Wafer cleaning basket

Abstract

The utility model belongs to the technical field of semiconductor wafer cleaning devices, and particularly relates to a wafer cleaning basket which comprises a fixing column and a placing basket, the placing basket is arranged on the side face of the fixing column, a fixing base is fixedly installed on the bottom face of the fixing column, an adjusting unit is arranged in the placing basket, and the adjusting unit comprises a clamping piece, a sliding groove, a partition plate, an inserting plate and an inserting groove. According to the wafer cleaning basket, the sliding grooves are formed in the inner wall of the containing basket, the partition plates are installed in the sliding grooves, wafers of different sizes can be placed, the wafer cleaning basket is suitable for the wafers of different sizes, the containing space is adjusted for cleaning, and the cleaning effect is improved; liquid inlet holes are formed in the inner bottom surface and the inner wall of the placement basket in a penetrating manner, so that the wafer can be quickly immersed and cleaned by cleaning liquid, and the placement basket can be driven to rotate by arranging a rotating mechanism when the wafer in the placement basket is cleaned, so that the cleaning effect is improved; and the lifting mechanism is arranged, so that the immersion depth of the placement basket in the ultrasonic cleaning liquid can be adjusted during cleaning, and the wafer can be cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer cleaning devices, in particular to a wafer cleaning basket. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its original material is silicon. During the wafer processing, the wafer usually needs to be cleaned several times. The general method of wafer cleaning is: first place the wafer in a cleaning basket, and then put the cleaning basket containing the wafer into a cleaning tank, which is filled with cleaning agent and has an ultrasonic generator.

[0003] The cleaning baskets in the prior art are mostly of a single size. In order to improve the cleaning effect, special cleaning baskets of different sizes need to be remade, which greatly increases the tooling cost. In addition, the existing cleaning baskets are generally only suitable for cleaning complete wafers of fixed sizes, and cannot clean wafers of different sizes.

[0004] For example, a wafer cleaning basket disclosed in Chinese patent CN213905325U includes a hand pole, the lower end of which is connected to a base, and a plurality of round holes and cylinders are arranged in the base, wherein the round holes are used to facilitate the entry of liquid, and the cylinders are used to support the wafer. The advantages are as follows: both sides can be fully cleaned, and the influence of particles and dirt on the surface of the wafer on the performance of the laser can be reduced.

[0005] However, the wafer cleaning basket is not convenient for adjusting the placement space according to wafers of different sizes for cleaning after placement, which affects the cleaning efficiency.

[0006] Therefore, we propose a wafer cleaning basket to solve the above problems. Utility Model Content

[0007] The utility model aims to provide a wafer cleaning basket to solve the problems raised in the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer cleaning basket, comprising a fixed column and a placement basket, wherein the placement basket is arranged on the side of the fixed column, a fixed base is fixedly installed on the bottom surface of the fixed column, and an adjustment unit is arranged inside the placement basket;

[0009] The adjustment unit includes a card connector, a slide groove, a partition, an insert plate and a slot. The card connector is fixedly installed on the side of the placement basket, the slide groove is opened on the inner wall of the placement basket, the partition plate is installed on the inner wall of the slide groove, the insert plate is inserted into the inner wall of the slide groove, the slot is opened on the upper surface of the insert plate, and the side of the partition plate is plug-in connected to the insert plate through the slot.

[0010] Preferably, a cover plate is installed on the upper surface of the placement basket, and the cover plate is clamped to the placement basket through a clamping piece. A round hole is penetrated through the upper surface of the cover plate, a bottom liquid inlet hole is penetrated through the inner bottom surface of the placement basket, and an inner wall liquid inlet hole is penetrated through the inner wall of the placement basket.

[0011] Preferably, a rotating mechanism is provided on the upper surface of the cover plate, and the rotating mechanism includes a fixed box, a base plate, a second drive motor, a worm, a worm wheel and a connecting shaft. The fixed box is provided above the cover plate, and the base plate is fixedly mounted on the bottom surface of the fixed box. The second drive motor is fixedly mounted on the side surface of the fixed box, and a worm is fixedly mounted on the output end of the second drive motor. A worm wheel is installed on the top surface of the fixed box, and a connecting shaft is fixedly mounted on the bottom surface of the worm wheel. The bottom surface of the connecting shaft is fixedly connected to the upper surface of the cover plate.

[0012] Preferably, a lifting mechanism is provided on the side of the fixed column, and the lifting mechanism includes a mounting groove, a first drive motor, a transmission member and a cross column. The mounting groove is opened on the side of the fixed column, the first drive motor is fixedly installed on the upper surface of the fixed column, the transmission member is installed on the bottom surface of the mounting groove, the cross column is fixedly installed at the side connection of the transmission member, and one end surface of the cross column is fixedly connected to the side of the fixed box.

[0013] Preferably, an axial hole is passed through the middle of the bottom surface of the base plate, the connecting shaft passes through the axial hole and is fixedly connected to the upper surface of the cover plate, and the outer surface of the worm wheel is meshed with the outer surface of the worm.

[0014] Preferably, a through hole is penetrated through the top surface of the installation groove, the upper end of the transmission member passes through the through hole and is fixedly connected to the output end of the first drive motor, and the fixing columns are symmetrically distributed on both sides of the fixing box.

[0015] Preferably, the slide grooves are distributed sequentially at equal intervals on both sides of the inner wall of the placement basket, there is a gap between the bottom surface of the partition and the inner bottom surface of the placement basket, and there is a gap between the bottom surface of the plug board and the inner bottom surface of the placement basket.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The wafer cleaning basket can place wafers of different sizes by opening a slide groove on the inner wall of the basket and installing a partition in the slide groove. The placement space of wafers of different sizes can be adjusted for cleaning to improve the cleaning effect. Liquid inlet holes are penetrated through the bottom surface and the inner wall of the basket so that the cleaning liquid can quickly immerse the wafer for cleaning.

[0018] 2. The wafer cleaning basket can drive the basket to rotate when cleaning the wafers inside the basket by setting a rotating mechanism to improve the cleaning effect. The lifting mechanism is set to facilitate the adjustment of the height of the basket before, during and after cleaning the wafers to facilitate loading and unloading. During cleaning, the immersion depth of the basket in the ultrasonic cleaning solution can be adjusted to clean the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the rotating mechanism structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the lifting mechanism structure of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the placement basket of the utility model.

[0023] In the figure: 1. fixed column; 2. fixed base; 3. mounting groove; 301. through hole; 302. first drive motor; 303. transmission member; 304. cross column; 305. fixed box; 306. bottom plate; 307. second drive motor; 308. worm; 309. worm wheel; 310. shaft hole; 311. connecting shaft; 312. cover plate; 313. round hole; 314. placement basket; 315. snap-on member; 316. bottom liquid inlet hole; 317. inner wall liquid inlet hole; 318. slide groove; 319. partition plate; 320. plug plate; 321. slot. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0026] Embodiment 1: A wafer cleaning basket comprises a fixed column 1 and a placement basket 314, wherein the placement basket 314 is arranged on the side of the fixed column 1, a fixed base 2 is fixedly installed on the bottom surface of the fixed column 1, and an adjustment unit is arranged inside the placement basket 314;

[0027] The adjustment unit includes a snap-in 315, a slide groove 318, a partition 319, an insert plate 320 and a slot 321. The snap-in 315 is fixedly installed on the side of the placement basket 314, the slide groove 318 is opened on the inner wall of the placement basket 314, the partition 319 is installed on the inner wall of the slide groove 318, the insert plate 320 is plugged into the inner wall of the slide groove 318, the slot 321 is opened on the upper surface of the insert plate 320, and the side of the partition 319 and the insert plate 320 are plugged in and connected through the slot 321.

[0028] A cover plate 312 is installed on the upper surface of the placement basket 314, and the cover plate 312 is clamped with the placement basket 314 through a clamping piece 315. A circular hole 313 is penetrated on the upper surface of the cover plate 312, and a bottom liquid inlet hole 316 is penetrated on the inner bottom surface of the placement basket 314, and an inner wall liquid inlet hole 317 is penetrated on the inner wall of the placement basket 314. The slide grooves 318 are distributed on both sides of the inner wall of the placement basket 314 at equal intervals. There is a gap between the bottom surface of the partition 319 and the inner bottom surface of the placement basket 314, and there is a gap between the bottom surface of the insert plate 320 and the inner bottom surface of the placement basket 314. By opening the slide groove 318 on the inner wall of the placement basket 314 and installing the partition 319 in the slide groove 318, wafers of different sizes can be placed, and the placement space for wafers of different sizes can be adjusted for cleaning to improve the cleaning effect. The liquid inlet holes are penetrated through the inner bottom surface and the inner wall of the placement basket 314 so that the cleaning liquid can quickly immerse the wafers for cleaning.

[0029] The cover plate 312 is snapped onto the clamping piece 315 to connect the placement basket 314, and the upper part of the wafers inside the placement basket 314 is protected to prevent them from falling out during cleaning. Wafers of different sizes or the same size are placed on the inner bottom surface of the placement basket 314 for cleaning. When placing wafers of different sizes on the inner bottom surface of the placement basket 314, the partition plate 319 is installed on the inner wall of the slide groove 318 at a suitable position according to the placement size of the wafers, and the partition plate 319 is inserted into the inner wall of the slot 321 to connect with the plug plate 320 to prevent wafers of different sizes from contacting and covering each other during cleaning, which affects the cleaning effect.

[0030] Embodiment 2: Based on embodiment 1, a rotating mechanism is arranged on the upper surface of the cover plate 312, and the rotating mechanism includes a fixed box 305, a bottom plate 306, a second drive motor 307, a worm 308, a worm wheel 309 and a connecting shaft 311. The fixed box 305 is arranged above the cover plate 312, and the bottom plate 306 is fixedly installed on the bottom surface of the fixed box 305. The second drive motor 307 is fixedly installed on the side of the fixed box 305, and the output end of the second drive motor 307 is fixedly installed with a worm 308. A worm wheel 309 is installed on the top surface of the fixed box 305, and a connecting shaft 311 is fixedly installed on the bottom surface of the worm wheel 309. The bottom surface of the connecting shaft 311 is fixedly connected to the upper surface of the cover plate 312, and an axial hole 310 is passed through the middle position of the bottom surface of the bottom plate 306. The connecting shaft 311 passes through the axial hole 310 and is fixedly connected to the upper surface of the cover plate 312, and the outer surface of the worm wheel 309 is meshed with the outer surface of the worm 308.

[0031] A lifting mechanism is arranged on the side of the fixed column 1, and the lifting mechanism includes a mounting groove 3, a first driving motor 302, a transmission member 303 and a cross column 304. The mounting groove 3 is opened on the side of the fixed column 1, the first driving motor 302 is fixedly mounted on the upper surface of the fixed column 1, the transmission member 303 is mounted on the inner bottom surface of the mounting groove 3, the cross column 304 is fixedly mounted at the side connection of the transmission member 303, one end surface of the cross column 304 is fixedly connected to the side of the fixed box 305, the inner top surface of the mounting groove 3 is penetrated by a through hole 301, and the upper end of the transmission member 303 passes through The through hole 301 is fixedly connected to the output end of the first driving motor 302, and the fixed columns 1 are symmetrically distributed on both sides of the fixed box 305. By setting a rotating mechanism, the placement basket 314 can be driven to rotate when the wafers inside the placement basket 314 are cleaned to improve the cleaning effect. The lifting mechanism is set to facilitate the adjustment of the height of the placement basket 314 before, during and after cleaning the wafers to facilitate material discharge and discharge. During cleaning, the immersion depth of the placement basket 314 in the ultrasonic cleaning solution can be adjusted to clean the wafers.

[0032] The power supply of the first drive motor 302 is started so that the first drive motor 302 can work and drive the threaded column in the transmission member 303 to rotate, and the moving block installed on the outer surface of the threaded column is driven by the threaded engagement to drive the cross column 304 to move on the outer surface of the threaded column to drive the fixed box 305 and the placement basket 314 to move, so as to adjust the immersion depth of the placement basket 314 in the ultrasonic cleaning solution to clean the wafer. During cleaning, the power supply of the second drive motor 307 is started so that the second drive motor 307 drives the worm 308 to rotate, and the worm wheel 309 is driven to rotate through engagement, thereby driving the connecting shaft 311 to rotate and causing the placement basket 314 to rotate.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A wafer cleaning basket, comprising a fixed column (1) and a placement basket (314), wherein the placement basket (314) is arranged on the side of the fixed column (1), and a fixed base (2) is fixedly installed on the bottom surface of the fixed column (1), characterized in that: An adjustment unit is provided inside the placement basket (314); The adjustment unit comprises a clamping member (315), a slide groove (318), a partition (319), an insert plate (320) and a slot (321); the clamping member (315) is fixedly mounted on the side of the placement basket (314); the slide groove (318) is opened on the inner wall of the placement basket (314); the partition plate (319) is installed on the inner wall of the slide groove (318); the insert plate (320) is plugged into the inner wall of the slide groove (318); the slot (321) is opened on the upper surface of the insert plate (320); and the side of the partition plate (319) and the insert plate (320) are plugged and connected via the slot (321).

2. The wafer cleaning basket according to claim 1, characterized in that: A cover plate (312) is installed on the upper surface of the placement basket (314); the cover plate (312) is clamped to the placement basket (314) via a clamping piece (315); a round hole (313) is penetrated through the upper surface of the cover plate (312); a bottom liquid inlet hole (316) is penetrated through the inner bottom surface of the placement basket (314); and an inner wall liquid inlet hole (317) is penetrated through the inner wall of the placement basket (314).

3. The wafer cleaning basket according to claim 2, characterized in that: A rotating mechanism is arranged on the upper surface of the cover plate (312), and the rotating mechanism comprises a fixed box (305), a bottom plate (306), a second driving motor (307), a worm (308), a worm wheel (309) and a connecting shaft (311); the fixed box (305) is arranged above the cover plate (312); the bottom plate (306) is fixedly mounted on the bottom surface of the fixed box (305); the second driving motor (307) is fixedly mounted on the side surface of the fixed box (305); the output end of the second driving motor (307) is fixedly mounted with a worm wheel (308); the top surface of the fixed box (305) is mounted with a worm wheel (309); the bottom surface of the worm wheel (309) is fixedly mounted with a connecting shaft (311); and the bottom surface of the connecting shaft (311) is fixedly connected to the upper surface of the cover plate (312).

4. The wafer cleaning basket according to claim 1, characterized in that: A lifting mechanism is arranged on the side of the fixed column (1), and the lifting mechanism comprises a mounting groove (3), a first drive motor (302), a transmission member (303) and a cross column (304); the mounting groove (3) is opened on the side of the fixed column (1); the first drive motor (302) is fixedly mounted on the upper surface of the fixed column (1); the transmission member (303) is mounted on the inner bottom surface of the mounting groove (3); the cross column (304) is fixedly mounted at the side connection of the transmission member (303); and one end surface of the cross column (304) is fixedly connected to the side of the fixed box (305).

5. The wafer cleaning basket according to claim 3, characterized in that: An axial hole (310) is formed in the middle of the bottom surface of the base plate (306); the connecting shaft (311) passes through the axial hole (310) and is fixedly connected to the upper surface of the cover plate (312); and the outer surface of the worm wheel (309) is meshed with the outer surface of the worm (308).

6. The wafer cleaning basket according to claim 4, characterized in that: A through hole (301) is formed on the inner top surface of the installation groove (3); the upper end of the transmission member (303) passes through the through hole (301) and is fixedly connected to the output end of the first drive motor (302); and the fixing columns (1) are symmetrically distributed on both sides of the fixing box (305).

7. The wafer cleaning basket according to claim 1, characterized in that: The slide grooves (318) are distributed in sequence at equal intervals on both sides of the inner wall of the placement basket (314); there is a gap between the bottom surface of the partition plate (319) and the inner bottom surface of the placement basket (314); and there is a gap between the bottom surface of the insert plate (320) and the inner bottom surface of the placement basket (314).

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