A PCB circuit board exposure processing platform

Abstract

The utility model discloses a PCB circuit board exposure processing carrier, comprising a first platform body, the top surface of which is evenly provided with through holes; a second platform body, which is fixed to the bottom of the first platform body, and an adsorption component; the adsorption component is placed between the first platform body and the second platform body, and both ends of the adsorption component extend to the outside of the first platform body and the second platform body, and all the vertical projections of the through holes fall on the adsorption component; the two ends of the adsorption component are connected to an external negative pressure device; through the designed adsorption component, PCB circuit boards of various specifications can be adsorbed and limited, compared with the existing technology, this improvement is more flexible and convenient, and no placement slots and other structures are provided on the processing carrier, which makes it more convenient to take the PCB circuit board, and the designed ejection component can further improve the convenience of taking, and improve the shortcomings of the existing structure in use.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board exposure processing, and specifically relates to a PCB circuit board exposure processing carrier. Background Art

[0002] In the processing of the PCB circuit board, the PCB circuit board with the second outer layer of dry film is placed in an exposure device for exposure treatment, and then developed to expose the pattern of the local etching area, and then tinned to protect the local etching area, and then stripped to expose other areas. The structure for placing the PCB circuit board in the exposure device is the exposure processing carrier.

[0003] Publication No. CN117693128A discloses a PCB circuit board exposure device and an exposure method thereof. The patent sets a positioning groove on a processing platform, i.e., a support plate, to limit the installation of the circuit board substrate, i.e., a copper clad laminate. However, the positioning groove in the patent has a fixed size. Once the size of the installed circuit board changes, it will cause unstable placement and inability to limit the position. In addition, the patent requires that the thickness of the copper clad laminate be set to a depth higher than the positioning depth in order to be able to pick it up. In actual operation, there are also certain inconveniences. Therefore, there are great limitations in actual use and there is room for improvement. Utility Model Content

[0004] The purpose of the utility model is to provide a PCB circuit board exposure processing carrier to solve the problem that the existing processing carrier mentioned in the above background technology cannot stably place circuit boards of different specifications.

[0005] To achieve the above purpose, the utility model provides the following technical solutions: a PCB circuit board exposure processing stage, comprising

[0006] The first body has through holes evenly formed on the top surface;

[0007] a second platform fixed to the bottom of the first platform, and

[0008] Adsorption components;

[0009] The adsorption component is placed between the first platform and the second platform, and both ends of the adsorption component extend to the outside of the first platform and the second platform, and all vertical projections of the through holes fall on the adsorption component; both ends of the adsorption component are connected to the external negative pressure equipment, and the negative pressure equipment generates negative pressure suction, which will suck in the air inside and directly above the through hole. At this time, the PCB circuit board placed on the top surface of the first platform will be adsorbed by the negative pressure, thereby achieving stable limiting.

[0010] Preferably, a placement groove passing through all the through holes is provided on the bottom end surface of the first body, and a limiting groove equal to the placement groove in shape, position and size is provided on the top end surface of the second body; the adsorption component is a suction tube, which is placed between the placement groove and the limiting groove, and a suction hole is provided on the top of the suction tube, and both ends of the suction tube protrude to the outside of the first body and the second body, so as to be connected to an external air supply device.

[0011] Preferably, the center of each of the suction holes and the through hole is on the same vertical line, so the negative pressure at the suction hole can adsorb the PCB circuit board at the fastest speed.

[0012] Preferably, the first platform and the second platform are connected by bonding, so as to ensure that the two can be quickly connected and can also be separated with the help of external tools.

[0013] Preferably, a mounting groove is further provided on the top surface of the first platform, and an adjusting frame is placed in the mounting groove, with both ends of the adjusting frame protruding to the outside of the first platform. Currently, when taking out a larger PCB circuit board, both hands are required, which is inconvenient. However, through the adjusting frame, when a PCB circuit board with a thin overall thickness and a larger volume needs to be taken out, it can be lifted and taken out through the adjusting frame, which makes the operation convenient. The PCB circuit board in the hollow position in the middle of the adjusting frame can be taken out with one hand, which is not considered. In actual use, the size of the mounting groove and the adjusting frame can be adjusted accordingly according to the operator's trapezoid and operating habits.

[0014] Preferably, the thickness of the adjustment frame is equal to the inner depth of the mounting groove, and the mounting groove and the through hole are staggered.

[0015] Preferably, the cross-sectional areas of the first platform and the second platform are equal, and the thicknesses of the two are equal.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] Through the designed adsorption component, PCB circuit boards of various specifications can be adsorbed and limited. Compared with the existing technology, this improvement is more flexible and convenient, and no placement grooves or other structures are provided on the processing carrier, which makes it more convenient to take out the PCB circuit boards. The designed ejection component can further improve the convenience of taking out and improve the shortcomings of the existing structure in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2It is an exploded schematic diagram of the first body and the suction pipe of the utility model;

[0020] Figure 3 It is an exploded schematic diagram of the second body and the suction pipe of the utility model.

[0021] In the figure:

[0022] 100, first platform; 100a, through hole; 100b, placement groove; 100c, installation groove; 101, adjustment frame;

[0023] 200, second platform; 200a, limiting groove;

[0024] 300, suction pipe; 300a, suction hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figures 1 to 3 The utility model provides a technical solution: a PCB circuit board exposure processing stage, including

[0027] The first platform 100 has through holes 100a uniformly formed on the top surface;

[0028] The second platform 200 is fixed to the bottom of the first platform 100, and

[0029] Adsorption components;

[0030] The adsorption component is placed between the first platform 100 and the second platform 200, and both ends of the adsorption component extend to the outside of the first platform 100 and the second platform 200, and the vertical projections of all the through holes 100a fall on the adsorption component; both ends of the adsorption component are connected to the external negative pressure device, and the negative pressure device generates negative pressure suction, which will suck in the air inside and directly above the through hole 100a. At this time, the PCB circuit board placed on the top surface of the first platform 100 will be adsorbed by the negative pressure, thereby achieving stable limiting.

[0031] In this embodiment, preferably, the bottom end surface of the first platform 100 is provided with a placement groove 100b passing through all the through holes 100a, and the top end surface of the second platform 200 is provided with a limiting groove 200a which is equal to the placement groove 100b in shape, position and size, so the shape of the through hole 100a can refer to Figure 3It is concluded that the adsorption component is a suction tube 300, which is placed between the placement groove 100b and the limit groove 200a. A suction hole 300a is opened at the top of the suction tube 300, and both ends of the suction tube 300 protrude to the outside of the first body 100 and the second body 200, thereby connecting with the external air supply equipment.

[0032] In this embodiment, preferably, the center of each suction hole 300a and the through hole 100a are on the same vertical line, so the negative pressure at the suction hole 300a can adsorb the PCB circuit board at the fastest speed.

[0033] In this embodiment, preferably, the first platform 100 and the second platform 200 are connected by bonding, so as to ensure that the two are quickly connected and can also be separated with the help of external tools.

[0034] In this embodiment, preferably, a mounting groove 100c is further provided on the top surface of the first body 100, and an adjustment frame 101 is placed in the mounting groove 100c, and both ends of the adjustment frame 101 protrude to the outside of the first body 100. Currently, when taking out a larger PCB circuit board, both hands are required, which is inconvenient. However, through the adjustment frame 101, when it is necessary to take out a PCB circuit board with a thin overall thickness and a larger volume, the PCB can be lifted and removed through the adjustment frame 101, which is convenient for operation. The PCB circuit board in the hollow position in the middle of the adjustment frame 101 can be taken out with one hand, which is not considered. In actual use, the size of the mounting groove 100c and the adjustment frame 101 can be adjusted accordingly according to the operator's trapezoid and operating habits.

[0035] In this embodiment, preferably, the thickness of the adjustment frame 101 is equal to the inner depth of the mounting groove 100c to avoid the protrusion affecting the placement of the PCB circuit board, and the mounting groove 100c and the through hole 100a are staggered.

[0036] In this embodiment, preferably, the cross-sectional areas of the first platform 100 and the second platform 200 are equal, and the thicknesses of the two are equal.

[0037] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board exposure processing stage, characterized in that: include The first platform (100) has through holes (100a) evenly formed on the top surface; A second platform (200) is fixed to the bottom of the first platform (100), and Adsorption components; The adsorption component is placed between the first platform (100) and the second platform (200), both ends of the adsorption component extend to the outside of the first platform (100) and the second platform (200), and the vertical projections of all the through holes (100a) fall on the adsorption component; both ends of the adsorption component are connected to the external negative pressure equipment; The bottom end surface of the first platform (100) is provided with a placement groove (100b) passing through all the through holes (100a), and the top end surface of the second platform (200) is provided with a limiting groove (200a) which is equal to the placement groove (100b) in shape, position and size; the adsorption component is a suction tube (300), and the suction tube (300) is placed between the placement groove (100b) and the limiting groove (200a), and the top of the suction tube (300) is provided with a suction hole (300a) through it, and both ends of the suction tube (300) protrude to the outside of the first platform (100) and the second platform (200).

2. A PCB circuit board exposure processing stage according to claim 1, characterized in that: The center of each suction hole (300a) and the through hole (100a) are located on the same vertical line.

3. A PCB circuit board exposure processing stage according to claim 1, characterized in that: The first platform (100) and the second platform (200) are bonded together.

4. A PCB circuit board exposure processing stage according to claim 1, characterized in that: A mounting groove (100c) is also provided on the top surface of the first platform (100), and an adjustment frame (101) is placed in the mounting groove (100c), with both ends of the adjustment frame (101) protruding to the outside of the first platform (100).

5. A PCB circuit board exposure processing stage according to claim 4, characterized in that: The thickness of the adjustment frame (101) is equal to the inner depth of the installation groove (100c), and the installation groove (100c) and the through hole (100a) are arranged in a staggered manner.

6. A PCB circuit board exposure processing stage according to claim 1, characterized in that: The cross-sectional areas of the first platform (100) and the second platform (200) are equal, and the thicknesses of the two are equal.

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