Heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation piece and a fastening piece, the heat dissipation piece is provided with an accommodating part, the bottom of the accommodating part is provided with a through hole, and an opening of the accommodating part is provided with a limiting structure; the fastener comprises a head part and a connecting part, the head part is positioned in the accommodating part, and the connecting part extends out of the through hole; wherein the fastening piece is used for fixing a piece to be fixed, and the limiting structure is used for limiting the fastening piece. According to the heat dissipation assembly and the electronic equipment, the heat dissipation piece and the fastening piece are integrated, the heat dissipation and protection effects on the SSD can be achieved, the SSD can be fixed, the adaptability of the heat dissipation assembly is improved, the structure is simple, a gasket is omitted, and the production cost is reduced; and the fastener is limited in the accommodating part, so that the problem of fire hazard caused by short circuit of the battery due to falling of the fastener can be effectively avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of accessory technology, and in particular to a heat dissipation component and an electronic device. Background Art

[0002] Ultrabooks are becoming more and more popular with consumers for their thinness and long battery life. To achieve the ultra-thinness of laptops, solid state disks (SSDs) are usually used instead of traditional hard disks, and iron parts are often used as heat sinks to dissipate heat and protect the SSDs. When the SSD is fixed, it is locked with screws, but this method requires the use of washers to prevent the screws from falling off. If the washers are omitted, the screws are likely to fall off, which in turn causes a short circuit in the battery and a fire. Utility Model Content

[0003] The present disclosure provides a heat dissipation component and an electronic device to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, there is provided a heat dissipation assembly, comprising:

[0005] A heat sink having a receiving portion, a through hole is formed at the bottom of the receiving portion, and a limiting structure is provided at the opening of the receiving portion; and

[0006] A fastener, comprising a head and a connecting portion, wherein the head is located in the receiving portion and the connecting portion extends out of the through hole;

[0007] Wherein, the fastener is used to fix the part to be fixed, and the limiting structure is used to limit the fastener.

[0008] In one possible implementation manner, the limiting structure includes two stop portions that are arranged opposite to each other, and the shortest distance between the bottom of the accommodating portion and the stop portions is greater than the thickness of the head.

[0009] In one possible implementation manner, the stopper and the heat sink meet a parallel condition.

[0010] In one possible implementation manner, the stop portion is arranged to extend obliquely in a direction away from the bottom of the accommodation portion.

[0011] In one possible implementation manner, the heat sink includes a main body and a folding structure extending from the main body, the folding structure and the main body meet a parallel condition, the accommodating portion is formed between the folding structure and the main body, and the through hole is opened on the folding structure; wherein a mounting hole is opened on the main body, and the folding structure is located below the mounting hole.

[0012] In one possible implementation manner, the limiting structure extends from a side wall of the mounting hole.

[0013] In one possible implementation, the mounting hole has an arc-shaped contoured portion.

[0014] In one possible implementation manner, the limiting structure and the heat sink are an integrally formed structure.

[0015] According to a second aspect of the present disclosure, there is provided an electronic device, comprising a fixing plate, a part to be fixed and a connecting part, wherein the fixing plate is provided with a connector, the connecting part is provided on the fixing plate, and further comprising a heat dissipation assembly as described in any one of the above-mentioned embodiments, the part to be fixed is plugged into the connector, and the part to be fixed is fastened to the connecting part via the fastener of the heat dissipation assembly.

[0016] In one possible implementation manner, a protective member is further included, wherein the protective member is sleeved on the connector, and the heat sink is fixed by the protective member.

[0017] In the present disclosure, since the heat sink of the heat dissipation assembly has a receiving portion, the receiving portion can accommodate the head of the fastener, and the connecting portion of the fastener extends from the through hole at the bottom of the receiving portion; and since a limiting structure is provided at the opening of the receiving portion, the limiting structure can abut against the head of the fastener, limit the fastener, and prevent the fastener from falling out of the receiving portion. Therefore, the heat dissipation assembly of the present disclosure integrates the heat sink and the fastener, which can not only dissipate heat and protect the SSD, but also fix the SSD, increase the adaptability of the heat dissipation assembly, and have a simple structure, eliminate the gasket, and reduce the production cost; and the fastener is limited in the receiving portion, which can effectively avoid the problem of battery short circuit caused by the fastener falling off, and then fire.

[0018] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0020] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0021] Figure 1 The overall structure of a heat dissipation assembly according to an exemplary embodiment of the present disclosure is shown. Figure 1 ;.

[0022] Figure 2 The overall structure of a heat dissipation assembly according to an exemplary embodiment of the present disclosure is shown. Figure 2 ;

[0023] Figure 3 A cross-sectional view of the overall structure of a heat dissipation assembly according to an exemplary embodiment of the present disclosure is shown;

[0024] Figure 4 A schematic structural diagram of a heat sink of a heat sink assembly according to an exemplary embodiment of the present disclosure is shown;

[0025] Figure 5 A schematic diagram of an application scenario of a heat dissipation assembly of an exemplary embodiment of the present disclosure is shown (the part to be fixed is a 2242-type SSD);

[0026] Figure 6 A schematic diagram of an application scenario of a heat dissipation assembly of an exemplary embodiment of the present disclosure is shown (the part to be fixed is a 2280-type SSD);

[0027] Figure 7 A cross-sectional view of an application scenario of a heat dissipation assembly according to an exemplary embodiment of the present disclosure is shown;

[0028] Figure 8 A schematic structural diagram of a connecting component of an electronic device according to an exemplary embodiment of the present disclosure is shown.

[0029] Explanation of the numbers in the figure: 1. heat sink; 2. limiting structure; 3. fastener; 4. 2242 type SSD; 5. 2280 type SSD; 6. fixing plate; 7. connecting member; 8. protective member; 11. main body; 12. folding structure; 21. stopper; 31. head; 32. connecting part; 71. thread; 111. mounting hole; 121. through hole; 1110. contoured part; 1112. accommodating part. DETAILED DESCRIPTION

[0030] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0031] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0032] Reference Figure 1 to Figure 6As shown, a heat dissipation assembly of an exemplary embodiment of the present disclosure includes a heat dissipation element 1 and a fastener 3. The heat dissipation element 1 has a receiving portion 1112, a through hole 121 is formed at the bottom of the receiving portion 1112, and a limiting structure 2 is provided at the opening of the receiving portion 1112; the fastener 3 includes a head 31 and a connecting portion 32, the head 31 is located in the receiving portion 1112, and the connecting portion 32 extends from the through hole 121. The fastener 3 is used to fix the part to be fixed, and the limiting structure 2 is used to limit the fastener 3.

[0033] In this embodiment, the heat sink 1 plays a role in heat dissipation, and can be made of metals including but not limited to iron, copper, aluminum or steel. In this disclosure, the heat sink 1 is an iron piece as an example. In actual application, the heat sink 1 is attached to the part to be fixed, so the heat sink 1 also plays a protective role for the part to be fixed. The part to be fixed specifically includes but is not limited to electronic components such as SSD, PCB or WiFi board. In the embodiments shown in this disclosure, the part to be fixed is SSD, and the two types of SSDs, 2242 and 2280, are specifically taken as examples. The fastener 3 in the heat dissipation assembly usually fixes the part to be fixed on the mainboard, the fastener 3 is a screw, the head 31 of the fastener 3 is a screw head, the connecting part 32 of the fastener 3 is a stud, and the connecting part 32 has a threaded structure, and the fastener 3 is used to lock and fix with the mainboard. The accommodating portion 1112 is formed on the heat sink 1, and the accommodating portion 1112 has a bottom, and the bottom can bear the head 31 of the fastener 3, and the connecting part 32 can pass through the bottom. It can be understood that the length of the heat sink 1 can be adaptively designed according to the size and length of the part to be fixed. For example, when applied to 2242 type SSD4, the length of the heat sink 1 is shorter and adapted to 2242 type SSD4; when applied to 2280 type SSD5, the length of the heat sink 1 is longer and adapted to 2280 type SSD5.

[0034] In this embodiment, since the heat sink 1 of the heat dissipation assembly has a receiving portion 1112, the receiving portion 1112 can accommodate the head 31 of the fastener 3, and the connecting portion 32 of the fastener 3 extends from the through hole 121 at the bottom of the receiving portion 1112; and since a limiting structure 2 is provided at the opening of the receiving portion 1112, the limiting structure 2 can abut against the head 31 of the fastener 3, and limit the fastener 3 to prevent the fastener 3 from falling out of the receiving portion 1112. Therefore, the heat dissipation assembly of the present disclosure integrates the heat sink 1 and the fastener 3, which can not only dissipate heat and protect the SSD, but also fix the SSD, increase the adaptability of the heat dissipation assembly, have a simple structure, eliminate the gasket, and reduce the production cost; and the fastener 3 is limited in the receiving portion 1112, which can effectively avoid the problem of battery short circuit caused by the fastener 3 falling off, and then fire.

[0035] In one embodiment, the limiting structure 2 includes two stopper portions 21 disposed opposite to each other, and the maximum distance between the bottom of the accommodating portion 1112 and the stopper portions 21 is greater than the thickness of the head portion 31 .

[0036] Specifically, in one embodiment, the stopper 21 and the heat sink 1 meet the parallel condition.

[0037] Alternatively, in one embodiment, the stopper portion 21 is arranged to extend obliquely in a direction away from the bottom of the accommodating portion 1112 .

[0038] In this embodiment, when the head 31 of the fastener 3 abuts against the bottom of the receiving portion 1112, a moving space is formed between the top of the head 31 and the stopper 21, and the head 31 of the fastener 3 can move along the axis of the through hole 121 in the moving space, thereby ensuring that the fastener 3 can be locked downward with the mainboard to fix the fixed component. The stopper 21 extends from the heat sink 1 to the center of the opening of the receiving portion 1112, and the stopper 21 is formed above the fastener 3. The stopper 21 can prevent the fastener 3 from falling off from the receiving portion 1112, so the stopper 21 and the heat sink 1 can meet the parallel condition or extend obliquely in the direction away from the bottom of the receiving portion 1112.

[0039] In one embodiment, the heat sink 1 includes a body 11 and a folding structure 12 extending from the body 11, the folding structure 12 and the body 11 meet the parallel condition, a receiving portion 1112 is formed between the folding structure 12 and the body 11, and a through hole 121 is provided on the folding structure 12. Among them, a mounting hole 111 is provided on the body 11, and the folding structure 12 is located below the mounting hole 111.

[0040] In this embodiment, the folding structure 12 is bent and extended toward the bottom of the heat sink 1 body 11. When the head 31 of the fastener 3 abuts against the folding structure 12, a moving space is formed between the head 31 and the mounting hole 111. The head 31 of the fastener 3 can move along the axis of the through hole 121 in the moving space, thereby ensuring that the fastener 3 can be locked downward with the mainboard to fix the fixed part.

[0041] In one embodiment, the limiting structure 2 extends from the side wall of the mounting hole 111 .

[0042] In this embodiment, the limiting structure 2 includes two stop portions 21 arranged opposite to each other. The stop portions 21 extend from the side walls of the mounting hole 111 to the center of the mounting hole 111. The stop portions 21 are located above the fastener 3. The stop portions 21 can prevent the fastener 3 from falling off from the accommodating portion 1112. Therefore, the stop portions 21 and the heat sink 1 can meet the parallel condition or extend obliquely in the direction away from the folding structure 12.

[0043] In one embodiment, the mounting hole 111 has an arc-shaped contoured portion 1110 .

[0044] In this embodiment, two opposite arc-shaped contoured portions 1110 are provided in the circumferential direction of the mounting hole 111 , so as to facilitate the locking of the fastener 3 .

[0045] In one possible implementation manner, the limiting structure 2 and the heat sink 1 are an integrally formed structure.

[0046] In this embodiment, the limiting structure 2 and the heat sink 1 are integrally formed, which has high production efficiency. The limiting structure 2 can also be fixed to the heat sink 1 by welding.

[0047] Reference Figures 5 to 8 As shown, the present disclosure further provides an electronic device, including a fixing plate 6, a part to be fixed, and a connecting member 7. A connector is provided on the fixing plate 6, and the connecting member 7 is provided on the fixing plate 6, and also includes a heat dissipation assembly as in any of the above-mentioned embodiments, the part to be fixed is plugged into the connector (not shown in the figure), and the part to be fixed is fastened and connected to the connecting member 7 through the fastener 3 of the heat dissipation assembly.

[0048] In one possible implementation manner, the electronic device further includes a protective member 8 , which is sleeved on the connector, and the heat sink 1 is fixed by the protective member 8 .

[0049] In this embodiment, the electronic device can be a laptop computer, a tablet, a mobile phone or a computer, etc. Taking the electronic device as a laptop computer as an example, the fixing plate 6 is usually a motherboard, and the connecting member 7 is arranged on the fixing plate 6. The inner wall of the connecting member 7 has a thread 71 for locking with the connecting portion 32 of the fastener 3, and the protective member 8 is a rubber fastener. When the part to be fixed is 2242-type SSD4, 2242-type SSD4 is plugged into the connector, and the connecting member 7 is arranged at a position relatively close to the connector on the fixing plate 6. After 2242-type SSD4 is engaged with the connecting member 7, the protective member 8 is sleeved on the connector, and then the ear piece on the heat sink 1 away from the fastener 3 is obliquely inserted into the protective member 8, so that the heat sink 1 is attached to 2242-type SSD4, and the fastener 3 and the connecting member 7 are locked after stabilization; when the part to be fixed is 2280-type SSD5, 2280-type SSD5 is plugged into the connector, and the connecting member 7 is arranged at a position relatively close to the connector on the fixing plate 6. After 2280-type SSD5 is engaged with the connecting member 7, the protective member 8 is sleeved on the connector, and then the ear piece on the heat sink 1 away from the fastener 3 is obliquely inserted into the protective member 8, so that the heat sink 1 is attached to 2242-type SSD4, and the fastener 3 and the connecting member 7 are locked after stabilization. Therefore, since the electronic device includes a heat dissipation assembly, the heat dissipation assembly integrates the heat sink 1 and the fastener 3, which can not only dissipate heat and protect the SSD, but also fix the SSD, thereby increasing the adaptability of the heat dissipation assembly, simplifying the structure, eliminating the gasket, and reducing the production cost; and the fastener 3 is limited in the accommodating portion 1112, which can effectively avoid the problem of battery short circuit caused by the fastener 3 falling off, and then preventing the problem of fire, thereby reducing the risk of damage to the electronic device.

[0050] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0051] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.

[0052] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.

[0053] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.

[0054] The present disclosure has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present disclosure to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present disclosure is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation component, characterized in that: include: A heat sink (1) having a receiving portion (1112), a through hole (121) being provided at the bottom of the receiving portion (1112), and a limiting structure (2) being provided at the opening of the receiving portion (1112); and A fastener (3), comprising a head (31) and a connecting portion (32), wherein the head (31) is located in the accommodating portion (1112), and the connecting portion (32) extends out of the through hole (121); Wherein, the fastener (3) is used to fix the part to be fixed, and the limiting structure (2) is used to limit the fastener (3).

2. The heat dissipation assembly according to claim 1, characterized in that: The limiting structure (2) comprises two stopper portions (21) arranged opposite to each other, and the shortest distance between the bottom of the accommodating portion (1112) and the stopper portions (21) is greater than the thickness of the head portion (31).

3. The heat dissipation assembly according to claim 2, characterized in that: The stopper (21) and the heat sink (1) meet a parallel condition.

4. The heat dissipation assembly according to claim 2, characterized in that: The stopper portion (21) is arranged to extend obliquely in a direction away from the bottom of the accommodating portion (1112).

5. The heat dissipation assembly according to claim 1, characterized in that: The heat sink (1) comprises a main body (11) and a folding structure (12) extending from the main body (11); the folding structure (12) and the main body (11) meet a parallel condition; the accommodating portion (1112) is formed between the folding structure (12) and the main body (11); the through hole (121) is provided on the folding structure (12); wherein a mounting hole (111) is provided on the main body (11), and the folding structure (12) is located below the mounting hole (111).

6. The heat dissipation assembly according to claim 5, characterized in that: The limiting structure (2) extends out from the side wall of the mounting hole (111).

7. The heat dissipation assembly according to claim 5, characterized in that: The mounting hole (111) has an arc-shaped profiling portion (1110).

8. The heat dissipation assembly according to claim 1, characterized in that: The limiting structure (2) and the heat sink (1) are an integrally formed structure.

9. An electronic device, comprising a fixing plate (6), a part to be fixed and a connecting part (7), wherein the fixing plate (6) is provided with a connector, and the connecting part (7) is provided on the fixing plate (6), characterized in that: It also includes a heat dissipation assembly as described in any one of claims 1 to 8, wherein the part to be fixed is plugged into the connector, and the part to be fixed is fastened to the connecting member (7) via the fastener (3) of the heat dissipation assembly.

10. The electronic device according to claim 9, characterized in that: It also comprises a protective member (8), wherein the protective member (8) is sleeved on the connector, and the heat sink (1) is fixed by the protective member (8).

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