A light source component

Abstract

The utility model relates to the technical field of light sources, and in particular to a light source assembly, which includes a light emitting chip, a wavelength conversion element and a semiconductor refrigerator. The light emitted by the light emitting chip is directed to the wavelength conversion element to excite and generate fluorescence, and the light emitting chip and the wavelength conversion element are thermally connected to the same working end of the semiconductor refrigerator. The light source assembly described in the utility model has a simple and compact structure and occupies a small volume. The semiconductor refrigerator is used to simultaneously control the temperature of the light emitting chip and the wavelength conversion element, so as to ensure that the light source assembly works long-term and stably in a suitable temperature environment, thereby improving the luminous efficiency and working stability.

Description

Technical Field

[0001] The utility model relates to the technical field of light sources, in particular to a light source component. Background Art

[0002] Light sources are important components of projection and lighting devices, and their light quality affects the overall quality of use of projection and lighting devices, such as the quality of the projection image of a projector. A commonly used light source component is a laser package light source, which is a high-power light source and is also accompanied by high heat generation. A large temperature rise will lead to more serious thermal expansion and contraction, which will change the bandgap width of the material, causing changes in the refractive index, and the output light beam working wavelength to change. When the temperature rises, it will also cause wavelength drift. The existing light source component has limited heat dissipation efficiency, and it is difficult to ensure that the light source component is at a suitable working temperature for a long time and stably, which affects the light efficiency and working reliability of the light source component. Utility Model Content

[0003] The technical problem to be solved and the technical task proposed by the utility model are to improve the existing technology and provide a light source component to solve the problem that the heat dissipation efficiency of the light source component in the current technology is limited, it is difficult to ensure the long-term and stable operation of the light source component at a suitable temperature, which affects the luminous efficiency and working reliability.

[0004] In order to solve the above technical problems, the technical solution of the utility model is:

[0005] A light source assembly comprises a light emitting chip, a wavelength conversion element, a heat conductive substrate, a semiconductor refrigerator and a substrate, wherein the light emitting chip and the wavelength conversion element are connected to the heat conductive substrate by heat conduction, the light emitted by the light emitting chip is directed to the wavelength conversion element to excite and generate fluorescence, the heat conductive substrate is connected to the working end 1 of the semiconductor refrigerator by heat conduction, and the working end 2 of the semiconductor refrigerator is connected to the substrate by heat conduction. The light source assembly described in the utility model has a simple and compact structure, and uses a semiconductor refrigerator to actively dissipate heat for the light emitting chip and the wavelength conversion element. When the light emitting chip is irradiated on the wavelength conversion element, the wavelength conversion element is excited to generate fluorescence with a wavelength different from the light emitted by the light emitting chip. Both the light emitting chip and the wavelength conversion element will generate a large amount of heat when working. The heat accumulation leads to excessive temperature rise, which will reduce the working stability and working efficiency of the light emitting chip and the wavelength conversion element, causing the light emitting chip to drift in wavelength and reduce the excitation conversion efficiency of the wavelength conversion element. The utility model uses a semiconductor refrigerator to actively control the temperature of the light emitting chip and the wavelength conversion element at the same time. When the temperature of the light emitting chip and the wavelength conversion element rises, the current loaded on the semiconductor refrigerator is controlled so that the working end 1 of the semiconductor refrigerator is the cold end. The second working end is the hot end, so that the heat generated by the light-emitting chip and the wavelength conversion element is dissipated from the base to the outside through the semiconductor refrigerator. When the ambient temperature is low, the light-emitting chip and the wavelength conversion element can be heated by the semiconductor refrigerator. Compared with the heat dissipation cooling mode, the current loaded on the semiconductor refrigerator is controlled to be reversed, so that the working end one of the semiconductor refrigerator can be the hot end and the working end two can be the cold end, thereby realizing the heating of the light-emitting chip and the wavelength conversion element, and then ensuring that the light-emitting chip and the wavelength conversion element can work stably and for a long time at a suitable temperature state, thereby improving the luminous efficiency and working stability. In the utility model, the semiconductor refrigerator is integrated with the light-emitting chip and the wavelength conversion element in a package, and the semiconductor refrigerator simultaneously controls the temperature of the light-emitting chip and the wavelength conversion element, with a compact structure and a small size.

[0006] Furthermore, the base is connected to the circuit substrate, and the light-emitting chip and the semiconductor cooler are electrically connected to the circuit on the circuit substrate. The structure is simple and the integration is high. The circuit substrate is used to realize the power-on control of the light-emitting chip and the semiconductor cooler, which is convenient for connecting the light source component with the outside and for SMT patch installation.

[0007] Furthermore, a positioning groove for placing the base is provided on the circuit substrate to improve connection stability and accuracy.

[0008] Furthermore, the circuit substrate adopts a base material made of a heat-conductive material, and the base is thermally connected to the circuit substrate, so that the circuit substrate and the base can fully exchange heat. The circuit substrate has a larger size and surface area than the base, so that the circuit substrate can be used for more efficient temperature control, and better ensure that the light-emitting chip and the wavelength conversion element work stably and long-term at a suitable temperature.

[0009] Furthermore, it also includes a ring-shaped frame, which surrounds the outer periphery of the base, and the frame and the base are combined to form a cavity, and the light-emitting chip, wavelength conversion element, heat-conducting substrate and semiconductor refrigerator are arranged in the cavity, and a light-transmitting window for light emission is packaged and connected on the frame. The light-emitting chip, wavelength conversion element, heat-conducting substrate and semiconductor refrigerator are packaged in a closed space, and are kept isolated from the outside, avoiding adverse effects from the outside, ensuring the light-emitting quality and extending the service life.

[0010] Furthermore, the light-transmitting window is a filter element, which filters the outgoing light, removes unnecessary wavelengths, and improves the purity of the outgoing light.

[0011] Furthermore, the light emitted by the light-emitting chip is obliquely directed toward the wavelength conversion element. The wavelength conversion element is excited to generate fluorescence under the illumination of the light-emitting chip. The emitted fluorescence has a large divergence angle. When the light emitted by the light-emitting chip is obliquely directed toward the wavelength conversion element, it is convenient to separate the optical paths of the light emitted by the light-emitting chip and the fluorescence generated by the wavelength conversion element. There is no need to set up a spectroscopic device, and the light-emitting chip is not in the emission optical path of the fluorescence, which will not hinder the emission of the fluorescence, which is conducive to making the structure of the light source assembly more compact and reducing the occupied volume.

[0012] Furthermore, the wavelength conversion element is a reflective fluorescent ceramic sheet or fluorescent glass with a simple and compact structure. The light emitted by the light-emitting chip is obliquely irradiated on the surface of the wavelength conversion element, and the fluorescence generated by the wavelength conversion element is emitted in the opposite direction as a whole.

[0013] Furthermore, the light-emitting chip is provided with a plurality of light sources that emit light toward the wavelength conversion element from different directions, thereby increasing the light output power of the light-emitting chip, increasing the power of the excitation light irradiated on the wavelength conversion element, increasing the fluorescence generated by the excitation, increasing the utilization rate of the wavelength conversion element, and increasing the light output power.

[0014] Furthermore, a support member is provided on the heat conductive substrate, and an inclined surface inclined to the surface of the wavelength conversion element is provided on the support member, and the light emitting chip is placed on the inclined surface to obliquely irradiate the wavelength conversion element. The structure is simple and stable, and the light emitting chip is kept to irradiate the wavelength conversion element at a stable inclined angle, thereby ensuring the stability and efficiency of fluorescence excitation conversion.

[0015] Compared with the prior art, the utility model has the following advantages:

[0016] The light source assembly described in the utility model has a simple and compact structure and occupies a small volume. A semiconductor cooler is used to simultaneously control the temperature of the light-emitting chip and the wavelength conversion element, thereby ensuring that the light source assembly can operate stably and long-term in a suitable temperature environment, thereby improving the luminous efficiency and working stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic cross-sectional structure diagram of a light source assembly of the utility model;

[0018] Figure 2 This is a schematic diagram of the exploded structure of a light source assembly of the utility model;

[0019] Figure 3 It is a schematic cross-sectional structure diagram of another light source assembly of the utility model.

[0020] In the figure:

[0021] Light emitting chip 1, wavelength conversion element 2, heat conductive substrate 3, support member 31, semiconductor refrigerator 4, working end 1 41, working end 2 42, base 5, frame 6, conductive layer 61, light-transmitting window 7, circuit substrate 8, positioning groove 81. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The light source component disclosed in the embodiment of the utility model has high temperature control efficiency and good effect, can play a good role in heat dissipation of heat accumulation effect, ensure the long-term and stable operation of the light source component in a suitable temperature environment, and improve the luminous efficiency and working stability.

[0024] like Figure 1 and Figure 2 As shown, a light source assembly includes a light emitting chip 1, a wavelength conversion element 2, a heat conductive substrate 3, a semiconductor refrigerator 4 and a substrate 5. The light emitting chip 1 and the wavelength conversion element 2 are thermally connected to the heat conductive substrate 3. The light emitted by the light emitting chip 1 is directed toward the wavelength conversion element 2 to excite and generate fluorescence. The heat conductive substrate 3 is thermally connected to a working end 1 41 of the semiconductor refrigerator 4, and a working end 2 42 of the semiconductor refrigerator 4 is thermally connected to the substrate 5.

[0025] The light-emitting chip 1 is specifically a laser COS chip, which emits excitation light in a narrow band range. A fluorescence conversion medium is provided on the wavelength conversion element 2. When the light emitted by the light-emitting chip 1 irradiates the wavelength conversion element 2, the fluorescence conversion medium is excited to generate fluorescence. Under normal circumstances, the wavelength range of the fluorescence is different from the wavelength range of the excitation light, and the fluorescence is emitted from the light source component as the output light of the light source component. The light-emitting chip 1 and the wavelength conversion element 2 generate a large amount of heat when working, which can easily lead to excessive temperature and affect the working stability and working efficiency of the light-emitting chip 1 and the wavelength conversion element 2. Therefore, the present embodiment uses a semiconductor refrigerator 4 to control the temperature of the light-emitting chip 1 and the wavelength conversion element 2 to ensure that the light-emitting chip 1 and the wavelength conversion element 2 work in a suitable temperature condition for a long time and stably, and to ensure the light conversion efficiency and light output quality. The semiconductor refrigerator 4 is made using the Peltier effect of semiconductor materials. When direct current passes through the couple composed of two semiconductor materials of the semiconductor refrigerator, one end absorbs heat and the other end releases heat. The working operation of the semiconductor refrigerator uses direct current, which can be used for both cooling and heating. The semiconductor refrigerator is determined by changing the polarity of the direct current to achieve cooling or heating, thereby realizing two-way temperature control. In other words, at room temperature or high temperature, the semiconductor refrigerator 4 cools and dissipates heat for the light-emitting chip 1 and the wavelength conversion element 2, while in a low temperature environment, the semiconductor refrigerator 4 heats the light-emitting chip 1 and the wavelength conversion element 2, thereby maintaining the long-term and stable operation of the light-emitting chip 1 and the wavelength conversion element 2 under suitable temperature conditions. More specifically, at room temperature or high temperature, a forward current is passed through the semiconductor refrigerator 4, and the working end 1 41 of the semiconductor refrigerator 4 is the cold end and the working end 2 42 is the hot end. Since the light-emitting chip 1 and the wavelength conversion element 2 are both thermally connected to the working end 1 41, the light-emitting chip 1 and the wavelength conversion element 2 can be cooled and dissipated at the same time. The structure is compact and the volume is small. The heat generated by the light-emitting chip 1 and the wavelength conversion element 2 is conducted to the substrate 5 through the semiconductor refrigerator 4 to be dissipated from the substrate 5. In a low temperature environment, the temperature of the light-emitting chip 1 and the wavelength conversion element 2 is too low, which will also affect Influencing the light output quality, when the heat generated by the light emitting chip 1 and the wavelength conversion element 2 during operation cannot effectively heat the light emitting chip 1 and the wavelength conversion element 2 to a suitable temperature, the light emitting chip 1 and the wavelength conversion element 2 are heated by the semiconductor refrigerator 4. Specifically, a reverse current is passed through the semiconductor refrigerator 4 at this time, and the working end 1 41 of the semiconductor refrigerator 4 is the hot end and the working end 2 42 is the cold end, thereby achieving simultaneous heating of the light emitting chip 1 and the wavelength conversion element 2, thereby maintaining the light emitting chip 1 and the wavelength conversion element 2 stably at a suitable temperature state, thereby ensuring the light conversion efficiency and light output quality.

[0026] exist Figure 1 and Figure 2In the illustrated embodiment, the heat-conducting substrate 3 is in the shape of a flat plate as a whole, the light-emitting chip 1 and the wavelength conversion element 2 are both arranged on one side of the upper surface of the heat-conducting substrate 3, and the lower surface of the heat-conducting substrate 3 is thermally connected to the working end 41 of the semiconductor refrigerator 4. Specifically, the connection and heat conduction can be achieved by means of a heat-conducting adhesive, solder, etc. The wavelength conversion element 2 is in the shape of a sheet as a whole, and is thermally connected to the heat-conducting substrate 3 in a state that is basically parallel to the upper surface of the heat-conducting substrate 3. More specifically, a groove is provided on the heat-conducting substrate 3 to position and place the wavelength conversion element 2, thereby improving the placement accuracy of the wavelength conversion element 2. Similarly, the wavelength conversion element 2 can be connected to the heat-conducting substrate 3 by means of a heat-conducting adhesive, solder, etc.

[0027] Furthermore, the light emitted by the light emitting chip 1 is directed obliquely toward the wavelength conversion element 2. By controlling the angle of the light emitted by the light emitting chip 1 relative to the surface of the wavelength conversion element 2 to control the shape and size of the light spot formed by the light emitting chip 1 irradiating the wavelength conversion element 2, a light spot with a large coverage range and / or uniformity is formed on the wavelength conversion element 2 as much as possible, which is beneficial to improving the fluorescence conversion efficiency. Furthermore, in this embodiment, the wavelength conversion element 2 adopts a reflective device, which can be a reflective fluorescent ceramic plate or fluorescent glass, so that the fluorescence generated by the excitation light irradiating the wavelength conversion element 2 is in a reverse emission state relative to the excitation light. The fluorescence divergence angle generated by the wavelength conversion element 2 is large, and the wavelength conversion element 2 adopts a reflective device. Then, when the light emitted by the light emitting chip 1 is directed obliquely toward the wavelength conversion element 2, the light emitting chip 1 will not be in the emission light path of the fluorescence, so that the light emitting chip 1 will not hinder the emission of fluorescence. In the present embodiment, the overall light emitting direction of the light source assembly is along the normal direction of the surface of the wavelength conversion element 2. Since the wavelength conversion element 2 adopts a reflective device, the light emitting direction of the light emitting chip 1 is generally opposite to the overall light emitting direction of the light source assembly. This method has better safety characteristics. The light emitted by the light emitting chip 1 cannot be directly emitted from the overall light emitting direction of the light source assembly. Therefore, when the wavelength conversion element 2 is damaged, the light emitted by the light emitting chip 1 will only be irradiated on the thermal conductive substrate 3, and the laser beam emitted by the light emitting chip 1 will not be emitted to the outside world of the light source assembly, thereby avoiding damage to the outside world. The thermal conductive substrate 3 can be used to scatter or absorb the laser beam emitted by the light emitting chip 1, thereby better avoiding the laser beam emitted by the light emitting chip 1 from being emitted to the outside world of the light source assembly.

[0028] like Figure 1 and Figure 2As shown, a supporting member 31 is provided on the thermally conductive substrate 3, and a slope inclined to the surface of the wavelength conversion element 2 is provided on the supporting member 31. The light-emitting chip 1 is placed on the slope to be obliquely emitted toward the wavelength conversion element 2. The supporting member 31 is made of a thermally conductive material to ensure that the light-emitting chip 1 can efficiently conduct heat with the thermally conductive substrate 3. The light-emitting chip 1 is stably supported on the thermally conductive substrate 3 by the supporting member 31. The light-emitting chip 1 is higher than the position of the wavelength conversion element 2 as a whole, so that the light emitted by the light-emitting chip 1 is inclined to the surface of the wavelength conversion element 2, and the light-emitting chip 1 will not hinder the emission of fluorescence. Furthermore, a plurality of light-emitting chips 1 are provided, and each light-emitting chip 1 is respectively placed and connected on a supporting member 31. Preferably, the light-emitting chips 1 are distributed on both sides or in a circumferential direction of the wavelength conversion element 2, so that the light emitted by different light-emitting chips 1 is emitted toward the wavelength conversion element 2 from different directions, forming a light spot with a larger coverage area and / or higher energy on the wavelength conversion element 2, thereby improving the fluorescence excitation conversion efficiency, improving the utilization rate of the wavelength conversion element 2, and improving the light output brightness of the light source assembly.

[0029] like Figure 2 As shown, the light source assembly also includes a ring-shaped frame 6, the frame 6 surrounds the outer periphery of the base 5, the frame 6 and the base 5 are combined to form a cavity, the light-emitting chip 1, the wavelength conversion element 2, the heat-conducting substrate 3 and the semiconductor refrigerator 4 are arranged in the cavity, the frame 6 is packaged and connected with a light-transmitting window 7 for light output, the light-transmitting window 7 is in the fluorescent light output path of the wavelength conversion element 2, the light output direction of the light-emitting chip 1 is opposite to the light-transmitting window 7, the frame 6, the base 5 and the light-transmitting window 7 are connected to form a closed chamber, and the other components are packaged in the closed chamber to avoid contact with the outside world, avoid adverse effects from the outside world, ensure the light quality, and extend the service life. Preferably, the light-transmitting window 7 is a filter element, which filters the overall light output of the light source assembly, filters out unnecessary bands, and improves the purity of the light output.

[0030] Furthermore, the light source assembly also includes a circuit substrate 8, the substrate 5 is connected to the circuit substrate 8, the light emitting chip 1 and the semiconductor refrigerator 4 are electrically connected to the circuit on the circuit substrate 8, the circuit substrate 8 is used to electrically connect the light emitting chip 1 and the semiconductor refrigerator 4 to external devices, and the circuit substrate 8 is used as the connecting part of the light source assembly to realize the SMT patch installation of the light source assembly. Preferably, a positioning groove 81 for placing the substrate 5 is provided on the circuit substrate 8, so that the substrate 5 can be more accurately connected to the circuit substrate 8, and the circuit substrate 8 is preferably made of a substrate made of a heat-conducting material, for example, the circuit substrate 8 is made of a ceramic substrate, and a circuit is processed on the ceramic substrate by coating, the substrate 5 is connected to the circuit substrate 8 by thermal conduction, the circuit substrate 8 has a larger surface area, and the heat on the substrate 5 can be conducted to the circuit substrate 8 to dissipate outward, so as to better improve the heat dissipation effect, and ensure that the light emitting chip 1 and the semiconductor refrigerator 4 work long-term and stably under a suitable temperature condition, and the substrate 5 is placed in the positioning groove 81 set on the circuit substrate 8, which can increase the contact area between the substrate 5 and the circuit substrate 8, thereby improving the heat conduction efficiency between the two, and thus better improving the heat dissipation efficiency.

[0031] like Figure 2 As shown, in one embodiment, the frame 6 is made of insulating material, such as ceramic material, and a conductive layer 61 is processed on the frame 6 by coating. The circuit on the circuit substrate 8 is electrically connected to the light-emitting chip 1 and the semiconductor refrigerator 4 through the conductive layer 61 on the frame 6, so that reliable electrical connection is achieved while ensuring the sealing of the package, and the power supply of the light-emitting chip 1 and the semiconductor refrigerator 4 can be effectively controlled as needed, that is, the semiconductor refrigerator 4 can be used to dissipate heat and cool the light-emitting chip 1 and the wavelength conversion element 2, and the semiconductor refrigerator 4 can also be used to heat and heat the light-emitting chip 1 and the wavelength conversion element 2, so as to ensure that the light-emitting chip 1 and the wavelength conversion element 2 can work stably for a long time under a suitable temperature state, thereby ensuring the luminous efficiency and quality and extending the service life.

[0032] like Figure 3In the embodiment of a light source assembly shown, the wavelength conversion element 2 may also be a transmissive device, that is, after the light from the light emitting chip 1 is irradiated on one side of the wavelength conversion element 2, the fluorescence generated on the wavelength conversion element 2 is emitted from the other side of the wavelength conversion element 2. Similarly, the light emitting chip 1 and the wavelength conversion element 2 are both thermally connected to the heat conductive substrate 3, the heat conductive substrate 3 is thermally connected to the working end 1 41 of the semiconductor refrigerator 4, and the working end 2 42 of the semiconductor refrigerator 4 is thermally connected to the substrate 5. Specifically, the light emitted by the light emitting chip 1 is vertically or obliquely directed to the wavelength conversion element 2, and the fluorescence generated by the wavelength conversion element 2 is emitted from the other side of the wavelength conversion element 2. The light-transmitting window 7 on the frame 6 is in the emission light path of the fluorescence, and the fluorescence passes through the light-transmitting window 7 to constitute the emission light of the light source assembly. Similarly, the light-transmitting window 7 can be a filter element to filter the light, filter out unnecessary wavelengths, and improve the purity of the emitted light.

[0033] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention. The protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A light source assembly, characterized in that: The invention comprises a light-emitting chip (1), a wavelength conversion element (2), a heat-conducting substrate (3), a semiconductor refrigerator (4) and a substrate (5); the light-emitting chip (1) and the wavelength conversion element (2) are connected to the heat-conducting substrate (3) by thermal conduction; the light emitted by the light-emitting chip (1) is directed toward the wavelength conversion element (2) to excite and generate fluorescence; the heat-conducting substrate (3) is connected to a first working end (41) of the semiconductor refrigerator (4) by thermal conduction; and a second working end (42) of the semiconductor refrigerator (4) is connected to the substrate (5) by thermal conduction.

2. The light source assembly according to claim 1, characterized in that: The base (5) is connected to a circuit substrate (8), and the light-emitting chip (1) and the semiconductor refrigerator (4) are electrically connected to the circuit on the circuit substrate (8).

3. The light source assembly according to claim 2, characterized in that: The circuit substrate (8) is provided with a positioning groove (81) for accommodating the base (5).

4. The light source assembly according to claim 2, characterized in that: The circuit substrate (8) is a base material made of a heat-conducting material, and the base (5) is connected to the circuit substrate (8) by heat conduction.

5. The light source assembly according to claim 1, characterized in that: The invention also comprises a ring-shaped frame (6), the frame (6) surrounding the outer periphery of the base (5), the frame (6) and the base (5) forming a cavity, the light-emitting chip (1), the wavelength conversion element (2), the heat-conducting substrate (3) and the semiconductor refrigerator (4) being arranged in the cavity, and a light-transmitting window (7) for emitting light being encapsulated and connected on the frame (6).

6. The light source assembly according to claim 5, characterized in that: The light-transmitting window (7) is a light filtering element.

7. The light source assembly according to claim 1, characterized in that: The light emitted by the light-emitting chip (1) is directed obliquely toward the wavelength conversion element (2).

8. The light source assembly according to claim 1, characterized in that: The wavelength conversion element (2) is a reflective fluorescent ceramic sheet or fluorescent glass.

9. The light source assembly according to claim 1, characterized in that: The light-emitting chips (1) are provided with a plurality of light-emitting chips so as to emit light towards the wavelength conversion element (2) from different directions respectively.

10. The light source assembly according to claim 1, characterized in that: A support member (31) is provided on the heat-conducting substrate (3), and an inclined surface inclined to the surface of the wavelength conversion element (2) is provided on the support member (31), and the light-emitting chip (1) is placed on the inclined surface to obliquely emit light toward the wavelength conversion element (2).

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