A sealed relay

Abstract

The utility model discloses a sealed relay, including an electromagnetic relay, the electromagnetic relay including a housing assembly and a plurality of lead pins protruding out of one side of the housing assembly; and also including a potting glue layer located outside the housing assembly, the potting glue layer completely or partially covering a side of the housing assembly where the plurality of lead pins are arranged, the plurality of lead pins respectively including a first section and a second section sequentially distributed along their extension direction, the first section being in the potting glue layer, and the second section being exposed outside the potting glue layer. The utility model can utilize the potting glue layer to effectively seal the gap that may occur between each lead pin and the housing assembly, so that the utility model can achieve the effect of effective sealing in a liquid cooling environment without using a double-layer housing, thereby ensuring that the utility model is small in size and reducing production costs.

Description

Technical Field

[0001] The utility model relates to the technical field of relays, in particular to a sealed relay. Background Art

[0002] With the rapid development of the Internet, the requirements for servers are getting higher and higher, and the power of servers is getting bigger and bigger, and the heat dissipation of servers has become a bottleneck in development. Liquid cooling, that is, using working fluid as the medium for intermediate heat transmission, transfers heat from the hot zone to a distant place for cooling. Since the specific heat of liquid is much greater than that of air, the heat dissipation speed is also much faster than that of air, so the cooling efficiency is much higher than that of air cooling. At the same time, liquid cooling can also be well controlled in terms of noise. Therefore, liquid cooling has become an inevitable trend in server heat dissipation.

[0003] Liquid cooling means immersing the server in liquid, and requires that all components in the server can withstand the test of liquid immersion. As an electronic component in the server, the relay also needs to be immersed in liquid. Since the electromagnetic relay is a mechanical structure moving device, once the liquid enters the inside of the relay, it will affect the action and release time of the relay, thereby affecting the overall response speed and function of the server. Therefore, the relay is required to be sealed and will not be damaged even after long-term immersion.

[0004] Traditional electromagnetic relays use a single-layer shell structure, which has the following disadvantages: During the wave soldering, reflow soldering and other welding processes, the sealant at the junction of the relay lead pin and the relay shell is easily melted by heat, resulting in a small gap, which leads to a poor seal of the relay and easy entry of liquid in a liquid cooling environment. In order to solve this problem, the existing technology mostly uses a double-layer shell combined with glue filling for sealing. This method can certainly achieve a sealing effect in a liquid cooling environment, but it also has the following shortcomings: The double-layer shell structure results in a larger overall volume and higher cost. Utility Model Content

[0005] The utility model aims at the technical problems existing in the prior art and provides a sealed relay which can achieve the effect of effective sealing in a liquid cooling environment without adopting a double-layer housing.

[0006] The utility model solves the technical problem by adopting the following technical solution: a sealed relay, comprising an electromagnetic relay, the electromagnetic relay comprising a housing assembly and a plurality of lead pins protruding out of one side of the housing assembly; and further comprising a potting glue layer located outside the housing assembly, the potting glue layer completely or partially covering a side of the housing assembly where the plurality of lead pins are arranged, the plurality of lead pins respectively comprising a first section and a second section sequentially distributed along their extension direction, the first section being in the potting glue layer, and the second section being exposed outside the potting glue layer.

[0007] Furthermore, the potting glue layer includes a main body layer, the main body layer is outside a side of the shell assembly where the multiple lead pins are arranged, the first sections of the multiple lead pins are respectively located in the main body layer, and the second sections of the multiple lead pins are respectively exposed outside the main body layer.

[0008] Furthermore, the potting glue layer also includes surrounding walls located at the edges of the main layer and extending to one side in the thickness direction of the main layer. The surrounding walls are located outside the four surfaces of the shell assembly adjacent to the surface on which the multiple lead pins are arranged, and fully or partially cover them.

[0009] Furthermore, the shell assembly includes an outer shell with an opening at one end and a cover plate, the cover plate is connected to the end of the outer shell with the opening, the multiple lead pins protrude out of the cover plate respectively, and the gap between the cover plate and the outer shell is covered by the potting glue layer.

[0010] Furthermore, the potting glue layer is formed by pouring potting glue into a potting mold which is sleeved outside the housing assembly and demoulding the mold after solidification. The potting glue mold is provided with through holes corresponding to each lead pin for the lead pin to pass through.

[0011] Furthermore, the glue-potting mold has a bottom wall and surrounding side walls, the bottom wall and the surrounding side walls form a concave cavity, the electromagnetic relay is placed in the concave cavity, and the multiple lead pins respectively pass downward through the corresponding through holes arranged in the bottom wall.

[0012] Furthermore, the multiple lead pins include two coil lead pins, a dynamic spring lead pin and a static spring lead pin.

[0013] Furthermore, the length of the first segment is smaller than the length of the second segment.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. Since the utility model further includes a potting glue layer located outside the shell assembly, the potting glue layer completely or partially covers a side of the shell assembly where the multiple lead pins are arranged, and the multiple lead pins respectively include a first section and a second section distributed in sequence along their extension direction, the first section is in the potting glue layer, and the second section is exposed outside the potting glue layer, so that the utility model can use the potting glue layer to effectively seal the gap that may appear between each lead pin and the shell assembly, so that the utility model does not need to adopt a double-layer shell, and can achieve the effect of effective sealing in a liquid cooling environment, thereby ensuring that the utility model is small in size and reducing production costs.

[0016] 2. Since the potting glue layer also includes surrounding walls located at the edges of the main body layer and extending to one side in the thickness direction of the main body layer, the surrounding walls are located outside the four surfaces of the shell assembly adjacent to the surface on which the multiple lead pins are arranged, and fully or partially cover the shell assembly, so that the contact area between the potting glue layer and the shell assembly is larger, and the two are more firmly and tightly matched, thereby preventing the potting glue layer from falling off.

[0017] 3. The housing assembly includes a shell with an opening at one end and a cover plate, the cover plate is connected to the end of the shell with the opening, the multiple lead pins protrude out of the cover plate respectively, and the gap between the cover plate and the shell is covered by the potting glue layer, so that the utility model can also use the potting glue layer to seal the gap between the cover plate and the shell, thereby eliminating the need for additional glue sealing between the cover plate and the shell, thereby simplifying the production steps of the relay and improving production efficiency.

[0018] 4. The potting glue layer is formed by pouring the potting glue into a potting mold which is sleeved outside the housing assembly and demoulding the mold after solidification, so that the molding process of the potting glue layer is relatively simple and easy to process.

[0019] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments; however, the sealed relay of the utility model is not limited to the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0021] Figure 2 It is a cross-sectional view of the utility model;

[0022] Figure 3 It is a schematic diagram of the cooperation between the electromagnetic relay and the glue-filling mold of the utility model;

[0023] In the figure, 1, electromagnetic relay, 11, housing assembly, 12, lead pins, 121, first section, 122, second section, 2, potting glue layer, 21, main body layer, 22, surrounding walls, 3, potting mold, 31, cavity. DETAILED DESCRIPTION

[0024] In the present utility model, the terms "first", "second", etc. are only used to distinguish similar objects, rather than to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance. In the description, the orientation or position relationship indicated by "upper", "lower", "inner", "outer", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present utility model, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present utility model. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, in the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0025] See also Figure 1-Figure 3 As shown, a sealed relay of the utility model includes an electromagnetic relay 1, which includes a housing assembly 11 and a plurality of lead pins 12 protruding from one side of the housing assembly 11. The utility model also includes a potting glue layer 2 located outside the housing assembly 11, and the potting glue layer 2 completely or partially covers a side of the housing assembly 11 where the plurality of lead pins 12 are provided. The plurality of lead pins 12 respectively include a first section 121 and a second section 122 sequentially distributed along the extension direction thereof, the length of the first section 121 is less than the length of the second section 122, the first section 121 is in the potting glue layer 2, and the second section 122 is exposed outside the potting glue layer 2, so as to be connected and matched with an external device (such as a PCB board, etc.). The plurality of lead pins 12 specifically include two coil lead pins 12, one dynamic spring lead pin 12, and one static spring lead pin 12.

[0026] In this embodiment, the encapsulating glue layer 2 includes a main body layer 21, the main body layer 21 is outside the side of the housing assembly 11 where the plurality of lead pins 12 are provided, the first sections 121 of the plurality of lead pins 12 are respectively located in the main body layer 21, and the second sections 122 of the plurality of lead pins 12 are respectively exposed outside the main body layer 21. Specifically, the side of the housing assembly 11 where the plurality of lead pins 12 are provided is at the bottom, and each lead pin 12 extends downward, respectively, so the main body layer 21 is located below the housing assembly 11, but is not limited thereto.

[0027] As a preferred structure, the encapsulation layer 2 also includes surrounding walls 22 located at the edges of the main body layer 21 and extending to one side (i.e., upward direction) in the thickness direction of the main body layer 21. The surrounding walls 22 are located outside the four faces of the shell assembly 11 adjacent to the face on which the multiple lead pins 12 are provided, and fully or partially cover the four faces. Specifically, the surrounding walls 22 of the encapsulation layer 2 partially cover the four faces of the shell assembly 11 adjacent to the face on which the multiple lead pins 12 are provided, and the covering height is less than half of the height of the shell assembly 11, but is not limited thereto. The provision of the surrounding walls 22 increases the contact area between the encapsulation layer 2 and the shell assembly 11, and the fit between the two is more firm and tight, thereby preventing the encapsulation layer 2 from falling off.

[0028] In this embodiment, the housing assembly 11 includes a shell with an opening at one end (not shown in the figure) and a cover plate (not shown in the figure), the cover plate is connected to the end of the shell with the opening, a plurality of lead pins 12 protrude out of the cover plate, and the gap between the cover plate and the shell is covered by the potting glue layer 2. Specifically, the end of the shell with the opening faces downward, and the cover plate is connected to the bottom of the shell, so the gap between the cover plate and the shell is covered by the main layer 21 of the potting glue layer 2. In this way, the utility model can also use the potting glue layer 2 to block the gap between the cover plate and the shell, so that the gap between the cover plate and the shell is free from additional glue sealing, thereby simplifying the production steps of the relay and improving production efficiency.

[0029] The above-mentioned potting glue layer 2 is specifically formed by pouring potting glue into a potting mold 3 which is sleeved outside the housing assembly 11 and demoulding after solidification. The potting mold 3 is provided with through holes for each lead pin 12 to pass through. Specifically, as Figure 3 As shown, the potting mold 3 has a bottom wall and surrounding side walls, and the bottom wall and the surrounding side walls form a concave cavity 31. When processing the potting layer 2, the electromagnetic relay 1 is first placed in the concave cavity 31, and each lead pin 12 is passed downward through the corresponding through holes in the bottom wall, and then the liquid potting mold 3 is poured into the potting mold 3. After the potting mold is cooled and solidified, the potting mold 3 is demoulded to obtain the potting layer 2.

[0030] The utility model is a sealed relay, which adopts a potting glue layer 2 arranged on the outside of the shell assembly 11 to effectively seal the gaps that may appear between each lead pin 12 and the shell assembly 11, so that the utility model does not need to adopt a double-layer shell to achieve the effect of effective sealing in a liquid cooling environment, thereby preventing the volume of the utility model from being too large and also helping to reduce production costs.

[0031] The utility model is a sealed relay, and the uninvolved parts (such as the structure and working principle of the magnetic circuit part and the contact part arranged inside the housing assembly of the electromagnetic relay) are the same as those in the prior art or can be implemented by using the prior art.

[0032] The above embodiments are only used to further illustrate a sealed relay of the utility model, but the utility model is not limited to the embodiments. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model fall within the protection scope of the technical solution of the utility model.

Claims

1. A sealed relay, comprising an electromagnetic relay, the electromagnetic relay comprising a housing assembly and a plurality of lead pins protruding out of one side of the housing assembly; characterized in that: It also includes a potting glue layer located outside the shell assembly, which fully or partially covers a side of the shell assembly where the multiple lead pins are set, and the multiple lead pins respectively include a first section and a second section distributed in sequence along their extension direction, the first section is in the potting glue layer, and the second section is exposed outside the potting glue layer; the first section and the second section are located on the same side of the shell assembly.

2. The sealed relay according to claim 1, characterized in that: The potting glue layer includes a main body layer, which is located outside a side of the shell assembly where the plurality of lead pins are arranged, the first sections of the plurality of lead pins are respectively located in the main body layer, and the second sections of the plurality of lead pins are respectively exposed outside the main body layer.

3. The sealed relay according to claim 2, characterized in that: The potting glue layer also includes surrounding walls located at the edges of the main body layer and extending to one side in the thickness direction of the main body layer. The surrounding walls are located outside the four surfaces of the shell assembly adjacent to a surface on which the multiple lead pins are arranged, and fully or partially cover the shell assembly.

4. The sealed relay according to any one of claims 1 to 3, characterized in that: The shell assembly includes a shell with an opening at one end and a cover plate, the cover plate is connected to the end of the shell with the opening, the multiple lead pins protrude out of the cover plate respectively, and the gap between the cover plate and the shell is covered by the potting glue layer.

5. The sealed relay according to any one of claims 1 to 3, characterized in that: The potting glue layer is formed by pouring potting glue into a potting mold sleeved outside the housing assembly and demoulding after solidification. The potting glue mold is provided with through holes corresponding to each lead pin for the lead pin to pass through.

6. The sealed relay according to claim 5, characterized in that: The glue-filling mold has a bottom wall and surrounding side walls, the bottom wall and the surrounding side walls form a concave cavity, the electromagnetic relay is placed in the concave cavity, and the multiple lead pins respectively pass downward through the corresponding through holes arranged on the bottom wall.

7. The sealed relay according to claim 1, characterized in that: The multiple lead pins include two coil lead pins, a dynamic spring lead pin and a static spring lead pin.

8. The sealed relay according to claim 1, characterized in that: The length of the first segment is smaller than the length of the second segment.

Images