Silicon wafer degumming tooling

Abstract

The present application provides a silicon wafer degumming tool, which relates to the field of photovoltaic technology, including: a material trough, the material trough has a material frame and a material port, the material frame and the material port are connected, the material frame is used to accommodate a silicon wafer unit, and the silicon wafer unit includes a crystal support and a silicon wafer fixed to the crystal support; the material trough includes a pair of first support rods arranged at the material port, the extension direction of the first support rod is the same as the length direction of the material trough, and the pair of first support rods are relatively arranged along the width direction of the material trough; the material trough also includes a pair of second support rods mounted on the pair of first support rods, the extension direction of the second support rods is the same as the width direction of the material trough, and the pair of second support rods are relatively arranged along the length direction of the material trough; a crystal support support card slot is arranged above the pair of second support rods; the crystal support has protrusions at both ends along its length direction, and when the silicon wafer unit is placed in the material trough, the protrusions are located in the crystal support support card slot. In this way, automatic support of the crystal support can be achieved without the need for manual insertion of iron rods, thereby improving production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, and more specifically, to a silicon wafer debonding tool. Background Art

[0002] In the production process of silicon wafers, silicon rods need to be cut into silicon wafers by a wire cutting machine. At this time, the silicon wafers are glued to the crystal tray with resin. In order to achieve automatic debonding after wire cutting, the crystal tray and the silicon wafers on the crystal tray need to be transported to the debonding machine for debonding to separate the silicon wafers from the crystal tray. Subsequently, the separated silicon wafers are transported to the inserting machine for slicing and inserting.

[0003] In the debonding tooling of the prior art, the wafer tray and the silicon wafer on the wafer tray need to be manually inserted with iron rods before entering the debonding machine to achieve the purpose of supporting the wafer tray. The manual operation method greatly reduces the production efficiency and is not conducive to automated production. Utility Model Content

[0004] In view of this, the utility model provides a silicon wafer degumming tool, which supports the wafer tray by introducing a wafer tray support slot, avoids manual insertion of iron rods, meets the needs of automated production, and is conducive to improving production efficiency.

[0005] In a first aspect, the present application provides a silicon wafer degumming tool, comprising:

[0006] A material trough, wherein the material trough has a material frame and a material opening, the material frame and the material opening are connected, the material frame is used to accommodate a silicon wafer unit, and the silicon wafer unit includes a crystal tray and a silicon wafer fixed to the crystal tray;

[0007] The material trough includes a pair of first support rods arranged at the material opening, the extension direction of the first support rods is the same as the length direction of the material trough, and the pair of first support rods are arranged oppositely along the width direction of the material trough;

[0008] The trough further includes a pair of second support rods mounted on the pair of first support rods, the extension direction of the second support rods is the same as the width direction of the trough, and the pair of second support rods are arranged oppositely along the length direction of the trough;

[0009] A crystal tray support slot is arranged above a pair of second support rods; the crystal tray has protrusions at both ends along its length direction, and when the silicon wafer unit is placed in the material slot, the protrusions are located in the crystal tray support slot.

[0010] Optionally, where:

[0011] The projection of the crystal tray support slot on the second support rod is a U-shaped structure, and a pair of U-shaped openings of the crystal tray support slot are arranged opposite to each other along the length direction of the material trough.

[0012] Optionally, where:

[0013] The material trough comprises a pair of side walls which are arranged opposite to each other along the length direction thereof, and the second support rod and the crystal support slot are located between the pair of side walls.

[0014] Optionally, where:

[0015] The material trough comprises at least one pair of silicon wafer clamping rods, the extension direction of the silicon wafer clamping rods is the same as the length direction of the material trough, and the pair of silicon wafer clamping rods are arranged oppositely along the width direction of the material trough;

[0016] The wafer clamping rods include a first state and a second state. The spacing between the pair of wafer clamping rods in the first state is greater than that in the second state and is greater than the width of the wafer in the wafer unit.

[0017] Optionally, where:

[0018] The material trough includes a pair of side walls arranged opposite to each other along the length direction thereof, the side walls include shifting grooves, and the material trough also includes a connecting rod mechanism, the connecting rod mechanism is fixed to the silicon wafer clamping rod, and the two ends of the same connecting rod mechanism are respectively located in the two shifting grooves on the pair of side walls and can move in the shifting grooves along the width direction of the material trough;

[0019] In the first state, the end of the connecting rod mechanism contacts the outer limiting wall of the shift groove; in the second state, the end of the connecting rod mechanism contacts the inner limiting wall of the shift groove, wherein the outer limiting wall and the inner limiting wall are arranged opposite to each other along the width direction of the material trough.

[0020] Optionally, where:

[0021] At the position corresponding to the side wall on the same side of the material trough, a connecting rod mechanism fixed with a pair of silicon wafer clamping rods is connected to the two ends of the same spring. In the first state, the spring is in a stretched state; in the second state, the spring is in a contracted state.

[0022] Optionally, where:

[0023] At a position corresponding to the side wall on the same side of the material trough, the displacement groove is located on the inner side of the side wall, and the spring is located on the outer side of the side wall; the side wall includes an opening portion, and the connecting rod mechanism is arranged through the opening portion.

[0024] Optionally, where:

[0025] It also includes a pull rod mechanism, which is used to apply a pulling force to the connecting rod mechanism to make the silicon wafer clamping rod enter a first state; when the pull rod mechanism cancels the pulling force applied to the connecting rod mechanism, the spring contracts to make the silicon wafer clamping rod enter a second state.

[0026] Optionally, where:

[0027] The material trough also includes a transverse support rod, which is arranged close to the side wall and extends along the width direction of the material trough. A plurality of connecting rod positioning parts are arranged above the transverse support rod, and the connecting rod positioning parts are arranged along the width direction of the material trough. The connecting rod mechanism is fixed to at least one of the connecting rod positioning parts.

[0028] Optionally, where:

[0029] It also includes at least two silicon wafer support rods, which extend along the length of the material trough. The side wall includes at least two pairs of positioning grooves arranged throughout the thickness direction of the material trough. The two ends of the silicon wafer support rods are respectively inserted into the two positioning grooves at the same height.

[0030] Compared with the prior art, the silicon wafer degumming tool provided by the utility model achieves at least the following beneficial effects:

[0031] In the silicon wafer degumming tool provided in the present application, a pair of first support rods and a pair of second support rods are arranged at the material mouth of the material trough, wherein the first support rods and the second support rods are arranged crosswise, the second support rods span over the pair of first support rods, and a crystal support card slot is arranged above the second support rods. When the silicon wafer unit is transferred to the silicon wafer degumming tool, the protrusions at both ends of the crystal support will be placed in the corresponding crystal support card slots. The crystal support card slots can reliably support the crystal support without the need for manual insertion of iron rods, thereby meeting the needs of automated production and helping to improve production efficiency.

[0032] Of course, any product implementing the present utility model does not necessarily need to achieve all of the above-mentioned technical effects at the same time.

[0033] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0035] Figure 1 The figure shows a structural schematic diagram of a silicon wafer degumming tool provided in an embodiment of the present application;

[0036] Figure 2 Shown is a top view of a silicon wafer unit;

[0037] Figure 3 Shown is a cross-sectional schematic diagram of a silicon wafer unit;

[0038] Figure 4 Shown is a structural schematic diagram of the side wall position in the silicon wafer degumming tooling provided in the present application;

[0039] Figure 5 The figure shows a relative position relationship diagram of the connecting rod mechanism and the spring in the silicon wafer debonding tooling provided by the present application;

[0040] Figure 6 The figure shows a relative position relationship diagram of the connecting rod mechanism and the connecting rod fixing part in the silicon wafer debonding tooling provided in the embodiment of the present application;

[0041] Figure 7 Shown is a structural schematic diagram of the side wall of the material trough in the silicon wafer degumming tooling provided in the present application. DETAILED DESCRIPTION

[0042] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0043] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0044] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0045] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0046] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0047] In the prior art, the silicon wafer unit needs to be manually inserted with iron rods before entering the debonding machine to achieve the purpose of supporting the wafer support. The need to manually insert the iron rods greatly reduces production efficiency and is not conducive to automated production.

[0048] In view of this, the utility model provides a silicon wafer degumming tool, which avoids the operation of manually inserting an iron rod, meets the needs of automated production, and is conducive to improving production efficiency.

[0049] The following is a detailed description with reference to the accompanying drawings and specific embodiments.

[0050] Figure 1 FIG. 1 is a schematic diagram of a structure of a silicon wafer degumming tool 100 provided in an embodiment of the present application. Figure 2FIG. 2 is a top view of a silicon wafer unit 200. Figure 3 FIG. 2 is a schematic cross-sectional view of a silicon wafer unit 200. It should be noted that: Figure 2 and Figure 3 The silicon wafer unit 200 is for illustration only and does not limit the shape and size of the wafer tray 201 in the silicon wafer unit 200 , nor does it limit the shape, size and number of the silicon wafers 202 in the silicon wafer unit 200 .

[0051] Please refer to Figure 1 and Figure 2 The present application provides a silicon wafer degumming tool 100, comprising:

[0052] A material tank LC, wherein the material tank LC has a material frame LK and a material opening K0, wherein the material frame LK is connected to the material opening K0, and the material frame LK is used to accommodate a silicon wafer unit 200, wherein the silicon wafer unit 200 includes a wafer support 201 and a silicon wafer 202 fixed to the wafer support 201;

[0053] The material trough LC includes a pair of first support rods 10 disposed at the material port K0, the extension direction of the first support rods 10 is the same as the length direction D1 of the material trough LC, and the pair of first support rods 10 are disposed opposite to each other along the width direction D2 of the material trough LC;

[0054] The material tank LC further includes a pair of second support rods 20 mounted on the pair of first support rods 10, the extension direction of the second support rods 20 is the same as the width direction D2 of the material tank LC, and the pair of second support rods 20 are arranged oppositely along the length direction D1 of the material tank LC;

[0055] A crystal tray support slot 30 is provided above the pair of second support rods 20 ; the crystal tray 201 has protrusions 203 at both ends along its length direction D1 , and when the silicon wafer unit 200 is placed in the material tank LC, the protrusions 203 are located in the crystal tray support slot 30 .

[0056] In the silicon wafer degumming tool 100 provided in the present application, its material trough LC is used to accommodate the silicon wafer unit 200 (including the silicon wafer 202 that has been cut but not yet degummed and the crystal support 201 fixed to the silicon wafer 202). In the actual production process, the silicon wafer unit 200 can be transferred to the top of the silicon wafer degumming tool 100, and the silicon wafer 202 and the crystal support 201 in the silicon wafer unit 200 are controlled to pass through the material opening K0 and enter the material frame LK of the material trough LC. The material trough LC of the silicon wafer degumming tool 100 includes a pair of first support rods 10 and a pair of second support rods 20 arranged at the material opening K0. Optionally, the length of the first support rod 10 is greater than the length of the second support rod 20, and the pair of second support rods 20 spans above the pair of first support rods 10, and the first support rods 10 and the second support rods 20 cross to form the material opening K0 of the material trough LC. A crystal tray support slot 30 is arranged above the second support rod 20. When the silicon wafer unit 200 is transferred to the silicon wafer degumming tool 100, the protrusions 203 at both ends of the crystal tray 201 will be respectively placed in the crystal tray support slots 30 above a pair of second support rods 20. The crystal tray support slots 30 can reliably support the crystal tray without the need for manual insertion of iron rods, thereby meeting the needs of automated production and helping to improve production efficiency.

[0057] Optionally, refer to Figure 1 At least two gear fixing blocks 21 are arranged on the same first support rod 10, and the two gear fixing blocks 21 are arranged along the length direction D1 of the material frame LK. The second support rod 20 is provided with a positioning hole adapted to the gear fixing block 21. By selecting the positioning holes on the second support rod 20 to fix the gear fixing blocks 21 at different positions, the distance between a pair of second support rods 20 can be adjusted, thereby adjusting the distance between the two crystal support support slots 30, which is conducive to meeting the application requirements of crystal supports of different lengths.

[0058] Please continue to refer to Figure 1 In an optional embodiment of the present application, the projection of the crystal tray support slot 30 on the second support rod 20 is a U-shaped structure, and a pair of U-shaped openings of the crystal tray support slot 30 are relatively arranged along the length direction D1 of the material tank LC.

[0059] Specifically, in the silicon wafer debonding tool 100 provided in the present application, the wafer support slot 30 is embodied as a U-shaped structure, and the opening of the U-shaped structure is toward the center of the material tank LC, that is, the U-shaped openings of the two wafer support slots 30 are arranged opposite to each other. Optionally, the inner wall contour of the U-shaped slot is adapted to the shape of the outer contour of the protrusions 203 at both ends of the crystal tray 201. When the protrusions 203 of the crystal tray 201 are placed at the position corresponding to the crystal tray support slot 30, the U-shaped structure can play a role in aligning the crystal tray 201 and the material tank LC. At the same time, the U-shaped structure can also play a role in limiting the crystal tray 201, thereby avoiding unnecessary displacement of the crystal tray when the crystal tray 201 is placed in the material tank LC, and avoiding unnecessary displacement of the crystal tray during the debonding process. For example, the two inner walls of the U-shaped structure that are opposite to each other along the width direction D2 of the material tank LC can prevent the crystal tray from being displaced along the width direction D2 of the material tank LC, and the bottom wall of the U-shaped structure that connects the above two inner walls can prevent the crystal tray from being displaced along the length direction D1 of the material tank LC, thereby having a better limiting effect on the crystal tray.

[0060] Continue to refer Figure 1 In an optional embodiment of the present application, the material tank LC includes a pair of side walls 40 arranged opposite to each other along the length direction D1 thereof, and the second support rod 20 and the crystal support slot 30 are located between the pair of side walls 40 .

[0061] When the second support rod 20 and the crystal support support slot 30 are introduced into the silicon wafer debonding tool 100, a pair of second support rods 20 are located between the two side walls 40 of the material tank LC, and the two second support rods 20 are respectively close to the two side walls 40 of the material tank LC, and there is a certain interval between the second support rods 20 and the corresponding side walls 40. The distance between the two second support rods 20 and the distance between the second support rods 20 and the corresponding side walls 40 are mainly determined by the length of the crystal support, and this application does not specifically limit this. The crystal support support slot 30 is arranged above the second support rod 20. When the crystal support is transferred to the top of the silicon wafer debonding tool 100 and the crystal support is lowered into the material tank LC, the protrusions at both ends of the crystal support can just fall into the crystal support support slot 30 on the second support rod 20, and the crystal support support slot 30 is used to support and position the crystal support.

[0062] Please continue to refer to Figure 1In addition to the first support rod 10 and the second support rod 20 mentioned in the aforementioned embodiment, the material trough LC of the silicon wafer degumming tool 100 may also include a bottom support rod 50 located at the bottom of the material trough LC, and a longitudinal support rod 60 located between the bottom support rod 50 and the first support rod 10, wherein the bottom support rod 50 is parallel to and opposite to the first support rod 10, and the longitudinal support rod 60 is respectively connected to the first support rod 10 and the bottom support rod 50, and is perpendicular to the first support rod 10 and the bottom support rod 50, and is used to support the first support rod 10 and the bottom support rod 50. In this way, the first support rod 10, the bottom support rod 50 and the longitudinal support rod 60 together form a accommodating space for the silicon wafer unit.

[0063] Please continue to refer to Figure 1 In an optional embodiment of the present application, the material trough LC also includes at least one pair of silicon wafer clamping rods 70, the extension direction of the silicon wafer clamping rods 70 is the same as the length direction D1 of the material trough LC, and the pair of silicon wafer clamping rods 70 are relatively arranged along the width direction D2 of the material trough LC; the silicon wafer clamping rods 70 include a first state and a second state, and the spacing between the pair of silicon wafer clamping rods 70 in the first state is greater than the spacing between them in the second state, and is greater than the width of the silicon wafer in the silicon wafer unit.

[0064] Specifically, the material trough LC of the silicon wafer degumming tool 100 also includes a silicon wafer clamping rod 70 for clamping the silicon wafer in the silicon wafer unit, the silicon wafer clamping rod 70 is parallel to the first support rod 10, and is located between the longitudinal support rods 60 relatively arranged along the width direction D2 of the material trough LC, a pair of silicon wafer clamping rods 70 are relatively arranged along the width direction D2 of the material trough LC, and the spacing between the pair of silicon wafer clamping rods 70 is adjustable. In the first state, the spacing between the pair of silicon wafer clamping rods 70 is greater than the width of the silicon wafer in the silicon wafer unit. , the first state is applicable to the situation when the silicon wafer unit is transferred to the silicon wafer degumming tool 100 and has not yet been transferred to the silicon wafer degumming tool 100, that is, before the silicon wafer unit is transferred to the material trough LC in the silicon wafer degumming tool 100, a pair of silicon wafer units are controlled to the first state, so that the spacing between a pair of silicon wafer clamping rods 70 is greater than the width of the silicon wafer in the silicon wafer unit, so that when the silicon wafer unit is transferred to the material trough LC, the silicon wafer clamping rod 70 can be prevented from causing unnecessary interference to the silicon wafer unit. After the silicon wafer unit is transferred to the material trough LC, the silicon wafer clamping rod 70 can be controlled to enter the second state. In the second state, the spacing between the pair of silicon wafer clamping rods 70 becomes smaller, and the silicon wafer clamping rod 70 clamps the silicon wafer to prevent the silicon wafer from shaking during the subsequent transportation process. It should be noted that the first state and the second state of the silicon wafer clamping rod 70 can be automatically controlled, so as to realize the automatic clamping of the silicon wafer in the silicon wafer unit to meet the needs of automated production.

[0065] Figure 4FIG. 4 is a schematic diagram of a structure of the side wall 40 in the silicon wafer debonding tool 100 provided in the present application. In order to clearly illustrate the corresponding structure, the side wall 40 at the corresponding position is not shown in the figure. The side wall can be referred to as Figure 1 , please combine Figure 1 and Figure 4 In an optional embodiment of the present application, the material trough LC includes a pair of side walls 40 relatively arranged along its length direction D1, and the side walls 40 include a shift groove 90. The material trough LC also includes a pair of connecting rod structures 80. The pair of connecting rod mechanisms 80 are fixed to a pair of silicon wafer clamping rods 70. The two ends of the same connecting rod mechanism 80 are respectively located in the two shift grooves 90 at the pair of side walls 40 and can move in the shift groove 90 along the width direction D2 of the material trough LC; in the first state, the end of the connecting rod mechanism 80 contacts the outer limiting wall 91 of the shift groove 90; in the second state, the end of the connecting rod mechanism 80 contacts the inner limiting wall 92 of the shift groove 90, wherein the outer limiting wall 91 and the inner limiting wall 92 are relatively arranged along the width direction D2 of the material trough LC.

[0066] In order to realize the switching of the wafer clamping rod 70 from the first state to the second state, the present application introduces a connecting rod mechanism 80 and a shifting groove 90 in the material tank LC. Figure 1 and Figure 4Optionally, the connecting rod mechanism 80 extends along the length direction of the material tank as a whole, and its two ends penetrate the shifting grooves 90 on the two side walls 40 and can slide in the shifting grooves. The connecting rod mechanism 80 and the silicon wafer clamping rod 70 can be connected by screws or other feasible methods, which is not specifically limited in this application. The shifting groove 90 can be regarded as a hollow rectangular structure, and the extension direction of the shifting groove 90 is the long side direction of the rectangular structure, which is the same as the width direction D2 of the material tank LC. When the connecting rod mechanism 80 moves in the shifting groove 90, the moving direction is parallel to the width direction D2 of the material tank LC. In the hollow rectangular structure of the shift slot 90, the two short sides correspond to the limiting walls of the shift slot 90, and the connecting rod mechanism 80 can be controlled to move only in the shift slot 90. Each shift slot 90 has two limiting walls, and the outer limiting wall 91 refers to the side wall 40 of the shift slot 90 close to the first support rod 10, and the inner limiting wall 92 refers to the side wall 40 of the shift slot 90 away from the first support rod 10. In the first state, an outward force can be applied to the connecting rod mechanism 80 or the silicon wafer clamping rod 70 through an external device to move the connecting rod mechanism 80 and the silicon wafer clamping rod 70 toward the outer periphery of the material slot LC. The connecting rod mechanism 80 moves in the shift slot 90 and contacts with the outer limiting wall 91 of the shift slot 90. At this time, the spacing between a pair of silicon wafer clamping rods 70 is the largest, and the silicon wafer unit can be moved into the material slot LC. When the silicon wafer unit enters the material trough LC, after the crystal tray support slot 30 supports and positions the crystal tray, the silicon wafer clamping rod 70 can be controlled to enter the second state. In the second state, the connecting rod mechanism 80 drives the silicon wafer clamping rod 70 to move toward each other, and the connecting rod mechanism 80 contacts the inner limiting wall 92 of the shift groove 90. At this time, the spacing distance between a pair of silicon wafer clamping rods 70 is the smallest, and the silicon wafer in the material trough LC can be clamped.

[0067] Please combine Figure 1 and Figure 4 It should be noted that the silicon wafer degumming tool 100 provided in the embodiment of the present application may also include a transverse support rod 01, which is parallel to the second support rod 20 and is located at the periphery of the second support rod 20, and the shift groove 90 may be arranged above the transverse support rod 01 to fix the shift groove 90.

[0068] Figure 5 The figure shows a relative position relationship diagram of the connecting rod mechanism 80 and the spring 02 in the silicon wafer debonding tool 100 provided in the present application. Figure 1 , Figure 4 and Figure 5 In an optional embodiment of the present application, at a position corresponding to the side wall 40 on the same side of the material trough LC, a connecting rod mechanism 80 fixed to a pair of silicon wafer clamping rods 70 is connected to the two ends of the same spring 02. In the first state, the spring 02 is in a stretched state; in the second state, the spring 02 is in a contracted state.

[0069] Specifically, this embodiment shows a solution in which two connecting rod mechanisms 80 located on the same side of the wafer clamping rod 70 are also connected to the two ends of the same spring 02. In the first state, an external force is applied to the connecting rod mechanism 80 or the wafer clamping rod 70, and the connecting rod mechanism 80 is pulled to the position corresponding to the outer limiting wall 91 of the displacement groove 90, and the interval between the wafer clamping rods 70 becomes larger. At this time, the spring 02 connected to the pair of connecting rod mechanisms 80 will be stretched with the displacement of the connecting rod mechanism 80. When the wafer unit is placed in the material tank LC and the crystal tray is positioned by the crystal tray support slot 30, the external force applied to the connecting rod mechanism 80 or the wafer clamping rod 70 can be removed. At this time, under the contraction of the spring 02, the connecting rod mechanism 80 will automatically drive the wafer clamping rod 70 to relatively displace, and the connecting rod mechanism 80 is displaced to the position corresponding to the inner limiting wall 92 of the displacement slot, so that the wafer clamping rod 70 is automatically retracted and clamps the wafer. It can be seen that when the connecting rod mechanism 80 fixed to the silicon wafer clamping rod 70 is connected to the same spring 02, after the external force is cancelled, the spring 02 can drive the silicon wafer clamping rod 70 to automatically enter the second state, thereby realizing the automatic clamping function of the silicon wafer clamping rod 70 on the silicon wafer in the material trough LC.

[0070] Please combine Figure 1 , Figure 4 and Figure 5 In an optional embodiment of the present application, at a position corresponding to the side wall 40 on the same side of the material trough LC, the displacement groove 90 is located on the inner side of the side wall 40, and the spring 02 is located on the outer side of the side wall 40; the side wall 40 includes an opening portion, and the connecting rod mechanism 80 is arranged to pass through the opening portion.

[0071] This embodiment further explains the relative positional relationship between the shifting groove 90, the connecting rod mechanism 80, the spring 02 and the side wall 40 of the material tank LC. Specifically, the shifting groove 90 is located on the inner side of the side wall 40, that is, on the side of the side wall 40 facing the inside of the material tank LC; the spring 02 is located on the outer side of the side wall 40, that is, on the side of the side wall 40 away from the inside of the material tank LC; the side wall 40 has an opening, and the connecting rod mechanism 80 passes through the opening. A part of the connecting rod mechanism 80 is located on the inner side of the side wall 40 and is movably connected to the shifting groove 90 and fixed to the silicon wafer clamping rod 70, and another part of the connecting rod mechanism 80 is located on the outer side of the side wall 40 for connecting with the spring 02. This arrangement makes reasonable use of the space at the side wall 40, which is conducive to realizing the structural integration of the silicon wafer debonding tooling 100.

[0072] In an optional embodiment of the present application, the silicon wafer degumming tool 100 also includes a pulling rod mechanism (not shown in the figure), which is used to apply a pulling force to the connecting rod mechanism 80 or the silicon wafer clamping rod 70 to make the silicon wafer clamping rod 70 enter the first state; when the pulling rod mechanism cancels the pulling force applied to the connecting rod mechanism 80 or the silicon wafer clamping rod 70, the spring 02 contracts to make the silicon wafer clamping rod 70 enter the second state.

[0073] Specifically, the silicon wafer degumming tool 100 provided in the present application may also include a pull rod mechanism. Before the silicon wafer unit is moved into the material trough LC of the silicon wafer degumming tool 100, an outward pulling force may be applied to the silicon wafer clamping rod 70 or the connecting rod mechanism 80 through the pull rod mechanism, so that the spacing distance between the silicon wafer clamping rods 70 is increased. The pull rod mechanism may be, for example, a mechanical wall. When the distance between the silicon wafer clamping rods 70 needs to be increased, the mechanical arm may be controlled to apply an outward pulling force to the silicon wafer clamping rod 70 or the connecting rod mechanism 80; after the silicon wafer unit is placed into the material trough LC, the force of the mechanical arm on the silicon wafer clamping rod 70 or the connecting rod mechanism 80 may be canceled, so that the connecting rod mechanism 80 drives the silicon wafer clamping rod 70 to automatically retract under the contraction of the spring 02, thereby realizing automatic clamping of the silicon wafer. In this way, the automatic opening and retraction of the silicon wafer clamping rod 70 is realized, which is conducive to realizing the automation of the production process.

[0074] Figure 6 The figure shows a relative position relationship diagram of the connecting rod mechanism and the connecting rod fixing part in the silicon wafer debonding tooling provided in the embodiment of the present application, please refer to Figure 6 In an optional embodiment of the present application, the material trough LC also includes a transverse support rod 01, which is arranged close to the side wall 40 and extends along the width direction D2 of the material trough LC. A plurality of connecting rod positioning portions 09 are arranged above the transverse support rod 01, and the connecting rod positioning portions 09 are arranged along the width direction D2 of the material trough LC. The silicon wafer clamping rod 70 is fixed to at least one of the connecting rod positioning portions 09.

[0075] Optionally, the connecting rod positioning portion 09 on the transverse support rod 01 is used to position the connecting rod mechanism 80. The connecting rod positioning portions 90 are arranged side by side in the same horizontal plane and along the width direction D2 of the material trough LC. Optionally, the connecting rod positioning portion 90 includes a positioning hole, and the connecting rod mechanism 80 also includes a positioning hole. When the positioning holes on the connecting rod positioning portion 90 are aligned with the positioning holes on the connecting rod mechanism 80, the positioning columns are inserted into the aligned positioning holes to achieve the positioning of the connecting rod mechanism 80 and the connecting rod positioning portion 90. Optionally, the number of positioning holes on the connecting rod mechanism 80 is smaller than the number of positioning holes on the connecting rod positioning part 90. The positioning holes on the connecting rod mechanism 80 can be fixed to the positioning holes at different positions on the connecting rod positioning part 90 by translating the connecting rod mechanism 80. In this way, the distance between a pair of connecting rod mechanisms 80 can be adjusted, and then the distance between a pair of silicon wafer clamping rods 70 fixed to the connecting rod mechanism 80 can be adjusted. For example, when the connecting rod mechanism 80 is fixed to the positioning holes on the outside of the connecting rod positioning part 90, the distance between the pair of silicon wafer clamping rods 70 can be increased; if the connecting rod mechanism 80 is fixed to the positioning holes on the inside of the connecting rod positioning part 90, the distance between the pair of silicon wafer clamping rods 70 can be reduced. In this way, by introducing the connecting rod positioning part 09, the distance between the pair of silicon wafer clamping rods 70 is adjustable, which is more flexible to use, can meet the needs of clamping silicon wafers of different sizes, and has a wider range of applications.

[0076] Continue to refer Figure 1 Combined with Figure 7 , Figure 7 The figure shows a structural schematic diagram of the side wall of the material trough in the silicon wafer degumming tool provided in the present application. In an optional embodiment of the present application, the silicon wafer degumming tool 100 also includes at least two silicon wafer support rods 03, and the silicon wafer support rods 03 extend along the length direction D1 of the material trough LC. The side wall 40 includes at least two pairs of positioning grooves 04 arranged throughout the thickness direction thereof, and the two ends of the silicon wafer support rods 03 are respectively inserted into two positioning grooves 04 at the same height.

[0077] In the silicon wafer degumming tool 100 provided in the present application, the silicon wafer support rod 03 is used to support the silicon wafer in the silicon wafer unit entering the material tank LC, and the silicon wafer support rod 03 and the silicon wafer clamp rod 70 jointly apply a force to the silicon wafer to prevent the silicon wafer from falling off during transportation. The positioning groove 04 set on the side wall 40 of the silicon wafer degumming tool 100 in the present application is used to fix the aforementioned silicon wafer support rod 03, and the two ends of the silicon wafer support rod 03 are respectively extended into the positioning groove 04 on a pair of side walls 40. When at least two pairs of positioning grooves 04 are set on the side wall 40, the two pairs of positioning grooves 04 have different heights. In actual application, the two ends of the silicon wafer support rod 03 are respectively penetrated in a pair of positioning grooves 04 at the same height, so that the silicon wafer support rod 03 is parallel to the first support rod 10. When the positioning grooves 04 with different heights are set, the position of the silicon wafer support rod 03 can be adjusted according to the size of the silicon wafer in the silicon wafer unit to meet the support of silicon wafers of different sizes, which is more flexible to use and has a wider range of applications.

[0078] It should be noted that in the silicon wafer degumming tooling provided in the present application, the silicon wafer clamping rod and the silicon wafer support rod 30 that are in direct contact with the silicon wafer can be covered with elastic materials such as sponge to avoid unnecessary damage to the silicon wafer when directly contacting the silicon wafer.

[0079] In summary, the silicon wafer degumming tool provided by the utility model achieves at least the following beneficial effects:

[0080] In the silicon wafer degumming tool provided in the present application, a pair of first support rods and a pair of second support rods are arranged at the material mouth of the material trough, wherein the first support rods and the second support rods are arranged crosswise, the second support rods span over the pair of first support rods, and a crystal support card slot is arranged above the second support rods. When the silicon wafer unit is transferred to the silicon wafer degumming tool, the protrusions at both ends of the crystal support will be placed in the corresponding crystal support card slots. The crystal support card slots can reliably support the crystal support without the need for manual insertion of iron rods, thereby meeting the needs of automated production and helping to improve production efficiency.

[0081] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A silicon wafer degumming tool, characterized in that: include: A material trough, wherein the material trough has a material frame and a material opening, the material frame is communicated with the material opening, the material frame is used to accommodate a silicon wafer unit, and the silicon wafer unit includes a crystal tray and a silicon wafer fixed to the crystal tray; The material trough comprises a pair of first support rods arranged at the material opening, the extension direction of the first support rods is the same as the length direction of the material trough, and the pair of first support rods are arranged oppositely along the width direction of the material trough; The material trough further includes a pair of second support rods mounted on the pair of first support rods, the extension direction of the second support rods is the same as the width direction of the material trough, and the pair of second support rods are arranged oppositely along the length direction of the material trough; A crystal tray support slot is arranged above the pair of second support rods; the crystal tray has protrusions at both ends along its length direction, and when the silicon wafer unit is placed in the material trough, the protrusions are located in the crystal tray support slot.

2. The silicon wafer degumming tool according to claim 1, characterized in that: The projection of the crystal tray support slot on the second support rod is a U-shaped structure, and a pair of U-shaped openings of the crystal tray support slot are arranged opposite to each other along the length direction of the material trough.

3. The silicon wafer degumming tool according to claim 1, characterized in that: The material trough includes a pair of side walls arranged opposite to each other along the length direction thereof, and the second support rod and the crystal support slot are located between the pair of side walls.

4. The silicon wafer degumming tool according to claim 1, characterized in that: The material trough comprises at least one pair of silicon wafer clamping rods, the extension direction of the silicon wafer clamping rods is the same as the length direction of the material trough, and the pair of silicon wafer clamping rods are arranged opposite to each other along the width direction of the material trough; The silicon wafer clamping rods include a first state and a second state. The distance between a pair of silicon wafer clamping rods in the first state is greater than the distance between them in the second state, and is greater than the width of the silicon wafer in the silicon wafer unit.

5. The silicon wafer degumming tool according to claim 4, characterized in that: The material trough comprises a pair of side walls arranged opposite to each other along the length direction thereof, the side walls comprising shifting grooves, the material trough further comprises a pair of connecting rod mechanisms, the pair of connecting rod mechanisms are respectively fixed to a pair of silicon wafer clamping rods, and the two ends of the connecting rod mechanisms are respectively located in the two shifting grooves on the pair of side walls and can move in the shifting grooves along the width direction of the material trough; In the first state, the end of the connecting rod mechanism contacts the outer limiting wall of the shift groove; in the second state, the end of the connecting rod mechanism contacts the inner limiting wall of the shift groove, wherein the outer limiting wall and the inner limiting wall are arranged opposite to each other along the width direction of the material trough.

6. The silicon wafer degumming tool according to claim 5, characterized in that: At a position corresponding to the side wall on the same side of the material trough, the connecting rod mechanism fixed with a pair of silicon wafer clamping rods is connected to two ends of the same spring. In the first state, the spring is in a stretched state; in the second state, the spring is in a contracted state.

7. The silicon wafer degumming tool according to claim 6, characterized in that: At a position corresponding to the side wall on the same side of the material trough, the displacement groove is located on the inner side of the side wall, and the spring is located on the outer side of the side wall; the side wall includes an opening portion, and the connecting rod mechanism is arranged to pass through the opening portion.

8. The silicon wafer degumming tool according to claim 6, characterized in that: It also includes a pulling rod mechanism, which is used to apply a pulling force to the connecting rod mechanism or the silicon wafer clamping rod to make the silicon wafer clamping rod enter a first state; when the pulling rod mechanism cancels the pulling force applied to the connecting rod mechanism or the silicon wafer clamping rod, the spring contracts to make the silicon wafer clamping rod enter a second state.

9. The silicon wafer degumming tool according to claim 5, characterized in that: The material trough also includes a transverse support rod, which is arranged close to the side wall and extends along the width direction of the material trough. A plurality of connecting rod positioning parts are arranged above the transverse support rod, and the connecting rod positioning parts are arranged along the width direction of the material trough. The connecting rod mechanism is fixed to at least one of the connecting rod positioning parts.

10. The silicon wafer degumming tool according to claim 5, characterized in that: It also includes at least two silicon wafer support rods, which extend along the length direction of the material trough. The side wall includes at least two pairs of positioning grooves arranged throughout its thickness direction, and the two ends of the silicon wafer support rods are respectively inserted into the two positioning grooves at the same height.

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