A computer radiator

Abstract

The utility model discloses a computer radiator, including a radiator, the top of which is fixedly connected to a water tank, a cooling component is arranged on the right side of the water tank; the cooling component includes a cooling block, and the cooling block is fixedly connected to the right side of the water tank. The utility model starts a semiconductor refrigeration sheet, which cools the cooling block, then cools the water inside the water tank through a temperature conducting rod and the cooling block, then dissipates heat from the semiconductor refrigeration sheet through a heat dissipation block and a heat dissipation fan, then starts a submersible pump, which flushes water through a water inlet pipe to the inside of a heat conducting pipe, dissipates heat from the inside of the radiator through the heat conducting pipe, performs water circulation, and dissipates heat, so that the radiator achieves an excellent heat dissipation effect, replaces the existing method of heat dissipation by air cooling, thereby achieving an efficient heat dissipation effect, improving the heat dissipation efficiency, and facilitating use by users.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer radiator. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical and logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and automatically and quickly process massive data. It is composed of hardware and software systems. A computer without any software installed is called a bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, quantum computers, etc.

[0003] When using a computer, a radiator is needed to dissipate heat from the processor. However, the existing radiator uses air cooling to dissipate heat. When the external ambient temperature is relatively high, the heat dissipation effect decreases, causing the processor to overheat and reduce its frequency, affecting the computer's operating performance and making it inconvenient for users.

[0004] Therefore, the radiator needs to be redesigned to effectively prevent the existing radiator from using air cooling to dissipate heat. When the external ambient temperature is relatively high, the heat dissipation effect decreases, causing the processor to overheat and reduce its frequency, affecting the computer's operating performance. Utility Model Content

[0005] In order to solve the problems raised in the above-mentioned background technology, the purpose of the utility model is to provide a computer radiator, which has the advantage of improving heat dissipation, and solves the problem that the existing radiator uses air cooling for heat dissipation, and when the external ambient temperature is relatively high, the heat dissipation effect decreases, causing the processor to overheat and reduce the frequency, thereby affecting the computer's operating performance.

[0006] To achieve the above object, the utility model provides the following technical solution: a computer radiator, comprising a radiator, the top of the radiator is fixedly connected to a water tank, and a cooling component is arranged on the right side of the water tank;

[0007] The cooling component includes a cooling block, the cooling block is fixedly connected to the right side of the water tank, a semiconductor refrigeration sheet is fixedly connected to the right side of the cooling block, a heat dissipation block is fixedly connected to the right side of the semiconductor refrigeration sheet, and a heat dissipation fan is fixedly connected to the right side of the heat dissipation block;

[0008] A submersible pump is arranged inside the water tank, a temperature conducting pipe is fixedly connected inside the radiator, the output end of the submersible pump is connected to one end of the temperature conducting pipe through a water inlet pipe, and the other end of the temperature conducting pipe is connected to the left side of the water tank through a return pipe.

[0009] As a preferred embodiment of the utility model, a filter cover is provided on the outer side of the submersible pump, and the filter cover is used in conjunction with the submersible pump.

[0010] As a preferred embodiment of the utility model, a safety cover is fixedly connected to the right side of the water tank, and the safety cover is used in conjunction with a cooling fan.

[0011] As a preferred embodiment of the present invention, a temperature conducting rod is fixedly connected to the left side of the cooling block, and the number of the temperature conducting rods is several.

[0012] As a preferred embodiment of the present invention, a sealing cover is provided on the top of the water tank, and the sealing cover is used in conjunction with the water tank.

[0013] As a preferred embodiment of the present invention, a handle is fixedly connected to the top of the sealing cover, and the handle is used in conjunction with the sealing cover.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] 1. The utility model starts the semiconductor refrigeration sheet, which cools the cooling block, and then cools the water inside the water tank through the temperature conducting rod and the cooling block, and then dissipates the heat from the semiconductor refrigeration sheet through the heat dissipation block and the heat dissipation fan, and then starts the submersible pump, which flushes the inside of the temperature conducting pipe through the water inlet pipe, and dissipates the heat from the inside of the radiator through the temperature conducting pipe, so as to circulate water and dissipate heat, so that the radiator can achieve excellent heat dissipation effect, replacing the existing method of heat dissipation by air cooling, thereby achieving efficient heat dissipation effect, improving heat dissipation efficiency, and facilitating user use.

[0016] 2. The utility model can protect the submersible pump by setting the filter cover, effectively improving the safety of the submersible pump and facilitating the use of the user. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0018] Figure 2 It is an explosion diagram of the water tank structure of the utility model;

[0019] Figure 3 It is a cross-sectional stereoscopic schematic diagram of the structural water tank of the utility model.

[0020] In the figure: 1. Radiator; 2. Water tank; 3. Cooling assembly; 31. Cooling block; 32. Semiconductor refrigeration plate; 33. Heat dissipation block; 34. Cooling fan; 4. Submersible pump; 5. Temperature conduction pipe; 6. Filter cover; 7. Safety cover; 8. Temperature conduction rod; 9. Sealing cover; 10. Handle. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figures 1 to 3 As shown, the utility model provides a computer radiator, comprising a radiator 1, a water tank 2 is fixedly connected to the top of the radiator 1, and a cooling component 3 is arranged on the right side of the water tank 2;

[0023] The cooling component 3 includes a cooling block 31, which is fixedly connected to the right side of the water tank 2, a semiconductor cooling sheet 32 ​​is fixedly connected to the right side of the cooling block 31, a heat dissipation block 33 is fixedly connected to the right side of the semiconductor cooling sheet 32, and a heat dissipation fan 34 is fixedly connected to the right side of the heat dissipation block 33;

[0024] A submersible pump 4 is provided inside the water tank 2, a temperature conducting pipe 5 is fixedly connected inside the radiator 1, the output end of the submersible pump 4 is connected to one end of the temperature conducting pipe 5 through a water inlet pipe, and the other end of the temperature conducting pipe 5 is connected to the left side of the water tank 2 through a return pipe.

[0025] refer to Figure 2 A filter cover 6 is arranged on the outside of the submersible pump 4 , and the filter cover 6 is used in conjunction with the submersible pump 4 .

[0026] As a technical optimization solution of the present invention, the filter cover 6 is provided to protect the submersible pump 4, thereby effectively improving the safety of the submersible pump 4 and facilitating the use of the submersible pump 4.

[0027] refer to Figure 2 A safety cover 7 is fixedly connected to the right side of the water tank 2 , and the safety cover 7 is used in conjunction with the cooling fan 34 .

[0028] As a technical optimization solution of the present invention, the safety cover 7 is provided to protect the cooling fan 34, thereby improving the safety of the cooling fan 34, avoiding damage to the cooling fan 34, and facilitating use by users.

[0029] refer to Figure 2 A temperature conducting rod 8 is fixedly connected to the left side of the cooling block 31, and the number of the temperature conducting rods 8 is several.

[0030] As a technical optimization solution of the present invention, by setting the temperature conducting rod 8, the heat dissipation of the cooling block 31 can be enhanced, thereby improving the heat dissipation effect of the cooling block 31 and facilitating use by users.

[0031] refer to Figure 1 A sealing cover 9 is provided on the top of the water tank 2, and the sealing cover 9 is used in conjunction with the water tank 2.

[0032] As a technical optimization solution of the present invention, by providing the sealing cover 9, the top of the water tank 2 can be sealed and protected, thereby improving the safety of the water tank 2.

[0033] refer to Figure 1 A handle 10 is fixedly connected to the top of the sealing cover 9, and the handle 10 is used in conjunction with the sealing cover 9.

[0034] As a technical optimization solution of the present invention, the sealing cover 9 can be moved by providing the handle 10 , which makes it convenient to move the sealing cover 9 and improves the convenience of the sealing cover 9 .

[0035] The working principle and use process of the utility model are as follows: when in use, when the user needs to cool down the water inside the water tank 2, the user starts the semiconductor refrigeration sheet 32, the semiconductor refrigeration sheet 32 ​​cools the cooling block 31, and then cools the water inside the water tank 2 through the temperature conducting rod 8 and the cooling block 31, and then the semiconductor refrigeration sheet 32 ​​is cooled by the heat dissipation block 33 and the heat dissipation fan 34, and then the submersible pump 4 is started, and the submersible pump 4 flushes the inside of the temperature conducting pipe 5 through the water inlet pipe, and the inside of the radiator 1 is cooled through the temperature conducting pipe 5, and water circulation and heat dissipation are performed, thereby achieving the effect of improving the heat dissipation.

[0036] In summary: the computer radiator, by arranging the radiator 1, the water tank 2, the cooling component 3, the cooling block 31, the semiconductor refrigeration sheet 32, the heat dissipation block 33, the heat dissipation fan 34, the submersible pump 4 and the temperature conduction tube 5 for coordinated use, solves the problem that the existing radiator uses air cooling for heat dissipation, and when the external ambient temperature is relatively high, the heat dissipation effect is reduced, resulting in the phenomenon of overheating and frequency reduction of the processor, thereby affecting the computer's operating performance.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer radiator, comprising a radiator (1), characterized in that: The top of the radiator (1) is fixedly connected to a water tank (2), and a cooling component (3) is provided on the right side of the water tank (2); The cooling component (3) comprises a cooling block (31), the cooling block (31) being fixedly connected to the right side of the water tank (2), a semiconductor cooling sheet (32) being fixedly connected to the right side of the cooling block (31), a heat dissipation block (33) being fixedly connected to the right side of the semiconductor cooling sheet (32), and a heat dissipation fan (34) being fixedly connected to the right side of the heat dissipation block (33); A submersible pump (4) is arranged inside the water tank (2), a temperature conducting pipe (5) is fixedly connected inside the radiator (1), an output end of the submersible pump (4) is connected to one end of the temperature conducting pipe (5) via a water inlet pipe, and the other end of the temperature conducting pipe (5) is connected to the left side of the water tank (2) via a water return pipe.

2. A computer radiator according to claim 1, characterized in that: A filter cover (6) is provided on the outside of the submersible pump (4), and the filter cover (6) is used in conjunction with the submersible pump (4).

3. A computer radiator according to claim 1, characterized in that: A safety cover (7) is fixedly connected to the right side of the water tank (2), and the safety cover (7) is used in conjunction with a cooling fan (34).

4. A computer radiator according to claim 1, characterized in that: A temperature conducting rod (8) is fixedly connected to the left side of the cooling block (31), and there are a plurality of temperature conducting rods (8).

5. A computer radiator according to claim 1, characterized in that: A sealing cover (9) is provided on the top of the water tank (2), and the sealing cover (9) is used in conjunction with the water tank (2).

6. A computer radiator according to claim 5, characterized in that: A handle (10) is fixedly connected to the top of the sealing cover (9), and the handle (10) is used in conjunction with the sealing cover (9).

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