PCB board, battery module and power-consuming device

Abstract

The utility model provides a PCB board, a battery module and an electrical device, and relates to the field of battery technology. The PCB board includes a PCB carrier, a sealing layer, a first laminated board layer and a number of components, and the PCB carrier has a pad; the sealing layer is located between the PCB carrier and the first laminated board layer; the components are electrically connected to the corresponding pads on the PCB carrier through binding wires, and the components are located in the sealing layer; wherein the first laminated board layer is formed with a via hole, and the via hole is configured to allow the pad to be exposed to form a pin. The PCB board provided by the utility model adheres the components to the PCB carrier and connects and fixes them using binding wires, so that the components do not need to adopt the SMT patch process, and after the sealing is performed to form the sealing layer, the multi-layer board is pressed to form the first laminated board layer, and the external devices are electrically connected to the components on the first laminated board layer through the via hole, and finally the purpose of reducing the thickness of the PCB board is achieved.

Description

Technical Field

[0001] The utility model relates to the field of batteries, and in particular to a PCB board, a battery module and an electrical device. Background Art

[0002] In the field of mobile phone batteries, components are attached after the PCB board is completed. The components have been packaged, so the thickness of the components increases, which increases the stacking thickness after the components are mounted on the surface of the PCB board, affecting the stacking thickness of the battery head, which is not conducive to improving the battery capacity. Utility Model Content

[0003] In view of this, the purpose of the utility model is to overcome the deficiencies in the prior art and provide a PCB board to reduce the thickness of the PCB board, thereby increasing the capacity of the battery cell;

[0004] In addition, a battery module and an electrical device using the PCB board are provided.

[0005] The utility model provides the following technical solutions:

[0006] According to a first aspect of the present utility model, a PCB board is provided, the PCB board comprising:

[0007] A PCB carrier, a sealing layer and a first laminated board layer, wherein the PCB carrier has a solder pad; the sealing layer is located between the PCB carrier and the first laminated board layer;

[0008] A plurality of components, wherein the components are electrically connected to the corresponding pads on the PCB carrier through binding wires, and the components are located in the sealing layer;

[0009] The first laminate layer is formed with a via hole, and the via hole is configured to expose the pad to form a pin.

[0010] Furthermore, the PCB board also includes a support member, which is installed in the sealing layer and is configured to support the laminated board layer.

[0011] Furthermore, the support member is formed with a plurality of through-type holes and grooves; wherein the components are located in the holes and grooves corresponding to their positions.

[0012] Furthermore, the support member is configured as an insulator.

[0013] Furthermore, the support member is in abutment with the PCB carrier, and the support member is a heat-conducting structure with heat-conducting capability.

[0014] Furthermore, the support member and the PCB carrier are both made of ceramic material.

[0015] Furthermore, the thickness of the PCB carrier is equal to the thickness of the sealing layer;

[0016] The thickness of the support member is smaller than the thickness of the sealing layer.

[0017] Furthermore, the PCB board also includes a second laminated board layer, and the second laminated board layer is arranged at an end of the PCB carrier away from the first laminated board layer; wherein

[0018] The via extends to the second laminate layer.

[0019] Furthermore, the components include one or more of the following: IC device wafers, resistor devices and MOS device wafers.

[0020] According to a second aspect of the present utility model, a battery module is provided, wherein the battery module comprises a PCB board as described in any one of the items.

[0021] According to a third aspect of the present utility model, there is provided an electrical device, the electrical device comprising the battery module.

[0022] The embodiments of the present utility model have the following advantages:

[0023] The PCB board provided by the utility model is adopted, by attaching active component wafers, passive components and other components to the PCB carrier, and connecting and fixing them with binding wires, so that the components do not need to adopt the SMT patch process, and after fixing the binding wires, the sealing is performed to form a sealing layer, and the first pressed board layer is formed by pressing the multilayer board, so that the components and the sealing layer can be located between the PCB carrier and the first pressed board layer, and the PCB carrier is bonded to the first pressed board layer through the sealing layer, and a through hole is set to electrically connect the external device (such as a resistor, a capacitor, an inductor and other devices) with the components on the first pressed board layer through the through hole, so as to reduce the height of the solder joint between the external device and the pad. Therefore, the present application reduces the thickness of the components and reduces the height of the solder joint between the external device and the pad by omitting the separate packaging process of the components, and finally achieves the purpose of reducing the thickness of the PCB board.

[0024] The utility model also relates to a battery module. Since the above-mentioned PCB board has the above-mentioned technical effects, the battery module including the PCB board should have the same technical effects, which will not be described in detail herein.

[0025] The utility model also relates to an electrical device. Since the above-mentioned battery module has the above-mentioned technical effects, the electrical device including the battery module should have the same technical effects, which will not be described in detail herein.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of a PCB board provided in an embodiment of the utility model is shown;

[0029] Figure 2 An assembly diagram of a PCB carrier board and components in an embodiment of the utility model is shown;

[0030] Figure 3 An assembly diagram of a PCB carrier, components and support members in an embodiment of the utility model is shown;

[0031] Figure 4 An assembly diagram of a PCB carrier board, components, support members and a sealing layer in an embodiment of the utility model is shown.

[0032] Description of main component symbols:

[0033] 100-PCB carrier; 200-sealing layer; 300-first laminate layer; 400-second laminate layer; 500-components; 510-soldering pad; 600-conducting hole; 700-supporting member. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the template herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0039] In the related art, PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board in Chinese, is an important electronic component, a support for electronic components 500, and a provider of electrical connections for electronic components 500. As electronic hardware is developing towards high density and miniaturization, the surface area of ​​the circuit board that matches it is drastically reduced, but the components 500 mounted on the PCB are only increasing.

[0040] Small size, light weight and thin thickness are the development trend of electronic products. The components 500 on the traditional circuit board are all arranged on the surface of the circuit board, which will inevitably increase the thickness of the circuit board and cannot be used to manufacture multi-layer circuit boards. Especially for PCB boards used in battery modules, the battery cell group of the battery module is welded on the PCB board, and the battery cell group and the PCB board are both located in the shell. Therefore, the components 500 are attached after the PCB hard board is completed. The components 500 have been packaged, and the thickness of the device is increased, which makes the stacking thickness increase after the device is mounted on the PCB surface. Due to the space limitation of the shell, it is not conducive to increasing the battery cell capacity.

[0041] like Figure 1 and Figure 2 As shown, in order to solve the above technical problems, according to the first aspect disclosed in the utility model, a PCB board is provided, which includes a PCB carrier 100, a sealing layer 200, a first laminate layer 300 and a plurality of components 500, wherein the PCB carrier 100 has a solder pad 510; the sealing layer 200 is located between the PCB carrier 100 and the first laminate layer 300; the components 500 are electrically connected to the corresponding solder pads on the PCB carrier 100 through binding wires, and the components 500 are located in the sealing layer 200; wherein the first laminate layer 300 is formed with a via hole 600, and the via hole 600 is configured to expose the solder pad 510 of the component 500 to form a pin.

[0042] It should be noted that the PCB carrier 100, also known as the substrate, is made of insulating material. The base material of the PCB carrier 100 refers to the material used in the non-conductor part of the circuit board, mainly glass fiber cloth, epoxy resin, polyimide. Ceramics, etc. Among them, glass fiber cloth is widely used in the manufacture of double-sided boards and multi-layer boards, while epoxy resin and polyimide are used in the manufacture of high-density multi-layer boards. For example, the PCB carrier 100 is a high Tg board, FR-4 glass fiber + epoxy resin board, ceramic board, etc.; among them, this type of board is mostly used in high-frequency circuits, and its dielectric constant and stability are very good.

[0043] In addition, other materials, such as shielding materials, isolation materials, packaging materials, etc., may be added to the PCB carrier 100 to ensure the correct operation and long-term stability of the circuit board.

[0044] Among them, in the electronics manufacturing industry, the use of binding wires is extremely important, and it plays an important role in the semiconductor assembly process. During use, there are some things to pay attention to when using binding wires: first, there are many types of binding wires, such as gold wires, aluminum wires, copper wires, etc., and the specific selection of suitable binding wires should be based on the actual application and needs; secondly, the quality of the main binding wires is needed, and the quality of the selected binding wires directly affects the performance and reliability of semiconductor equipment.

[0045] Generally, the component 500 is electrically connected to the corresponding pad on the PCB carrier 100 through the binding wire. The specific operation is: the binding wire is fixed by welding, that is, the two ends of the binding wire are respectively welded to the pin of the component 500 and the pad on the PCB carrier 100 to achieve electrical connection between the components 500.

[0046] It should be noted that the via hole 600 is obtained by preserving or drilling to expose the pad 510 of the component 500, thereby enabling the PCB board and the component 500 to be connected. For example, the via hole 600 is metallized to achieve the connection between the PCB board and the component 500.

[0047] When the PCB board provided by the utility model is used, components 500 such as active component wafers and passive components are attached to the PCB carrier 100 and connected and fixed by binding wires, so that the components 500 do not need to adopt the SMT patch process, and the separate component packaging process is omitted; and after the binding wires are fixed, the sealing is performed to form a sealing layer 200, and the first laminated board layer 300 is formed by laminating the multi-layer boards, so that the components 500 and the sealing layer 200 can be located between the PCB carrier 100 and the first laminated board layer 300, and the PCB carrier 100 is bonded to the first laminated board layer 300 through the sealing layer 200, and the through hole 600 is arranged in cooperation, so that the external device (such as a resistor, a capacitor, an inductor, etc.) is electrically connected to the component 500 on the first laminated board layer by threading through the through hole 600, thereby reducing the height of the solder joint between the external device and the pad. Therefore, the present application eliminates the separate packaging process of components to reduce the thickness of components and the height of solder joints between external devices and pads, thereby ultimately achieving the purpose of reducing the thickness of the PCB board.

[0048] like Figure 3 As shown, based on the above embodiment, the PCB board further includes a support member 700, which is installed in the sealing layer 200, and the support member 700 is configured to support the laminated board layer.

[0049] It is easy to understand that the first laminated board layer 300 is formed by laminating a plurality of board layers, and the specific number of board layers can be selected according to actual needs, for example, it can be 1 layer, 2 layers, 3 layers, 4 layers or 5 layers. That is to say, in the process of laminating to form the first laminated board layer 300, the components 500 can be protected by the support member 700 to avoid the board layer contacting and squeezing the components 500 when the board layers are laminated. It is understandable that the components 500 do not protrude from the support member 700, that is, when the board layer squeezes the sealing layer 200, the sealing layer 200 is deformed, that is, the board layer moves toward the PCB carrier 100 until the board layer contacts the support member 700, and the board layer cannot continue to approach the PCB carrier 100 due to the obstruction of the support member 700, thereby ensuring that the board layer cannot contact the components 500.

[0050] For example, the height of the support member 700 protruding from the PCB carrier 100 is greater than the height of the component 500 protruding from the PCB carrier 100, ensuring that the side of the component 500 facing the board layer is lower than the side of the support member 700 facing the board layer.

[0051] Of course, in some embodiments, a recessed area may be provided on the PCB carrier 100, and the component 500 may be installed in the recessed area, with the component 500 being lower than the end of the recessed area, thereby also avoiding contact and extrusion of the component 500 when the board layers are pressed together.

[0052] like Figure 3As shown, on the basis of the above embodiment, the support member 700 is formed with a plurality of through holes; wherein the components 500 are located in the holes corresponding to their positions.

[0053] That is to say, there is no specific limit on the number of holes and slots. The number of holes and slots is set according to the number of components 500 installed on the PCB carrier 100, and the size of the holes and slots corresponding to the components 500 is set according to the size specifications of the components 500, to ensure that the components 500 and the binding wires connected to the components 500 can be located in the holes and slots, so that the support member 700 can effectively protect the components 500 and the binding wires.

[0054] Exemplarily, the support member 700 includes a plurality of support frames, and the inner holes of the support frames form hole slots; that is, the number of support frames is consistent with the number of components 500. In addition, by setting the two ends of the support frame as planar structures, it is ensured that the support frame is in surface contact with the first laminated board layer 300 and the PCB carrier 100, respectively, so as to avoid excessive local force on the PCB board or board layer when the first laminated board layer 300 is laminated, thereby damaging the PCB carrier 100 or the board layer. Of course, by making the support frame contact the first laminated board layer 300 and the PCB carrier 100, respectively, it is also possible to ensure that the distance between each part of the first laminated board layer 300 and the PCB carrier 100 is equal, thereby avoiding the first laminated board layer 300 from being skewed (the first laminated board layer 300 and the PCB carrier 100 are not in a parallel state).

[0055] Obviously, in other examples, the hole groove may also be set as a non-closed hole, such as a U-shaped groove, etc.

[0056] On the basis of the above embodiment, the support member 700 is set as an insulator, that is, the support member 700 is set to be made of insulating material to prevent the support member 700 from conducting electricity.

[0057] It can be understood that by configuring the support member 700 as an insulator, it is possible to avoid a short circuit of the component 500 caused by the movement of the support member 700 .

[0058] Of course, in other embodiments, the support member 700 may be pre-fixed on the PCB carrier 100 to prevent the support member 700 from shifting. For example, the support member 700 is pre-fixed on the PCB carrier 100 by glue dispensing.

[0059] It should be noted that when the first laminated board layer 300 is laminated, since the sealing layer 200 has the ability to deform, it is easy to cause the support member 700 placed in the sealing layer 200 to shift.

[0060] On the basis of the above-mentioned embodiment, the support member 700 is in contact with the PCB carrier 100 , and the support member 700 is a heat-conducting structure with heat-conducting capability.

[0061] It is easy to understand that PCB boards are widely used in the prior art. It is well known that electronic components will generate heat during operation, so the heat dissipation of PCB boards is an important indicator. Taking the single-sided PCB board commonly used in the prior art as an example, it includes a conductive layer, an insulating layer and a heat dissipation layer (in specific implementation, it also includes conventional layers such as a printing layer).

[0062] Obviously, the components 500 of the conventional PCB board are all arranged on the outer surface, which is different from the method of arranging the components 500 inside the PCB board adopted in the present application. Among them, arranging the components 500 on the outer surface of the PCB board can expose the components 500 to the outside world, and the heat is further dissipated and transmitted to the outside world, so the heat dissipation performance is good; while in the present application, the components 500 are arranged inside the PCB board, so the heat generated by the operation of the components 500 will be accumulated in the PCB board, and the heat dissipation performance of the sealing layer 200 is poor. By arranging the support member 700, the heat generated by the components 500 can be transferred to the first laminated board layer 300, and then the heat is dissipated to the outside world through the first laminated board layer 300, so that the support member 700 forms a heat-conducting structure, which is beneficial to the heat dissipation of the PCB board.

[0063] On the basis of the above-mentioned embodiment, the support member 700 and the PCB carrier board 100 are both made of ceramic material.

[0064] That is to say, the support member 700 and the PCB carrier 100 are both ceramic members, which have excellent thermal conductivity and heat dissipation performance and are insulating. Specifically, the support member 700 includes a plurality of ceramic frames, which can be circular, square, diamond or polygonal, etc., and are not specifically limited here, as long as they can cover the components 500. However, it is not limited to this one, and other materials that can achieve the same function can be used.

[0065] like Figure 1 As shown, based on the above embodiment, the thickness of the PCB carrier 100 is equal to the thickness of the sealing layer 200 ; wherein the thickness of the support member 700 is smaller than the thickness of the sealing layer 200 .

[0066] The thickness of the PCB carrier 100 and the sealing layer 200 being equal is conducive to maintaining the symmetrical arrangement of the PCB carrier 100 and the sealing layer 200, which is conducive to the later pressing and forming of the first pressing board layer 300 on the sealing layer 200, avoiding the presence of bubbles in the sealing layer 200 or the sealing layer 200 not being compacted.

[0067] For example, the height of the support member 700 protruding from the PCB carrier 100 is set to be smaller than the thickness of the sealing layer 200 to ensure that there is still a portion of the sealing layer 200 between the support member 700 and the first laminated board layer 300. This can ensure that when the first laminated board layer 300 is laminated, the first laminated board layer 300 can squeeze the sealing layer 200 to deform, thereby eliminating bubbles in the sealing layer 200 and improving the compaction effect of the sealing layer 200.

[0068] That is to say, by limiting the thickness of the support member 700 , it can be achieved that the first laminated board layer 300 has a movable margin when laminating the first laminated board layer 300 .

[0069] like Figure 1 As shown, based on the above embodiment, the PCB board also includes a second laminated board layer 400, which is arranged at one end of the PCB carrier 100 away from the first laminated board layer 300; wherein the conductive hole 600 extends to the second laminated board layer 400.

[0070] The components 500, the first laminated board layer 300 and the second laminated board layer 400 can be connected through a single via hole 600, so as to avoid too many via holes 600 being opened on the PCB board, thereby ensuring the overall strength of the PCB board and preventing the PCB board from bending and deforming due to low strength. When the via hole 600 is specifically set, the via hole 600 can be opened by drilling, thereby penetrating the pad 510 by drilling, and ensuring that the subsequent via hole 600 is metallized to achieve conduction between the PCB board and the components 500.

[0071] Of course, when the first laminated board layer 300 and the second laminated board layer 400 do not need to be connected, corresponding conductive holes 600 can be opened in the corresponding first laminated board layer 300 or the second laminated board layer 400, that is, the conductive holes between the first laminated board layer 300 and the second laminated board layer 400 are not connected.

[0072] like Figure 2 As shown, based on the above embodiments, the component 500 includes one or more of the following IC device wafers, resistor devices and MOS device wafers.

[0073] That is to say, the type of specific components is determined according to the actual usage scenario. For example, in some embodiments, the component 500 includes only one of an IC device wafer, a resistor device, and a MOS device wafer; or, in some embodiments, the component 500 includes only two of an IC device wafer, a resistor device, and a MOS device wafer; or, in some embodiments, the component 500 includes an IC device wafer, a resistor device, and a MOS device wafer; no specific limitation is made here.

[0074] Exemplarily, the IC device wafer and the passive components are fixed to the PCB carrier 100 through binding wires, and the resistor device and the MOS device wafer are respectively connected to the pads 510 disposed on the PCB carrier 100 through binding wires.

[0075] like Figure 2 , Figure 3 and Figure 4 As shown, in order to facilitate understanding of the technical solution of the present application, a method for producing a PCB board provided by the present application is also provided. It should be noted that the production of the PCB board provided by the present application is not limited to this method. The specific steps are as follows:

[0076] S100, fixing the component 500 on the PCB carrier 100 by glue, and connecting the component 500 and the pad by binding wires;

[0077] S200, using a ceramic grid to frame the component 500;

[0078] S300, filling with glue after framing, ensuring that the thickness of the glue filling is consistent with the thickness of the PCB carrier board 100, so as to form a sealing glue layer 200;

[0079] S400, laminating the board layers after sealing, connecting the electrical properties of the components 500 with the electrical properties of the board layers through the vias 600 to form a first laminated board layer 300; wherein the number of board layers can be increased according to actual needs.

[0080] It can be seen from the above operation that by directly connecting the components 500 through the PCB carrier 100 with binding wires, the device packaging and component 500 mounting processes are saved, and the thickness of the PCBA is reduced.

[0081] Compared with the prior art, the connection between the soft board and the hard board is through automatic welding or reflow welding. After welding, the height is at least 0.37mm higher than the hard board. In addition, the height of the glue is increased to more than 0.5mm. The height of the solder joint affects the stacking thickness of the battery head and affects the thinning of the battery. This application can effectively reduce the thickness of the PCBA, which is conducive to maintaining the battery capacity and achieving the thinness of the battery.

[0082] According to a second aspect of the present utility model, a battery module is provided. The battery module includes a PCB board.

[0083] Since the above-mentioned PCB board has the above-mentioned technical effects, the battery module including the PCB board should have the same technical effects, which will not be repeated here.

[0084] For example, the battery module can be a lithium battery, which is particularly light and can be used as a power source for digital cameras, mobile phones, etc. With the recent rapid increase in the popularity of personal portable terminal devices such as smart phones and tablet PCs, lithium batteries are actually the most widely used. However, it is not limited to this type, and other types of batteries are also within the scope of protection. For example, lead-acid batteries, nickel-metal hydride batteries, etc.

[0085] According to a third aspect of the present utility model, there is provided an electrical device, which includes a battery module.

[0086] The use of the battery module of the present application is not particularly limited, and it can be used for any electrical device known in the prior art. In some embodiments, the battery of the present application can be used for, but not limited to, laptop computers, pen-input computers, mobile computers, e-book players, portable phones, portable fax machines, portable copiers, portable printers, head-mounted stereo headphones, video recorders, LCD TVs, portable cleaners, portable CD players, mini-discs, transceivers, electronic notepads, calculators, memory cards, portable recorders, radios, backup power supplies, motors, cars, motorcycles, power-assisted bicycles, bicycles, lighting fixtures, toys, game consoles, clocks, power tools, flashlights, cameras, large household batteries and lithium-ion capacitors, etc.

[0087] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0088] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0089] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A PCB board, characterized in that: The PCB board comprises: A PCB carrier, a sealing layer and a first laminated board layer, wherein the PCB carrier has a solder pad; the sealing layer is located between the PCB carrier and the first laminated board layer; A plurality of components, wherein the components are electrically connected to the corresponding pads on the PCB carrier through binding wires, and the components are located in the sealing layer; The first laminate layer is formed with a via hole, and the via hole is configured to allow the pad to be exposed to form a pin.

2. The PCB board according to claim 1, characterized in that: The PCB board also includes a support member, which is installed in the sealing layer and is configured to support the first laminated board layer.

3. The PCB board according to claim 2, characterized in that: The support member is formed with a plurality of through holes; wherein the components are located in the holes corresponding to their positions.

4. The PCB board according to claim 3, characterized in that: The support member is configured as an insulator.

5. The PCB board according to any one of claims 2 to 4, characterized in that: The support member is in contact with the PCB carrier, and the support member is a heat-conducting structure with heat-conducting capability.

6. The PCB board according to claim 5, characterized in that: The support member and the PCB carrier are both made of ceramic material.

7. The PCB board according to claim 5, characterized in that: The thickness of the PCB carrier is equal to the thickness of the sealing layer; The thickness of the support member is smaller than the thickness of the sealing layer.

8. The PCB board according to claim 1, characterized in that: The PCB board also includes a second laminated board layer, and the second laminated board layer is arranged at an end of the PCB carrier away from the first laminated board layer; wherein The via extends to the second laminate layer.

9. The PCB board according to claim 1, characterized in that: The components include one or more of the following: C device wafers, resistor devices and MOS device wafers.

10. A battery module, characterized in that: The battery module comprises a PCB board as claimed in any one of claims 1 to 9.

11. An electrical device, characterized in that: The electrical device comprises the battery module as claimed in claim 10.

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