A suction plate for semiconductor manufacturing equipment

Abstract

The utility model discloses a suction disk for semiconductor manufacturing equipment, and relates to the technical field of semiconductor materials. The utility model includes a bottom shell, an upper cover is installed on the bottom shell, a plurality of suction cups are arranged at the bottom of the bottom shell, an adjustment shaft is rotatably matched on the upper cover, a connecting rod is installed on the upper cover, an adjustment component is arranged between the bottom shell and the upper cover, and the adjustment component includes a rotating disk rotatably matched on the bottom shell, a slider slidably matched on the bottom shell, a connecting frame arranged between the rotating disk and the slider, and the suction cup is arranged at the bottom of the slider, and the adjustment shaft cooperates with the rotating disk. The utility model drives a plurality of sliders to slide on the bottom shell through a plurality of connecting frames by rotating the rotating disk, and the suction cups are located at the bottom of the slider, and the relative suction cups move relative to each other, so that the suction cups that move relative to each other can adapt to wafers of different sizes to perform adsorption operations on them when the slider slides and adjusts.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor materials, and in particular relates to an adsorption disk used for semiconductor manufacturing equipment. Background Art

[0002] The wafer in the prior art refers to the substrate (also called base) for manufacturing semiconductor transistors or integrated circuits. It is called a wafer because it is made of crystalline material and is round in shape. The wafer suction plate is used to vacuum-absorb the wafer and fix it on the suction plate during the semiconductor manufacturing process, and perform photolithography and glue coating operations on the wafer.

[0003] The Chinese patent with publication number CN211788958U discloses a semiconductor wafer suction cup, which solves the technical problem that the current suction cup can only handle wafers of a single size. It includes a suction cup body, a connecting sleeve with an internal thread, and a connecting piece with an external thread. The connecting sleeve and the suction cup body are detachably connected, and the connecting piece passes through the connecting sleeve and is threadedly connected to the suction cup body, so that the suction cup body and the connecting sleeve are detachably fixed together. According to the above technical scheme, the wafer suction cup structure with suction cup bodies of different sizes can be replaced, so that after the suction cup is equipped, the purpose of handling multiple sizes of wafers can be achieved by disassembling the suction cup body.

[0004] The above semiconductor wafer suction cup needs to replace the suction cup body when sucking and picking up semiconductor wafers of different sizes, and needs to be stopped for replacement. It is inconvenient to replace and also increases the operation time, reducing the suction efficiency of the wafer.

[0005] In view of this, the present utility model is proposed. Utility Model Content

[0006] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a suction plate for semiconductor manufacturing equipment.

[0007] In order to solve the above technical problems, the basic concept of the technical solution adopted by the utility model is:

[0008] A suction plate for semiconductor manufacturing equipment, comprising a bottom shell, an upper cover mounted on the bottom shell, a plurality of suction cups arranged at the bottom of the bottom shell, an adjustment shaft rotatably matched on the upper cover, a connecting rod mounted on the upper cover, and an adjustment component arranged between the bottom shell and the upper cover;

[0009] The adjusting assembly comprises a rotating disk rotatably matched with the bottom shell, a sliding block slidably matched with the bottom shell, a connecting frame arranged between the rotating disk and the sliding block, and a suction cup arranged at the bottom of the sliding block, and the adjusting shaft matches with the rotating disk.

[0010] Optionally, a plurality of first connecting columns are installed on the rotating disk, and connecting grooves are respectively provided at both ends of the connecting frame, the first connecting column rotatably fits in one of the connecting grooves, a second connecting column is installed on one side of the slider, and the second connecting column rotatably fits in another connecting groove, a plurality of sliding grooves are provided on the bottom shell, the slider slides in the sliding grooves, a rotating groove is provided on the bottom shell, and a rotating column is installed at the bottom of the rotating disk, and the rotating column rotatably fits in the rotating groove; the rotating rotating disk drives the plurality of sliders to slide on the bottom shell through the plurality of connecting frames, and the suction cups are located at the bottom of the slider, and the relative suction cups move relative to each other, so that the suction cups moving relative to each other can adapt to wafers of different sizes to adsorb them when the slider slides and is adjusted.

[0011] Optionally, a first gear is installed on the rotating disk, a second gear is installed at the bottom of the adjusting shaft, the second gear is meshed with the first gear, a through slot is opened on one side of the adjusting shaft, a moving block is slidably fitted in the through slot, a first slot hole and a plurality of slots are opened on the upper cover, the adjusting shaft is rotatably fitted in the first slot hole, a pin is installed at the bottom of the moving block, and the pin is inserted in the slot.

[0012] Optionally, a fixing rod is installed in the through slot, a second slot hole is opened on one side of the moving block, the second slot hole is slidably fitted on the fixing rod, a spring is installed on the moving block, and the spring is sleeved on the fixing rod, and operating blocks are installed on opposite sides of the moving block; the second gear arranged at the bottom of the rotating adjustment shaft is meshed with the first gear of the rotating disk, so that the rotating adjustment shaft drives the rotating disk to rotate, and the moving block is arranged on the adjusting shaft, and the moving block is applied with a downward force by the action of the spring so that the pin is inserted into the slot, thereby limiting the moving block and fixing the rotation of the adjusting shaft.

[0013] After adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art. Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described below at the same time:

[0014] 1. The adsorption disk used for semiconductor manufacturing equipment drives multiple sliders to slide on the bottom shell by rotating the rotating disk through multiple connecting frames, and the suction cups are located at the bottom of the sliders, and the relative suction cups move relative to each other, so that the suction cups that move relative to each other can adapt to wafers of different sizes for adsorption operations when the sliders are slid and adjusted, thereby reducing the need to replace the suction cup body when adsorbing and picking up semiconductor wafers of different sizes. The need to stop the machine for replacement increases the operation time and reduces the adsorption efficiency of the wafers.

[0015] 2. The suction disk for semiconductor manufacturing equipment meshes with the first gear of the rotating disk through the second gear arranged at the bottom of the rotating adjustment shaft, so that the rotating adjustment shaft drives the rotating disk to rotate. A moving block is arranged on the adjusting shaft, and the moving block exerts a downward force on it through the force of the spring so that the pin is inserted into the slot, which limits the moving block and fixes the rotation of the adjusting shaft, thereby reducing the situation where the adjusting shaft rotates when multiple suction cups adsorb semiconductor wafers, causing the adjustment component to be unstable, and causing the suction cups to fall when adsorbing semiconductor wafers. Multiple slots are arranged on the upper cover so that the pins of the moving block are located in different slots for adjustment and fixing.

[0016] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the exploded structure of the regulating assembly of the embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the connection between the adjusting shaft and the rotating disk in the embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the mobile block connection of the embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the upper cover of an embodiment of the utility model;

[0023] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0024] 1-bottom shell, 2-upper cover, 3-suction cup, 4-adjusting shaft, 5-rotating disk, 6-connecting frame, 7-slider, 8-moving block, 9-spring, 101-slide groove, 102-rotating groove, 201-first slot hole, 202-slot, 203-connecting rod, 401-second gear, 402-through slot, 403-fixing rod, 501-first connecting column, 502-first gear, 503-rotating column, 601-connecting groove, 701-second connecting column, 801-second slot hole, 802-latch, 803-operating block.

[0025] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0026] The utility model will now be further described in detail with reference to the accompanying drawings.

[0027] See also Figure 1-5 As shown, in this embodiment, a suction plate for semiconductor manufacturing equipment is provided, including a bottom shell 1, an upper cover 2 is mounted on the bottom shell 1, a plurality of suction cups 3 are arranged at the bottom of the bottom shell 1, an adjustment shaft 4 is rotatably matched on the upper cover 2, a connecting rod 203 is mounted on the upper cover 2, and an adjustment component is arranged between the bottom shell 1 and the upper cover 2;

[0028] The adjusting assembly includes a rotating disk 5 rotatably engaged with the bottom shell 1, a slider 7 slidably engaged with the bottom shell 1, a connecting frame 6 arranged between the rotating disk 5 and the slider 7, and the suction cup 3 is arranged at the bottom of the slider 7, and the adjusting shaft 4 cooperates with the rotating disk 5.

[0029] One aspect of the application of this embodiment is: the rotating rotating disk 5 drives multiple sliders 7 to slide on the bottom shell 1 through multiple connecting frames 6, and the suction cups 3 are located at the bottom of the sliders 7, and the relative suction cups 3 move relative to each other, so that the suction cups 3 that move relative to each other can adapt to wafers of different sizes for adsorption operations when the sliders 7 slide and adjust, thereby reducing the need to replace the suction cup body when adsorbing and picking up semiconductor wafers of different sizes. The need to stop the machine for replacement increases the operation time and reduces the adsorption efficiency of the wafers.

[0030] In the present embodiment, a plurality of first connecting posts 501 are mounted on the rotating disk 5, and connecting grooves 601 are respectively provided at both ends of the connecting frame 6. The first connecting post 501 is rotatably engaged in one of the connecting grooves 601. A second connecting post 701 is mounted on one side of the slider 7, and the second connecting post 701 is rotatably engaged in another connecting groove 601. A plurality of slide grooves 101 are provided on the bottom shell 1, and the slider 7 is slidably engaged in the slide grooves 101. A rotating groove 102 is provided on the bottom shell 1, and a rotating post 503 is mounted at the bottom of the rotating disk 5, and the rotating post 503 is rotatably engaged in the rotating groove 102; the rotating rotating disk 5 drives the plurality of sliders 7 to slide on the bottom shell 1 through the plurality of connecting frames 6, and the suction cups 3 are located at the bottom of the slider 7, and the relative suction cups 3 move relative to each other, so that the suction cups 3 that move relative to each other can adapt to wafers of different sizes to adsorb them when the slider 7 slides and adjusts, thereby reducing the need to replace the suction cup body when adsorbing and picking up semiconductor wafers of different sizes, and the need to stop the machine for replacement increases the operation time and reduces the wafer adsorption efficiency.

[0031] In this embodiment, a first gear 502 is installed on the rotating disk 5, and a second gear 401 is installed at the bottom of the adjusting shaft 4. The second gear 401 is meshed with the first gear 502. A through slot 402 is provided on one side of the adjusting shaft 4, and a moving block 8 is slidably fitted in the through slot 402. A first slot hole 201 and a plurality of slots 202 are provided on the upper cover 2. The adjusting shaft 4 is rotatably fitted in the first slot hole 201. A latch 802 is installed at the bottom of the moving block 8, and the latch 802 is inserted into the slot 202.

[0032] In this embodiment, a fixing rod 403 is installed in the through slot 402, a second slot hole 801 is opened on one side of the moving block 8, and the second slot hole 801 is slidably matched on the fixing rod 403. A spring 9 is installed on the moving block 8, and the spring 9 is sleeved on the fixing rod 403. Operation blocks 803 are installed on the opposite sides of the moving block 8; the second gear 401 arranged at the bottom of the rotating adjustment shaft 4 is meshed with the first gear 502 of the rotating disk 5, so that the rotating adjustment shaft 4 drives the rotating disk 5 to rotate. By arranging the moving block 4 on the adjusting shaft 8. The moving block 8 is exerted a downward force by the force of the spring 9 so that the pin 802 is inserted into the slot 202, which limits the moving block 8, thereby fixing the rotation of the adjustment shaft 4, reducing the situation where the adjustment shaft 4 rotates when multiple suction cups 3 adsorb semiconductor wafers, causing the adjustment component to be unstable, and causing the suction cups 3 to fall when adsorbing semiconductor wafers. Multiple slots 202 are provided on the upper cover 2 so that the pins 802 of the moving block 8 are located in different slots 202 for adjustment and fixing.

[0033] The present invention is not limited to the above-mentioned implementation modes. Anyone should be aware of the structural changes made under the inspiration of the present invention. Any technical solution that is the same or similar to the present invention falls within the protection scope of the present invention. The technology, shape, and structure that are not described in detail in the present invention are all known technologies.

Claims

1. A suction plate for semiconductor manufacturing equipment, characterized in that: include: A bottom shell (1), an upper cover (2) is mounted on the bottom shell (1), a plurality of suction cups (3) are arranged at the bottom of the bottom shell (1), an adjustment shaft (4) is rotatably mounted on the upper cover (2), a connecting rod (203) is mounted on the upper cover (2), and an adjustment component is arranged between the bottom shell (1) and the upper cover (2); The adjustment assembly comprises a rotating disk (5) rotatably matched with the bottom shell (1), a slider (7) slidably matched with the bottom shell (1), and a connecting frame (6) arranged between the rotating disk (5) and the slider (7), and the suction cup (3) is arranged at the bottom of the slider (7), and the adjustment shaft (4) is matched with the rotating disk (5).

2. The adsorption tray for semiconductor manufacturing equipment according to claim 1, characterized in that: A plurality of first connecting posts (501) are mounted on the rotating disk (5), connecting grooves (601) are respectively formed at both ends of the connecting frame (6), the first connecting post (501) is rotatably engaged in one of the connecting grooves (601), and a second connecting post (701) is mounted on one side of the sliding block (7), the second connecting post (701) is rotatably engaged in the other connecting groove (601).

3. The adsorption tray for semiconductor manufacturing equipment according to claim 2, characterized in that: A plurality of slide grooves (101) are provided on the bottom shell (1), and the sliders (7) are slidably fitted in the slide grooves (101). A rotation groove (102) is provided on the bottom shell (1), and a rotation column (503) is installed at the bottom of the rotating disk (5), and the rotation column (503) is rotationally fitted in the rotation groove (102).

4. The adsorption tray for semiconductor manufacturing equipment according to claim 1, characterized in that: A first gear (502) is mounted on the rotating disk (5), a second gear (401) is mounted on the bottom of the adjusting shaft (4), the second gear (401) is meshed with the first gear (502), a through slot (402) is formed on one side of the adjusting shaft (4), and a moving block (8) is slidably fitted in the through slot (402).

5. The adsorption tray for semiconductor manufacturing equipment according to claim 4, characterized in that: The upper cover (2) is provided with a first slot hole (201) and a plurality of slots (202); the adjusting shaft (4) is rotatably fitted in the first slot hole (201); a latch (802) is installed at the bottom of the moving block (8); and the latch (802) is inserted into the slots (202).

6. The adsorption tray for semiconductor manufacturing equipment according to claim 5, characterized in that: A fixing rod (403) is arranged in the through slot (402); a second slot hole (801) is opened on one side of the moving block (8); the second slot hole (801) is slidably fitted on the fixing rod (403); a spring (9) is arranged on the moving block (8), and the spring (9) is sleeved on the fixing rod (403); and operating blocks (803) are arranged on opposite sides of the moving block (8).

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