurement module can reflect the intermodulation product generated by the first contact surface 41 of the sample 5 to be tested and the test fixture 4.

[0090] Figure 7 It is a schematic diagram of test results showing a sample to be tested being a titanium alloy and a gold-plated material according to an exemplary embodiment. Figure 8 It is a schematic diagram of test results showing a sample to be tested being a titanium alloy material without gold plating according to an exemplary embodiment.

[0091] In some embodiments, Figure 7-8 The figure shows the test results of the PIM third-order intermodulation products of the gold-plated foam wrapped test sample 5 at different working heights by the test device 1. The horizontal axis is the number of measurements at different times, and the vertical axis is the power value of the PIM third-order products.

[0092] like Figure 7 As shown, the first contact surface 41 of the test fixture 4 is made of titanium alloy and gold-plated. When the gold-plated foam-wrapped sample 5 is tested at a working height of 28% and 55%, the PIM third-order intermodulation product is close to -130dBm, which is much smaller than the reference limit of -80dBm, and the result is relatively stable.

[0093] like Figure 8 As shown, the first contact surface 41 of the test fixture 4 is made of titanium alloy without gold plating. When the working height of the gold-plated foam-wrapped sample 5 is 73%, the third-order product of PIM is small and stable. When the working height is reduced to 55% or 28%, the third-order intermodulation product of PIM deteriorates to close to -60dBm and is unstable.

[0094] like Figure 7 As shown in FIG8 , the results show that when the first contact surface 41 is made of titanium alloy and gold plating is added, the nonlinear intermodulation (PIM) performance can be significantly improved. This conclusion is consistent with the whole machine verification results of electronic devices (such as mobile phones, tablet computers, etc.).

[0095] Fig. 9 It is a schematic diagram of test results of an omni-directional foam material with a size of 2.5*10mm for a sample to be tested according to an exemplary embodiment. Fig.10 It is a schematic diagram of test results of an omnidirectional foam material with a size of 2.5*10mm for a sample to be tested according to another exemplary embodiment.

[0096] In some embodiments, Figure 9-10 The figure shows the test results of the PIM third-order intermodulation products of the omni-foam type of test sample 5 at different working heights by the test device 1. The horizontal axis is the records of multiple different test samples 5, and the vertical axis is the power value of the PIM third-order product.

[0097] like Fig. 9 As shown, for the sample 5 with a size of 2.5*10mm and a type of omni-directional foam, the test results at a typical working height of 0.33mm are as follows Figure 7 As shown, the PIM third-order intermodulation product result is -100dBm to -120dBm, which is relatively stable.

[0098] like Fig.10 As shown, for the sample 5 with a size of 2.5*10mm and a type of omni-directional foam, the test results at a typical working height of 0.48mm are as follows Figure 8 As shown, the PIM third-order intermodulation product may cause the test sample 5 to be unstable for multiple measurements or the consistency between the first test sample 5 and the second test sample 5 is poor, which does not meet the design requirements.

[0099] like Figure 9-10As shown, according to the test results of the test system 100 disclosed in the present invention, the test sample 5 with a size of 2.5*10mm and a type of omni-directional foam cannot meet the design requirements under the upper limit working height of, for example, 0.48mm, and the design solution needs to be changed. This conclusion is consistent with the whole machine verification results of electronic devices (such as mobile phones, tablets, etc.).

[0100] The disclosed embodiment uses a test device 1 to build a corresponding test system 100 to evaluate in advance the energy of passive nonlinear products generated by grounding auxiliary material monomers and / or connections between different contact surfaces to simulate the final application scenario of the electronic device. The test device 1 is equipped with multiple test fixtures 4 and multiple test positions 311 to simultaneously measure the passive intermodulation performance of connection auxiliary materials at different heights and different metal contact surfaces, providing a relatively complete risk assessment method for the grounding design of electronic equipment.

[0101] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0102] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0103] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0104] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0105] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0106] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the utility model disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.

[0107] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. A testing device, characterized in that: include: A connecting plate having a conductive portion, wherein the conductive portion is used to electrically connect to an end surface of a sample to be tested; A base, wherein a test area is provided between the base and the connecting plate, and the base is provided with an electrical connection portion, and the electrical connection portion is provided correspondingly to the conductive portion; and The test fixture comprises a first contact surface and a second contact surface, wherein the first contact surface and the second contact surface are electrically connected to each other, the first contact surface is used to electrically connect to the other end surface of the corresponding sample to be tested, and the second contact surface is electrically connected to the electrical connection portion.

2. The testing device according to claim 1, characterized in that: The connecting plate has a plurality of the conductive parts; The test area includes a plurality of test positions, and the plurality of test positions correspond to the plurality of conductive parts one by one; There are multiple test fixtures, and each test position is provided with a test fixture.

3. The testing device according to claim 1, characterized in that: The conductive portion is provided with a first connection and a second connection, wherein the first connection is used to connect to a test signal source, and the second connection is used to connect to an analysis device.

4. The testing device according to claim 1, characterized in that: The base has an external terminal, the external terminal is electrically connected to the power connection portion of the base, and the base is connected to a reference voltage signal through the external terminal.

5. The testing device according to claim 1, characterized in that: Also includes: A fastening assembly is connected between the base and the connecting plate, and the sample to be tested in the test area is pressed by the fastening assembly.

6. The testing device according to claim 2, characterized in that: The first contact surface of each test fixture has the same shape as the other end surface of the corresponding sample to be tested.

7. The testing device according to claim 2, characterized in that: A test spacing is provided between the first contact surface of each test fixture and the corresponding conductive portion, and the test spacing corresponds to a test height of the sample to be tested.

8. The testing device according to claim 7, characterized in that: The same sample to be tested has multiple test heights, and correspondingly, multiple test fixtures with different test spacings are configured.

9. The testing device according to any one of claims 1 to 8, characterized in that: The first contact surface is provided with a conductive layer; and / or, The second contact surface is provided with a conductive layer.

10. The testing device according to claim 9, characterized in that: The test fixture is made of conductive material; and / or, The base is made of conductive material.

11. A testing system, characterized in that: include: A testing device, which is a testing device as claimed in any one of claims 1 to 10; a test signal source, electrically connected to the test fixture through a first connection of the test fixture; The test analyzer is electrically connected to the test fixture through a second connection of the test fixture.

12. The test system according to claim 11, characterized in that: The test signal source is a reflective passive intermodulation tester; The test analyzer is a PIM analyzer.

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