A crystal oscillator test socket

Abstract

The utility model discloses a crystal oscillator test seat, which relates to the field of crystal oscillator technology. The utility model includes a test box, a heat dissipation port is opened on the side of the test box, a filter is fixedly connected to the inner wall of the installation component, a lifting component is arranged on the side of the test box, a closing block is fixedly connected to the surface of the lifting component, a semiconductor refrigerator is fixedly connected to the inner wall of the ventilation component, and a temperature sensor is arranged on the inner wall of the test box. In the utility model, a filter is installed in the installation frame. If the temperature in the test box is too high, the lifting component can drive the closing block to move so that the heat dissipation port is opened, and the wind force generated by the fixed block drives the hot air in the test box to circulate, and cooperates with the cooling of the temperature sensor to achieve the goal of facilitating the cooling process in the test box, avoiding the problem of causing malfunction of the electronic components inside the crystal oscillator test equipment, and at the same time, it can effectively prevent external dust from entering the interior of the test box during heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal oscillators, in particular to a crystal oscillator test socket. Background Art

[0002] Crystal oscillators are one of the most commonly used electronic components in electronic circuits. There are many types of crystal oscillators. For example, crystal oscillators can be divided into active crystal oscillators and passive crystal oscillators. Different types of active crystal oscillators have different working voltages. Passive crystal oscillators are also divided into two types: chip-type passive crystal oscillators and plug-in passive crystal oscillators according to different packaging forms. At present, a crystal oscillator tester is often used to test the crystal oscillator. The Chinese patent with publication number CN212872541U discloses a crystal oscillator test seat, including a test box, the inner cavity of the test box is fixedly connected with a fixing frame, the left side of the fixing frame is respectively fixedly connected with a partition and a first electric push rod, the surface of the piston rod of the first electric push rod is fixedly connected with a connecting block, the top of the connecting block passes through the inner cavity of the test box and extends to the top of the test box, and the inner cavity of the test box is provided with a first sliding groove that is slidably connected to the surface of the connecting block.

[0003] In response to the disclosed technology, existing crystal oscillator testing devices, some of which adopt a closed design structure, have poor heat dissipation effects. After long-term use, high temperatures are easily generated inside the crystal oscillator testing equipment, causing electronic components inside the crystal oscillator testing equipment to malfunction, resulting in reduced test accuracy, causing many qualified crystal oscillators to be damaged, affecting the production qualification rate of the crystal oscillators.

[0004] For this purpose, a crystal oscillator test socket is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve the problem that most of these devices have poor heat dissipation effect. After long-term use, high temperature is easily generated inside the crystal oscillator test equipment, causing electronic components inside the crystal oscillator test equipment to malfunction, resulting in reduced test accuracy, causing many qualified crystal oscillators to be damaged, and affecting the production qualification rate of crystal oscillators. The utility model provides a crystal oscillator test socket.

[0006] In order to achieve the above-mentioned purpose, the utility model specifically adopts the following technical solutions:

[0007] A crystal oscillator test socket comprises a test box, a heat dissipation port is provided on the side of the test box, a connection component for heat dissipation is arranged on the inner wall of the heat dissipation port, a mounting component for heat dissipation is arranged on the inner wall of the heat dissipation port, a filter is fixedly connected to the inner wall of the mounting component, a lifting component is provided on the side of the test box, a closing block is fixedly connected to the surface of the lifting component, a ventilation component for heat dissipation is provided inside the test box, a semiconductor refrigerator is fixedly connected to the inner wall of the ventilation component, a temperature sensor is provided on the inner wall of the test box, a box cover is provided on the top surface of the test box, and a crystal oscillator test substrate is provided on the inner wall of the test box.

[0008] Furthermore, the connection component comprises a connection frame, the inner wall of the heat dissipation port is fixedly connected with the connection frame, and the surface of the connection frame is fixedly connected with a magnetic attraction block.

[0009] Furthermore, the installation assembly includes an installation frame, the inner wall of the heat dissipation port is movably plugged with the installation frame, the filter is fixedly connected to the installation frame, and the installation frame is fitted with the magnetic block, and a handle is fixedly connected to the surface of the installation frame.

[0010] Furthermore, the lifting assembly comprises a mounting block, a side surface of the test box is fixedly connected with the mounting block, a top surface of the mounting block is fixedly connected with an electric push rod, and a closing block is connected to an output end of the electric push rod.

[0011] Furthermore, the ventilation assembly includes a fixed frame, the inner wall of the test box is fixedly connected to the fixed frame, the inner wall of the fixed frame is fixedly connected to a fixed block, and the semiconductor cooler is connected to the fixed block, and the surface of the fixed block is fixedly connected to a fan.

[0012] Furthermore, there are two fans, and the two fans are symmetrically distributed on the surface of the fixing block.

[0013] The beneficial effects of the utility model are as follows:

[0014] In the utility model, a filter is installed in the installation frame, and the filter can block external dust and prevent external dust from entering the interior of the test box. The installation frame is adsorbed and connected to the surface of the magnetic suction block, and the surface of the installation frame is connected to a handle. Then, when the filter needs to be replaced, the installation frame can be taken out by the handle. During the test process, if the temperature inside the test box is too high, the temperature in the test box is monitored by a temperature sensor. If the temperature in the test box is too high, the lifting component can drive the closing block to move, so that the heat dissipation port is opened, and the semiconductor refrigerator cools the air in the test box at the same time. Two fans work, and the wind force generated by the fans drives the hot air in the test box to circulate, and cooperates with the cooling of the temperature sensor to make the hot air in the test box flow outward through the heat dissipation port, and then the test box is cooled. Through the sensing of the temperature sensor, when the temperature in the test box is appropriate, the lifting component drives the closing block back to the original position, so that the device remains closed; the goal of facilitating the cooling process in the test box is achieved, and the problem of causing failure of the electronic components inside the crystal oscillator test equipment is avoided. At the same time, the external dust can be effectively prevented from entering the interior of the test box during heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the expanded structure of the box cover of the utility model;

[0017] Figure 3 It is a schematic diagram of the interior of the three-dimensional structure of the utility model;

[0018] Figure 4 It is an enlarged schematic diagram of the structure of point A of the utility model.

[0019] Figure numerals: 1. test box; 2. heat dissipation port; 3. connection assembly; 301. connection frame; 302. magnetic block; 4. installation assembly; 401. installation frame; 402. handle; 5. filter; 6. lifting assembly; 601. installation block; 602. electric push rod; 7. closing block; 8. ventilation assembly; 801. fixing frame; 802. fixing block; 803. fan; 9. semiconductor refrigerator; 10. temperature sensor; 11. box cover; 12. crystal oscillator test substrate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, a crystal oscillator test socket comprises a test box 1, a heat dissipation port 2 is provided on the side of the test box 1, a connecting component 3 for heat dissipation is provided on the inner wall of the heat dissipation port 2, a mounting component 4 for heat dissipation is provided on the inner wall of the heat dissipation port 2, a filter screen 5 is fixedly connected to the inner wall of the mounting component 4, a lifting component 6 is provided on the side of the test box 1, a closing block 7 is fixedly connected to the surface of the lifting component 6, a ventilation component 8 for heat dissipation is provided inside the test box 1, a semiconductor refrigerator 9 is fixedly connected to the inner wall of the ventilation component 8, a temperature sensor 10 is provided on the inner wall of the test box 1, a box cover 11 is provided on the top surface of the test box 1, and a crystal oscillator test substrate 12 is provided on the inner wall of the test box 1; specifically, the crystal oscillator test socket, the heat dissipation port 2 is provided, the connecting component 3 and the mounting component 4 can be connected, the filter screen 5 is installed in the mounting component 4, the external dust can be blocked to prevent the dust from entering the interior of the test box 1, the lifting component 6 is provided, the lifting component 6 is connected to the closing block 7, the closing block 7 can heat the heat dissipation port 2 The test box 1 is sealed at the position so that the test equipment can be a closed structure. The lifting component 6 drives the sealing block 7 to move. The filter 5 is connected to the connecting component 3 through the mounting component 4. The mounting component 4 is adsorbed and connected, so that the filter 5 can be easily replaced. The inner wall of the test box 1 is provided with a ventilation component 8 and a semiconductor refrigerator 9. The crystal oscillator test substrate 12 can place the crystal oscillator. During the test process, if the internal temperature of the test box 1 is too high, the temperature in the test box 1 is monitored by the temperature sensor 10. If the temperature in the test box 1 is too high, the lifting component 6 drives the sealing block 7 to move, so that the heat dissipation port 2 is opened, and the semiconductor refrigerator 9 cools the air in the test box 1. At the same time, the ventilation component 8 can drive the hot air to move outward through the heat dissipation port 2, so that the temperature in the test box 1 will not be too high, achieving the goal of facilitating the cooling treatment of the test box 1, avoiding the problem of causing malfunctions of the electronic components inside the crystal oscillator test equipment, and effectively preventing external dust from entering the interior of the test box 1 during heat dissipation.

[0025] like Figure 4 As shown, the connection component 3 includes a connection frame 301, the inner wall of the heat dissipation port 2 is fixedly connected with the connection frame 301, and the surface of the connection frame 301 is fixedly connected with a magnetic block 302; specifically, the heat dissipation port 2 is opened, and the connection component 3 and the installation component 4 can be connected, and the connection component 3 is set, the connection frame 301 is connected in the heat dissipation port 2, and the surface of the connection frame 301 is connected with the magnetic block 302, and the magnetic block 302 can adsorb and fix the installation component 4.

[0026] like Figure 4As shown, the installation component 4 includes a mounting frame 401, the inner wall of the heat dissipation port 2 is movably plugged with the mounting frame 401, and the filter 5 is fixedly connected to the mounting frame 401, and the mounting frame 401 is in contact with the magnetic block 302, and the surface of the mounting frame 401 is fixedly connected with a handle 402; specifically, the installation component 4 is arranged, the mounting frame 401 is adsorbed and connected to the surface of the magnetic block 302, and the surface of the mounting frame 401 is connected with the handle 402, and then when the filter 5 needs to be replaced, it is only necessary to take out the mounting frame 401 through the handle 402, and the filter 5 can be cleaned or replaced, which facilitates the disassembly and assembly process of the filter 5, and at the same time, the filter 5 can block external dust to prevent external dust from entering the interior of the test box 1.

[0027] like Figure 2 As shown, the lifting assembly 6 includes a mounting block 601, the side of the test box 1 is fixedly connected with the mounting block 601, the top surface of the mounting block 601 is fixedly connected with an electric push rod 602, and the closing block 7 is connected to the output end of the electric push rod 602; specifically, during the test process, if the temperature inside the test box 1 is too high, a temperature sensor 10 is provided in the test box 1, and the temperature in the test box 1 is monitored by the temperature sensor 10. If the temperature in the test box 1 is too high, the lifting assembly 6 can drive the closing block 7 to move, the mounting block 601 is connected to the electric push rod 602, the output end of the electric push rod 602 drives the closing block 7 to move, the electric push rod 602 drives the closing block 7 to move downward, and the closing block 7 leaves the surface of the heat dissipation port 2, so that the heat dissipation port 2 is opened, cooperating with the operation of the ventilation assembly 8 and the semiconductor refrigerator 9.

[0028] like Figure 2 , Figure 4 As shown, the ventilation component 8 includes a fixed frame 801, the inner wall of the test box 1 is fixedly connected with the fixed frame 801, the inner wall of the fixed frame 801 is fixedly connected with a fixed block 802, and the semiconductor refrigerator 9 is connected to the fixed block 802, and the surface of the fixed block 802 is fixedly connected with a fan 803; specifically, the semiconductor refrigerator 9 cools the air in the test box 1, and at the same time the ventilation component 8 is running, the fan 803 is connected to the fixed block 802, and the two fans 803 are working. The wind force generated by the fan 803 drives the hot air in the test box 1 to circulate, and cooperates with the cooling of the temperature sensor 10 to make the hot air in the test box 1 flow outward through the heat dissipation port 2, and then the test box 1 is cooled. Through the sensing of the temperature sensor 10, when the temperature in the test box 1 is appropriate, the lifting component 6 drives the closing block 7 back to the original position, so that the device remains closed, so that the temperature in the test box 1 will not be too high.

[0029] like Figure 2As shown, there are two fans 803, and the two fans 803 are symmetrically distributed on the surface of the fixed block 802; specifically, the arrangement of the two fans 803 makes the air circulation effect in the test box 1 better when heat dissipation is required in the test box 1, thereby allowing the heat to be quickly dissipated.

[0030] In summary: the crystal oscillator test socket, the heat dissipation port 2 is opened, and the connecting component 3 and the installation component 4 can be connected. A filter 5 is installed in the installation frame 401, and the filter 5 can block external dust to prevent external dust from entering the interior of the test box 1. The connecting frame 301 is connected to the heat dissipation port 2, and the surface of the connecting frame 301 is connected to the magnetic suction block 302. The installation frame 401 adsorbs and connects to the surface of the magnetic suction block 302. The surface of the installation frame 401 is connected to the handle 402, and then when the filter 5 needs to be replaced, it only needs to take out the installation frame 401 through the handle 402. During the test process, if the temperature inside the test box 1 is too high, a temperature sensor 10 is provided in the test box 1, and the temperature in the test box 1 is monitored by the temperature sensor 10. If the temperature in the test box 1 is too high, the lifting component 6 can drive the closed Block 7 moves, and the mounting block 601 is connected to the electric push rod 602. The output end of the electric push rod 602 drives the closing block 7 to move, and the electric push rod 602 drives the closing block 7 to move downward, and the closing block 7 leaves the surface of the heat dissipation port 2, so that the heat dissipation port 2 is opened, and at the same time, the semiconductor refrigerator 9 cools the air in the test box 1, and at the same time, the ventilation component 8 is running, and the fan 803 is connected to the fixed block 802. The two fans 803 are working, and the wind force generated by the fan 803 drives the hot air in the test box 1 to circulate, and cooperates with the cooling of the temperature sensor 10 to make the hot air in the test box 1 flow out through the heat dissipation port 2, and then the test box 1 is cooled. Through the sensing of the temperature sensor 10, when the temperature in the test box 1 is appropriate, the lifting component 6 drives the closing block 7 back to the original position, so that the device remains closed.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A crystal oscillator test socket, characterized in that: The invention comprises a test box (1), wherein a heat dissipation port (2) is provided on the side of the test box (1), a connection component (3) for heat dissipation is provided on the inner wall of the heat dissipation port (2), a mounting component (4) for heat dissipation is provided on the inner wall of the heat dissipation port (2), a filter screen (5) is fixedly connected to the inner wall of the mounting component (4), a lifting component (6) is provided on the side of the test box (1), a sealing block (7) is fixedly connected to the surface of the lifting component (6), a ventilation component (8) for heat dissipation is provided inside the test box (1), a semiconductor refrigerator (9) is fixedly connected to the inner wall of the ventilation component (8), a temperature sensor (10) is provided on the inner wall of the test box (1), a box cover (11) is provided on the top surface of the test box (1), and a crystal oscillator test substrate (12) is provided on the inner wall of the test box (1).

2. A crystal oscillator test socket according to claim 1, characterized in that: The connection assembly (3) comprises a connection frame (301), the inner wall of the heat dissipation port (2) is fixedly connected to the connection frame (301), and the surface of the connection frame (301) is fixedly connected to a magnetic attraction block (302).

3. A crystal oscillator test socket according to claim 2, characterized in that: The mounting assembly (4) comprises a mounting frame (401), the inner wall of the heat dissipation port (2) is movably plugged with the mounting frame (401), the filter (5) is fixedly connected to the mounting frame (401), the mounting frame (401) is fitted with the magnetic block (302), and a handle (402) is fixedly connected to the surface of the mounting frame (401).

4. The crystal oscillator test socket according to claim 1, characterized in that: The lifting assembly (6) comprises a mounting block (601), the side of the test box (1) is fixedly connected to the mounting block (601), the top surface of the mounting block (601) is fixedly connected to an electric push rod (602), and the closing block (7) is connected to the output end of the electric push rod (602).

5. The crystal oscillator test socket according to claim 1, characterized in that: The ventilation assembly (8) comprises a fixing frame (801), the inner wall of the test box (1) is fixedly connected to the fixing frame (801), the inner wall of the fixing frame (801) is fixedly connected to a fixing block (802), and the semiconductor cooler (9) is connected to the fixing block (802), and the surface of the fixing block (802) is fixedly connected to a fan (803).

6. The crystal oscillator test socket according to claim 5, characterized in that: There are two fans (803), and the two fans (803) are symmetrically distributed on the surface of the fixing block (802).

Images