Flash module and electronic equipment

Abstract

The present application relates to the technical field of electronic equipment, and discloses a flashlight module and electronic equipment, wherein the flashlight module comprises a flashlight body, a heat-conducting part and a bearing part; the flashlight body is attached to one side of the heat-conducting part, and the bearing part is located on the side of the heat-conducting part away from the flashlight body, and is fixedly connected to the heat-conducting part; wherein a heat dissipation gap is formed between at least part of the heat-conducting part and the bearing part, and at least part of the heat generated by the flashlight body can be diffused to the heat dissipation gap through the heat-conducting part. The flashlight module and electronic equipment provided by the present application have good heat dissipation effect, and can realize rapid cooling of the flashlight and its adjacent area.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a flash module and electronic equipment. Background Art

[0002] In order to meet the market demand for diversified camera functions of electronic devices, more and more electronic devices are equipped with multiple cameras. In order to improve the shooting effect in poor light conditions, a flash is usually set near the camera on the electronic device, which emits a beam of light to provide fill light during the shooting process.

[0003] However, the power consumption of the flash is generally high, and the heat it generates when working is also high. Some of the heat generated by the flash will accumulate near the flash, which may affect the camera performance of the electronic device; and the flash module is close to the main board in the electronic device. When too much heat accumulates, it may also affect the performance of the main board. Utility Model Content

[0004] In view of this, the present application provides a flash module and an electronic device, which have a good heat dissipation effect and can achieve rapid cooling of the flash and its surrounding areas.

[0005] Specifically, this application includes the following technical solutions:

[0006] In a first aspect, the present application provides a flash module, the flash module comprising a flash body, a heat conducting part and a bearing part;

[0007] The flash lamp body is attached to one side of the heat conducting part, and the bearing part is located on a side of the heat conducting part away from the flash lamp body and is fixedly connected to the heat conducting part;

[0008] A heat dissipation gap is formed between at least a portion of the heat conducting portion and the bearing portion, and at least a portion of the heat generated by the flash lamp body can be diffused to the heat dissipation gap through the heat conducting portion.

[0009] Optionally, the bearing portion has a first surface facing the heat conducting portion, and the heat conducting portion has a second surface facing the bearing portion, wherein:

[0010] At least one first protrusion is disposed on the first surface, and the at least one first protrusion is connected to or abuts against the second surface to form the heat dissipation gap between the first surface and the second surface; and / or,

[0011] At least one second protrusion is disposed on the second surface, and the at least one second protrusion is connected to or abuts against the first surface to form the heat dissipation gap between the first surface and the second surface.

[0012] Optionally, the bearing portion has a first surface facing the heat conducting portion, and the heat conducting portion has a second surface facing the bearing portion, wherein:

[0013] A first groove is provided on the first surface, and a gap is formed between the bottom wall of the first groove and the second surface to form the heat dissipation gap between the first surface and the second surface; and / or,

[0014] A second groove is disposed on the second surface, and a gap is provided between a groove bottom wall of the second groove and the first surface to form the heat dissipation gap between the first surface and the second surface.

[0015] Optionally, the heat conducting part includes a heat conducting member and a bracket;

[0016] The heat conductive member wraps at least a portion of the bracket and contacts the flash lamp body, and a heat dissipation gap is formed between a side of the heat conductive member away from the flash lamp body and the bearing portion;

[0017] Wherein, the density of the bracket is smaller than the density of the heat conducting component.

[0018] Optionally, the heat conducting member includes a first plate body, a second plate body and a connecting plate;

[0019] The first plate body and the second plate body are stacked and arranged at intervals, a slot is formed between the first plate body and the second plate body, and the connecting plate is connected to the first plate body and the second plate body respectively;

[0020] The flash lamp body is attached to the surface of the first plate body away from the second plate body, and the heat dissipation gap is formed between the surface of the second plate body away from the first plate body and the bearing part;

[0021] At least a portion of the bracket is located in the slot and connected to the heat conducting member.

[0022] Optionally, the flash lamp body comprises a flexible circuit board and a light-emitting element, the flexible circuit board is attached to the heat-conducting portion, the light-emitting element is fixed to a surface of the flexible circuit board away from the heat-conducting portion and is electrically connected to the flexible circuit board for emitting light;

[0023] The flash module also includes a heat absorbing portion, which is arranged on a surface of the flexible circuit board away from the heat conducting portion and adjacent to the light emitting component for absorbing at least part of the heat generated by the light emitting component.

[0024] Optionally, the heat absorption portion is a light absorbing component with light absorbing properties, which is used to absorb heat radiation generated by the light emitted by the light emitting component.

[0025] Optionally, the heat absorption part is a graphite-metal composite, and the graphite-metal composite is a component formed by solidifying after graphite powder is mixed into liquid metal.

[0026] Optionally, the heat absorbing portion is annular, and the light emitting member is located on the inner side of the heat absorbing portion.

[0027] Optionally, a plurality of connectors are provided on the heat absorption part, a plurality of first through holes are opened through the flexible circuit board, the connectors are passed through the first through holes and exposed on a side of the heat absorption part close to the heat conducting part, and the connectors are in thermal contact with the heat conducting part.

[0028] Optionally, the heat-conducting part further includes a rigid support member, wherein the rigid support member is located between the flexible circuit board and the heat-conducting part, and is connected to the flexible circuit board and the heat-conducting part respectively;

[0029] The rigid support member is provided with a plurality of second through holes, and the connecting member penetrates the first through holes and the second through holes and contacts the heat conducting part.

[0030] A second aspect of the present application provides an electronic device, which includes the above-mentioned flash module.

[0031] The beneficial effects of the technical solution provided by the embodiments of the present application include at least:

[0032] The flash module and electronic device provided in the embodiments of the present application are provided with a heat conducting part between the bearing part and the flash body. The heat conducting part can absorb at least part of the heat when the flash body emits flash and generates heat, and a heat dissipation gap is provided between the heat conducting part and the bearing part. The heat conducting part can conduct part of the absorbed heat to the air in the heat dissipation gap to complete the heat diffusion, and the heat dissipation effect is good, which avoids the heat accumulation near the flash and causes the temperature of the mainboard in this area to increase, and further avoids the heat generated by the flash body from affecting the performance of the mainboard, and can meet the heat dissipation requirements of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A cross-sectional view of a flash module provided by an embodiment of the present application is shown;

[0035] Figure 2An exploded view of the heat conducting portion and the bearing portion provided in an embodiment of the present application is shown;

[0036] Figure 3 An exploded view of a heat conducting member and a bracket provided in an embodiment of the present application is shown;

[0037] Figure 4 A side view of a heat conducting member provided in an embodiment of the present application is shown;

[0038] Figure 5 A partial structural schematic diagram of a flash module provided in an embodiment of the present application is shown;

[0039] Figure 6 for Figure 5 Exploded view of the flash module shown. Description of the drawings:

[0041] 1. flash lamp body; 11. flexible circuit board; 111. first through hole; 12. light emitting element;

[0042] 2. heat conducting part; 20. second surface; 21. heat dissipation gap; 22. second protrusion; 23. heat conducting member; 231. first plate body; 232. second plate body; 233. connecting plate; 24. bracket; 25. rigid support member; 251. second through hole; 26. first adhesive backing; 27. second adhesive backing;

[0043] 3. bearing portion; 30. first surface; 31. first protrusion;

[0044] 4. heat absorbing part; 41. connecting piece;

[0045] 5. Flash lamp cover;

[0046] 6. Decorative parts;

[0047] 7. Lenses.

[0048] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In order to make the technical solutions and advantages of the present application clearer, the flash module and electronic equipment will be described in detail below in conjunction with the drawings.

[0050] In order to meet the market demand for diversified camera functions of electronic devices, more and more electronic devices are equipped with multiple cameras. In poor light conditions, in order to improve the shooting effect, a flash is usually set near the camera on the electronic device to provide fill light during the shooting process. With the improvement of mobile phone camera performance, the flash has a high power and high efficiency demand. The mobile phone flash consumes a lot of power and generates a lot of heat when working. The heat generated by the flash will accumulate in a local area, causing the temperature of the motherboard near the area to increase, and the performance of the motherboard will also be affected to a certain extent.

[0051] In the related art, a steel plate is usually set under the flash lamp to support the flash lamp and absorb some heat. However, this arrangement has a poor heat dissipation effect and cannot effectively conduct the heat generated by the flash lamp to the outside, which is difficult to meet the heat dissipation requirements of the whole machine.

[0052] In this regard, the present application provides a flash module, such as Figure 1 As shown, the flash module may include a flash body 1, a heat-conducting part 2 and a bearing part 3; the flash body 1 is attached to one side of the heat-conducting part 2, the bearing part 3 is located on the side of the heat-conducting part 2 away from the flash body 1, and is fixedly connected to the heat-conducting part 2, and the first side and the second side are opposite; wherein a heat dissipation gap 21 is formed between at least part of the heat-conducting part 2 and the bearing part 3, and at least part of the heat generated by the flash body 1 can be diffused to the heat dissipation gap 21 through the heat-conducting part 2.

[0053] It should be noted that, in the embodiment of the present application, “adhering” two components means that the two components are fitted together in a surface-to-surface contact manner, but it does not require that there must be a connection relationship between the two components.

[0054] When the flash body 1 is working, heat is generated. Since the flash body 1 is attached to one side surface of the heat-conducting part 2, the temperature of the flash body 1 is higher than that of the heat-conducting part 2. Therefore, the heat generated by the flash body 1 is directly transferred to the heat-conducting part 2, and the temperature of the heat-conducting part 2 will increase. Moreover, the temperature of the heat-conducting part 2 must be higher than the temperature of the air in the heat dissipation gap 21. When there is a temperature difference between objects, the high-temperature object will radiate energy to the low-temperature object, that is, the heat on the heat-conducting part 2 will gradually diffuse into the air in the heat dissipation gap 21, and the temperature of the heat-conducting part 2 will drop, and continue to absorb the heat generated by the flash body 1, thereby forming a heat conduction channel between the flash body 1, the heat-conducting part 2 and the air, thereby achieving continuous heat dissipation and cooling of the flash body 1.

[0055] It should also be noted that the specific heat capacity of air is greater than that of steel plates, that is, the amount of heat that air needs to absorb when the temperature rises by 1°C is greater than the amount of heat that steel plates absorb when the temperature rises by 1°C. The flash lamp module provided in the embodiment of the present application conducts the heat generated by the flash lamp body 1 to the air in the heat dissipation gap 21, which has a better heat dissipation effect than the solution of absorbing heat through steel plates in the related art.

[0056] In summary, in the flash module provided in the embodiment of the present application, a heat conducting part 2 is arranged between the bearing part 3 and the flash body 1. Since the heat conducting part 2 and the flash body 1 are in surface contact, the heat conducting part 2 can quickly absorb at least part of the heat when the flash body 1 emits flash and generates heat, and there is a heat dissipation gap 21 between the heat conducting part 2 and the bearing part 3. The heat conducting part 2 can conduct the absorbed heat to the air in the heat dissipation gap 21 to complete the heat diffusion, and the heat dissipation effect is good, which avoids the heat accumulation near the flash and causes the temperature of the mainboard in this area to increase, and further avoids the heat generated by the flash body 1 from affecting the performance of the mainboard, and can meet the heat dissipation requirements of the whole machine.

[0057] In some embodiments, the bearing part 3 may be an antenna bracket 24 in an electronic device, the heat conducting part 2 is mounted on the antenna bracket 24 , and the heat dissipation gap 21 is formed between the heat conducting part 2 and the antenna bracket 24 to dissipate heat from the flash body 1 .

[0058] In some embodiments, since metal has good thermal conductivity, at least a portion of the contact surface between the heat conducting part 2 and the flash body 1 can be a metal component; and / or, at least a portion of the surface of the heat conducting part 2 facing the heat dissipation gap 21 can be a metal surface. The heat generated by the flash body 1 can be more efficiently conducted to the heat conducting part 2 through the metal part, and the heat conducting part 2 can also more efficiently conduct the heat to the air through the metal part, further improving the heat dissipation performance of the flash module.

[0059] Continue to see Figure 1 In some embodiments of the present application, the bearing portion 3 has a first surface 30 facing the heat conducting portion 2, and the heat conducting portion 2 has a second surface 20 facing the bearing portion 3, wherein: at least one first protrusion 31 is provided on the first surface 30, and at least one first protrusion 31 is connected to or abuts against the second surface 20 to form a heat dissipation gap 21 between the first surface 30 and the second surface 20; and / or at least one second protrusion 22 is provided on the second surface 20, and at least one second protrusion 22 is connected to or abuts against the first surface 30 to form a heat dissipation gap 21 between the first surface 30 and the second surface 20.

[0060] In the flash module provided in the embodiment of the present application, the bearing part 3 and the heat-conducting part 2 are separated by providing a first protrusion 31 on the first surface 30 of the bearing part 3 and / or providing a second protrusion 22 on the second surface 20 of the heat-conducting part 2 to form a heat dissipation gap 21 therebetween. When the flash body 1 is working, part of the heat generated by it can be conducted to the heat dissipation gap 21 through the heat-conducting part 2, thereby achieving cooling of the flash body 1.

[0061] In one example, a plurality of first protrusions 31 are provided on the first surface 30 of the bearing portion 3, and the plurality of first protrusions 31 are adhesively connected to the second surface 20 of the heat conducting portion 2, so that the heat conducting portion 2 and the bearing portion 3 are connected and fixed, and a heat dissipation gap 21 is formed between the first surface 30 and the second surface 20.

[0062] In another example, a plurality of second protrusions 22 are provided on the second surface 20 of the heat conducting part 2, and the plurality of second protrusions 22 are adhesively connected to the first surface 30 of the bearing part 3, so that the heat conducting part 2 and the bearing part 3 are connected and fixed, and a heat dissipation gap 21 is formed between the first surface 30 and the second surface 20.

[0063] In another example, Figure 2 As shown, three first protrusions 31 are arranged on the first surface 30 of the bearing part 3, and a second protrusion 22 is arranged at a corner of the second surface 20 of the heat conducting part 2. The three first protrusions 31 are connected to the other three corners of the heat conducting part 2 except the corner where the second protrusion 22 is located, so as to form a heat dissipation gap 21 between the first surface 30 and the second surface 20.

[0064] Those skilled in the art may select and adjust the number and location of the first protrusions 31 and the second protrusions 22 according to actual needs.

[0065] Optionally, the bearing portion 3 and the heat conducting portion 2 are connected by bonding with adhesive.

[0066] Although the method of providing a protrusion on the bearing part 3 and / or the heat conducting part 2 to form a heat dissipation gap 21 therebetween has a better heat dissipation effect, it will also increase the height size of the flash module to a certain extent, thereby increasing the height size of the electronic device.

[0067] Therefore, in some embodiments of the present application, a first groove is provided on the first surface 30 of the bearing portion 3, and after the first surface 30 contacts the second surface 20 of the heat conducting portion 2, a gap is provided between the bottom wall of the first groove and the second surface 20 to form a heat dissipation gap 21 between the first surface 30 and the second surface 20; and / or, a second groove is provided on the second surface 20 of the heat conducting portion 2, and after the second surface 20 contacts the first surface 30 of the bearing portion 3, a gap is provided between the bottom wall of the second groove and the first surface 30 to form a heat dissipation gap 21 between the first surface 30 and the second surface 20.

[0068] The method of forming the heat dissipation gap 21 by providing a groove on the bearing part 3 and / or the heat conducting part 2 not only has the same heat dissipation effect, but also does not occupy more space, and can reduce the size of the flash module in the height direction to meet the requirements of thinness and lightness of electronic equipment. Optionally, in order to enhance the heat dissipation in the groove, the groove can be extended to the edge of the heat conducting part 2 or the bearing part 3 where it is located.

[0069] In some embodiments of the present application, Figure 3 As shown, the heat-conducting part 2 may include a heat-conducting member 23 and a bracket 24; the heat-conducting member 23 wraps at least a portion of the bracket 24 and contacts the flash body 1, and a heat dissipation gap 21 is formed between the side of the heat-conducting member 23 away from the flash body 1 and the bearing part 3; wherein the density of the bracket 24 is less than the density of the heat-conducting member 23.

[0070] In the flash module provided in the embodiment of the present application, the heat conductor 23 is wrapped around the outside of the bracket 24. The heat generated by the flash body 1 during operation is directly conducted to the heat dissipation gap 21 through the heat conductor 23. A heat dissipation gap 21 is formed between the bracket 24 and the bearing part 3 to support the heat conductor 23. In addition, the density of the bracket 24 is less than that of the heat conductor 23, which can reduce the weight of the heat conductor 2 and thus reduce the weight of the entire machine.

[0071] In some embodiments, the heat conductor 23 is a metal component, which has good thermal conductivity and can more efficiently conduct the heat generated by the flash body 1 to the heat dissipation gap 21; the bracket 24 can be a plastic component, which can provide support while reducing the weight of the heat conductor 2, and the thermal conductivity of the plastic component is poor. The heat conducted to the heat conductor 23 will not be easily absorbed by the bracket 24, but will be conducted to the air in the heat dissipation gap 21 through the heat conductor 23, thereby avoiding local heat accumulation.

[0072] Optionally, the heat conductor 23 is a metal component made by stamping a steel sheet; and the bracket 24 is a plastic component formed by plastic injection molding.

[0073] In some embodiments of the present application, Figure 3 and Figure 4As shown, the heat conductor 23 may include a first plate 231, a second plate 232 and a connecting plate 233; the first plate 231 and the second plate 232 are stacked and arranged at intervals, a slot is formed between the first plate 231 and the second plate 232, and the connecting plate 233 is respectively connected to the first plate 231 and the second plate 232; the flash body 1 is attached to the surface of the first plate 231 facing away from the second plate 232, and a heat dissipation gap 21 is formed between the surface of the second plate 232 facing away from the first plate 231 and the bearing part 3; at least a part of the bracket 24 is located in the slot and is connected to the heat conductor 23.

[0074] The connecting plate 233 is connected to the first plate 231 and the second plate 232 respectively, and a heat conduction channel is formed between the first plate 231, the connecting plate 233 and the second plate 232. When the flash lamp body 1 is working and generates heat, the heat is firstly conducted to the first plate 231, then to the second plate 232 through the connecting plate 233, and finally to the air in the heat dissipation gap 21 through the second plate 232; and a slot is formed inside the heat conducting member 23, and when the heat conducting member 23 and / or the bracket 24 need to be replaced or disassembled, the bracket 24 can be pulled out from the slot, which is more convenient to operate.

[0075] In one example, if Figure 4 As shown, the first plate 231 and the second plate 232 are arranged in parallel and at intervals, the orthographic projection of the heat conductor 23 on the projection plane is U-shaped, the upper and lower surfaces of the bracket 24 are also parallel to each other, matching the shape of the slot in the heat conductor 23, and the projection plane is perpendicular to the upper surface of the bracket 24. Those skilled in the art can select and adjust the shapes of the heat conductor 23 and the bracket 24 according to actual needs.

[0076] In order to further improve the heat dissipation performance of the flash module, in some embodiments of the present application, the flash body 1 may include a flexible circuit board 11 and a light-emitting component 12, the flexible circuit board 11 is attached to the heat-conducting portion 2, the light-emitting component 12 is fixed to the surface of the flexible circuit board 11 facing away from the heat-conducting portion 2, and is electrically connected to the flexible circuit board 11 for emitting light; the flash module may also include a heat absorption portion 4, the heat absorption portion 4 is arranged on the surface of the flexible circuit board 11 facing away from the heat-conducting portion 2, and is adjacent to the light-emitting component 12, and is used to absorb at least part of the heat generated by the light-emitting component 12.

[0077] In the flash module provided in the embodiment of the present application, Figure 5As shown, a heat absorbing portion 4 can also be provided near the light emitting element 12, and the heat absorbing portion 4 is provided on the flexible circuit board 11. Part of the heat generated by the light emitting element 12 will be conducted to the flexible circuit board 11 and absorbed by the heat absorbing portion 4, thereby avoiding heat accumulation near the light emitting element 12, and forming a second heat conduction channel between the light emitting element 12, the flexible circuit board 11 and the heat absorbing portion 4 (the heat conduction channel between the above-mentioned flash body 1, the heat conducting portion 2 and the heat dissipation gap 21 can be called the first heat conduction channel), and the flash body 1 can be cooled through the two heat conduction channels, thereby further improving the heat dissipation performance of the flash module.

[0078] Optionally, the heat absorption part 4 is a metal component. The metal component has good heat absorption performance and can quickly absorb at least part of the heat generated by the light-emitting component 12 to cool the light-emitting component 12.

[0079] In some embodiments, the heat absorption portion 4 may be a light absorbing component with light absorbing properties, which is used to absorb the heat radiation generated by the light emitted by the light emitting element 12 .

[0080] When the light emitting element 12 emits light, in addition to the light emitted to the outside for fill light, part of the light will be scattered and diffusely reflected inside the flash assembly. When this part of the light is reflected on the heat absorbing part 4, since the heat absorbing part 4 has a light absorbing property, it can absorb at least part of the light and absorb the thermal radiation generated by the light. At this time, a third heat conduction channel is formed between the light emitting element 12, the air between the light emitting element 12 and the heat absorbing part 4, and the heat absorbing part 4.

[0081] Optionally, the heat absorbing part 4 is a graphite component or a dark metal component.

[0082] Optionally, the heat absorbing part 4 is a graphite-metal composite, which is a component formed by solidifying after graphite powder is doped into liquid metal. Exemplarily, the heat absorbing part 4 is composed of liquid metal doped with graphite powder, and the weight ratio of liquid metal to graphite powder is 100:1 to 50:1.

[0083] Optionally, the heat absorbing part 4 is a metal component, and the outer surface of the metal component is coated with a light absorbing coating.

[0084] Those skilled in the art can select and adjust the type of the heat absorption part 4 according to actual needs.

[0085] In some embodiments of the present application, Figure 5 and Figure 6 As shown, the heat absorbing portion 4 is annular, and the light emitting member 12 is located inside the heat absorbing portion 4. Figure 5As shown, the heat absorbing portion 4 includes an inner annular surface and an outer annular surface, both of which are perpendicular to the flexible circuit board 11, and the light emitting element 12 is located in the annular space inside the heat absorbing portion 4. Since the light generated by the light emitting element 12 is emitted toward multiple angles, the annular heat absorbing portion 4 can absorb the heat radiation generated by the light at multiple angles, further improving the heat dissipation effect of the flash assembly.

[0086] In some embodiments of the present application, a plurality of connectors 41 may be provided on the heat absorption portion 4, a plurality of first through holes 111 are opened through the flexible circuit board 11, the connectors 41 are passed through the first through holes 111, and are exposed on a side of the heat absorption portion 4 close to the heat conducting portion 2, and the connectors 41 are in thermal contact with the heat conducting portion 2.

[0087] The heat absorbing part 4 is fixedly connected to the flexible circuit board 11 through the connecting piece 41, and after absorbing at least part of the heat generated by the light-emitting part 12 through the second heat conduction channel and the third heat conduction channel, the heat can be conducted to the heat-conducting part 2 through the connecting piece 41, and finally the heat is conducted to the air in the heat dissipation gap 21 through the heat-conducting part 2 to complete the heat dissipation of the flash body 1. The connecting piece 41 not only has a connecting function, but also has a heat conduction function, which can conduct the heat generated by the light-emitting part to the heat-conducting part 2 in a timely manner to complete its own cooling.

[0088] In some embodiments of the present application, Figure 6 As shown, the heat-conducting part 2 may further include a rigid support member 25, which is located between the flexible circuit board 11 and the heat-conducting part 2 and is respectively connected to the flexible circuit board 11 and the heat-conducting part 2; a plurality of second through holes 251 are formed through the rigid support member 25, and the connecting member 41 penetrates the first through hole 111 and the second through hole 251 and contacts the heat-conducting part 2.

[0089] By arranging a rigid support member 25 between the flexible circuit board 11 and the heat-conducting part 2, support can be applied to the flexible circuit board 11, and the connecting member 41 on the heat-absorbing part 4 can pass through the second through hole 251 on the rigid support member 25 to directly contact the heat-conducting part 2, and the heat absorbed by the heat-absorbing part 4 is transferred to the heat-conducting part 2, thereby realizing heat dissipation of the flash body 1.

[0090] In some embodiments, the rigid support member 25 is a metal member or a member with a heat absorption function. The heat conducted by the light-emitting member 12 to the flexible circuit board 11 and the heat absorption part 4 can also be partially absorbed by the rigid support member 25, further improving the heat dissipation performance of the flash module.

[0091] Optionally, the rigid support member 25 is a metal member. Exemplarily, the rigid support member 25 is a steel plate.

[0092] In some embodiments, a first adhesive 26 is provided between the rigid support member 25 and the flexible circuit board 11, and the two are bonded and connected by the first adhesive 26; and / or a second adhesive 27 is provided between the rigid support member 25 and the heat conducting portion 2, and the two are bonded and connected by the second adhesive 27. Correspondingly, both the first adhesive 26 and the second adhesive 27 are provided with through holes, and the through holes correspond to the positions of the first through hole 111 and the second through hole 251, and the connector penetrates the first through hole 111, the through hole on the first adhesive 26, the second through hole 251 and the through hole on the second adhesive 27, and contacts the heat conducting portion 2.

[0093] In some embodiments, Figure 1 As shown, the flash module can also include a flash cover 5, a decorative part 6 and a lens 7; the flash cover 5 is located on the side of the flash body 1 away from the bearing part 3, and is covered on the flash body 1, and can convert the direct light of the flash into soft heat dissipation light; a through hole is opened inside the decorative part 6, and is mounted on the outside of the flash body 1 and the flash cover 5, and the lens 7 is located in the through hole and is connected to the flash cover 5.

[0094] A second aspect of the present application provides an electronic device, which includes the above-mentioned flash module.

[0095] In the electronic device provided in the embodiment of the present application, a heat conducting part 2 is arranged between the bearing part 3 and the flash body 1. The heat conducting part 2 can absorb at least part of the heat when the flash body 1 emits flash and generates heat, and there is a heat dissipation gap 21 between the heat conducting part 2 and the bearing part 3. The heat conducting part 2 can conduct part of the absorbed heat to the air in the heat dissipation gap 21 to complete the heat diffusion, and the heat dissipation effect is good, which avoids heat accumulation at the main board near the flash, and further avoids the heat generated by the flash body 1 from affecting the performance of the main board, and can meet the heat dissipation requirements of the whole machine.

[0096] Furthermore, since the above-mentioned flash module is provided, the electronic device can meet the high power and high efficiency requirements of the flash, thereby improving the photographing performance without affecting the performance of the mainboard.

[0097] Optionally, the electronic device in the embodiment of the present application may be any one of a mobile phone, a tablet computer, a camera, a wearable device, etc.

[0098] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0099] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the utility model disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0100] It should be understood that the present application is not limited to the exact construction that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof.

Claims

1. A flashlight module, characterized in that: The flash lamp module comprises a flash lamp body (1), a heat conducting part (2) and a bearing part (3); The flashlight body (1) is attached to one side of the heat conducting part (2), and the bearing part (3) is located on a side of the heat conducting part (2) away from the flashlight body (1), and is fixedly connected to the heat conducting part (2); A heat dissipation gap (21) is formed between at least a portion of the heat-conducting portion (2) and the bearing portion (3), and at least a portion of the heat generated by the flash lamp body (1) can be diffused to the heat dissipation gap (21) through the heat-conducting portion (2).

2. The flash module according to claim 1, characterized in that: The bearing portion (3) has a first surface (30) facing the heat conducting portion (2), and the heat conducting portion (2) has a second surface (20) facing the bearing portion (3), wherein: At least one first protrusion (31) is provided on the first surface (30), and the at least one first protrusion (31) is connected to or abuts against the second surface (20) to form the heat dissipation gap (21) between the first surface (30) and the second surface (20); and / or, At least one second protrusion (22) is provided on the second surface (20), and the at least one second protrusion (22) is connected to or abuts against the first surface (30) to form the heat dissipation gap (21) between the first surface (30) and the second surface (20).

3. The flash module according to claim 1, characterized in that: The bearing portion (3) has a first surface (30) facing the heat conducting portion (2), and the heat conducting portion (2) has a second surface (20) facing the bearing portion (3), wherein: A first groove is provided on the first surface (30), and a gap is provided between the bottom wall of the first groove and the second surface (20), so as to form the heat dissipation gap (21) between the first surface (30) and the second surface (20); and / or, A second groove is provided on the second surface (20), and a gap is provided between a groove bottom wall of the second groove and the first surface (30) so as to form the heat dissipation gap (21) between the first surface (30) and the second surface (20).

4. The flash module according to any one of claims 1 to 3, characterized in that: The heat conducting part (2) comprises a heat conducting member (23) and a bracket (24); The heat conducting member (23) wraps at least a portion of the bracket (24) and is in contact with the flashlight body (1), and a heat dissipation gap (21) is formed between a side of the heat conducting member (23) away from the flashlight body (1) and the bearing portion (3); Wherein, the density of the bracket (24) is smaller than the density of the heat conducting element (23).

5. The flash module according to claim 4, characterized in that: The heat conducting member (23) comprises a first plate body (231), a second plate body (232) and a connecting plate (233); The first plate body (231) and the second plate body (232) are stacked and arranged at intervals, a slot is formed between the first plate body (231) and the second plate body (232), and the connecting plate (233) is respectively connected to the first plate body (231) and the second plate body (232); The flash lamp body (1) is attached to a surface of the first plate (231) facing away from the second plate, and a heat dissipation gap (21) is formed between a surface of the second plate (232) facing away from the first plate (231) and the bearing portion (3); At least a portion of the bracket (24) is located in the slot and is connected to the heat conducting member (23).

6. The flash module according to claim 1, characterized in that: The flash lamp body (1) comprises a flexible circuit board (11) and a light-emitting element (12), wherein the flexible circuit board (11) is attached to the heat-conducting portion (2), and the light-emitting element (12) is fixed to a surface of the flexible circuit board (11) facing away from the heat-conducting portion (2) and is electrically connected to the flexible circuit board (11) for emitting light; The flash module further comprises a heat absorbing portion (4), which is arranged on a surface of the flexible circuit board (11) facing away from the heat conducting portion (2) and adjacent to the light emitting element (12) and is used to absorb at least part of the heat generated by the light emitting element (12).

7. The flash module according to claim 6, characterized in that: The heat absorbing portion (4) is a light absorbing component with light absorbing properties, and is used to absorb the heat radiation generated by the light emitted by the light emitting component (12).

8. The flash module according to claim 7, characterized in that: The heat absorbing part is a graphite-metal composite part, and the graphite-metal composite part is a component formed by mixing graphite powder into liquid metal and then solidifying it.

9. The flash module according to claim 6, characterized in that: The heat absorbing portion (4) is annular in shape, and the light emitting element (12) is located on the inner side of the heat absorbing portion (4).

10. The flash module according to claim 6, characterized in that: The heat absorbing portion (4) is provided with a plurality of connecting members (41), the flexible circuit board (11) is provided with a plurality of first through holes (111), the connecting members are passed through the first through holes (111) and exposed on a side of the heat absorbing portion (4) close to the heat conducting portion (2), and the connecting members are in thermal contact with the heat conducting portion (2).

11. The flash module according to claim 10, characterized in that: The heat conducting part (2) further comprises a rigid support member (25), wherein the rigid support member (25) is located between the flexible circuit board (11) and the heat conducting part (2), and is respectively connected to the flexible circuit board (11) and the heat conducting part (2); The rigid support member (25) is provided with a plurality of second through holes (251), and the connecting member (41) penetrates the first through holes (111) and the second through holes (251) and contacts the heat conducting portion (2).

12. An electronic device, characterized in that: The electronic device comprises the flash module according to any one of claims 1 to 11.

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