Electronic component glue filling device

Abstract

The utility model discloses a glue filling device for electronic components, which relates to the glue filling technology field, including a main body and an electronic component, a crossbeam is fixed on the top of the main body, a first telescopic mechanism is slidably connected to the crossbeam, a second telescopic mechanism is arranged on one side of the first telescopic mechanism, and two groups of fixing clamps are fixed on the top of the movable chassis, a plurality of groups of engaging grooves are evenly arranged on the inner side of each group of fixing clamps, a fixing plate is fixed inside the fixing clamp, and an elastic clamp is elastically connected to the position where the corresponding engaging grooves are arranged inside the fixing plate. The utility model arranges a first telescopic mechanism on the crossbeam, and the first telescopic mechanism drives the second telescopic mechanism to move up and down through a first electric push rod, and the second telescopic mechanism can drive the electronic electronic sensing glue automatic pressure pump to move up and down, thereby enabling the nozzle to more accurately perform glue filling operations on smaller electronic components, and making the glue supply of the equipment more stable and smooth.

Description

Technical Field

[0001] The utility model relates to the technical field of glue pouring, in particular to a glue pouring device for electronic components. Background Art

[0002] Electronic component potting is a process of filling glue between electronic components and substrates. This process can provide the functions of protecting, fixing and isolating electronic components, preventing physical and chemical changes between components and the environment, and improving the stability and reliability of components.

[0003] In the prior art, when gluing electronic components, the traditional gluing method cannot meet the quality and performance requirements of new energy products. Ordinary gluing equipment fills the small electronic welding area with uneven glue. At the same time, when gluing smaller electronic components, more fixtures are required to clamp and fix the electronic components. More fixtures not only increase the production cost, but also make the clamping process more cumbersome. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide an electronic component glue filling device to solve the problem that ordinary glue equipment in the prior art fills the small area of ​​electronic welding area with uneven glue, and at the same time, when filling glue for smaller electronic components, more fixtures and tools are needed to clamp and fix the electronic components. More fixtures and tools not only increase the production cost, but also make the clamping process more troublesome.

[0005] To achieve the above purpose, the utility model provides the following technical solutions: an electronic component glue filling device, comprising a main body and an electronic component, a crossbeam is fixed on the top of the main body, and a first telescopic mechanism is slidably connected to the crossbeam;

[0006] A second telescopic mechanism is arranged on one side of the first telescopic mechanism, an electronic induction glue volume automatic pressure pump is arranged on one side of the second telescopic mechanism, a nozzle is arranged at the bottom of the electronic induction glue volume automatic pressure pump, a mobile chassis is arranged inside the main body below the nozzle, and two groups of fixing clamps are fixed on the top of the mobile chassis, a plurality of groups of engaging grooves are evenly arranged on the inner side of each group of fixing clamps, a fixing plate is fixed inside the fixing clamp, and an elastic clamp is elastically connected to a position where a corresponding engaging groove is arranged inside the fixing plate;

[0007] Two sets of fixing fixtures are arranged on the top of the mobile chassis, wherein multiple sets of engaging grooves are evenly arranged on the inner side of each set of fixing fixtures, wherein the multiple sets of engaging grooves can be engaged and fixed to multiple sets of electronic components, so that the multiple sets of electronic components can be glued sequentially under the movement of the nozzle and the adjustment of the moving mechanism, which not only makes it more convenient to clamp and fix the multiple sets of electronic components, but also reduces the cost of making multiple sets of separate fixing fixtures, and the overall use effect is better;

[0008] A first electric push rod is arranged on the top of the first telescopic mechanism, and the output end of the first electric push rod drives the second telescopic mechanism to move up and down. A second electric push rod is arranged on the top of the second telescopic mechanism, and the output end of the second electric push rod drives the electronic sensing glue quantity automatic pressure pump to move up and down. Glue injection hoses are fixed at both ends of the electronic sensing glue quantity automatic pressure pump, and the glue injection hoses are connected to the external glue storage cylinder through pipelines.

[0009] By adopting the above technical solution, a first telescopic mechanism is arranged on the crossbeam, and the first telescopic mechanism drives the second telescopic mechanism to move up and down through the first electric push rod, and the second telescopic mechanism can drive the electronic electronic sensing glue amount automatic pressure pump to move up and down, so that the nozzle can more accurately perform glue filling operations on smaller electronic components, making the glue supply of the equipment more stable and smoother.

[0010] The utility model is further configured that cooling racks are fixed on the tops of the two sets of fixing clamps, and connecting pipes are arranged at one end of the two sets of cooling racks.

[0011] By adopting the above technical solution, the cooling rack can cool the electronic components after the glue is poured to a certain extent, thereby accelerating the cooling and molding speed of the glue.

[0012] The utility model is further configured that a moving mechanism is provided between the main body and the moving chassis, and the moving mechanism plays a role in driving the moving chassis to move.

[0013] By adopting the above technical solution, the moving mechanism can drive the moving chassis to move, so that the nozzle can better perform glue filling operations on different electronic components.

[0014] In summary, the utility model mainly has the following beneficial effects:

[0015] The utility model is provided with a first telescopic mechanism on the crossbeam, and the first telescopic mechanism drives the second telescopic mechanism to move up and down through the first electric push rod, and the second telescopic mechanism can drive the electronic electronic sensing glue automatic pressure pump to move up and down, so that the nozzle can be more accurately filled with glue for electronic components with smaller volume, and the glue supply of the equipment is more stable and smoother; in addition, two groups of fixing clamps are provided on the top of the mobile chassis, wherein each group of fixing clamps has multiple groups of engaging grooves evenly arranged on the inner side, wherein the multiple groups of engaging grooves can be engaged and fixed for multiple groups of electronic components, so that the multiple groups of electronic components can be filled with glue in sequence under the movement of the nozzle and the adjustment of the moving mechanism, which is not only more convenient for clamping and fixing the multiple groups of electronic components, but also reduces the cost of making multiple groups of separate fixing clamps, and the overall use effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a partial structural exploded view of the utility model;

[0018] Figure 3 For this utility model Figure 2 Enlarged view of point A.

[0019] In the figure: 1. main body; 2. crossbeam; 3. first telescopic mechanism; 4. first electric push rod; 5. second telescopic mechanism; 6. second electric push rod; 7. electronic sensing glue quantity automatic pressure pump; 8. glue injection hose; 9. nozzle; 10. mobile chassis; 11. fixing fixture; 12. engaging groove; 13. electronic component; 14. fixing plate; 15. elastic splint; 16. cooling rack; 17. connecting pipe; 18. mobile mechanism. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0021] The following describes an embodiment of the utility model based on its overall structure.

[0022] An electronic component glue filling device, such as Figure 1-3 As shown, it includes a main body 1 and an electronic component 13. A crossbeam 2 is fixed on the top of the main body 1, and a first telescopic mechanism 3 is slidably connected to the crossbeam 2;

[0023] A second telescopic mechanism 5 is arranged on one side of the first telescopic mechanism 3, an electronic induction glue automatic pressure pump 7 is arranged on one side of the second telescopic mechanism 5, a nozzle 9 is arranged at the bottom of the electronic induction glue automatic pressure pump 7, a mobile chassis 10 is arranged inside the main body 1 below the nozzle 9, and two groups of fixing clamps 11 are fixed on the top of the mobile chassis 10, and multiple groups of engaging grooves 12 are evenly arranged on the inner side of each group of fixing clamps 11, and a fixing plate 14 is fixed inside the fixing clamp 11, and an elastic clamping plate 15 is elastically connected at the position where the corresponding engaging grooves 12 are opened inside the fixing plate 14, by arranging two groups of fixing clamps 11 on the top of the mobile chassis, wherein multiple groups of engaging grooves 12 are evenly arranged on the inner side of each group of fixing clamps 11, wherein multiple groups of engaging grooves 12 can be engaged and fixed to multiple groups of electronic components, so that multiple groups of electronic components can be sequentially filled with glue under the movement of the nozzle 9 and the adjustment of the moving mechanism 18;

[0024] A first electric push rod 4 is arranged on the top of the first telescopic mechanism 3, and the output end of the first electric push rod 4 drives the second telescopic mechanism 5 to move up and down. A second electric push rod 6 is arranged on the top of the second telescopic mechanism 5, and the output end of the second electric push rod 6 drives the electronic sensing glue quantity automatic pressure pump 7 to move up and down. Both ends of the electronic sensing glue quantity automatic pressure pump 7 are fixed with glue injection tubes 8, and the glue injection tubes 8 are connected to the external glue storage cylinder through pipelines.

[0025] See also Figure 1 and Figure 2 A cooling rack 16 is fixed on the top of the two sets of fixing clamps 11, and a connecting pipe 17 is provided at one end of the two sets of cooling racks 16. By setting the above structure, the utility model can cool the electronic components 13 after glue filling to a certain extent, thereby accelerating the cooling and molding speed of the colloid.

[0026] See also Figure 1 A moving mechanism 18 is provided between the main body 1 and the moving chassis 10, and the moving mechanism 18 plays a role in driving the moving chassis 10 to move. The utility model sets the above structure, wherein the moving mechanism 18 can drive the moving chassis 10 to move, thereby enabling the nozzle 9 to better perform glue filling operations on different electronic components 13.

[0027] The working principle of the utility model is as follows: when in use, the power is turned on, so that the first electric push rod 4 and the second electric push rod 6 are connected to the external power supply device, so that the first telescopic mechanism 3 and the second telescopic mechanism 5 can be lifted and moved;

[0028] At the same time, the two sets of glue injection pipes 8 are connected to the external glue cylinder through two sets of hoses, and then under the action of the electronic sensing glue automatic pressure pump 7, the glue can be transported from the external glue cylinder to the nozzle 9, and then the glue injection operation is performed;

[0029] Two sets of fixing fixtures 11 are arranged on the top of the mobile chassis, wherein each set of fixing fixtures 11 has multiple sets of snap-fit ​​grooves 12 evenly arranged inside, wherein the multiple sets of snap-fit ​​grooves 12 can snap-fit ​​and fix multiple sets of electronic components, so that the multiple sets of electronic components can be glued sequentially under the movement of the nozzle 9 and the adjustment of the moving mechanism 18;

[0030] It is not only convenient to clamp and fix multiple groups of electronic components, but also reduces the cost of making multiple groups of separate fixing fixtures, and the overall use effect is good;

[0031] Furthermore, a fixing plate 14 is fixed inside the fixing fixture 11, and elastic clamps 15 are elastically connected at positions inside the fixing plate 14 corresponding to the multiple groups of snap-fit ​​grooves 12. After the staff inserts the electronic component 13 into the snap-fit ​​groove 12, the elastic clamp 15 can clamp and fix the head of the electronic component 13, thereby further improving the stability of the electronic component 13.

[0032] Although an embodiment of the utility model has been shown and described, this specific embodiment is merely an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. An electronic component glue potting device, comprising a main body (1) and an electronic component (13), characterized in that: A crossbeam (2) is fixed on the top of the main body (1), and a first telescopic mechanism (3) is slidably connected to the crossbeam (2); A second telescopic mechanism (5) is arranged on one side of the first telescopic mechanism (3), an electronic induction glue quantity automatic pressure pump (7) is arranged on one side of the second telescopic mechanism (5), a nozzle (9) is arranged at the bottom of the electronic induction glue quantity automatic pressure pump (7), a mobile chassis (10) is arranged inside the main body (1) below the nozzle (9), and two groups of fixing clamps (11) are fixed on the top of the mobile chassis (10), each group of the fixing clamps (11) has a plurality of groups of engaging grooves (12) evenly arranged on the inner side, a fixing plate (14) is fixed inside the fixing clamp (11), and an elastic clamp (15) is elastically connected to the position where the corresponding engaging groove (12) is arranged inside the fixing plate (14).

2. The electronic component glue potting device according to claim 1, characterized in that: A first electric push rod (4) is arranged on the top of the first telescopic mechanism (3), and the output end of the first electric push rod (4) drives the second telescopic mechanism (5) to move up and down.

3. The electronic component glue potting device according to claim 1, characterized in that: A second electric push rod (6) is arranged on the top of the second telescopic mechanism (5), and the output end of the second electric push rod (6) drives the electronic induction glue quantity automatic pressure pump (7) to move up and down.

4. The electronic component glue potting device according to claim 1, characterized in that: Both ends of the electronic induction glue quantity automatic pressure pump (7) are fixed with glue injection pipes (8), and the glue injection pipes (8) are connected to an external glue storage cylinder through a pipeline.

5. The electronic component glue potting device according to claim 1, characterized in that: A cooling rack (16) is fixed on the top of the two sets of fixing fixtures (11), and a connecting pipe (17) is provided at one end of the two sets of cooling racks (16).

6. The electronic component glue potting device according to claim 1, characterized in that: A moving mechanism (18) is provided between the main body (1) and the moving chassis (10), and the moving mechanism (18) plays a role in driving the moving chassis (10) to move.

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