A weak leakage probe for low temperature IV testing

Abstract

A weak leakage probe for low-temperature I-V testing includes a support platform for carrying a device to be tested, a refrigerant for cooling the support platform is arranged at the lower side of the support platform, and a mounting member for fixedly connecting with a probe seat; a heat sink, the heat sink is fixedly mounted on the mounting member; a probe assembly, one end of the probe assembly is fixedly mounted on the mounting member, and the other end extends toward the support platform; a charged coaxial shielding layer is sleeved on the probe body and wraps the rod; a conductive member, one end of the conductive member is connected to the support platform / the refrigerant, and the other end is connected to the heat sink. The temperature of the probe body can be reduced by setting the conductive member and the insulating heat-conducting layer, thereby reducing the thermal gradient between the probe body and the device to be tested, so that the potential between the probe body and the instrument ground terminal is reduced, thereby reducing the electron migration between the probe body and the instrument ground terminal, and reducing the occurrence of leakage.

Description

Technical Field

[0001] The utility model relates to the technical field of detection equipment, in particular to a weak leakage probe used for low-temperature IV testing. Background Art

[0002] At present, with the rapid development of electronic information technology, some high-reliability and high-performance semiconductor devices are also developing rapidly. Wafer probe test, also known as intermediate test, is the most important part of integrated circuits. It is to ensure that the damaged or unqualified chips are screened out as much as possible before the chip is packaged, so as to save packaging costs.

[0003] With the continuous iteration and update of products, wafer detection equipment also needs to meet various environmental requirements such as temperature and pressure. During the test in a vacuum low-temperature environment, the device to be tested needs to be placed in a vacuum low-temperature environment, and the probe detects the wafer. For example, the Chinese patent with the announcement number CN116165472B discloses a low-temperature probe test device, which is a device for placing the wafer in a low-temperature environment for detection. Usually, the refrigerant is used to cool the platform used to carry the wafer, so that the wafer is tested in a low-temperature environment. During the detection process, since the probe is connected to an external instrument, in a low-temperature test, such as liquid nitrogen temperature -196°C, the temperature of the uncooled probe body is usually room temperature, which has a huge thermal gradient compared to the temperature of the sample to be tested. When such a probe is connected to the device to be tested, the heat of the probe will be introduced into the device to be tested, causing the temperature of the device to rise, and it is impossible to measure the semiconductor characterization parameters of the sample at the required target temperature. In addition, because conventional IV test probes do not have a charged coaxial shielding layer, when the instrument is tested, the test voltage on the probe will be higher than the reference voltage of the instrument ground, which is usually 0V, causing the probe to leak to the ground, which will affect and interfere with the IV measurement work that requires precision.

[0004] Therefore, there is an urgent need for a weak leakage probe for low-temperature IV testing. Utility Model Content

[0005] The purpose of the utility model is to provide a weak leakage probe for low temperature IV testing. In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A weak leakage probe for low temperature IV testing, comprising a support platform for carrying a device to be tested, a refrigerant for cooling the support platform is arranged at the lower side of the support platform, and

[0007] A mounting member, the mounting member being used for fixed connection with the probe seat;

[0008] A heat sink, the heat sink is fixedly mounted on the mounting member;

[0009] A probe assembly, one end of which is fixedly mounted on the mounting member and the other end of which extends toward the support platform. The probe assembly includes

[0010] The probe body comprises a rod fixedly connected to the mounting member, and a probe formed at one end of the rod away from the mounting member and bent toward the supporting platform.

[0011] A charged coaxial shielding layer, wherein the charged coaxial shielding layer is sleeved on the probe body and wraps the rod;

[0012] A conductive member, one end of which is connected to the supporting platform / the refrigerant, and the other end of which is connected to the heat sink.

[0013] Furthermore, an insulating heat-conducting layer is provided on the probe assembly, and the insulating heat-conducting layer is located between the charged coaxial shielding layer and the probe body, and wraps the rod.

[0014] Furthermore, the conductive member is made of a braided copper strip, and at least one conductive member is provided.

[0015] Furthermore, the charged coaxial shielding layer is tubular, the inner diameter of which is matched with the diameter of the rod, and is sleeved on the rod.

[0016] Furthermore, the insulating heat-conducting layer is made of epoxy resin and coated on the rod.

[0017] The beneficial effects produced by the utility model are as follows:

[0018] The utility model provides a probe with weak leakage current. The temperature of the probe body can be lowered by arranging a conductive part and an insulating heat-conducting layer, thereby reducing the thermal gradient between the probe body and the device to be measured. By arranging a charged coaxial shielding layer insulated from the ground terminal around the probe body, the potential difference between the probe and the ground terminal of an IV measuring instrument can be reduced, thereby reducing the leakage current during IV measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0020] Figure 2 It is a schematic diagram of the explosion structure of the utility model.

[0021] Figure 3 It is a cross-sectional view of the probe assembly and the mounting part in the utility model.

[0022] Figure 4for Figure 3 A partial enlarged view of part A in the middle.

[0023] In the figure: support platform-100; mounting member-101; heat sink-102; probe assembly-200; probe body-210; rod-211; probe-212; charged coaxial shielding layer-201; conductive member-103; insulating thermal conductive layer-202. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation manner are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0025] The embodiment of the utility model provides a weak leakage probe for low-temperature IV testing, which is mainly used to detect devices under test in a low-temperature environment. It can reduce the thermal gradient between the devices under test and have strong insulation and leakage prevention performance to ensure the accuracy of detection.

[0026] like Figure 1-4 As shown, an embodiment of the utility model provides a weak leakage probe for low-temperature IV testing, including a support platform 100 for carrying a device to be tested, a refrigerant for cooling the support platform 100 is arranged at the lower side of the support platform 100, and also includes a mounting member 101, a heat sink 102, a probe assembly 200 and a conductive member 103, wherein the mounting member 101 is used to be fixedly connected to the probe seat, and the heat sink 102 is fixedly mounted on the mounting member 101. In this embodiment, the heat sink 102 is fixedly mounted on the mounting member 101 by a low-temperature epoxy resin and is insulated from the mounting member 101; one end of the probe assembly 200 is fixedly mounted on the mounting member 101, and the other end extends toward the support platform 100, and The probe assembly 200 includes a probe body 210 and a charged coaxial shielding layer 201, wherein the probe body 210 has a rod 211 fixedly connected to the mounting member 101, and a probe 212 formed on the end of the rod 211 away from the mounting member 101 and bent toward the support platform 100, the charged coaxial shielding layer 201 is sleeved on the probe body 210 and wraps the rod 211; one end of the conductive member 103 is connected to the support platform / the refrigerant, and the other end is connected to the heat sink 102, the conductive member 103 is composed of a braided copper strip, and in this embodiment, the conductive member is specifically a copper strip, and at least one conductive member 103 is provided to ensure the heat conduction rate.

[0027] During the detection process, the low temperature above the refrigerant is conducted to the probe through the heat sink 102 by the conductive member 103, thereby lowering the probe temperature and reducing the thermal gradient between the probe and the device to be tested. When the temperature of the probe and the device to be tested is roughly consistent, the probe is prevented from introducing heat higher than the target temperature to the device to be tested, resulting in inaccurate temperature measurement and failure to obtain semiconductor characterization parameters at the required temperature. At the same time, since there is a charged coaxial shielding layer around the probe body, a voltage equal to that applied to the probe body can be introduced from the instrument, reducing the potential difference between the probe and the instrument ground terminal, avoiding electron migration caused by the potential difference, which is often called leakage in our measurement, and improving the IV measurement accuracy of the probe.

[0028] In this embodiment, an insulating heat-conducting layer 202 is further provided on the probe assembly 200, and the insulating heat-conducting layer 202 is located between the charged coaxial shielding layer 201 and the probe body 210, and wraps the rod 211; the charged coaxial shielding layer 201 is tubular, and its inner diameter is adapted to the diameter of the rod 211, and is mounted on the rod 211; the insulating heat-conducting layer 202 is made of epoxy resin and coated on the rod 211.

[0029] During the detection process, by providing an insulating thermal conductive layer 202 made of low-temperature epoxy resin on the probe assembly 200, the temperature conductivity can be guaranteed, so that the temperature on the probe 212 is reduced, the thermal gradient between the probe 212 and the device to be tested is reduced, and the temperature difference between the probe and the sample to be tested is reduced, so as to avoid the probe from directing heat higher than the target temperature to the device to be tested, resulting in inaccurate temperature measurement and inability to obtain semiconductor characterization parameters at the required temperature. At the same time, since there is a charged coaxial shielding layer around the probe body, a voltage equal to that applied to the probe body can be introduced from the instrument, reducing the potential difference between the probe and the instrument ground terminal, greatly reducing the electron migration caused by the potential difference, that is, leakage current, which is often referred to in our measurement, so that the leakage current of the probe body is below 10fA, ensuring the accuracy of IV measurement.

[0030] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A weak leakage probe for low-temperature IV testing, comprising a support platform for carrying a device to be tested, a refrigerant for cooling the support platform is arranged at the lower side of the support platform, characterized in that: Also includes A mounting member, the mounting member being used for fixed connection with the probe seat; A heat sink, the heat sink is fixedly mounted on the mounting member; A probe assembly, one end of which is fixedly mounted on the mounting member and the other end of which extends toward the support platform. The probe assembly includes The probe body comprises a rod fixedly connected to the mounting member, and a probe formed at one end of the rod away from the mounting member and bent toward the supporting platform. A charged coaxial shielding layer, wherein the charged coaxial shielding layer is sleeved on the probe body and wraps the rod; A conductive member, one end of which is connected to the supporting platform / the refrigerant, and the other end of which is connected to the heat sink.

2. A weak leakage probe for low temperature IV testing according to claim 1, characterized in that: An insulating heat-conducting layer is also arranged on the probe assembly. The insulating heat-conducting layer is located between the charged coaxial shielding layer and the probe body and wraps the rod.

3. A weak leakage probe for low temperature IV testing according to claim 1, characterized in that: The conductive member is made of a braided copper strip, and at least one conductive member is provided.

4. A weak leakage probe for low temperature IV testing according to claim 1, characterized in that: The charged coaxial shielding layer is in a tubular shape, the inner diameter of which is matched with the diameter of the rod, and is sleeved on the rod.

5. A weak leakage current probe according to claim 2, characterized in that: The insulating heat-conducting layer is made of low-temperature heat-conducting epoxy resin and is coated on the rod.

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