A micro-hemispherical grinding and polishing device

Abstract

The utility model discloses a micro-hemispherical grinding and polishing device, which includes a first sliding mechanism, a second sliding mechanism, a mounting frame, a grinding and polishing tool and a clamping mechanism; the first sliding mechanism is used to support the mounting frame so that the mounting frame can move in the front-back direction; the second sliding mechanism is arranged on the mounting frame and can slide in the vertical direction relative to the mounting frame; the micro-hemispherical resonator can be circumferentially rotatably arranged at the lower end of the clamping mechanism, the clamping mechanism can be rotatably arranged on the second sliding mechanism, and it can be rotated in a vertical plane relative to the second sliding mechanism until the central axis of the micro-hemispherical resonator is at a set angle with the horizontal plane, and the grinding and polishing tool can be horizontally rotatably arranged below the clamping mechanism. The utility model can complete the grinding + polishing + chamfering operation of the hemispherical resonator at one time without changing the fixture, effectively improving the flatness and precision of the product, eliminating the edge collapse phenomenon of the product, and improving the qualified rate of the product.

Description

Technical Field

[0001] The utility model relates to the technical field of inertial navigation device preparation, in particular to a micro-hemispherical grinding and polishing device. Background Art

[0002] The working principle of the micromechanical vibration gyroscope is based on the Coriolis effect of the microresonant structure. The existing high-performance micromechanical vibration gyroscopes are mostly made of isotropic materials such as fused quartz, polycrystalline silicon, and polycrystalline diamond, and most of them are rotary resonant structures with a high degree of symmetry in physical parameters and geometric structures. The symmetry accuracy directly determines the upper limit of the gyroscope's performance. Common micro-rotary resonant structures include disc-shaped ring structures, micro-hemispherical structures, and so on. Due to the small size, complex structure, and hard and brittle transparent medium of the micro-resonant structure, the lip edge of the blow-molded micro-hemispherical product processed by a high-temperature blowtorch will have residual edge material, and must be precisely cut and polished before it can become a micro-hemispherical resonator for normal use. In addition, when the lip edge of the micro-hemispherical is ground and polished, the edge of the outermost circle will have a small local chipping edge. In order to improve the quality factor of the micro-hemispherical and reduce the damage to the lip edge, the lip edge after grinding and polishing needs to be chamfered to eliminate the chipping edge.

[0003] The commonly used process is laser cutting + mechanical polishing + chamfering, which mainly has the following difficulties:

[0004] 1) Cutting, polishing and chamfering are not completed in the same process, and repeated replacement of fixtures cannot guarantee the flatness of the product;

[0005] 2) Micro cracks (edge ​​collapse, etc.) are prone to occur on the laser cutting edge;

[0006] 3) It requires investment in a variety of processing equipment, which results in high investment costs. Summary of the invention

[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and to provide a micro-hemispherical grinding and polishing device which can complete the grinding, polishing and chamfering processes of a hemispherical resonator on the same device, thereby effectively improving the flatness, precision and qualified rate of the product.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A micro-hemispherical grinding and polishing device comprises a first sliding mechanism, a second sliding mechanism, a mounting frame, a grinding and polishing tool and a clamping mechanism;

[0010] The first sliding mechanism is used to support the mounting frame so that the mounting frame can move in the front-rear direction;

[0011] The second sliding mechanism is disposed on the mounting frame and is capable of sliding in a vertical direction relative to the mounting frame;

[0012] The micro-hemispherical resonator can be rotatably arranged at the lower end of the clamping mechanism, and the clamping mechanism can be rotatably arranged on the second sliding mechanism. It can rotate in a vertical plane relative to the second sliding mechanism until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and the grinding and polishing tool is horizontally rotatably arranged below the clamping mechanism.

[0013] Optionally, the clamping mechanism can be rotatably mounted on the second sliding mechanism through a fastening structure, and the fastening structure includes a first fastener, a waist-shaped hole opened on the clamping mechanism, and a plurality of threaded holes opened on the second sliding mechanism. The clamping mechanism can be rotated relative to the second sliding mechanism until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and at least one threaded hole is exposed in the waist-shaped hole. The first fastener passes through the waist-shaped hole and the exposed threaded hole to fasten the clamping mechanism and the second sliding mechanism together.

[0014] Optionally, the clamping mechanism is rotatably installed on the second sliding mechanism through a positioning column, and is detachably connected to the second sliding mechanism through a fastening structure. The fastening structure includes a first fastener, a waist-shaped hole opened on the clamping mechanism, and a plurality of threaded holes opened on the second sliding mechanism. The clamping mechanism can rotate around the positioning column until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and at least one threaded hole is exposed in the waist-shaped hole. The first fastener passes through the waist-shaped hole and the exposed threaded hole to fasten the clamping mechanism to the second sliding mechanism.

[0015] Optionally, the positioning column is a second fastener, and after the clamping mechanism rotates around the positioning column until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, the second fastener fastens the clamping mechanism and the second sliding mechanism.

[0016] Optionally, the clamping mechanism includes a first plate, a second plate and a clamping assembly, the first plate is arranged vertically, the waist-shaped hole is opened on the first plate, the second plate is horizontally connected to the lower end of the first plate, and the clamping assembly is installed on the second plate for loading the micro-hemispherical resonator and driving its circumferential rotation.

[0017] Optionally, the clamping assembly includes a rotary drive motor, a rotating shaft and a bearing, the rotating shaft is vertically mounted on the second plate through the bearing and passes through the second plate, the rotary drive motor is mounted on the second plate and is transmission-connected to the rotating shaft for driving the rotating shaft to rotate circumferentially, and the micro-hemispherical resonator is mounted at the lower end of the rotating shaft.

[0018] Optionally, the micro-hemispherical resonator is mounted on the lower end of the rotating shaft by a clamp, a mounting hole matching the micro-hemispherical resonator is provided on the lower end surface of the clamp, and the micro-hemispherical resonator is adhered in the mounting hole by an adhesive.

[0019] Optionally, a first through hole penetrating the clamp is formed on the bottom surface of the mounting hole, and a second through hole connecting the first through hole and the external environment is formed on the rotating shaft.

[0020] Optionally, the clamping mechanism also includes a stopping pin, a third through hole is opened on the second plate for the rotating shaft to pass through, and a screw hole is opened on the side of the second plate to cooperate with the stopping pin and communicate with the third through hole, and the stopping pin can pass through the screw hole and abut against the rotating shaft.

[0021] Optionally, the grinding and polishing tool comprises: a polishing disc and a grinding wheel disc, the polishing disc is arranged above the grinding wheel disc, and the two are coaxially arranged.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: the micro-hemispherical grinding and polishing device of the present invention, by rotatably setting the clamping mechanism for clamping the micro-hemispherical resonator on the sliding mechanism, can be rotated relative to the sliding mechanism in the vertical plane until the central axis of the micro-hemispherical resonator is at a set angle with the horizontal plane, thereby realizing vertical grinding and polishing of the micro-hemispherical resonator, and also deflecting the main axis of the micro-hemispherical resonator at a certain angle to realize the processing and grinding and polishing of the chamfer of the lip edge. Therefore, the present invention can complete the grinding + polishing + chamfering of the hemispherical resonator at one time without changing the fixture, effectively improving the flatness and precision of the product, eliminating the edge collapse phenomenon of the product, and improving the qualified rate of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a micro-hemispherical grinding and polishing device according to an embodiment of the utility model;

[0024] Figure 2 It is a schematic diagram of the exploded structure of the clamping mechanism;

[0025] Figure 3 It is a schematic diagram of the cross-sectional structure of the clamping mechanism;

[0026] Figure 4 It is a three-dimensional structural schematic diagram of the plate structure.

[0027] Legend: 100, clamping mechanism; 1, rotary drive motor; 2, rotating shaft; 4, bearing; 5, second plate; 6, fixture; 8, first plate; 9, positioning column; 10, waist-shaped hole; 11, threaded hole; 12, mounting hole; 13, first through hole; 14, second through hole; 15, third through hole; 16, screw hole; 17, stop pin; 18, first fastener; 200, first sliding mechanism; 300, second sliding mechanism; 400, mounting frame; 500, grinding and polishing tool. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0029] like Figure 1-Figure 4 As shown, the micro-hemispherical grinding and polishing device of this embodiment includes a first sliding mechanism 200, a second sliding mechanism 300, a mounting frame 400, a grinding and polishing tool 500 and a clamping mechanism 100;

[0030] The first sliding mechanism 200 is used to support the mounting frame 400 so that the mounting frame 400 can move in the front-rear direction;

[0031] The second sliding mechanism 300 is disposed on the mounting frame 400 and can slide in a vertical direction relative to the mounting frame 400;

[0032] The micro-hemispherical resonator can be rotatably arranged at the lower end of the clamping mechanism 100, and the clamping mechanism 100 can be rotatably arranged on the second sliding mechanism 300. It can be rotated in a vertical plane relative to the second sliding mechanism 300 until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and the grinding and polishing tool 500 can be rotatably arranged horizontally below the clamping mechanism 100.

[0033] Thus, by rotatably setting the clamping mechanism 100 for clamping the micro-hemispherical resonator on the sliding mechanism of the micro-hemispherical grinding and polishing device, the micro-hemispherical resonator can be rotated relative to the sliding mechanism in the vertical plane until the central axis of the micro-hemispherical resonator is at a set angle with the horizontal plane, thereby realizing vertical grinding and polishing of the micro-hemispherical resonator, and also deflecting the main axis of the micro-hemispherical resonator at a certain angle to realize the processing and grinding and polishing of the lip chamfer. Therefore, the utility model can complete the grinding + polishing + chamfering of the micro-hemispherical resonator at one time without changing the fixture, effectively improving the flatness and precision of the product, eliminating the edge collapse phenomenon of the product, and improving the qualified rate of the product.

[0034] In this embodiment, the clamping mechanism 100 can be rotatably installed on the second sliding mechanism 300 through a fastening structure. The fastening structure includes a first fastener 18, a waist-shaped hole 10 opened on the clamping mechanism 100, and a plurality of threaded holes 11 opened on the second sliding mechanism 300. The clamping mechanism 100 can be rotated relative to the second sliding mechanism 300 until the central axis of the micro-hemispherical resonator is at a set angle to the horizontal plane, and at least one threaded hole 11 is exposed in the waist-shaped hole 10. The first fastener 18 passes through the waist-shaped hole 10 and the exposed threaded hole 11 to fasten the clamping mechanism 100 and the second sliding mechanism 300 together.

[0035] It can be seen that the fastening structure of the waist-shaped hole + fastener design in this embodiment is used not only for the fixed connection between the clamping mechanism and the main body of the grinding and polishing equipment, but also for realizing the overall angular swing of the clamping mechanism, thereby realizing the chamfering grinding and polishing of the micro-hemispherical or flat sheet fixed on the clamping mechanism.

[0036] In this embodiment, in order to facilitate the installation of the clamping mechanism 100, the clamping mechanism 100 is rotatably installed on the second sliding mechanism 300 through the positioning column 9, and is detachably connected to the second sliding mechanism 300 through a fastening structure. The fastening structure includes a first fastener 18, a waist-shaped hole 10 opened on the clamping mechanism 100, and a plurality of threaded holes 11 opened on the second sliding mechanism 300. The clamping mechanism 100 can be rotated around the positioning column 9 until the central axis of the micro-hemispherical resonator is at a set angle to the horizontal plane, and the waist-shaped hole 10 exposes at least one threaded hole 11. The first fastener 18 passes through the waist-shaped hole 10 and the exposed threaded hole 11 to fasten the clamping mechanism 100 and the second sliding mechanism 300 together.

[0037] In this embodiment, in order to further improve the stability of the micro-hemispherical resonator during grinding and polishing, the positioning column 9 is the second fastener. After the clamping mechanism 100 rotates around the positioning column 9 until the central axis of the micro-hemispherical resonator is at a set angle with the horizontal plane, the second fastener fastens the clamping mechanism 100 and the second sliding mechanism 300.

[0038] The installation process of the clamping mechanism 100 is as follows: the clamping mechanism 100 is first suspended on the second sliding mechanism 300 of the grinding and polishing machine equipment body through the positioning column 9, and then according to the grinding and polishing requirements of the micro-hemispherical resonator, the clamping mechanism 100 is rotated around the positioning column 9 until the central axis of the micro-hemispherical resonator is at a set angle with the horizontal plane. At this time, the waist-shaped hole 10 opened on the clamping mechanism 100 exposes at least one threaded hole 11 opened on the second sliding mechanism 300, and then the first fastener 18 is passed through the waist-shaped hole 10 and the threaded hole 11 to fix the clamping mechanism 100 on the second sliding mechanism 300, and finally the positioning column 9 is tightened to achieve the effect of double fixing tooling.

[0039] In this embodiment, the clamping mechanism 100 includes a plate structure and a clamping assembly. The plate structure includes a first plate 8, a second plate 5 and a third plate 7. The first plate 8 is arranged vertically, and a waist-shaped hole 10 is opened on the first plate 8. The second plate 5 is horizontally connected to the lower end of the first plate 8. The clamping assembly is installed on the second plate 5 for loading the micro-hemispherical resonator and driving it to rotate circumferentially. The third plate 7 is connected between the first plate 8 and the second plate 5 to act as a reinforcing rib plate.

[0040] In this embodiment, the clamping assembly includes a rotary drive motor 1, a rotating shaft 2 and a bearing 4. The rotating shaft 2 is vertically mounted on the second plate 5 through the bearing 4 and passes through the second plate 5. The rotary drive motor 1 is mounted on the second plate 5 and is transmission-connected to the rotating shaft 2 for driving the rotating shaft 2 to rotate circumferentially. The micro-hemispherical resonator is mounted at the lower end of the rotating shaft 2, thereby realizing variable speed controlled grinding of the micro-hemispherical or flat sheet being polished.

[0041] In this embodiment, the grinding and polishing tool 500 is installed on the bed of the micro-hemispherical grinding and polishing device through a rotating drive motor. The micro-hemispherical resonator rotates during grinding or chamfering, and the grinding and polishing tool 500 revolves, thereby achieving uniform grinding or chamfering of the micro-hemispherical resonator.

[0042] In this embodiment, two bearings 4 are provided, and the two bearings 4 are respectively provided on both sides of the second plate 5 . A dust cover 3 is provided on the outside of each bearing 4 to prevent external pollutants from entering the bearing 4 , thereby improving the running stability and service life of the bearing 4 .

[0043] In this embodiment, the micro-hemispherical resonator is mounted on the lower end of the rotating shaft 2 by means of a clamp 6. The lower end surface of the clamp 6 is provided with a mounting hole 12 that matches the micro-hemispherical resonator. The micro-hemispherical resonator is pasted in the mounting hole 12 by means of an adhesive. The edge portion of the micro-hemispherical resonator that needs to be removed or chamfered is exposed outside the mounting hole 12. The bonding process is as follows: first measure the thickness of the quartz glass, and then measure the overall thickness and flatness after pasting. If there is non-parallel pasting or deviation, it is pasted again after high-temperature cleaning.

[0044] If the shape and size of the micro-hemispherical ball changes, it can be realized by replacing a single fixture, which improves the diversified and simplified application. At the same time, the replaceability of the fixture 6 means that the device can be used not only for the grinding and polishing of the lip edge and chamfer of the micro-hemispherical ball, but also for the grinding and polishing of flat sheets.

[0045] In this embodiment, a first through hole 13 penetrating the clamp 6 is provided on the bottom surface of the mounting hole 12, and a second through hole 14 connecting the first through hole 13 and the external environment is provided on the rotating shaft 2, so that the gas generated during the grinding or chamfering of the micro-hemispherical resonator can be quickly discharged, thereby improving the grinding and polishing quality of the product.

[0046] In this embodiment, the clamping mechanism 100 also includes a stop pin 17, a third through hole 15 is opened on the second plate 5 for the rotating shaft 2 to pass through, and a screw hole 16 is opened on the side of the second plate 5 to cooperate with the stop pin 17 and connected to the third through hole 15. The stop pin 17 can pass through the screw hole 16 and abut against the rotating shaft 2.

[0047] Therefore, when the part does not need to be ground, the stop pin 17 can be screwed into the screw hole 16 until it abuts against the rotating shaft 2 in the third through hole 15 to fix the rotating shaft 2 and realize static grinding of the part.

[0048] In this embodiment, the grinding and polishing tool 500 includes: a polishing disc and a grinding wheel disc. The polishing disc is arranged above the grinding wheel disc, and the two are coaxially arranged.

[0049] In this embodiment, the first sliding mechanism 200 and the second sliding mechanism 300 both adopt a double guide rail + double slide frame structure, and the double slide frame is driven by a servo motor to slide on the double guide rail, and finally the clamping mechanism 100 drives the workpiece to move forward and backward and up and down, so that the edge of the micro-hemispherical oscillator attached to the fixture 6 selectively contacts the polishing disc or the grinding wheel disc. By designing a single-sided double-grinding polishing medium solution, the grinding and polishing operations of the edge and chamfer of the hemispherical resonator can be completed at one time without changing the fixture, effectively improving the flatness of the product.

[0050] It should be noted that the “front” and “rear” in the front and rear surfaces and the “upper” and “lower” in the upper and lower end surfaces involved in the textual description of this embodiment are used to express the relative relationship between the above-mentioned surfaces or end surfaces, and should not be understood as a description of the absolute position relationship of the above-mentioned surfaces or end surfaces, which may be expressed differently under different azimuth viewing angles.

[0051] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A micro-hemispherical grinding and polishing device, characterized in that: It comprises a first sliding mechanism (200), a second sliding mechanism (300), a mounting frame (400), a grinding and polishing tool (500) and a clamping mechanism (100); The first sliding mechanism (200) is used to support the mounting frame (400) so that the mounting frame (400) can move in the front-rear direction; The second sliding mechanism (300) is disposed on the mounting frame (400) and is capable of sliding in a vertical direction relative to the mounting frame (400); The micro-hemispherical resonator is rotatably arranged at the lower end of the clamping mechanism (100), and the clamping mechanism (100) is rotatably arranged on the second sliding mechanism (300). The clamping mechanism (100) can be rotated in a vertical plane relative to the second sliding mechanism (300) until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and the grinding and polishing tool (500) is horizontally rotatably arranged below the clamping mechanism (100).

2. The micro-hemispherical grinding and polishing device according to claim 1, characterized in that: The clamping mechanism (100) can be rotatably mounted on the second sliding mechanism (300) via a fastening structure, wherein the fastening structure comprises a first fastener (18), a waist-shaped hole (10) provided on the clamping mechanism (100), and a plurality of threaded holes (11) provided on the second sliding mechanism (300); the clamping mechanism (100) can be rotated relative to the second sliding mechanism (300) until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane and the waist-shaped hole (10) exposes at least one threaded hole (11); and the first fastener (18) passes through the waist-shaped hole (10) and the exposed threaded hole (11) to fasten the clamping mechanism (100) and the second sliding mechanism (300) together.

3. The micro-hemispherical grinding and polishing device according to claim 1, characterized in that: The clamping mechanism (100) is rotatably mounted on the second sliding mechanism (300) via a positioning column (9), and is detachably connected to the second sliding mechanism (300) via a fastening structure, wherein the fastening structure comprises a first fastener (18), a waist-shaped hole (10) provided on the clamping mechanism (100), and a plurality of threaded holes (11) provided on the second sliding mechanism (300); the clamping mechanism (100) can be rotated around the positioning column (9) until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, and the waist-shaped hole (10) exposes at least one threaded hole (11); the first fastener (18) passes through the waist-shaped hole (10) and the exposed threaded hole (11), and then the clamping mechanism (100) and the second sliding mechanism (300) are fastened and connected.

4. The micro-hemispherical grinding and polishing device according to claim 3, characterized in that: The positioning column (9) is a second fastener, and after the clamping mechanism (100) rotates around the positioning column (9) until the central axis of the micro-hemispherical resonator forms a set angle with the horizontal plane, the second fastener fastens the clamping mechanism (100) and the second sliding mechanism (300) together.

5. The micro-hemispherical grinding and polishing device according to any one of claims 2 to 4, characterized in that: The clamping mechanism (100) comprises a first plate (8), a second plate (5) and a clamping assembly, wherein the first plate (8) is arranged vertically, the waist-shaped hole (10) is opened on the first plate (8), the second plate (5) is horizontally connected to the lower end of the first plate (8), and the clamping assembly is installed on the second plate (5) for loading the micro-hemispherical resonator and driving it to rotate in a circumferential direction.

6. The micro-hemispherical grinding and polishing device according to claim 5, characterized in that: The clamping assembly comprises a rotary drive motor (1), a rotating shaft (2) and a bearing (4); the rotating shaft (2) is vertically mounted on a second plate (5) via the bearing (4) and penetrates the second plate (5); the rotary drive motor (1) is mounted on the second plate (5) and is transmission-connected to the rotating shaft (2) for driving the rotating shaft (2) to rotate circumferentially; and the micro-hemispherical resonator is mounted at the lower end of the rotating shaft (2).

7. The micro-hemispherical grinding and polishing device according to claim 6, characterized in that: The micro-hemispherical resonator is mounted on the lower end of the rotating shaft (2) via a clamp (6); a mounting hole (12) matching the micro-hemispherical resonator is provided on the lower end surface of the clamp (6); and the micro-hemispherical resonator is adhered to the mounting hole (12) via an adhesive.

8. The micro-hemispherical grinding and polishing device according to claim 7, characterized in that: A first through hole (13) penetrating the clamp (6) is provided on the bottom surface of the mounting hole (12), and a second through hole (14) communicating with the first through hole (13) and the external environment is provided on the rotating shaft (2).

9. The micro-hemispherical grinding and polishing device according to claim 5, characterized in that: The clamping mechanism (100) further comprises a stop pin (17); a third through hole (15) is provided on the second plate (5) for the rotation shaft (2) to pass through; a screw hole (16) is provided on the side of the second plate (5) and is matched with the stop pin (17) and is connected with the third through hole (15); the stop pin (17) can pass through the screw hole (16) and abut against the rotation shaft (2).

10. The micro-hemispherical grinding and polishing device according to any one of claims 1 to 4, characterized in that: The grinding and polishing tool (500) comprises a polishing disc and a grinding wheel disc, wherein the polishing disc is arranged above the grinding wheel disc, and the two are coaxially arranged.

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