Card insertion structure and communication equipment

Abstract

The present specification provides a card insertion structure and a communication device, wherein the card insertion structure includes an A plate and a B plate, and the A plate and the B plate are connected by a first fixing member, and the first fixing member passes through the upper end surface of the A plate and is fixed to the A plate by a first supporting structure member. In the embodiment of the present application, the first fixing member for fixing the A plate and the B plate passes through the upper end surface of the A plate, eliminating the thickness tolerance of the A plate, so that when the A plate and the B plate are positively buckled, the connector connection adaptation effect is good.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a card insertion structure and communication equipment. Background Art

[0002] Multi-layer boards are connected by studs. Usually, the tolerances of the multi-layer boards and studs accumulate, causing problems in connector installation and matching.

[0003] For example, many communication devices have a mother-daughter card structure. The space of the daughter card panel is limited, but the density of the daughter card panel is getting higher and higher. Common mother-daughter card structures include single-layer daughter cards and double-layer (or even multi-layer) daughter-daughter card structures. Due to the design of the connector plug-in between the daughter card and the mother card, the daughter card and the mother card connector plug-in must ensure that the daughter card and the mother card are on the same plane. The plug-in of a single-layer daughter card is easy to achieve, but when the bottom buckle plate of a double-layer daughter card and the mother card are plugged in at the same time, due to the accumulation of tolerances, it is easy to introduce the problem of single board thickness tolerance.

[0004] In the double-layer mother-daughter card structure, if the daughter card is inverted, the connector direction is opposite, and the card is compatible with fewer models; Figure 3a As shown, if a daughter card is used, although the plug-in card can be adapted to many models, the connector mounting surface tolerance of the buckle plate includes the base plate thickness tolerance, the stud tolerance and the buckle plate thickness tolerance, which can easily cause problems such as mismatch when the connector is connected, inability to insert normally or bending of the pins. Summary of the invention

[0005] In order to overcome the problems existing in the related art, this specification provides a card insertion structure and a communication device, which can eliminate the positive buckle cumulative tolerance between multi-layer boards and achieve good connector connection and adaptation effect.

[0006] According to a first aspect of an embodiment of the present application, a card insertion structure is provided, including a plate A and a plate B, wherein the plate A and the plate B are connected via a first fixing member, and the first fixing member is fixed to the plate A via an upper end surface of the plate A and a first supporting structure member.

[0007] Preferably, the A plate includes an A-1 plate and an A-2 plate, the B plate includes a B-1 plate and a B-2 plate, the upper end surface of the A-1 plate is connected to the upper end surface of the A-2 plate via a first connector, the upper end surface of the B-1 plate is connected to the upper end surface of the B-2 plate via a second connector, the A-1 plate and the B-1 plate are connected via a first fixing member A, the first fixing member A passes through the upper end surface of the A-1 plate and is fixed to the A-1 plate via a first supporting structure member A, the A-2 plate and the B-2 plate are connected via a first fixing member B, the first fixing member B passes through the upper end surface of the A-2 plate and is fixed to the A-2 plate via a first supporting structure member B.

[0008] Furthermore, the first fixing member A and the first fixing member B are respectively the first stud A and the first stud B. The first stud A passes through the upper end surface of the A-1 plate, and the first supporting structure A is arranged at the end. The first supporting structure A is fixed to the A-1 plate; the first stud B passes through the upper end surface of the A-2 plate, and the first supporting structure B is arranged at the end. The first supporting structure B is fixed to the A-2 plate.

[0009] Furthermore, the first supporting structure includes a stepped fixing plate and a fixing nut. The upper step surface and the lower step surface of the stepped fixing plate are both provided with holes. The hole of the lower step surface passes through the end of the stud, and the nut passes through the A plate and the hole of the upper step surface for fixing.

[0010] Preferably, at least a C plate is included, and the C plate is connected to the A plate via a second fixing member, and the second fixing member passes through the upper end surface of the A plate and is fixed to the A plate via a second supporting structure.

[0011] Furthermore, the C plate includes a C-1 plate and a C-2 plate, the C-1 plate is connected to the A-1 plate by a second fixing member A, and the second fixing member B passes through the upper end surface of the C-1 plate and is fixed to the C-1 plate by the second supporting structure member A; the C-2 plate is connected to the A-2 plate by a second fixing member B, and the second fixing member B passes through the upper end surface of the C-2 plate and is fixed to the C-2 plate by the second supporting structure member B.

[0012] Preferably, board A is a buckle board, board B is a base board, board A-1 is a mother buckle board, board A-2 is a daughter buckle board, board B-1 is a mother base board, board B-2 is a daughter base board, a first mother connector is arranged on the upper surface of the mother buckle board, a first daughter connector is arranged on the upper surface of the daughter buckle board, the mother buckle board and the daughter buckle board are connected with the first daughter connector through the first mother connector and the first daughter connector, a second mother connector is arranged on the upper surface of the mother base board, a second daughter connector is arranged on the upper surface of the daughter base board, and the mother base board and the daughter base board are connected with the second daughter connector and the second daughter connector.

[0013] Preferably, both the A board and the B board are motherboards, and the A board and the B board are connected to the backplane via a third connector.

[0014] Preferably, the third connector includes an adapter connected to the backplane and a motherboard connector connected to the motherboard.

[0015] A second aspect of an embodiment of the present application provides a communication device, including the above-mentioned card insertion structure.

[0016] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0017] In the embodiment of the present specification, the first fixing member for fixing the A plate and the B plate passes through the upper end surface of the A plate, eliminating the thickness tolerance of the A plate, so that when the A plate and the B plate are buckled, the connector connection adaptation effect is good.

[0018] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0020] Figure 1 This is a structural axial view of the first embodiment of the present application;

[0021] Figure 2 yes Figure 1 A front view of

[0022] Figure 3a It is a schematic diagram of the existing double-layer mother-child card structure;

[0023] Figure 3b It is a schematic diagram of the double-layer mother-child card structure of this application.

[0024] Number Description:

[0025] 1-A plate; 11-A-1 plate; 12-A-2 plate; 2-B plate; 21-B-1 plate; 22-B-2 plate; 3-first fixing member; 31-first fixing member A; 32-first fixing member B; 4-first supporting structure; 41-first supporting structure A; 42-first supporting structure B; 43-gasket; 44-nut; 51-first female connector; 52-first sub-connector; 61-second female connector; 62-second sub-connector

[0026] Wherein, the first connector 5 includes a first female connector 51 and a first sub-connector 52;

[0027] The second connector 6 includes a second female connector 61 and a second sub connector 62 . DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0029] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0030] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0031] The present application provides a card insertion structure, such as Figure 1 and Figure 2 , Figure 3b As shown, it includes a plate A 1 and a plate B 2, and the plates A 1 and B 2 are connected by a first fixing member 3, and the first fixing member 3 passes through the upper end surface of the plate A and is fixed to the plate A through a first supporting structure member 4. Because the first fixing member passes through the plates A and B and the end passes through the upper end surface of the plate A, the plate thickness tolerance of the plate A is eliminated during installation. In the embodiment of the present application, the plates A and B are both provided with plug-in cards on the panel.

[0032] The technical solution of this application can be applied to a double-layer mother-and-child card positive buckle structure. Figure 1 and Figure 2 , Figure 3bSpecifically, the A board includes an A-1 board 11 and an A-2 board 12, and the B board includes a B-1 board 21 and a B-2 board 22. The upper end surface of the A-1 board 11 is connected to the upper end surface of the A-2 board 12 through a first connector 5, and the upper end surface of the B-1 board 21 is connected to the upper end surface of the B-2 board 22 through a second connector 6. The A board is a buckle board, the B board is a base board, the A-1 board is a mother buckle board, the A-2 board is a sub-buckle board, the B-1 board is a mother base board, and the B-2 board is a sub-base board. The upper end surface of the mother buckle board is provided with a first mother connector 51, and the upper end surface of the sub-buck board is provided with a first sub-connector 52. The mother buckle board and the sub-buck board are connected through the first mother connector 51 and the first sub-connector 52, the upper end surface of the mother base board is provided with a second mother connector 61, and the upper end surface of the sub-base board is provided with a second sub-connector 62, and the mother base board and the sub-base board are connected through the second mother connector 61 and the second sub-connector 62. The positive buckle structure refers to the same installation direction of the connectors of different layers of single boards, for example, the first connector is located on the upper end surface of the A board, and the second connector is also located on the upper end surface of the B board, in the same direction. The mother buckle plate is connected to the mother base plate by the first fixing member A31, and the first fixing member A passes through the upper end surface of the mother buckle plate and is fixed to the mother buckle plate by the first supporting structure member A41. The sub-buckle plate is connected to the sub-base plate by the first fixing member B32, and the first fixing member B32 passes through the upper end surface of the sub-buckle plate and is fixed to the sub-buckle plate by the first supporting structure member B42. As a preferred embodiment of the first fixing member A31 and the first fixing member B32, the first stud A and the second stud B can be respectively used, which is of course only for example and does not constitute a limitation. The first supporting structure member 4, such as the first supporting structure member A41 and the first supporting structure member B42, can adopt the following structure, which is of course only for example and does not constitute a limitation. The first supporting structure member 4 includes a stepped fixing plate (411 or 421) and a fixing nut 44. The upper step surface and the lower step surface of the stepped fixing plate are both provided with holes, and the hole of the lower step surface passes through the end of the stud. Of course, the lower step surface can be directly fixed to the end of the stud through the hole by welding or the like. The nut 44 passes through the hole of the A plate and the upper step surface for fixing. There is a certain distance between the upper step surface and the upper end surface of the gusset plate, and the spacer 43 can be used to eliminate the distance. The nut passes through the screw holes of the A plate, the gasket and the upper step surface and is fixed to the A plate. The gasket can be set separately from the upper step surface or can be set as an integral part.

[0033] The embodiment of the present application can realize the setting of more than 2 layers of panels on the basis of the above embodiment. Specifically (this embodiment is not shown), it includes a C plate, and the C plate is connected to the A plate by a second fixing member, and the second fixing member passes through the upper end surface of the A plate and is fixed to the A plate by a second supporting structure. The second fixing member here is arranged at a different position from the first fixing member, and is used to eliminate the plate thickness tolerance of the C plate. The C plate here is also a plug-in card arranged on the panel, and the connector is arranged in the same direction as the A plate and the B plate. In the embodiment of the present application, the second fixing member can adopt the same structure as the first fixing member in the above embodiment, and of course other structures can also be adopted, as long as the purpose of eliminating the tolerance of the C plate can be achieved, which is not limited here. The same second supporting structure can also adopt the structure of the first supporting structure member in the above embodiment, which is not limited here. The C plate includes a C-1 plate and a C-2 plate, and the C-1 plate is connected to the A-1 plate by a second fixing member A. The second fixing member B passes through the upper end surface of the C-1 plate and is fixed to the C-1 plate by the second supporting structure member A. The C-2 board is connected to the A-2 board through the second fixing member B, and the second fixing member B passes through the upper end surface of the C-2 board and is fixed to the C-2 board through the second supporting structure member B. The C-1 board is a mother buckle board, and the C-2 board is a daughter buckle board. The mother buckle board and the daughter buckle board are connected through a connector. Of course, the C board can also be set below the B board, and the B board and the C board are fixed through the second fixing member.

[0034] In another application embodiment of the technical solution of the present application, both board A and board B are motherboards, and board A and board B are orthogonally plugged into the backplane through a third connector. The third connector includes an adapter connected to the backplane and a motherboard connector connected to the motherboard. Board A and board B are respectively connected to the backplane through the above-mentioned third connector. Board A and board B are connected by a first fixing member, and the first fixing member passes through the upper end surface of board A and is fixed to board A through a first supporting structure. Because the first fixing member eliminates the thickness tolerance of board A, the adaptability of board A and board B when they are orthogonally plugged into the backplane can be guaranteed. The first fixing member and the first supporting structure here can both adopt the structures in the aforementioned embodiments, which are of course only examples and do not constitute a limitation. If there is a third-layer motherboard C, a third connector with the same structure is also used for connection.

[0035] A communication device comprises the above-mentioned card insertion structure.

[0036] The description of directional terms in the embodiments of the present application, such as upper end surface, lower end surface, end portion, etc., refers to the accompanying drawings.

[0037] For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying creative labor.

[0038] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0039] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0040] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0041] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A card insertion structure, comprising a board A and a board B, characterized in that: The A plate and the B plate are connected by a first fixing member, and the first fixing member passes through the upper end surface of the A plate and is fixed to the A plate through a first supporting structure member; The A plate includes an A-1 plate and an A-2 plate, and the B plate includes a B-1 plate and a B-2 plate. The upper end surface of the A-1 plate is connected to the upper end surface of the A-2 plate by a first connector, and the upper end surface of the B-1 plate is connected to the upper end surface of the B-2 plate by a second connector. The A-1 plate and the B-1 plate are connected by a first fixing member A, and the first fixing member A passes through the upper end surface of the A-1 plate and is fixed to the A-1 plate by the first supporting structure member A. The A-2 plate and the B-2 plate are connected by a first fixing member B, and the first fixing member B passes through the upper end surface of the A-2 plate and is fixed to the A-2 plate by the first supporting structure member B.

2. The card insertion structure according to claim 1, characterized in that: The first fixing member A and the first fixing member B are respectively the first stud A and the first stud B. The first stud A passes through the upper end surface of the A-1 plate, and the first supporting structure A is arranged at the end. The first supporting structure A is fixed to the A-1 plate; the first stud B passes through the upper end surface of the A-2 plate, and the first supporting structure B is arranged at the end. The first supporting structure B is fixed to the A-2 plate.

3. The card insertion structure according to claim 2, characterized in that: The first supporting structure comprises a stepped fixing plate and a fixing nut. The upper step surface and the lower step surface of the stepped fixing plate are both provided with holes. The hole of the lower step surface passes through the end of the stud. The nut passes through the A plate and the hole of the upper step surface for fixing.

4. The card insertion structure according to claim 1, characterized in that: At least a C plate is included, and the C plate is connected to the A plate via a second fixing member, and the second fixing member passes through the upper end surface of the A plate and is fixed to the A plate via a second supporting structure.

5. The card insertion structure according to claim 4, characterized in that: The C plate includes a C-1 plate and a C-2 plate. The C-1 plate is connected to the A-1 plate via a second fixing member A. The second fixing member B passes through the upper end surface of the C-1 plate and is fixed to the C-1 plate via a second supporting structure member A. The C-2 plate is connected to the A-2 plate via a second fixing member B. The second fixing member B passes through the upper end surface of the C-2 plate and is fixed to the C-2 plate via a second supporting structure member B.

6. The card insertion structure according to claim 3, characterized in that: Board A is a buckle board, board B is a base board, board A-1 is a mother buckle board, board A-2 is a daughter buckle board, board B-1 is a mother base board, board B-2 is a daughter base board, a first mother connector is arranged on the upper end surface of the mother buckle board, a first daughter connector is arranged on the upper end surface of the daughter buckle board, the mother buckle board and the daughter buckle board are connected with the first daughter connector through the first mother connector and the first daughter connector, a second mother connector is arranged on the upper end surface of the mother base board, a second daughter connector is arranged on the upper end surface of the daughter base board, the mother base board and the daughter base board are connected with the second daughter connector and the second daughter connector.

7. The card insertion structure according to claim 1, characterized in that: Both the A board and the B board are motherboards, and the A board and the B board are connected to the backplane through a third connector.

8. The card insertion structure according to claim 7, characterized in that: The third connector includes an adapter connected to the backplane and a motherboard connector connected to the motherboard.

9. A communication device, characterized in that: The invention comprises the card insertion structure as described in any one of claims 1 to 8.

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