Cooling system for stage lamp

By designing a circulating heat dissipation system for the cooling system in the stage lamp, the heat accumulation problem of the stage lamp when the laser irradiates the wavelength conversion material is solved, and efficient heat dissipation of the chip and wavelength conversion components is achieved, and the heat dissipation efficiency is improved.

CN223228372UActive Publication Date: 2025-08-15SHANGHAI SHUOMI NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202422385184.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2025-08-15
Estimated Expiration
2034-09-29

AI Technical Summary

Technical Problem

The accumulation of heat generated by stage lamps when the laser irradiates the wavelength conversion material leads to problems such as lower wavelength conversion efficiency and rising chip operating temperature.

Method used

A cooling system is designed to connect the radiator to the chip assembly and wavelength conversion assembly into a circulating heat dissipation system through the cooling pipeline and the return pipeline, and use a pump to drive the coolant to circulate for heat dissipation.

Benefits of technology

It realizes efficient heat dissipation of chips and wavelength conversion components at the same time, saves the use of radiators and improves heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a cooling system for a stage lamp. The cooling system comprises a chip assembly. The radiator is connected with the chip assembly through a cooling pipeline, and a power source is arranged on the cooling pipeline; one end of the wavelength conversion assembly is connected with the chip assembly through a first backflow pipeline, and the other end of the wavelength conversion assembly is connected with the radiator through a second backflow pipeline. The radiator, the chip and the wavelength conversion assembly are connected into a circulating heat dissipation system through the cooling pipeline and the backflow pipeline, so that the chip and the wavelength conversion assembly can be cooled at the same time through one radiator, the usage amount of the radiator is reduced, and the heat dissipation efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of stage lamps, in particular to a cooling system for stage lamps. Background Art

[0002] Stage lights are essential equipment for stage performances, and they can produce a variety of lighting effects under the control of a control system. To enable stage lights to emit a variety of colors, lasers and other light sources are currently used to illuminate wavelength-converting materials for excitation.

[0003] However, since a large amount of heat is generated when the laser irradiates the wavelength conversion material, the accumulation of heat will lead to a decrease in the wavelength conversion efficiency. At the same time, the excess heat will also cause the temperature of the stage light control system to rise, which will burden the normal operation of the chip. Utility Model Content

[0004] In view of the existing problems, the utility model provides a cooling system for stage lights to solve the above problems.

[0005] A cooling system for a stage lamp, comprising

[0006] Chip components;

[0007] A radiator, wherein the radiator is connected to the chip assembly via a cooling pipeline, and a power source is provided on the cooling pipeline;

[0008] A wavelength conversion component, one end of which is connected to the chip component through a first return line, and the other end of which is connected to the radiator through a second return line.

[0009] In a possible implementation, the wavelength conversion component includes a wavelength conversion material layer and a first cooling cavity, the wavelength conversion material layer is placed in the first cooling cavity, and the first return line or the second return line is connected to the first cooling cavity.

[0010] In a possible implementation, the chip assembly includes a chip and a second cooling cavity, the chip is placed in the second cooling cavity, and the cooling pipeline or the first return pipeline is connected to the second cooling cavity.

[0011] In a possible implementation manner, the power source is a pump.

[0012] In a possible implementation, the radiator is a water-cooled radiator or an oil-cooled radiator.

[0013] In a possible implementation, the wavelength conversion component further includes a condenser lens, and the condenser lens is disposed above the wavelength conversion material layer.

[0014] In a possible implementation, the first cooling cavity is made of an optically transparent material.

[0015] Compared with the prior art, the utility model has the following advantages:

[0016] The radiator, chip and wavelength conversion component are connected into a circulating heat dissipation system using cooling pipes and return pipes, so that one radiator can dissipate heat for the chip and wavelength conversion component at the same time, saving the use of radiators and improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0018] In the figure: 10, wavelength conversion component, 20, chip component, 30, cooling pipe, 40, first return pipe, 50, radiator, 60, pump, 70, second return pipe, 11, wavelength conversion material layer, 12, first cooling cavity, 13, focusing lens, 21, chip, 22, second cooling cavity. DETAILED DESCRIPTION

[0019] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0020] The following describes the embodiments of the present disclosure through specific concrete examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0021] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structures and / or functions described herein are merely illustrative. Based on this disclosure, those skilled in the art will appreciate that an aspect described herein can be implemented independently of any other aspect, and that two or more of these aspects can be combined in various ways.

[0022] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure. The illustrations only show structures related to the present disclosure and are not drawn according to the number, shape and size of structures in actual implementation. In actual implementation, the form, quantity and proportion of each structure may be changed at will, and its structural layout may also be more complex.

[0023] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described can be practiced without these specific details.

[0024] See also Figure 1 A cooling system for a stage light includes: a chip assembly 20; a radiator 50, which serves as a cold source and can provide cooling water or cooling oil to the pipeline. The radiator 50 is connected to the chip assembly 20 via a cooling pipeline 30, and the cooling pipeline 30 is provided with a power source 60; a wavelength conversion assembly 10, one end of the wavelength conversion assembly 10 is connected to the chip assembly 20 via a first return pipeline 40, and the other end is connected to the radiator 50 via a second return pipeline 70.

[0025] The power source 60 can be a pump, such as a peristaltic pump, which delivers a coolant, such as cooling water or cooling oil, to the cooling line 30. Furthermore, because the cooling line 30, the first return line 40, and the second return line 70 form a circulation line, the cooling water or cooling oil can cool the chip and the wavelength conversion material layer.

[0026] Furthermore, the chip assembly 20 includes a chip 21 and a second cooling cavity 22. The chip 21 is placed in the second cooling cavity 22. The second cooling cavity 22 is a closed structure. In this application, the chip is mainly used to control the laser intensity, irradiation time, etc. irradiated to the wavelength conversion material.

[0027] Furthermore, the wavelength conversion component 10 includes a wavelength conversion material layer 11, a first cooling cavity 12 and a condenser 13. The condenser 13 is arranged above the wavelength conversion material layer 11, and the wavelength conversion material layer 11 is placed in the first cooling cavity 12, that is, the first cooling cavity 12 seals the wavelength conversion material layer. The first return line 40 or the second return line 70 is connected to the first cooling cavity 12. The first cooling cavity 12 is made of an optically transparent material so that the light beam converged by the condenser 13 can be irradiated onto the wavelength conversion material. In the present application, the wavelength conversion material in the wavelength conversion material layer 11 can be fluorescent powder, phosphor powder or quantum dots, etc. The condenser 13 can converge the excitation light so that the light energy incident on the wavelength conversion material can meet the excitation requirements.

[0028] During operation, the pump is activated to transport the cooling water or oil from the radiator through the cooling pipe to the second cooling chamber to cool the chip. The cooling water or oil then enters the first return pipe and, under the action of the pump, enters the first cooling chamber to cool the wavelength conversion material. Finally, the used cooling water or oil returns to the radiator, completing the entire cooling cycle. The flow rate of the cooling water or oil can be adjusted by adjusting the pump speed to achieve the desired cooling effect.

[0029] The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A cooling system for a stage light, characterized in that: include Chip assembly (20); A radiator (50), the radiator (50) and the chip assembly (20) are connected via a cooling pipe (30), and a power source (60) is provided on the cooling pipe (30); A wavelength conversion component (10) is provided, wherein one end of the wavelength conversion component (10) is connected to the chip component (20) via a first return line (40), and the other end of the wavelength conversion component (10) is connected to the heat sink (50) via a second return line (70).

2. A cooling system for a stage light according to claim 1, characterized in that: The wavelength conversion component (10) comprises a wavelength conversion material layer (11) and a first cooling cavity (12), wherein the wavelength conversion material layer (11) is placed in the first cooling cavity (12), and the first return line (40) or the second return line (70) is connected to the first cooling cavity (12).

3. A cooling system for a stage light according to claim 1, characterized in that: The chip assembly (20) comprises a chip (21) and a second cooling cavity (22), the chip (21) is placed in the second cooling cavity (22), and the cooling pipeline (30) or the first return pipeline (40) is connected to the second cooling cavity (22).

4. A cooling system for a stage light according to claim 1, characterized in that: The radiator (50) is a water-cooled radiator or an oil-cooled radiator.

5. The cooling system for a stage light according to claim 1, characterized in that: The power source (60) is a pump.

6. A cooling system for a stage light according to claim 2, characterized in that: The wavelength conversion component (10) further comprises a condenser (13), and the condenser (13) is arranged above the wavelength conversion material layer (11).

7. The cooling system for a stage light according to claim 2, characterized in that: The first cooling cavity (12) is a cooling cavity made of an optically transparent material.

Citation Information

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