A single chip computer heat dissipation device

Abstract

The utility model relates to the field of heat dissipation technology for electronic products, and discloses a single-chip microcomputer heat dissipation device, including a back plate, an array of four buckles on the outer peripheral wall of the back plate, an elastic band connected between the back plate and the buckle, the buckle is used to be clamped and fixed with the bottom plate of the single-chip microcomputer, and an electric fan is installed in the center of the back plate. The buckle is clamped and fixed to the bottom plate of the single-chip microcomputer from four sides respectively, the electric fan blows air toward the single-chip microcomputer to accelerate the heat dissipation, and the elastic band contracts to generate elastic force to lock the buckle. The provision of the elastic band also enables the heat dissipation device to be applicable to single-chip microcomputers of different sizes, thereby improving the compatibility of the heat dissipation device. The application has the effect of facilitating the maintenance of electronic components in the single-chip microcomputer and realizing the quick connection between the single-chip microcomputer and the heat dissipation device.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation technology of electronic products, in particular to a heat dissipation device for a single chip computer. Background Art

[0002] The microcontroller integrates the processor core, memory, input / output interface and other necessary circuits on a single chip and is widely used in various electronic devices. Since the electronic components on the microcontroller are densely packed, a lot of heat will be generated during operation. If the heat is not dissipated in time, the performance of the microcontroller will be affected and even hardware damage will be caused. An effective heat dissipation device is essential to ensure the stable operation of the microcontroller.

[0003] The existing single-chip microcomputer heat dissipation device can refer to the Chinese patent document with publication number CN114115468A, which discloses a high-performance heat dissipation type single-chip microcomputer, in which a heat dissipation fan is installed in the center of the bottom plate, a heat dissipation tube is supported between the bottom plate and the single-chip microcomputer, and then the heat dissipation tube is fixedly connected to the single-chip microcomputer with fixing bolts. In addition, a heat dissipation pipe, a cooling box, etc. are also provided for auxiliary heat dissipation.

[0004] However, since the heat dissipation device in the above technical solution has a complicated structure, when some components in the single-chip microcomputer are damaged, it is necessary to remove each component in the heat dissipation device one by one before repairing the single-chip microcomputer, which causes inconvenience in installation. Utility Model Content

[0005] In order to facilitate the maintenance of electronic components in a single-chip microcomputer and to achieve a quick connection between the single-chip microcomputer and a heat dissipation device, the present application provides a single-chip microcomputer heat dissipation device.

[0006] The present application provides a single chip microcomputer heat dissipation device, which adopts the following technical solution:

[0007] A single-chip microcomputer heat dissipation device comprises a back plate, wherein the outer peripheral wall array of the back plate has four buckles, an elastic band is connected between the back plate and the buckles, the buckles are used to be clamped and fixed with the bottom plate of the single-chip microcomputer, and an electric fan is installed on the back plate.

[0008] By adopting the above technical solution, the back plate with the electric fan is fixed to the bottom plate of the single-chip computer from four sides by buckles, the electric fan blows air toward the single-chip computer to accelerate heat dissipation, and an elastic band is provided to lock the buckle by elastic force, thereby realizing a quick connection between the single-chip computer and the heat dissipation device, and facilitating the maintenance of the electronic components in the single-chip computer. In addition, the provision of the elastic band can also make the heat dissipation device suitable for single-chip computers of different sizes, thereby improving the compatibility of the heat dissipation device.

[0009] Furthermore, a plurality of unpowered fans are provided on the back plate, and the unpowered fans are distributed around the periphery of the electric fan, and the electric fan blows air to drive the unpowered fans to rotate.

[0010] By adopting the above technical solution, multiple unpowered fans are arranged around the electric fan. Using the electric fan to blow the unpowered fans can expand the range of action of the electric fan without replacing a stronger electric fan, further promote air circulation, and improve heat dissipation efficiency.

[0011] Furthermore, the unpowered fan includes fan blades and a rotating shaft, wherein the fan blades are rotatably connected to one end of the rotating shaft, and a plurality of slots are formed on the back plate, and one end of the rotating shaft away from the fan blades can be inserted into the slots.

[0012] By adopting the above technical solution, the unpowered fan is detachably connected to the back plate, and a plurality of slots for inserting the rotating shaft are provided. During installation, the position of the unpowered fan can be flexibly changed according to the distribution of electronic components on different single-chip computers, so as to further improve the adaptability of the heat dissipation device.

[0013] Furthermore, a support member is provided at the edge of the back plate, one end of the support member is fixedly connected to the back plate, one end of the support member away from the back plate abuts against the bottom plate of the single chip computer, and the support member and the elastic band are arranged in a one-to-one correspondence.

[0014] By adopting the above technical solution, since the elastic band has the characteristic of poor out-of-plane bending resistance, the back plate and the electric fan are easy to shake in the direction out of the plane of the elastic band, thereby colliding with the electronic components on the single-chip computer. Therefore, a support is provided between the back plate and the bottom plate of the single-chip computer to ensure that the heat dissipation device and the electronic components are separated by an appropriate distance, which is more convenient for air circulation.

[0015] Furthermore, a threaded hole is formed on the back plate, and a screw is provided at one end of the support member connected to the back plate, and the screw is threadably matched with the threaded hole.

[0016] By adopting the above technical solution, the support member and the back plate are fixed by means of threaded connection, so that the distance between the back plate and the single-chip microcomputer can be adjusted, thereby further improving the compatibility between the heat dissipation device and different single-chip microcomputers.

[0017] Furthermore, a soft rubber suction cup is provided at one end of the support member abutting against the single chip computer.

[0018] By adopting the above technical solution, the soft glue suction cup can be fixed by abutting against the single-chip microcomputer through attraction, thereby improving the fixing strength between the heat dissipation device and the single-chip microcomputer. In addition, the soft glue suction cup can also disperse the stress to protect the single-chip microcomputer, and the soft glue suction cup can also play a role in buffering and shock absorption in the event of a collision.

[0019] Furthermore, the electric fan is a negative pressure fan.

[0020] By adopting the above technical solution, the electric fan is set as a negative pressure fan. The suction force generated can not only accelerate the heat dissipation but also absorb dust, preventing dust accumulation from affecting the performance of the single-chip microcomputer, thereby solving the problem that the surface of the single-chip microcomputer is densely covered with electronic components and is difficult to clean.

[0021] Furthermore, a filter screen is provided on one side of the air outlet of the negative pressure fan.

[0022] By adopting the above technical solution, a filter screen is installed on one side of the exhaust port of the negative pressure fan to collect the sucked-out dust.

[0023] Furthermore, a temperature sensor is provided on a side of the back plate facing the single-chip microcomputer. The temperature sensor is electrically connected to the electric fan, and the temperature sensor is used to control the operation of the electric fan.

[0024] By adopting the above technical solution, a temperature sensor is set to monitor the temperature of the single-chip computer in real time, and a limit value is set for controlling the start and stop of the electric fan. When the temperature is higher than the limit value, the temperature sensor controls the electric fan to start, and when it is lower than a certain limit value, the electric fan stops running, thereby improving the automation of the heat dissipation device. In addition, operation according to demand can also be beneficial to energy conservation and environmental protection, and extend the service life of the electric fan.

[0025] Furthermore, a Velcro is provided on one side of the back plate facing away from the single-chip microcomputer, and the Velcro is used to fix the buckle. The Velcro includes a hook surface and a velvet surface bonded in a one-to-one manner, and the hook surface or the velvet surface is fixedly installed on the back plate and the buckle respectively.

[0026] By adopting the above technical solution, since the elastic band is flexible, when not in use, the buckle is in a free state and is inconvenient to store, so a Velcro is provided to store the buckle. A hook surface and a velvet surface are provided on the back of the back plate and the buckle respectively, and the hook surface and the velvet surface are bonded and fixed, so that the buckle is fixed and stored on the back of the back plate, and can be torn off, which is easy to operate.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. The back plate with the electric fan is fixed to the bottom plate of the single-chip computer from four sides by buckles, and an elastic band is set to lock the buckle by elastic force, so as to realize the quick connection between the single-chip computer and the heat dissipation device, which is convenient for the maintenance of the electronic components in the single-chip computer. In addition, the setting of the elastic band can also make the heat dissipation device suitable for single-chip computers of different sizes, improving the compatibility of the heat dissipation device.

[0029] 2. By arranging a plurality of unpowered fans around the electric fan, using the electric fan to blow the unpowered fans can expand the range of action of the electric fan without replacing a more powerful electric fan, promote air circulation, and improve heat dissipation efficiency.

[0030] 3. By setting the electric fan as a negative pressure fan and installing a filter on one side of the exhaust port, the suction generated by the negative pressure fan can not only accelerate the heat dissipation but also absorb dust, preventing dust accumulation from affecting the performance of the microcontroller, thereby solving the problem that the surface of the microcontroller is densely covered with electronic components and difficult to clean. The filter can collect the sucked out dust. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the assembly of the single-chip microcomputer heat dissipation device and the single-chip microcomputer according to an embodiment of the present application.

[0032] Figure 2 It is a schematic diagram of the structure of the microcontroller heat dissipation device.

[0033] Figure 3 It is a schematic diagram of the structure of an unpowered fan.

[0034] Description of reference numerals:

[0035] 101. Bottom plate; 1. Back plate; 11. Slot; 12. Threaded hole; 2. Buckle; 3. Elastic band; 4. Electric fan; 5. Unpowered fan; 51. Fan blade; 52. Rotating shaft; 6. Support member; 61. Screw; 62. Soft rubber suction cup; 7. Filter; 8. Temperature sensor; 9. Velcro; 91. Hook surface; 92. Suede surface. DETAILED DESCRIPTION

[0036] The following is combined with Figure 1-3 The technical solution of this application is described clearly and completely.

[0037] The embodiment of the present application discloses a heat dissipation device for a single chip computer.

[0038] Reference Figure 1 , Figure 2 A single-chip microcomputer heat dissipation device includes a back plate 1, an outer peripheral wall array of the back plate 1 has four buckles 2, an elastic band 3 is connected between the back plate 1 and the buckles 2, the buckles 2 are used to be clamped and fixed with the bottom plate 101 of the single-chip microcomputer, and an electric fan 4 is installed in the center of the back plate 1.

[0039] The buckle 2 is respectively fixed to the bottom plate 101 of the single chip computer from four sides, the electric fan 4 blows air toward the single chip computer to accelerate heat dissipation, and the elastic band 3 contracts to generate elastic force to lock the buckle 2, thereby realizing a quick connection between the single chip computer and the heat dissipation device, which is convenient for repairing the electronic components in the single chip computer. In addition, the provision of the elastic band 3 can also make the heat dissipation device suitable for single chips of different sizes, thereby improving the compatibility of the heat dissipation device.

[0040] Referring to Figure 1 and Figure 2 , it is preferred to make the size of the back plate 1 smaller than that of the single-chip microcomputer, and the shape of the back plate 1 follows that of the single-chip microcomputer. Four elastic bands 3 are respectively arranged in the middle of the four sides of the rectangular back plate 1, and the elastic bands 3 are parallel to the back plate 1. In other embodiments, the back plate 1 can also be selected to be circular, elliptical or other shapes, as long as the elastic bands 3 are arranged in a cross connection. The U-shaped buckle 2 is fixedly installed at one end of the elastic band 3 away from the back plate 1. An installation hole for installing the electric fan 4 is opened in the center of the back plate 1. In addition, four power-free fans 5 are detachably connected to the back plate 1, and the power-free fans 5 are distributed around the electric fan 4. The blowing of the electric fan 4 can drive the power-free fans 5 to rotate. Therefore, the action range of the electric fan 4 can be expanded without optimizing the performance of the electric fan 4 itself, further promoting air circulation and improving the heat dissipation efficiency.

[0041] Referring to Figure 3 , the power-free fan 5 includes a fan blade 51 and a rotating shaft 52, and the fan blade 51 is rotatably connected to one end of the rotating shaft 52. A plurality of slots 11 are opened on the back plate 1, and one end of the rotating shaft 52 away from the fan blade 51 can be inserted into the slots 11. The connection mode between the rotating shaft 52 and the back plate 1 can be selected as interference fit or screw fit. When installing, different positions of the slots 11 can be flexibly selected according to the distribution of electronic components on different single-chip microcomputers, so as to further improve the adaptability of the heat dissipation device.

[0042] Referring to Figure 2 , due to the characteristic that the elastic band 3 has poor out-of-plane bending resistance, the back plate 1 and the electric fan 4 are prone to shake in the out-of-plane direction of the elastic band 3, thus colliding with the electronic components on the single-chip microcomputer. Therefore, a support member 6 is arranged between the back plate 1 and the bottom plate 101 of the single-chip microcomputer, which can ensure an appropriate distance between the heat dissipation device and the electronic components, and is more convenient for air circulation. It is preferred to vertically fix the support member 6 to the edge of the back plate 1 so that the support member 6 is adjacent to the elastic band 3. In order to keep the back plate 1 balanced, the support member 6 is arranged in one-to-one correspondence with the elastic band 3. Threaded holes 12 are opened on the back plate 1, and a screw rod 61 is provided at one end of the support member 6 connected to the back plate 1. The screw rod 61 is in threaded cooperation with the threaded holes 12. The threaded connection method can facilitate the adjustment of the distance between the back plate 1 and the single-chip microcomputer, and further improve the adaptability between the heat dissipation device and different single-chip microcomputers. In this embodiment, the support member 6 is a support rod, and a soft rubber suction cup 62 is sleeved at one end of the support member 6 away from the back plate 1. The soft rubber suction cup 62 abuts against the single-chip microcomputer and is suction-fixed to the single-chip microcomputer, improving the fixing strength between the heat dissipation device and the single-chip microcomputer. In addition, the soft rubber suction cup 62 can also disperse stress to protect the single-chip microcomputer, and the soft rubber suction cup 62 can also play a role in buffering and shock absorption when there is a collision.

[0043] Referring to Figure 1 and Figure 2 The electric fan 4 preferably uses a negative pressure fan, and a filter 7 is set on one side of the exhaust port of the negative pressure fan. The suction force generated by the negative pressure fan not only accelerates the heat dissipation, but also can suck away the dust on the surface of the electronic components to prevent the accumulation of dust from affecting the performance of the single-chip microcomputer, thereby solving the problem that the electronic components on the surface of the single-chip microcomputer are densely packed and difficult to clean. The filter 7 can collect the sucked dust in a centralized manner.

[0044] Reference Figure 2 A temperature sensor 8 is also provided on the side of the back plate 1 facing the single-chip microcomputer. The temperature sensor 8 is electrically connected to the electric fan 4 to control the operation of the electric fan 4. The temperature sensor 8 monitors the temperature of the single-chip microcomputer in real time and sets a corresponding temperature range. When the temperature is higher than the upper limit, the temperature sensor 8 controls the electric fan 4 to turn on. When the temperature is lower than the lower limit, the electric fan 4 stops running, thereby improving the automation of the heat dissipation device. In addition, time-sharing operation according to the actual temperature can also be beneficial to energy conservation and environmental protection, and extend the service life of the electric fan 4.

[0045] Reference Figure 1 Since the elastic band 3 is flexible, the buckle 2 is in a scattered free state when not in use, which is inconvenient to store. Therefore, a Velcro 9 can be set on the side of the back plate 1 away from the single-chip microcomputer to store the buckle 2. The Velcro 9 includes a hook surface 91 and a velvet surface 92 that are matched one by one. The hook surface 91 or the velvet surface 92 is posted on the back plate 1 and the buckle 2, respectively. In this embodiment, the hook surface 91 is set on the back plate 1, and the velvet surface 92 is set on the buckle 2. The hook surface 91 and the velvet surface 92 are bonded and fixed, so that the buckle 2 is fixed and stored on the back of the back plate 1. When in use, it can be torn off and removed, which is easy to operate. In other embodiments, the hook surface 91 and the velvet surface 92 can also exchange the posting position.

[0046] The above are all preferred embodiments of the present application. Obviously, the embodiments described above are only preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made by ordinary technicians in this field based on the structure, shape, and principle of the present application without making any creative work should be covered within the protection scope of the present application.

Claims

1. A single chip microcomputer heat dissipation device, characterized in that: The invention comprises a back plate (1), wherein the outer peripheral wall array of the back plate (1) has four buckles (2), an elastic band (3) is connected between the back plate (1) and the buckles (2), the buckles (2) are used to be clamped and fixed to the bottom plate (101) of the single-chip computer, and an electric fan (4) is installed on the back plate (1).

2. The single chip microcomputer heat dissipation device according to claim 1, characterized in that: A plurality of unpowered fans (5) are also provided on the back plate (1), and the unpowered fans (5) are distributed around the outer periphery of the electric fan (4), and the electric fan (4) blows air to drive the unpowered fans (5) to rotate.

3. The single chip microcomputer heat dissipation device according to claim 2, characterized in that: The unpowered fan (5) comprises a fan blade (51) and a rotating shaft (52), wherein the fan blade (51) is rotatably connected to one end of the rotating shaft (52), a plurality of slots (11) are provided on the back plate (1), and one end of the rotating shaft (52) away from the fan blade (51) can be inserted into the slot (11).

4. The single chip microcomputer heat dissipation device according to claim 1, characterized in that: A support member (6) is provided at the edge of the back plate (1), one end of the support member (6) is fixedly connected to the back plate (1), one end of the support member (6) away from the back plate (1) abuts against the microcontroller base plate (101), and the support member (6) and the elastic band (3) are arranged in a one-to-one correspondence.

5. The single chip microcomputer heat dissipation device according to claim 4, characterized in that: The back plate (1) is provided with a threaded hole (12); one end of the support member (6) connected to the back plate (1) is provided with a screw rod (61); the screw rod (61) is threadably matched with the threaded hole (12).

6. The single chip microcomputer heat dissipation device according to claim 4, characterized in that: One end of the support member (6) abutting against the single chip computer is provided with a soft rubber suction cup (62).

7. The single chip microcomputer heat dissipation device according to claim 1, characterized in that: The electric fan (4) is a negative pressure fan.

8. The single chip microcomputer heat dissipation device according to claim 7, characterized in that: A filter screen (7) is provided on one side of the air outlet of the negative pressure fan.

9. The single chip microcomputer heat dissipation device according to claim 1, characterized in that: A temperature sensor (8) is also provided on the side of the back plate (1) facing the single-chip microcomputer. The temperature sensor (8) is electrically connected to the electric fan (4). The temperature sensor (8) is used to control the operation of the electric fan (4).

10. The single chip microcomputer heat dissipation device according to claim 1, characterized in that: A Velcro tape (9) is provided on a side of the back plate (1) facing away from the single-chip microcomputer, the Velcro tape (9) being used to fix the buckle (2), the Velcro tape (9) comprising a hook surface (91) and a velvet surface (92) bonded in a one-to-one correspondence, the hook surface (91) or the velvet surface (92) being fixedly mounted on the back plate (1) and the buckle (2) respectively.

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