Packages, packaging components and batteries

Abstract

The present application discloses a package, a package assembly and a battery, and relates to the field of packaging. A package comprises: a circuit board, a first electrical component, a second electrical component and a plastic sealing layer; the first electrical component and the second electrical component are respectively arranged on the circuit board and are respectively electrically connected to the circuit board; in a direction perpendicular to the board surface of the circuit board, the thickness dimension of the first electrical component is greater than the thickness dimension of the second electrical component; the plastic sealing layer is wrapped around the outer side of the second electrical component. The present application can solve the problems that the current packaging structure is thick and increases the occupied space.

Description

Technical Field

[0001] The present application belongs to the field of packaging technology, and specifically relates to a packaging part, a packaging assembly and a battery. Background Art

[0002] In the related art, the system in a package (SIP) structure uses the SIP packaging process to plastic-encapsulate all devices, which invisibly increases the thickness of the packaging structure. Therefore, when installing the packaging structure, the packaging structure requires a larger space, resulting in a problem of cramped installation space. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a package, a package assembly and a battery, which can solve the problems of the current package structure being thick and increasing the occupied space.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] The embodiment of the present application provides a package, comprising: a circuit board, a first electrical component, a second electrical component and a plastic packaging layer;

[0006] The first electrical component and the second electrical component are respectively disposed on the circuit board and are respectively electrically connected to the circuit board;

[0007] In a direction perpendicular to the surface of the circuit board, the thickness of the first electrical component is greater than the thickness of the second electrical component;

[0008] The plastic packaging layer is wrapped around the outer side of the second electrical component.

[0009] Optionally, the board surface of the circuit board has a first area and a second area;

[0010] The first electrical element is disposed in the first area;

[0011] The second electrical element is disposed in the second area;

[0012] The plastic sealing layer is arranged in the second area, and is arranged on the periphery of the second electrical component and on the side of the second electrical component away from the board surface.

[0013] Optionally, the second electrical element is distributed on at least one side of the first electrical element.

[0014] Optionally, in a plane parallel to the board surface, a projected area of ​​the plastic packaging layer is equal to a projected area of ​​the second region.

[0015] Optionally, the first electrical component is disposed on the board surface;

[0016] The second electrical component is stacked on a side of the first electrical component facing away from the board surface;

[0017] The plastic packaging layer is arranged on the outer periphery of the second electrical component and on a side of the second electrical component away from the first electrical component.

[0018] Optionally, a groove is provided on a surface of the circuit board.

[0019] Optionally, the depth dimension of the groove in a direction perpendicular to the plate surface ranges from 0.05 mm to 0.15 mm.

[0020] The embodiment of the present application also provides a packaging assembly, including a mold and the above-mentioned packaging component;

[0021] The mold is arranged above the package, and a protrusion structure is arranged on a side of the mold facing the package, and the protrusion structure is arranged correspondingly to the groove up and down.

[0022] Optionally, in a plastic-sealed state, at least a portion of the protruding structure is located in the groove, and a gap exists between a bottom end surface of the protruding structure and a bottom wall of the groove.

[0023] Optionally, the protruding structure includes a first surface facing the plastic encapsulation layer and a second surface facing away from the plastic encapsulation layer;

[0024] The first surface extends obliquely from top to bottom toward the second surface.

[0025] The embodiment of the present application also provides a battery, including a battery body and a protection plate;

[0026] The protection plate is electrically connected to the battery body;

[0027] The protection plate is the above-mentioned packaging component.

[0028] In the embodiment of the present application, the second electrical component with a smaller thickness is plastic-encapsulated to form a plastic-encapsulation layer wrapped around the outside of the second electrical component, while the first electrical component with a larger thickness is not plastic-encapsulated. Compared with the method of plastic-encapsulating all components, the embodiment of the present application can effectively reduce the overall thickness of the package, thereby reducing the space occupied by the package, and further provide a larger accommodation space for other components, effectively alleviating the problem of cramped accommodation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is an overall schematic diagram of the package disclosed in the embodiment of the present application;

[0030] Figure 2 It is a first partial schematic diagram of a package disclosed in an embodiment of the present application;

[0031] Figure 3 A second partial schematic diagram of a package disclosed in an embodiment of the present application;

[0032] Figure 4 A third partial schematic diagram of the package disclosed in the embodiment of the present application;

[0033] Figure 5 A schematic cross-sectional view of a first form of a packaging component disclosed in an embodiment of the present application;

[0034] Figure 6 A schematic cross-sectional view of a second form of a packaging component disclosed in an embodiment of the present application;

[0035] Figure 7 A schematic cross-sectional view of a third form of a packaging component disclosed in an embodiment of the present application;

[0036] Figure 8 for Figures 5 to 7 A partial enlarged view of point A in the middle.

[0037] Description of reference numerals:

[0038] 10-Packaging;

[0039] 11-circuit board; 111-first area; 112-second area; 113-groove;

[0040] 12- a first electrical component;

[0041] 13- a second electrical component;

[0042] 14- plastic sealing layer;

[0043] 20-mold; 21-protruding structure; 211-first surface; 212-second surface;

[0044] M-Gap. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0047] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0048] refer to Figures 1 to 8 The embodiment of the present application discloses a package 10 , and the disclosed package 10 includes a circuit board 11 , a first electrical component 12 , a second electrical component 13 and a plastic packaging layer 14 .

[0049] Among them, the circuit board 11 is a basic component, which can provide a bearing and installation basis for the first electrical component 12, the second electrical component 13, the plastic packaging layer 14, etc. In some embodiments, the first electrical component 12 and the second electrical component 13 are respectively arranged on the circuit board 11 to ensure the firmness and stability of the first electrical component 12 and the second electrical component 13. It should be pointed out that the first electrical component 12 and the second electrical component 13 can each be directly arranged on the circuit board 11, or indirectly arranged on the circuit board 11, and the specific arrangement form can be selected according to the actual working conditions.

[0050] In addition, the first electrical component 12 and the second electrical component 13 are both functional devices, and both are electrically connected to the circuit board 11 to achieve signal transmission between the first electrical component 12 and the second electrical component 13 and the circuit board 11, such as electrical signals, data signals, etc.

[0051] Exemplarily, the first electrical component 12 may be an electric meter, a fuse, etc., and the second electrical component 13 may be a chip, etc. Of course, the first electrical component 12 and the second electrical component 13 may also be other components, which are not specifically limited here.

[0052] In a direction perpendicular to the surface of the circuit board 11, the thickness of the first electrical component 12 is greater than the thickness of the second electrical component 13. Based on this, the first electrical component 12 can be defined as a high-order component, the second electrical component 13 can be defined as a low-order component, and the thickness (or height) of the high-order component is greater than that of the low-order component.

[0053] Considering that the external environment may have certain influences on the circuit board 11, the first electrical component 12 and the second electrical component 13, such as humidity, corrosion, high temperature and other environments. In order to reduce the influence of the external environment and extend their respective service life, in theory, the outer sides of the circuit board 11, the first electrical component 12 and the second electrical component 13 can be plastic-sealed (i.e., injection molded) so that a protective layer can be formed on their respective outer sides to alleviate the influence of the external environment.

[0054] However, in some cases, since the first electrical component 12 is a high-position component and its own thickness is relatively large, after a protective layer is formed on the outside of the first electrical component 12, the thickness of the first electrical component 12 will be further increased. Accordingly, the space occupied by the first electrical component 12 in the thickness direction will be increased, resulting in a larger overall thickness of the package 10, making the installation space of other components more cramped, and ultimately affecting the performance of other components.

[0055] For example, when the package 10 is applied to a battery, if the thickness of the package 10 is large, the overall volume of the battery will be larger, or the capacity of the battery will be reduced without changing the overall volume of the battery, thereby affecting the battery's endurance performance.

[0056] Based on the above situation, taking into account the possible impact of the external environment on the package 10 and the overall performance of the package 10, the embodiment of the present application performs air-avoidance treatment on high-order components such as the first electrical component 12 instead of plastic sealing, and plastic seals low-order components such as the second electrical component 13 to form a plastic sealing layer 14. Thus, the plastic sealing layer 14 is wrapped around the outside of the second electrical component 13 to protect the second electrical component 13. It should be noted here that the impact that the external environment may have on the package 10 is relatively slow, and the overall performance of the package 10 is more critical. Therefore, the embodiment of the present application performs plastic sealing on a local area of ​​the package 10 without affecting the overall performance of the package 10 to play a role of local protection.

[0057] Considering that the first electrical component 12 and the second electrical component 13 have a certain thickness difference in the direction perpendicular to the board surface of the circuit board 11, and wrapping the plastic encapsulation layer 14 on the outer side of the second electrical component 13 may cause the thickness of the second electrical component 13 in the direction perpendicular to the board surface of the circuit board 11 to increase, so that the sum of the thickness of the second electrical component 13 and the plastic encapsulation layer 14 in the direction perpendicular to the board surface of the circuit board 11 reaches or even exceeds the thickness of the first electrical component 12. Therefore, after the plastic encapsulation layer 14 is provided, in the direction perpendicular to the board surface of the circuit board 11, the sum of the thickness of the second electrical component 13 and the plastic encapsulation layer 14 can be made less than or equal to the thickness of the first electrical component 12, so as to prevent the thickness of the entire package 10 from increasing after the plastic encapsulation layer 14 is provided.

[0058] Of course, in other embodiments, the plastic layer 14 may also cover at least a portion of the circuit board 11 to protect the circuit board 11. Exemplarily, the plastic layer 14 may plastic-seal the surface of the circuit board 11 adjacent to the second electrical component 13 to protect it.

[0059] Therefore, the embodiment of the present application performs plastic encapsulation on the second electrical component 13 with a smaller thickness to form a plastic encapsulation layer 14 wrapped around the outside of the second electrical component 13, while the first electrical component 12 with a larger thickness is not plastic encapsulated. Compared with the method of plastic encapsulating all components, the embodiment of the present application can effectively reduce the overall thickness of the package 10, thereby reducing the occupied space of the package 10, and further provide a larger accommodation space for other components, effectively alleviating the problem of cramped accommodation space.

[0060] refer to Figures 1 to 7 In some embodiments, the board surface of the circuit board 11 may have a first area 111 and a second area 112. The arrangement of the first area 111 and the second area 112 may be set according to actual working conditions and is not specifically limited here.

[0061] In the embodiment of the present application, along the length direction of the circuit board 11, the second area 112 may be distributed on at least one side of the first area 111. Figure 5 As shown, the second area 112 can be set on the right side of the first area 111; Figure 6 As shown, the second area 112 can be set on the left side of the first area 111; Figure 7 As shown, the second area 112 may be disposed on both sides of the first area 111 .

[0062] like Figures 5 to 7 As shown, the first electrical element 12 is disposed in the first area 111, and the second electrical element 13 is disposed in the second area 112. Therefore, the distribution of the first electrical element 12 and the second electrical element 13 can be determined based on the distribution forms of the first area 111 and the second area 112.

[0063] The plastic encapsulation layer 14 may be disposed in the second region 112 and located at the periphery of the second electrical component 13 and at the side of the second electrical component 13 facing away from the board surface.

[0064] Based on the above configuration, the outer peripheral surface of the second electrical component 13 and the side of the second electrical component 13 facing away from the circuit board 11 can be plastic-sealed by the plastic sealing layer 14, thereby playing a protective role, and the first electrical component 12 is not plastic-sealed by the plastic sealing layer 14. Therefore, the embodiment of the present application does not increase the overall thickness of the package 10 due to the plastic sealing layer 14 wrapping the first electrical component 12 while playing a certain protective role for the package 10.

[0065] In other embodiments, the first electrical component 12 can be disposed on the board surface of the circuit board 11, the second electrical component 13 is stacked on the side of the first electrical component 12 facing away from the board surface, and the plastic packaging layer 14 is disposed on the periphery of the second electrical component 13 and on the side of the second electrical component 13 facing away from the first electrical component 12.

[0066] Based on the above arrangement, the embodiment of the present application arranges the first electrical component 12 and the second electrical component 13 in an overlapping manner, and performs plastic sealing on the outer peripheral surface of the second electrical component 13 and the side facing away from the first electrical component 12, so that the overall thickness of the package 10 will not be increased due to the plastic sealing layer 14 wrapping the first electrical component 12 while playing a certain protective role.

[0067] Based on the different distribution forms of the first electrical component 12 and the second electrical component 13, the embodiment of the present application may involve a variety of plastic packaging methods and perform corresponding panel assembly, specifically including:

[0068] refer to Figures 1 to 4 In some embodiments, the first electrical component 12 can be located on the left side of the circuit board 11 without being plastic-sealed; the second electrical component 13 can be located on the right side of the circuit board 11 and be plastic-sealed. In this case, the panels can be placed from top to bottom.

[0069] In other embodiments, the first electrical component 12 can be located in the middle area of ​​the circuit board 11 without being plastic-sealed; the second electrical component 13 can be located on the left and right sides of the circuit board 11 and are plastic-sealed respectively. In this case, the panels can be placed from top to bottom.

[0070] In some other embodiments, the first electrical component 12 can be arranged on the surface of the circuit board 11, that is, the first electrical component 12 is placed on the lower side, and the second electrical component 13 is arranged on the side of the first electrical component 12 away from the surface of the circuit board 11, that is, the second electrical component 13 is placed on the upper side and plastic-sealed. In this case, the panels can be placed from left to right.

[0071] When the board surface of the circuit board 11 has the first area 111 and the second area 112, the first electrical component 12 and the second electrical component 13 are respectively distributed in different areas of the board surface. In this case, in a plane parallel to the board surface, the projection area of ​​the plastic encapsulation layer 14 is equal to the projection area of ​​the second area 112. Based on this, the plastic encapsulation layer 14 not only protects the second electrical component 13, but also protects the entire second area 112 where the second electrical component 13 is arranged.

[0072] Of course, in other embodiments, in a plane parallel to the board surface, the projected area of ​​the plastic sealing layer 14 may also be smaller than the projected area of ​​the second region 112 , as long as the second electrical component 13 can be plastic sealed.

[0073] In the embodiment of the present application, the plastic layer 14 is formed by injection molding, wherein the injection molding process can be applied to an injection molding mold 20. It should be noted here that the specific structure of the mold 20 and its injection molding principle can refer to the prior art and will not be elaborated here.

[0074] During the injection molding process, the mold 20 moves toward the package 10. To prevent the partial structure of the mold 20 from contacting the circuit board 11 and causing damage to the circuit board 11, a groove 113 may be provided on the surface of the circuit board 11. Figures 5 to 7 Based on this, when the mold 20 moves to the injection molding position (i.e., the plastic sealing state), part of the structure of the mold 20 can be located in the groove 113, thereby effectively alleviating the problem that the part of the structure of the mold 20 contacts the circuit board 11 and causes the circuit board 11 to be squeezed, resulting in damage to the circuit board 11.

[0075] In some embodiments, when the board surface of the circuit board 11 has a first area 111 and a second area 112, the first electrical component 12 and the second electrical component 13 are respectively distributed in different areas of the board surface. Considering that the first electrical component 12 is not plastic-sealed, and the second electrical component 13 is plastic-sealed, in order to avoid the overflow of the injection molding medium from the second area 112 to the first area 111, the groove 113 can be located between the first area 111 and the second area 112. Therefore, in the plastic-sealed state, part of the structure of the mold 20 is located in the groove 113, thereby separating the first area 111 from the second area 112, and thus effectively alleviating the overflow of the injection molding medium from the second area 112 to the first area 111.

[0076] Optionally, the depth of the groove 113 in the direction perpendicular to the plate surface may range from 0.05 mm to 0.15 mm, for example, including 0.05 mm, 0.10 mm, 0.15 mm, etc. Of course, other values ​​are also possible and are not specifically limited here.

[0077] It should be noted that, in order to further reduce the risk of overflow of the injection molding medium, in the injection molding state, the mold 20 pre-presses the circuit board 11 in the non-injection molding area (e.g., the first area 111, etc.) by 20 μm to increase the cavity pressure in the non-injection molding area. Of course, even with the pre-pressing of 20 μm, the presence of the groove 113 can prevent the mold 20 from causing extrusion damage to the circuit board 11.

[0078] Based on the above-mentioned package 10, the present application embodiment also discloses a packaging component, referring to Figures 1 to 8 The disclosed packaging component includes a mold 20 and the above-mentioned package 10, wherein the mold 20 is arranged above the package 10, and a protruding structure 21 (that is, the above-mentioned partial structure) is provided on the side of the mold 20 facing the package 10, and the protruding structure 21 is arranged corresponding to the groove 113 up and down.

[0079] Based on the above arrangement, in the plastic sealing state, the mold 20 moves downward until at least part of the protruding structure 21 is located in the groove 113. At this time, the side wall of the protruding structure 21 can block the injection medium to prevent the injection medium from overflowing from the position where the second electrical component 13 is located to the position where the first electrical component 12 is located.

[0080] To prevent the mold 20 from crushing the circuit board 11 during the injection molding process, at least a portion of the protruding structure 21 is located within the groove 113 during the plastic packaging (i.e., injection molding) process, and a gap M is provided between the bottom end surface of the protruding structure 21 and the bottom wall of the groove 113. Figure 8 As shown, the existence of the gap M can effectively prevent the protruding structure 21 from contacting the circuit board 11 and damaging the circuit board 11, and since the gap M is relatively small, it is difficult for the injection medium to pass through the gap M, thereby also overcoming the problem of injection medium overflow.

[0081] Exemplarily, the gap M may range from 0.02 mm to 0.08 mm, including, for example, 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, etc. Of course, it may also be other values, which are not specifically limited here.

[0082] Continue to refer Figure 8 In some embodiments, the protruding structure 21 may include a first surface 211 facing the molding layer 14 and a second surface 212 facing away from the molding layer 14. The first surface 211 extends obliquely from top to bottom toward the second surface 212. Based on this design, the flow velocity and pressure of the injection medium can be effectively reduced, and the overflow of the injection medium from the injection area to the non-injection area can be alleviated to a certain extent, thereby alleviating the problem of glue overflow.

[0083] In addition, the design of the first surface 211 extending obliquely and the design of the mold 20 pre-pressing the circuit board 11 in the non-injection area can cooperate with each other to further alleviate the glue overflow problem.

[0084] Of course, the second surface 212 may also extend obliquely from top to bottom toward the first surface 211 , so that the protruding structure 21 may be a wedge-shaped structure.

[0085] Based on the above-mentioned package 10, the embodiment of the present application further discloses a battery, wherein the disclosed battery includes a battery body and a protection plate, wherein the protection plate is electrically connected to the battery body to protect the battery body.

[0086] Based on the above configuration, the configuration of the plastic layer 14 can help reduce the thickness of the package 10, thereby increasing the volume of the battery body accordingly while keeping the overall volume of the battery unchanged, thereby increasing the battery capacity and improving the battery's endurance performance.

[0087] In the embodiment of the present application, after the circuit board 11 undergoes processes such as surface mounting technology (SMT), flux cleaning, and plasma (PLASMA) treatment, a SIP local injection molding process is performed. High-bit components such as a gas gauge and a fuse avoid secondary injection molding, thereby reducing the total thickness of the injection molding, which is beneficial to reducing the stacking thickness of the protection board, thereby increasing the ID capacity of the battery, and correspondingly improving the battery's availability and endurance.

[0088] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A package, characterized in that: include: A circuit board (11), a first electrical component (12), a second electrical component (13) and a plastic packaging layer (14); The first electrical component (12) and the second electrical component (13) are respectively arranged on the circuit board (11) and are respectively electrically connected to the circuit board (11); In a direction perpendicular to the surface of the circuit board (11), the thickness of the first electrical component (12) is greater than the thickness of the second electrical component (13); The plastic sealing layer (14) is wrapped around the outer side of the second electrical component (13).

2. The package according to claim 1, characterized in that The board surface of the circuit board (11) comprises a first area (111) and a second area (112); The first electrical element (12) is disposed in the first area (111); The second electrical element (13) is disposed in the second area (112); The plastic sealing layer (14) is arranged in the second area (112), and is located at the periphery of the second electrical component (13), and at a side of the second electrical component (13) facing away from the board surface.

3. The package according to claim 2, characterized in that The second electrical element (13) is distributed on at least one side of the first electrical element (12).

4. The package according to claim 2, characterized in that: In a plane parallel to the board surface, the projection area of ​​the plastic sealing layer (14) is equal to the projection area of ​​the second region (112).

5. The package according to claim 1, characterized in that The first electrical element (12) is arranged on the board surface; The second electrical component (13) is stacked on a side of the first electrical component (12) facing away from the board surface; The plastic sealing layer (14) is arranged on the outer periphery of the second electrical component (13) and on a side of the second electrical component (13) facing away from the first electrical component (12).

6. The package according to any one of claims 1 to 5, characterized in that: The board surface of the circuit board (11) is provided with a groove (113), and the depth dimension of the groove (113) in a direction perpendicular to the board surface ranges from 0.05 mm to 0.15 mm.

7. A packaging component, characterized in that: include: A mold (20) and a package (10) as claimed in claim 6; The mold (20) is arranged above the package (10), and a protruding structure (21) is provided on the side of the mold (20) facing the package (10), and the protruding structure (21) and the groove (113) are arranged correspondingly in the upper and lower parts.

8. The packaging assembly according to claim 7, characterized in that: In the plastic-sealed state, at least part of the protruding structure (21) is located in the groove (113), and a gap (M) is provided between the bottom end surface of the protruding structure (21) and the bottom wall of the groove (113).

9. The packaging assembly according to claim 7 or 8, characterized in that: The protruding structure (21) comprises a first surface (211) facing the plastic encapsulation layer (14) and a second surface (212) facing away from the plastic encapsulation layer (14); The first surface (211) extends obliquely from top to bottom toward the second surface (212).

10. A battery, characterized in that: include: Battery body and protection board; The protection plate is electrically connected to the battery body; The protection plate is the package (10) according to any one of claims 1 to 6.

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