Audio circuit and switching device

Abstract

The utility model relates to an audio circuit and a switch device. The audio circuit comprises an audio power amplifier module, a loudspeaker, a main control chip, a recovery circuit, an audio processing module and a microphone. The audio power amplifier module is respectively connected with the loudspeaker and the main control chip; the recovery circuit is respectively connected with the loudspeaker and the audio processing module; the audio processing module is also connected with the microphone and the main control chip; wherein the main control chip is used for outputting broadcast signals to the loudspeaker through the audio power amplifier module and receiving voice signals output by the audio processing module; the recovery circuit is used for collecting an audio signal of the loudspeaker; the microphone is used for collecting external sound signals; the audio processing module is used for eliminating audio signals mixed in the sound signals and then outputting voice signals. According to the invention, more accurate voice signals can be obtained, so that mutual influence between the loudspeaker and the microphone is avoided, the voice communication definition of the audio circuit is improved, and the call is smoother.

Description

Technical Field

[0001] The present application relates to the technical field of switch devices, and in particular to audio circuits and switch devices. Background Art

[0002] With the popularity of smart homes, voice control has become the mainstream way to control devices. Traditional audio circuits identify and eliminate echoes by coupling the output of the power amplifier and sampling the output signal of the power amplifier and inputting it into the main control chip. However, general main control chips usually do not have the ability to eliminate echoes in the device cavity when the speaker is playing and spatial echoes with varying delay times; these echoes can have negative effects, such as hearing your own voice repeatedly during intercoms or interruption wake-up performance being reduced due to echoes. Switching devices Utility Model Content

[0003] Based on this, it is necessary to provide an audio circuit and a switch device to address the problem that the voice switch device has an echo between the speaker and the microphone, resulting in poor sound reception.

[0004] In a first aspect, the present application provides an audio circuit, the audio circuit comprising an audio power amplifier module, a speaker, a main control chip, a sampling circuit, an audio processing module and a microphone; the audio power amplifier module is respectively connected to the speaker and the main control chip; the sampling circuit is respectively connected to the speaker and the audio processing module; the audio processing module is also connected to the microphone and the main control chip;

[0005] Among them, the main control chip is used to output the broadcast signal to the speaker through the audio power amplifier module and receive the voice signal output by the audio processing module; the sampling circuit is used to collect the audio signal of the speaker; the microphone is used to collect external sound signals; the audio processing module is used to eliminate the audio signal mixed in the sound signal and then output the voice signal.

[0006] In one embodiment, the recovery circuit includes an aec recovery circuit.

[0007] In one of the embodiments, the AEC recovery circuit includes a filtering subcircuit and a current limiting subcircuit; the filtering subcircuit is connected to the speaker for filtering the audio signal; the current limiting subcircuit is respectively connected to the filtering subcircuit and the main control chip.

[0008] In one embodiment, the filtering subcircuit includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a first resistor, a second resistor, a third resistor and a fourth resistor; one end of the first capacitor is connected to the positive signal end of the speaker, and the other end of the first capacitor is respectively connected to one end of the second capacitor and one end of the first resistor; the other end of the second capacitor is respectively connected to one end of the third capacitor and one end of the second resistor, and is also connected to an equivalent ground end, the other end of the first resistor is respectively connected to the other end of the third capacitor and the other end of the second resistor, and is also connected to the first end of the current limiting subcircuit; one end of the fourth capacitor is connected to the negative signal end of the speaker, the other end of the fourth capacitor is respectively connected to one end of the fifth capacitor and one end of the third resistor, the other end of the fifth capacitor is respectively connected to one end of the sixth capacitor and one end of the fourth resistor, and is also connected to the equivalent ground end, the other end of the third resistor is respectively connected to the other end of the sixth capacitor and the other end of the fourth resistor, and is also connected to the second end of the current limiting subcircuit.

[0009] In one embodiment, the current limiting sub-circuit includes a fifth resistor and a sixth resistor; the two ends of the fifth resistor are respectively connected to the second resistor, one end of the third capacitor and the positive signal end of the main control chip; the two ends of the sixth resistor are respectively connected to the fourth resistor, one end of the sixth capacitor and the negative signal end of the main control chip.

[0010] In a second aspect, the present application also provides a switching device, which includes a face shell, a circuit board and an audio circuit as described above; the audio power amplifier module, the main control chip, the feedback circuit and the audio processing module in the audio circuit are arranged on the circuit board; the circuit board is fixed to the back of the face shell; the speaker and the microphone in the audio circuit are arranged close to the back of the face shell.

[0011] In one of the embodiments, the switch device further comprises an isolating member; the isolating member is disposed on a side of the circuit board facing the surface shell and is disposed between the microphone and the speaker to isolate noise between the microphone and the speaker.

[0012] In one embodiment, there are multiple microphones; the face shell is provided with multiple through holes; each of the microphones is connected to the audio processing module, and the multiple microphones are arranged in the multiple through holes in a one-to-one correspondence.

[0013] In one of the embodiments, the switch device further comprises a first airtight element, wherein the first airtight element is used to wrap at least a portion of each of the microphones to fill a gap between the microphone and the through hole.

[0014] In one of the embodiments, the switch device further comprises a second airtight element; the second airtight element is disposed between the speaker and the back side of the face shell, and is used to fill a gap between the speaker and the back side of the face shell.

[0015] The above-mentioned audio circuit and switch device, the audio circuit includes an audio power amplifier module, a speaker, a main control chip, a sampling circuit, an audio processing module and a microphone; the audio power amplifier module is respectively connected to the speaker and the main control chip; the sampling circuit is respectively connected to the speaker and the audio processing module; the audio processing module is also connected to the microphone and the main control chip; wherein the main control chip is used to output the broadcast signal to the speaker via the audio power amplifier module and receive the voice signal output by the audio processing module; the sampling circuit is used to collect the audio signal of the speaker; the microphone is used to collect the external sound signal; the audio processing module is used to eliminate the audio signal mixed in the sound signal and then output the voice signal. Since the audio circuit of the present application is provided with an independent audio processing module between the sampling circuit and the main control chip, the audio processing module can perform echo cancellation on the sound signal according to the audio signal, that is, it can eliminate the audio signal mixed in the sound signal and then output the voice signal, so the main control chip can obtain a more accurate voice signal, thereby avoiding the mutual influence between the speaker and the microphone, improving the clarity of the voice communication of the audio circuit, and making the call smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is one of the structural schematic diagrams of the audio circuit in one embodiment of the present application;

[0018] Figure 2 Schematic diagram of the structure of the filtering subcircuit and the current limiting subcircuit in one embodiment of the present application;

[0019] Figure 3 This is a schematic diagram of the structure of a switch device in an embodiment of the present application;

[0020] Figure 4 It is a schematic structural diagram of an isolation member in an embodiment of the present application;

[0021] Figure 5 This is a second structural diagram of an audio circuit in an embodiment of the present application;

[0022] Figure 6Schematic diagram of the structure of an audio control component in one embodiment of the present application.

[0023] Description of Figure Numbers:

[0024] Audio power amplifier module: 110; speaker: 120; main control chip: 130; MCU: 131; recovery circuit: 140; AEC recovery circuit: 141; filter subcircuit: 1411; current limiting subcircuit: 1412; audio processing module: 150; DSP: 151; microphone: 160; face shell: 170; circuit board: 180; isolation component: 190. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0030] The switch device in the present application may be a switch panel, a remote control switch, etc. Since the switch device in the present application is provided with a microphone and a speaker, under the control of the control circuit in the circuit board, the microphone can collect the user's voice instructions, thereby realizing the control of the device to be switched connected to the switch device. For example, if the user needs to control the lamp, he can say the command "turn on the lamp" in the area where the switch device can collect the sound. After the microphone collects the sound information, the control circuit in the circuit board can realize the control of turning on the lamp. At the same time, the control circuit in the circuit board can also control the speaker to broadcast the execution result, for example, through the speaker to broadcast "the lamp has been turned on", but it is not limited to this.

[0031] See attached Figure 1 , attached Figure 1 One of the structural diagrams of the audio circuit in an embodiment of the present application is shown. The audio circuit in this embodiment includes an audio power amplifier module 110, a speaker 120, a main control chip 130, a sampling circuit 140, an audio processing module 150 and a microphone 160.

[0032] The audio power amplifier module 110 refers to any module or chip that can process the broadcast signal output by the main control chip 130 and to be played by the speaker 120. The audio power amplifier module 110 in this embodiment is connected to the speaker 120 and the main control chip 130 respectively, and is mainly used to amplify and output the broadcast signal output by the main control chip 130.

[0033] The speaker 120 is also called a "speaker", which is a transducer that can convert electrical signals into audible sounds. The speaker 120 in this embodiment is mainly used to broadcast the content corresponding to the broadcast signal after receiving the broadcast signal amplified by the audio power amplifier module 110.

[0034] The main control chip 130 refers to a chip that can process the input and output of all audio signals and related sound processing functions. Exemplarily, the main control chip 130 can be an MCU (Microcontroller Unit). The main control chip 130 in this embodiment is mainly used to output the broadcast signal to the speaker 120 via the audio power amplifier module 110 and receive the voice signal output by the audio processing module 150.

[0035] The collection circuit 140 refers to a circuit structure capable of collecting the sound or signal of the speaker 120. The collection circuit 140 in this embodiment is connected to the speaker 120 and the audio processing module 150 respectively to collect the audio signal of the speaker 120 and transmit the audio signal to the audio processing module 150.

[0036] The audio processing module 150 refers to a signal processing chip or module that can achieve echo cancellation, effectively remove near-field and far-field echo interference, and integrate noise reduction technology. For example, it can be a DSP (Digital Signal Processor). The microphone 160 is an electronic component that can accurately capture sound and convert it into an electrical signal for other main control chips 130 or the main control chip 130 to perform voice recognition and perform control operations. The microphone 160 in this embodiment is mainly used to collect external sound signals. Since the sound broadcast by the speaker 120 will be collected by the microphone 160 from the outside, the audio signal of the speaker 120 may be mixed into the sound signal, causing interference to the microphone 160. The audio processing module 150 in this embodiment is also connected to the microphone 160 and the main control chip 130, and can output a voice signal after eliminating the audio signal mixed in the sound signal, thereby achieving echo cancellation of the sound signal and outputting a more accurate voice signal.

[0037] In this embodiment, an independent audio processing module 150 is provided between the audio circuit 140 and the main control chip 130. The audio processing module 150 can perform echo cancellation on the sound signal collected by the microphone 160 according to the audio signal from the speaker 120 obtained by the echo circuit 140, that is, output a voice signal after eliminating the audio signal mixed in the sound signal. Therefore, the main control chip 130 can obtain a more accurate voice signal, thereby avoiding mutual influence between the speaker 120 and the microphone 160, improving the clarity of the voice communication of the audio circuit, and making the call smoother.

[0038] In one embodiment, the recovery circuit includes an aec recovery circuit.

[0039] The AEC (Acoustic Echo Cancellation) echo cancellation circuit is a circuit used to eliminate acoustic echoes. The AEC echo cancellation circuit in this embodiment is mainly used to collect the audio signal output by the speaker, and filter and limit the current of the audio signal to ensure that the main control module receives a stable audio signal.

[0040] In one embodiment, the AEC recovery circuit includes a filtering subcircuit and a current limiting subcircuit; the filtering subcircuit is connected to the speaker and is used to filter the audio signal; the current limiting subcircuit is respectively connected to the filtering subcircuit and the main control module.

[0041] Specifically, the filter subcircuit is connected to the positive and negative poles of the speaker, respectively, to receive the audio signal SKP_LB_P transmitted by the positive pole of the speaker and the audio signal SKP_LB_N transmitted by the negative pole of the speaker. The current limiting subcircuit is connected to the positive signal receiving end and the negative signal receiving end of the main control module, respectively, to achieve current limiting processing of the audio signal.

[0042] In one embodiment, see the attached Figure 2 , attached Figure 2 The structure diagram of the filter subcircuit 1411 is shown. The filter subcircuit 1411 includes a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a first resistor R1, a second resistor R2, a third resistor R3 and a fourth resistor R4; one end of the first capacitor C1 is connected to the positive signal end of the speaker, and the other end of the first capacitor C1 is respectively connected to one end of the second capacitor C2 and one end of the first resistor R1; the other end of the second capacitor C2 is respectively connected to one end of the third capacitor C3 and the second resistor R2, and is also connected to the equivalent ground end. The first resistor R1 is The other end is respectively connected to the other end of the third capacitor C3 and the other end of the second resistor R2, and is connected to the first end of the current limiting sub-circuit 1412; one end of the fourth capacitor C4 is connected to the negative signal end of the speaker, the other end of the fourth capacitor C4 is respectively connected to one end of the fifth capacitor C5 and one end of the third resistor R3, the other end of the fifth capacitor C5 is respectively connected to one end of the sixth capacitor C6 and one end of the fourth resistor R4, and is also connected to the equivalent ground end, the other end of the third resistor R3 is respectively connected to the other end of the sixth capacitor C6 and the other end of the fourth resistor R4, and is also connected to the second end of the current limiting sub-circuit 1412.

[0043] One end of the first capacitor C1 is connected to the positive signal end of the speaker to receive the audio signal SKP_LB_P transmitted by the positive signal end of the speaker, and one end of the fourth capacitor C4 is connected to the negative signal end of the speaker to receive the audio signal SKP_LB_N transmitted by the negative signal end of the speaker. The audio signal is smoothed by the filtering subcircuit 1411 composed of the first capacitor C1 to the sixth capacitor C6 and the first resistor R1 to the fourth resistor R4, so that the audio processing module receives a more stable audio signal.

[0044] In one embodiment, continue to refer to the attached Figure 2 , attached Figure 2 A structural schematic diagram of the current limiting sub-circuit 1412 is also shown. The current limiting sub-circuit 1412 in this embodiment includes a fifth resistor R5 and a sixth resistor R6; the two ends of the fifth resistor R5 are respectively connected to the second resistor R2, one end of the third capacitor C3 and the positive signal terminal SPKP_OUT of the main control chip; the two ends of the sixth resistor R6 are respectively connected to the fourth resistor R4, one end of the sixth capacitor C6 and the negative signal terminal SPKN_OUT of the main control chip.

[0045] Since the signal terminals of the main control chip are usually in a high impedance state, this means that they themselves have a large internal resistance, which is equivalent to an open circuit. In this case, if the current signal is directly input to the main control chip, it may cause excessive current to flow into the main control chip, thereby damaging the main control chip. Therefore, the fifth resistor R5 and the sixth resistor R6 of the current limiting subcircuit 1412 in this embodiment are used to limit the current of the audio signal, so as to prevent the main control chip from being damaged by excessive current.

[0046] In one embodiment, the present application also provides a switch device, see the attached Figure 1 , 3 , attached Figure 3 This is a structural schematic diagram of a switch device in an embodiment of the present application. The switch device in this embodiment includes a face shell 170, a circuit board 180 and an audio circuit in any of the above embodiments; the audio power amplifier module 110, the main control chip 130, the recovery circuit 140 and the audio processing module 150 in the audio circuit are arranged on the circuit board 180; the circuit board 180 is fixed to the back of the face shell 170; the speaker 120 and the microphone 160 in the audio circuit are arranged close to the back of the face shell 170.

[0047] The circuit board 180 refers to a carrier for supporting and connecting electronic components. The circuit board 180 in this embodiment is provided with an audio circuit for signal processing of the microphone 160 and the speaker 120, and the audio circuit is used to perform echo cancellation and noise reduction processing on the sound signal collected by the microphone 160. In addition, the circuit board 180 may also be provided with necessary circuits for realizing the above functions, such as a power supply circuit. It is not limited thereto.

[0048] In this embodiment, the number of microphones 160 can be one or more, and can be flexibly set according to actual needs. For example, in order to reduce costs, one microphone 160 can be set, and the sound information can be collected through one microphone 160. Another example is that in order to improve the efficiency of sound collection and obtain the sound at various positions in the space, at least two microphones 160 can be set, and the microphone 160 can be set at multiple different positions of the face shell 170. For example, two microphones 160 are set at two diagonal corners at the upper end of the front of the face shell 170.

[0049] The circuit board 180 in this embodiment is fixed to the back of the face shell 170, which can prevent the various audio circuit structures in the circuit board 180 from being exposed, and can protect the various audio circuit structures. It can be understood that the microphone 160 includes a main body and an electrical connection part, wherein the main body includes a structure for sound collection and conversion, such as a vibration membrane, a coil, an amplifier, a housing, etc., and the electrical connection part includes a structure for electrical connection with the circuit board 180, such as a copper wire, a power line, etc. In this embodiment, the main body of the microphone 160 is arranged close to the back of the face shell 170, and the electrical connection parts of the microphone 160 are respectively connected to the circuit board 180 of the main body of the microphone 160, thereby making more reasonable use of the accommodation space of the switch device.

[0050] It can be understood that if the speaker 120 and the microphone 160 are arranged relatively close, the audio emitted by the speaker 120 may affect the sound collection effect of the microphone 160, thereby affecting the recognition effect of the main control chip 130 in the audio circuit of the circuit board 180 on the signal collected by the microphone 160, and further affecting the control effect of the switch device. Therefore, when designing the positions of the speaker 120 and the microphone 160, the length and width of the face shell 170 can be combined to set the two at a preset distance to reduce the interference between the speaker 120 and the microphone 160 in terms of physical distance.

[0051] In one embodiment, see the attached Figure 4 , attached Figure 4 A schematic diagram of the structure of the isolating member 190 in this embodiment is shown. The switch device also includes the isolating member 190. The isolating member 190 is arranged on the side of the circuit board facing the surface shell and is arranged between the microphone 160 and the speaker 120 to isolate the noise between the microphone 160 and the speaker 120.

[0052] The isolation element 190 refers to any structure that can achieve sound insulation and noise isolation, and includes, by way of example, but is not limited to, acoustic foam, foam plastic, thermal insulation silicone, asbestos, mineral wool, glass wool, high-density fiberboard, rubber, and the like.

[0053] Since the sound of the speaker 120 may be collected by the microphone 160 from the outside as well as from the inside of the switch device, if the switch device is not well isolated, the microphone 160 may receive the sound signal from the speaker with a time difference, which is not conducive to the audio processing module to eliminate the sound of the speaker 120. Specifically, the sound signal of the speaker 120 is collected by the return circuit, and the microphone 160 receives the audio signal of the speaker 120 twice with a phase difference. The return circuit can usually only eliminate it once, so there may still be a situation where the sound signal of the speaker is recognized and processed by the main control chip, or the audio processing module cannot effectively recognize that the synthesized sound is the sound emitted by the speaker 120 when processing the synthesized sound of the audio signal of the speaker twice with a phase difference. This is because the return circuit directly collects the audio signal of the speaker 120, which may cause the return circuit to deteriorate or fail. Therefore, in this embodiment, an isolation member 190 is added to the switch device to prevent the audio signal of the speaker 120 from being collected by the microphone 160 inside the switch device, thereby interfering with the signal collected by the microphone 160.

[0054] In order to more effectively isolate the microphone 160 from the speaker 120 in this embodiment, the isolating member 190 is preferably made of thermally conductive silicone. By utilizing its flexible physical properties, the microphone 160 and the speaker 120 can be isolated in two independent cavities between the back of the face shell and the circuit board, respectively, thereby reducing the sound directly transmitted from the speaker 120 to the microphone 160 through the internal space of the switch device, and avoiding the speaker 120 from causing sound interference to the microphone 160. In addition, the use of flexible thermally conductive silicone as the isolating member 190 can significantly reduce the structural vibration of the entire switch device, thereby making the switch device structure more stable and reducing external interference to the microphone 160. Therefore, the switch device of the present application can not only improve the sound insulation effect, but also has stronger stability.

[0055] In one embodiment, there are multiple microphones; the face shell is provided with multiple through holes; each microphone is connected to the audio processing module, and the multiple microphones are arranged in the multiple through holes in a one-to-one correspondence.

[0056] The switch device in this embodiment is provided with multiple microphones, which is conducive to the main control chip of the audio circuit on the circuit board to accurately identify the sound signals collected by the microphone. Even if the switch device is in a noise-loaded environment, it can accurately identify the sound signals of external users and improve the sound reception effect of the switch device. It can be understood that the microphone includes a main body and an electrical connection part, wherein the main body includes a structure for sound collection and conversion, and the electrical connection part includes a structure for electrical connection with the circuit board. Therefore, in order to collect the user's voice signal more efficiently, the main body of the microphone can be set in the through hole to avoid the cover from blocking the microphone and affecting the sound collection.

[0057] In one embodiment, the switch device in this embodiment further includes a first airtight element, and the first airtight element is used to wrap at least a portion of each microphone to fill the gap between the microphone and the through hole.

[0058] The first airtight element may be any structure that can achieve a filling effect, including but not limited to silicone, foam material, epoxy resin, rubber, etc. The first airtight element in this embodiment may be a silicone sleeve, which is sleeved on the main body of the microphone, so that the gap between the silicone sleeve and the through hole can be filled, thereby improving the airtightness of the microphone, preventing the microphone from being affected by internal noise, and improving the sound reception quality of the switch device.

[0059] It is understandable that the purpose of setting the first airtight element is to prevent gas from entering the inside of the switch device from the outside, thereby protecting the sensitive components inside the switch device from being affected by the external environment. Therefore, when setting the first airtight element, it is only necessary to ensure that there is no air circulation between the outside and the inside of the switch device, and it is necessary to avoid the first airtight element completely wrapping the microphone, thereby preventing the microphone from receiving the sound of the external environment.

[0060] In one embodiment, the switch device further comprises a second airtight element, which is disposed between the speaker and the back side of the face shell and is used to fill a gap between the speaker and the back side of the face shell.

[0061] The second airtight element may be any structure that can achieve the above-mentioned filling effect. Exemplarily, the second airtight element includes but is not limited to rubber, sealant, sealing tape, silicone, foam, etc. In this embodiment, in order to more tightly fill the gap between the back of the face shell and the speaker, the second airtight element is set to foam. It should be noted that when setting the second airtight element, it is necessary to avoid the second airtight element blocking the slot, causing damage to the sound effect of the speaker.

[0062] In one embodiment, see the attached Figure 5 , attached Figure 5The second structural diagram of the audio circuit is shown. The audio circuit in this embodiment includes an audio power amplifier module 110, a speaker 120, an MCU131, an AEC feedback circuit 141, a DSP151, and two microphones 160. Both microphones 160 are connected to the DSP151.

[0063] The function and connection relationship of MCU131 in this embodiment are the same as those of the main control chip 130 in the above embodiment. The function and connection relationship of DSP151 in this embodiment are the same as those of the audio processing module 150 in the above embodiment. In this embodiment, two microphones 160 are included to form a dual-microphone sound source localization circuit, which can more clearly distinguish the sound source, which is beneficial for DSP151 to process complex environmental noise, making the voice signal received by the main control chip 130 clearer and more real, providing users with a better voice call and recording experience.

[0064] In one embodiment, the present application also provides an audio control component, see the attached Figure 6 , attached Figure 6 The structure diagram of an audio control component is shown. The audio control component in this embodiment includes a microphone 160, a speaker 120 and an isolating member 190. The isolating member 190 is disposed between the microphone 160 and the speaker 120 to isolate the noise between the microphone 160 and the speaker 120. The isolating member 190 can completely block the passage of sound from the speaker 120 to the microphone 160. The microphone 160, the speaker 120 and the isolating member 190 in this embodiment have the same functions and connection relationships as those described in any of the above embodiments, so they will not be repeated here.

[0065] In one embodiment, see the attached Figure 3 The audio control component in this embodiment also includes a face shell 170 and a circuit board 180, the circuit board 180 is fixed to the back of the face shell 170; the isolation member 190 is arranged on the side of the circuit board 180 facing the back of the face shell 170; the speaker 120 and the microphone 160 are arranged close to the back of the face shell 170.

[0066] The circuit board 180 is provided with necessary circuits or modules for controlling the microphone 160 and the speaker 120, such as a power supply circuit, the audio circuit in the above embodiment, etc., but is not limited thereto. The circuit board 180 in this embodiment has the same function and connection relationship as those described in any of the above embodiments, so it will not be repeated here.

[0067] In one embodiment, there are multiple microphones in the audio control component; the surface shell is provided with multiple through holes; each microphone is connected to the audio processing module, and the multiple microphones are arranged in the multiple through holes in a one-to-one correspondence.

[0068] The microphone in this embodiment has the same function and connection relationship as those described in any of the above embodiments, so it will not be described again here.

[0069] In one embodiment, the audio control assembly further includes a first airtight element, which is used to wrap at least a portion of each microphone to fill the gap between the microphone and the through hole. The first airtight element in this embodiment has the same function and connection relationship as those described in any of the above embodiments, so it will not be repeated here.

[0070] In one embodiment, the audio control assembly further includes a second airtight element, which is disposed between the speaker and the back of the housing to fill the gap between the speaker and the back of the housing. The second airtight element in this embodiment has the same function and connection relationship as those described in any of the above embodiments, so it will not be described again here.

[0071] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the application. It should be noted that, for a person of ordinary skill in the art, several variations and improvements may be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. An audio circuit, characterized in that: The audio circuit includes an audio power amplifier module, a speaker, a main control chip, a sampling circuit, an audio processing module and a microphone; the audio power amplifier module is connected to the speaker and the main control chip respectively; the sampling circuit is connected to the speaker and the audio processing module respectively; the audio processing module is also connected to the microphone and the main control chip; Among them, the main control chip is used to output the broadcast signal to the speaker through the audio power amplifier module and receive the voice signal output by the audio processing module; the sampling circuit is used to collect the audio signal of the speaker; the microphone is used to collect external sound signals; the audio processing module is used to eliminate the audio signal mixed in the sound signal and then output the voice signal.

2. The audio circuit according to claim 1, characterized in that: The recovery circuit includes an aec recovery circuit.

3. The audio circuit according to claim 2, characterized in that: The AEC recovery circuit includes a filtering subcircuit and a current limiting subcircuit; the filtering subcircuit is connected to the speaker and is used to filter the audio signal; the current limiting subcircuit is respectively connected to the filtering subcircuit and the main control chip.

4. The audio circuit according to claim 3, characterized in that: The filtering subcircuit includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a first resistor, a second resistor, a third resistor and a fourth resistor; one end of the first capacitor is connected to the positive signal end of the speaker, and the other end of the first capacitor is respectively connected to one end of the second capacitor and one end of the first resistor; the other end of the second capacitor is respectively connected to one end of the third capacitor and one end of the second resistor, and is also connected to an equivalent ground end, the other end of the first resistor is respectively connected to the other end of the third capacitor and the other end of the second resistor, and is also connected to the first end of the current limiting subcircuit; one end of the fourth capacitor is connected to the negative signal end of the speaker, the other end of the fourth capacitor is respectively connected to one end of the fifth capacitor and one end of the third resistor, the other end of the fifth capacitor is respectively connected to one end of the sixth capacitor and one end of the fourth resistor, and is also connected to the equivalent ground end, the other end of the third resistor is respectively connected to the other end of the sixth capacitor and the other end of the fourth resistor, and is also connected to the second end of the current limiting subcircuit.

5. The audio circuit according to claim 4, characterized in that: The current limiting sub-circuit includes a fifth resistor and a sixth resistor; the two ends of the fifth resistor are respectively connected to the second resistor, one end of the third capacitor and the positive signal end of the main control chip; the two ends of the sixth resistor are respectively connected to the fourth resistor, one end of the sixth capacitor and the negative signal end of the main control chip.

6. A switch device, characterized in that: The switching device includes a face shell, a circuit board and the audio circuit as described in any one of claims 1 to 5; the audio power amplifier module, main control chip, feedback circuit and audio processing module in the audio circuit are arranged on the circuit board; the circuit board is fixed to the back of the face shell; the speaker and microphone in the audio circuit are arranged close to the back of the face shell.

7. The switchgear according to claim 6, characterized in that The switch device further comprises an isolating member; the isolating member is arranged on a surface of the circuit board facing the surface shell and is arranged between the microphone and the speaker, and is used to isolate noise between the microphone and the speaker.

8. The switchgear according to claim 6, characterized in that There are multiple microphones; the surface shell is provided with multiple through holes; each of the microphones is connected to the audio processing module, and the multiple microphones are arranged in the multiple through holes in a one-to-one correspondence.

9. The switchgear according to claim 8, characterized in that The switch device further includes a first airtight element, which is used to wrap at least a portion of each microphone to fill a gap between the microphone and the through hole.

10. The switchgear according to claim 6, characterized in that The switch device also includes a second airtight element; the second airtight element is arranged between the speaker and the back side of the surface shell, and is used to fill the gap between the speaker and the back side of the surface shell.

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