Silicon wafer blanking device and silicon wafer blanking circulation system
By designing the cutting device of the silicon wafer, the coordinated work of the stage, bracket, hoisting mechanism and translation mechanism is used to solve the problem of complex flow process of the silicon wafer and the reliance on manpower, and efficient flow from direct cutting to the production link of the battery cell is achieved, which improves production efficiency and reduces resource waste.
Patent Information
- Application Number
- CN202420494304.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-03-13
AI Technical Summary
In the prior art, the silicon wafer flow process is complex and relies on a large amount of manpower to operate, resulting in waste of resources and low production efficiency.
A silicon wafer cutting device is designed, including a stage, a bracket, a hoisting mechanism and a translation mechanism. Through the coordinated work of these components, the silicon wafer is directly discharged from the silicon wafer production link to the material support in the battery cell production link.
It reduces complex operations during the silicon wafer flow process, eliminates steps such as packaging, circulation and unpacking, improves production efficiency, and reduces personnel redundancy and material waste.
Smart Images
Figure CN222720367U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the photovoltaic field, in particular to a silicon wafer unloading device and a silicon wafer unloading circulation system. Background Art
[0002] In the photovoltaic industry, there are two links: silicon wafer production and battery cell production. Silicon wafer production refers to the process of cutting silicon rods into silicon wafers, while battery cell production refers to the process of processing silicon wafers into battery cells.
[0003] At present, after obtaining silicon wafers in the silicon wafer production link, they can be manually bagged, boxed, packed, labeled, wrapped with protective film, put into storage, shipped out of storage, and transported, so that the packaged silicon wafers are transported to the battery cell production site. After that, the battery cell production link manually performs unpacking, information verification, inspection, basket insertion and other operations in sequence, thus starting the battery cell production.
[0004] The existing technology has at least the following problems: multiple steps of operation between the two links require human resources, which makes the silicon wafer circulation process complicated and highly dependent on human resources. Utility Model Content
[0005] The utility model provides a silicon wafer unloading device to solve the problems in the prior art.
[0006] In order to solve the above problems, the utility model is achieved as follows:
[0007] In a first aspect, the utility model provides a silicon wafer unloading device, the silicon wafer unloading device comprising:
[0008] A carrier, a bracket arranged on the carrying surface of the carrier, and a lifting mechanism and a translation mechanism arranged on the carrying surface of the carrier;
[0009] The bracket is provided with a material discharge opening, and the lifting mechanism is arranged at a projection position of the material discharge opening on the bearing surface of the carrier; the material discharge opening is used to receive the silicon wafer; the lifting mechanism is used to move in a direction perpendicular to the bearing surface of the carrier;
[0010] The translation mechanism is used to move in a direction parallel to the bearing surface of the platform, and the translation mechanism includes two working states: an extended working state and a retracted working state;
[0011] In the retracting condition, the orthographic projection of the translation mechanism on the carrying surface overlaps with the orthographic projection of the lifting mechanism on the carrying surface, and the translation mechanism provides an empty tray to the lifting mechanism, or receives a tray carrying the silicon wafer;
[0012] During the process from the retracted working state to the extended working state, the translation mechanism carries the material tray.
[0013] Optionally, the silicon wafer unloading device further comprises: a tidying mechanism;
[0014] The aligning mechanism comprises: a plurality of aligning cylinders arranged along the edge of the blanking opening, and a guide block connected to each of the aligning cylinders.
[0015] Optionally, the blanking opening is a rectangular opening;
[0016] The regularizing cylinders are respectively arranged at the midpoints of the four sides of the blanking opening, and each of the regularizing cylinders is connected to 1-2 guide blocks.
[0017] Optionally, a plurality of columns are arranged on the bottom plate of the tray, and the space enclosed by the bottom plate of the tray and the plurality of columns is used to accommodate the silicon wafer;
[0018] An inclined guide surface is arranged at one end of the guide block away from the carrier; the inclination angle of the guide surface is 30 degrees.
[0019] Optionally, the regular cylinder is connected to the bracket via an L-shaped support frame;
[0020] The L-shaped support frame includes an adjustment plate connected to the bracket, and a mounting plate connected to the regular cylinder;
[0021] The adjusting plate is provided with a strip hole, and a bolt passes through the strip hole to be connected with the bracket, so that the relative position of the adjusting plate and the bracket can be adjusted.
[0022] Optionally, the translation mechanism includes a translation track, a slider and a material support bearing plate;
[0023] The translation track is arranged on the platform along a direction parallel to the bearing surface of the platform, the material tray bearing plate is parallel to the bearing surface of the platform, and the material tray bearing plate is installed on the translation track through the slider, and the material tray bearing plate is provided with a hollow opening for the jacking mechanism to pass through.
[0024] Optionally, the lifting mechanism comprises: a telescopic member and a top plate arranged at the end of the telescopic member;
[0025] A clamping groove is provided on a side of the material tray away from the silicon wafer bearing surface; a clamping block matching the clamping groove is provided on a side of the top plate used for bearing the material tray;
[0026] A buffer pad is also provided on one side of the top plate for supporting the material tray.
[0027] In a second aspect, the utility model provides a silicon wafer unloading and circulation system, the system comprising:
[0028] A first transmission device, a second transmission device, and a silicon wafer unloading device;
[0029] The first transmission device has a transmission surface, and the transmission surface of the first transmission device is used to transmit silicon wafers;
[0030] The second conveying device includes a movable adsorption component, one end of which is connected to the discharge port of the first conveying device, and the other end of the second conveying device is aligned with the unloading opening of the unloading device for the silicon wafer; the adsorption component is used to grab the silicon wafer transmitted by the first conveying device and transport the silicon wafer to the unloading opening.
[0031] Optionally, when the lifting mechanism of the silicon wafer unloading device is lifted to the unloading position, a preset distance is spaced between the lifting mechanism and the target silicon wafer, and the target silicon wafer is the silicon wafer carried by the adsorption member aligned with the unloading opening;
[0032] The preset distance is 0.3-0.5 mm.
[0033] Optionally, the system further comprises: a mechanical gripper;
[0034] The mechanical gripper is used to grab the material tray;
[0035] A transmission direction of the first transmission device is perpendicular to a transmission direction of the second transmission device.
[0036] In the utility model, the translation mechanism of the silicon wafer unloading device can facilitate the unloading of the tray filled with silicon wafers from the translation mechanism when it is extended, and facilitate the placement of a new empty tray on the translation mechanism again. When the translation mechanism is in the retracted state, the translation mechanism and the lifting mechanism overlap in a top-down perspective, and the operation of unloading silicon wafers into an empty tray can be achieved with the cooperation of the translation mechanism and the lifting mechanism. Based on the use of the silicon wafer unloading device, the silicon wafer packaging, circulation, unpacking and other operations between the silicon wafer production link and the battery cell production link in the related technology can be omitted. Instead, the silicon wafer unloading device is used to directly unload the silicon wafers obtained in the silicon wafer production link into the tray used in the battery cell production link, thereby eliminating a large amount of redundant personnel and material waste, reducing the complex operations in the circulation process, and improving the overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments of the utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0038] Figure 1 This is a schematic structural diagram of a silicon wafer unloading device according to an embodiment of the utility model;
[0039] Figure 2 This is a structural schematic diagram of a material tray according to an embodiment of the utility model;
[0040] Figure 3 A side view of a silicon wafer unloading device according to an embodiment of the utility model;
[0041] Figure 4 A top view of a silicon wafer unloading device according to an embodiment of the utility model;
[0042] Figure 5 It is a partial structure enlarged schematic diagram of a silicon wafer unloading device according to an embodiment of the utility model;
[0043] Figure 6 This is a schematic structural diagram of a material tray and a top plate according to an embodiment of the utility model;
[0044] Figure 7 A schematic diagram of a silicon wafer unloading and circulation system according to an embodiment of the utility model
[0045] Figure 8 This is a schematic diagram of the structure of a mechanical gripper according to an embodiment of the utility model;
[0046] Fig. 9 The figure is a schematic diagram of the movement of another mechanical gripper according to an embodiment of the utility model. DETAILED DESCRIPTION
[0047] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can also be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.
[0048] Reference Figure 1The present invention provides a schematic structural diagram of a silicon wafer unloading device, wherein the silicon wafer unloading device comprises: a carrier 10, a bracket 20 arranged on a bearing surface M of the carrier 10, a lifting mechanism 30 and a translation mechanism 40 arranged on the bearing surface M of the carrier 10; a unloading opening 21 is arranged on the bracket 20, and the lifting mechanism 30 is arranged at a projection position of the unloading opening 21 on the bearing surface M of the carrier 10; the unloading opening 21 is used to receive silicon wafers; the lifting mechanism 30 is used to move in a direction X perpendicular to the bearing surface M of the carrier 10; the translation mechanism 40 is used to move in a direction Y parallel to the bearing surface M of the carrier 10, and the translation mechanism 40 includes an extending working condition and a retracting working condition ( Figure 1 In the figure, two working states are shown: the extending working state and the retracting working state. In the retracting working state, the orthographic projection of the translation mechanism 40 on the bearing surface M overlaps with the orthographic projection of the lifting mechanism 30 on the bearing surface M. The translation mechanism 40 provides an empty tray 50 to the lifting mechanism 30, or receives the tray 50 carrying silicon wafers. In the process from the retracting working state to the extending working state, the translation mechanism 40 carries the tray 50.
[0049] In the overall production process of solar cells, there are two links, namely silicon wafer production and cell production. The silicon wafer production link is the process of cutting silicon rods to obtain silicon wafers, while the cell production link is the process of processing silicon wafers to generate cell wafers. In the embodiment of the utility model, the two production links of silicon wafer production and cell production can be concentrated in the same site, and the operations of silicon wafer packaging, circulation, unpacking, etc. between the silicon wafer production link and the cell production link in the related technology are omitted. Instead, the silicon wafer unloading device is used to directly unload the silicon wafers obtained in the silicon wafer production link into the material tray used in the cell production link, thereby eliminating a large amount of redundant personnel and material waste, while improving production efficiency and reducing secondary damage to silicon wafers during the circulation process.
[0050] The embodiment of the utility model can directly feed the silicon wafers obtained in the silicon wafer production process to the material tray 50, referring to Figure 2 The structure of the tray 50 includes a bottom plate 51 and a plurality of columns 52 arranged on the bottom plate 51. The space enclosed by the bottom plate 51 and the plurality of columns 52 is used to accommodate silicon wafers. The embodiment of the utility model directly feeds silicon wafers into the tray 50, so that the silicon wafers in the tray can be directly processed by inserting a basket, making a texture, etc. in the subsequent battery cell production process.
[0051] Specifically, the unloading device for silicon wafers is composed of a carrier 10, a bracket 20 arranged on the carrier 10, a lifting mechanism 30 and a translation mechanism 40 arranged on the carrier 10, wherein the translation mechanism 40 is used to move along a direction Y parallel to the bearing surface of the carrier 10, thereby realizing the extension working condition and the retraction working condition. Figure 1In the extended working condition, the translation mechanism 40 extends from the carrier 10 and the bracket 20, and there is no other structure interference around the translation mechanism 40. The translation mechanism 40 can be in a fully extended extended working condition when carrying the tray 50 full of silicon wafers. In the extended working condition, it is convenient to unload the tray 50 full of silicon wafers from the translation mechanism 40, and to place a new empty tray 50 on the translation mechanism 40 again.
[0052] Further references Figure 3 When the translation mechanism 40 is in the retracted state, the positions of the translation mechanism 40 and the lifting mechanism 30 overlap (in the top view), and the operation of unloading silicon wafers into the empty tray 50 can be realized with the cooperation of the translation mechanism 40 and the lifting mechanism 30. Specifically, in the retracted state, since the positions of the translation mechanism 40 and the lifting mechanism 30 overlap in the top view, the lifting mechanism 30 can be lifted along the direction X perpendicular to the carrier 10, and the empty tray 50 carried by the translation mechanism 40 can be lifted through the hollow opening provided on the tray bearing plate 42 of the translation mechanism 40, and the height of the empty tray 50 is continuously raised until the empty tray 50 is lifted to the position of the unloading opening 21 on the bracket 20, at which time the empty tray 50 carried by the lifting mechanism 30 is in the state of waiting for unloading, and the silicon wafers produced in the silicon wafer production process can fall into the empty tray 50 through the unloading opening 21 to realize unloading. During the entire unloading process, the translation mechanism 40 remains stationary. After the unloading is completed, the lifting mechanism 30 descends along the direction X to the height of the translation mechanism 40. At this time, the material tray 50 filled with silicon wafers falls into the translation mechanism 40. The translation mechanism 40 can be transformed from the retracted working state to the extended working state, so that the material tray 50 filled with silicon wafers can be unloaded in the extended working state.
[0053] It should be noted that, after each loading of a number of silicon wafers (e.g., 3-7 wafers) onto the tray 50, the lifting mechanism 30 can be lowered along the direction X to lower the height of the tray 50 (reduce the overall thickness of the 3-7 stacked silicon wafers), so that the height of the plane in the tray 50 for receiving new silicon wafers and the height of the loading opening 21 always maintain a suitable relative position relationship, so as to ensure that the silicon wafers dropped from the loading opening 21 have a suitable falling height.
[0054] In the utility model, the translation mechanism of the silicon wafer unloading device can facilitate the unloading of the tray filled with silicon wafers from the translation mechanism when it is extended, and facilitate the placement of a new empty tray on the translation mechanism again. When the translation mechanism is in the retracted state, the translation mechanism and the lifting mechanism overlap in a top-down perspective, and the operation of unloading silicon wafers into an empty tray can be achieved with the cooperation of the translation mechanism and the lifting mechanism. Based on the use of the silicon wafer unloading device, the silicon wafer packaging, circulation, unpacking and other operations between the silicon wafer production link and the battery cell production link in the related technology can be omitted. Instead, the silicon wafer unloading device is used to directly unload the silicon wafers obtained in the silicon wafer production link into the tray used in the battery cell production link, thereby eliminating a large amount of redundant personnel and material waste, reducing the complex operations in the circulation process, and improving the overall production efficiency.
[0055] Optional, see Figure 1 The silicon wafer unloading device also includes: a tidying mechanism 60; the tidying mechanism 60 includes: a plurality of tidying cylinders 61 arranged along the edge of the unloading opening 21, and a guide block 62 connected to each tidying cylinder 61; when the lifting mechanism 30 carries the material tray 50 and rises to the position of the unloading opening 21, and the material tray 21 contains at least part of the silicon wafers, the tidying cylinder 61 is used to drive the guide block 62 to move toward the inner side of the unloading opening 21 to tidy at least part of the silicon wafers, and drive the guide block 62 to reset after tidying.
[0056] When the silicon wafer falls from the discharge opening 21 into the tray 50 , due to a certain falling height, the silicon wafer may fall with a certain deviation due to interference from other factors (such as equipment vibration, collision, etc.), resulting in irregular position of the silicon wafer carried by the tray 50 .
[0057] In the embodiment of the utility model, a regularization mechanism 60 can be arranged at the edge of the material opening 21. Specifically, when the material tray 50 carries a plurality of (such as 3-7) silicon wafers, the guide block 62 connected to the regularization cylinder 61 is driven to move toward the inner side of the material opening 21 so that the guide block 62 contacts the side of the silicon wafer carried by the material tray 50 and regularizes the position of the silicon wafer carried by the material tray 50. After the regularization is completed, the guide block 62 is reset under the drive of the regularization cylinder 61 and waits for the next regularization.
[0058] It should be noted that after each several pieces (such as 3-7 pieces) of silicon wafers are unloaded into the material tray 50, the silicon wafers can be firstly untied by the untied mechanism 80, and then the lifting mechanism 30 is controlled to descend along the direction X to lower the height of the material tray 50, thereby ensuring that the silicon wafers that fall from the unloading opening 21 subsequently have a suitable falling height.
[0059] Optional, see Figure 4The material discharge opening 21 is a rectangular opening; regular cylinders 61 are respectively arranged at the midpoints of the four sides of the material discharge opening 21, and each regular cylinder 61 is connected to 1-2 guide blocks 62.
[0060] In the embodiment of the utility model, based on the rectangular structure of the silicon wafer, the unloading opening 21 can be designed as a rectangular opening, and the regularization operation can be specifically performed by the guide blocks 62 pushing the silicon wafer inward from the four side directions of the silicon wafer to achieve regularization. Therefore, the embodiment of the utility model can respectively set regularization cylinders 61 at the midpoint positions of the four sides of the unloading opening 21, and each regularization cylinder 61 is connected to 1-2 guide blocks 62; wherein, in the case where the regularization cylinder 61 is connected to two guide blocks 62, the two guide blocks 62 are symmetrically distributed relative to the connected regularization cylinders 61. When the regularization mechanism is working, the four regularization cylinders 61 can simultaneously drive the guide blocks 62 to move, so as to regularize the several stacked silicon wafers received by the material tray 50.
[0061] Optional, see Figure 2 and Figure 4 , a plurality of columns 52 are arranged on the bottom plate 51 of the tray 50, and the space enclosed by the bottom plate 51 of the tray 50 and the plurality of columns 52 is used to accommodate silicon wafers; in a top view, when the lifting mechanism 30 carries the tray 50, the first area enclosed by all the guide blocks 62 coincides with the second area enclosed by all the columns 52 on the tray; further refer to Figure 5 An inclined guide surface 621 is provided at one end of the guide block 62 away from the carrier 10; the guide surface 621 is used to contact the edge of the silicon wafer; and the inclination angle of the guide surface 621 is 30 degrees.
[0062] In the embodiment of the utility model, the columns 52 arranged on the bottom plate 51 of the material tray 50 are used to limit the horizontal displacement of the silicon wafer carried by the bottom plate 51, so that the silicon wafer can be fixedly stored in the space surrounded by the bottom plate 51 and the plurality of columns 52, so as to realize the carrying of the silicon wafer by the material tray 50. Further, in a top-down perspective, when the lifting mechanism 30 carries the material tray 50, the first area surrounded by all the guide blocks 62 coincides with the second area surrounded by all the columns 52 on the material tray, so that when the silicon wafer falls from the unloading opening 21, the guide block 62 can further play a guiding role, that is, under the guiding action of the guide block 62, the silicon wafer falls vertically from the first area to the second area, ensuring the precise falling of the silicon wafer. In addition, the inclined guide surface 621 set at one end of the guide block 62 can also further improve the guiding effect and reduce the probability of the edge of the silicon wafer being damaged by collision.
[0063] In addition, the guide block may be made of a soft and flexible material, such as silicone, rubber, etc. A buffer layer of a flexible material may be attached to the guide surface 621 to further provide a buffering and protective effect on the unloaded silicon wafers.
[0064] Optional, see Figure 1 The regular cylinder 61 is connected to the bracket 20 through an L-shaped support frame 70; the L-shaped support frame 70 includes an adjustment plate 71 connected to the bracket, and a mounting plate 72 connected to the regular cylinder 61; a strip hole 711 is provided on the adjustment plate 71, and a bolt passes through the strip hole 711 to be connected to the bracket 20, so that the relative position of the adjustment plate 71 and the bracket 20 can be adjusted.
[0065] In the embodiment of the utility model, the L-shaped support frame 70 can realize the function of adjusting the position of the regular cylinder 61 on the basis of connecting the regular cylinder 61 with the bracket 20. Specifically, by changing the position of the bolt in the strip hole 711, the position of the regular cylinder 61 can be adjusted, so that the guiding and regularizing operation of the guide block 62 connected to the regular cylinder 61 is more accurate.
[0066] Optional, see Figure 1 The translation mechanism 40 includes a translation track 41, a slider (not shown in the figure) and a material tray bearing plate 42; the translation track 41 is arranged on the platform 10 along a direction Y parallel to the bearing surface M of the platform 10, the material tray bearing plate 42 is parallel to the bearing surface M of the platform 10, and the material tray bearing plate 42 is installed on the translation track 41 through the slider, and a hollow opening is provided on the material tray bearing plate 42 for the jacking mechanism 30 to pass through.
[0067] In the embodiment of the utility model, the translation mechanism 40 realizes the support of the material tray 50 through the material tray support plate 42, and realizes the movement of the material tray support plate 42 on the platform 10 along the direction Y through the cooperation of the material tray support plate 42, the slider and the translation track 41. This translation method is stable and accurate. In addition, when the translation mechanism 40 is in the retracted working condition, since the positions of the translation mechanism 40 and the lifting mechanism 30 overlap in the top view, the lifting mechanism 30 can be lifted along the direction X perpendicular to the platform 10, and the empty material tray 50 carried by the translation mechanism 40 can be lifted up through the hollow opening set on the material tray support plate 42 of the translation mechanism 40 to unload the silicon wafer. Among them, the translation mechanism 40 as a whole can be driven by components such as cylinders, hydraulic cylinders, and servo electric cylinders.
[0068] Optional, see Figure 1 The lifting mechanism 30 includes: a telescopic member 31 and a top plate 32 disposed at the end of the telescopic member 31; further referring to Figure 6 The side of the tray 50 facing away from the wafer bearing surface is provided with a clamping groove 51; the side of the top plate 32 used for carrying the tray 50 is provided with a clamping block 321 matching the clamping groove 51; Figure 4 A buffer pad 322 is also provided on one side of the top plate 32 for supporting the material tray 50 .
[0069] In the embodiment of the utility model, the lifting mechanism 30 realizes the lifting and lowering along the direction X through the telescopic member 31, and the telescopic member 31 can be driven by a mechanism such as a cylinder, a hydraulic cylinder, a driving motor, etc. The top plate 32 of the lifting mechanism 30 is used to carry the material tray 50, and the buffer pad 322 (flexible materials such as rubber, silicone, cotton, etc.) provided on the top plate 32 can reduce the rigid stress between the material tray 50 and the top plate 32, and improve the stability of the top plate 32 carrying the material tray 50. In addition, the clamping groove 51 provided on the side of the material tray 50 away from the silicon wafer bearing surface and the clamping block 321 corresponding to the top plate 32 can realize the limiting fixation of the material tray 50 by the top plate 32, thereby further improving the stability of the top plate 32 carrying the material tray 50. It should be noted that, in another case, the clamping block 321 can also be provided on the side of the material tray 50 away from the silicon wafer bearing surface, and the clamping groove 51 can be provided on the side of the top plate 32 used to carry the material tray 50.
[0070] Reference Figure 7 The embodiment of the utility model provides a silicon wafer unloading and circulation system, the system comprises: a first transmission device 80, a second transmission device 90, and Figure 1 The silicon wafer unloading device shown in the figure; the first transmission device 80 has a transmission surface A, and the transmission surface A of the first transmission device 80 is used to transmit the silicon wafer B; the second transmission device 90 includes a movable suction member 91, one end of the second transmission device 90 is connected to the discharge port of the first transmission device 80, and the other end of the second transmission device 90 is aligned with the unloading opening 21 of the silicon wafer unloading device; the suction member 91 is used to grab the silicon wafer B transmitted by the first transmission device 80, and transport the silicon wafer B to the unloading opening 21.
[0071] In an embodiment of the utility model, the first transmission device 80 can be connected to a silicon wafer sorter in the silicon wafer production process. After analyzing and testing the silicon wafers cut from the silicon rods, the silicon wafer sorter outputs the silicon wafers B that meet the quality requirements to the transmission surface A of the first transmission device 80 for transmission. In one case, the first transmission device 80 can use a conveyor belt for transmission. When the silicon wafer B is transmitted to the discharge port of the first transmission device 80, the suction member 91 of the second transmission device 90 can grab the silicon wafer B and move it until it moves to align with the unloading opening 21 of the unloading device of the silicon wafer, and then put the silicon wafer B into the unloading opening 21, and the silicon wafer B further falls into the material tray carried by the lifting device to realize unloading. In one case, the suction member 91 can use a bar-shaped Bernoulli suction cup to achieve the adsorption of the silicon wafer by vacuum adsorption.
[0072] Optionally, when the lifting mechanism of the silicon wafer unloading device is lifted to the unloading position, a preset distance is provided between the lifting mechanism and the target silicon wafer, and the target silicon wafer is the silicon wafer carried by the adsorption member aligned with the unloading opening; the preset distance is 0.3-0.5 mm.
[0073] In an embodiment of the utility model, when feeding for the first time, the lifting mechanism is lifted so that the surface of the material tray carried by the lifting mechanism is spaced a preset distance from the target silicon wafer. After each time a number of silicon wafers (such as 3-7 wafers) are unloaded onto the material tray, the lifting mechanism can be lowered to lower the height of the material tray (reduce the overall thickness of the 3-7 stacked silicon wafers), so that the height difference between the plane in the material tray for receiving the new silicon wafer and the target silicon wafer always maintains a preset distance, so as to ensure that the silicon wafers falling from the unloading opening have a suitable falling height.
[0074] Optional, see Figure 7 , Figure 8 and Fig. 9 The system also includes: a mechanical gripper 92; the mechanical gripper 92 is used to grab the material tray; the transmission direction of the first transmission device is perpendicular to the transmission direction of the second transmission device.
[0075] In an embodiment of the utility model, a mechanical gripper 92 may be arranged in the site of the silicon wafer unloading flow system. In addition, the site may be divided into a full tray storage area C and an empty tray storage area D. The mechanical gripper 92 may be driven by a multi-directional drive motor to achieve movement in directions X, Y, and Z.
[0076] Specifically, refer to Figure 2 , handles 53 are respectively provided on the opposite sides of the tray 50, and the mechanical gripper 92 can grasp the tray 50 by clamping the handles 53. The mechanical gripper 92 moves along the direction X to grasp the tray from the translation mechanism and raise the height of the tray, and to place the empty tray on the translation mechanism. The mechanical gripper 92 moves along the direction Y to transport the tray. If the mechanical gripper 92 moves along the direction Y (moving to the right in the figure), the tray grasped from the translation mechanism can be transported to a position between the full tray storage area C and the empty tray storage area D, and then the mechanical gripper 92 moves along the direction Z (moving upward in the figure), and the full tray can be stored in the full tray storage area C. Afterwards, the mechanical gripper 92 moves along direction Z (downward in the figure), and moves to the empty tray storage area D. After grabbing the empty tray, the mechanical gripper 92 moves along direction Z (upward in the figure). When the mechanical gripper 92 moves to a position between the full tray storage area C and the empty tray storage area D, the mechanical gripper 92 further moves along direction Y (left in the figure), and the mechanical gripper 92 can transport the empty tray to the translation mechanism.
[0077] In summary, in the utility model, the translation mechanism of the silicon wafer unloading device can facilitate the unloading of the tray full of silicon wafers from the translation mechanism when it is in the extended working condition, and facilitate the placement of a new empty tray on the translation mechanism again. When the translation mechanism is in the retracted working condition, the translation mechanism and the lifting mechanism overlap in the top-down perspective, and the operation of unloading silicon wafers into the empty tray can be realized with the cooperation of the translation mechanism and the lifting mechanism. Based on the use of the silicon wafer unloading device, the silicon wafer packaging, circulation, unpacking and other operations between the silicon wafer production link and the battery cell production link in the related technology can be omitted. Instead, the silicon wafer unloading device is used to directly unload the silicon wafers obtained in the silicon wafer production link into the tray used in the battery cell production link, thereby eliminating a large amount of redundant personnel and material waste, while reducing the complex operations in the circulation process and improving the overall production efficiency.
[0078] The terms "first", "second", etc. in the specification and claims of the present utility model are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the present utility model can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more.
[0079] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0080] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims
1. A silicon wafer unloading device, characterized in that: The silicon wafer unloading device comprises: A carrier, a bracket arranged on the carrying surface of the carrier, and a lifting mechanism and a translation mechanism arranged on the carrying surface of the carrier; The bracket is provided with a material discharge opening, and the lifting mechanism is arranged at a projection position of the material discharge opening on the bearing surface of the carrier; the material discharge opening is used to receive the silicon wafer; the lifting mechanism is used to move in a direction perpendicular to the bearing surface of the carrier; The translation mechanism is used to move in a direction parallel to the bearing surface of the platform, and the translation mechanism includes two working states: an extended working state and a retracted working state; In the retracting condition, the orthographic projection of the translation mechanism on the carrying surface overlaps with the orthographic projection of the lifting mechanism on the carrying surface, and the translation mechanism provides an empty tray to the lifting mechanism, or receives a tray carrying the silicon wafer; During the process from the retracted working state to the extended working state, the translation mechanism carries the material tray.
2. The silicon wafer unloading device according to claim 1, characterized in that: The silicon wafer unloading device further comprises: a tidying mechanism; The tidying mechanism comprises: a plurality of tidying cylinders arranged along the edge of the blanking opening, and a guide block connected to each of the tidying cylinders.
3. The silicon wafer unloading device according to claim 2, characterized in that: The blanking opening is a rectangular opening; The regularizing cylinders are respectively arranged at the midpoints of the four sides of the blanking opening, and each of the regularizing cylinders is connected to 1-2 guide blocks.
4. The silicon wafer unloading device according to claim 3, characterized in that: A plurality of columns are arranged on the bottom plate of the tray, and the space enclosed by the bottom plate of the tray and the plurality of columns is used to accommodate the silicon wafer; An inclined guide surface is arranged at one end of the guide block away from the carrier; the inclination angle of the guide surface is 30 degrees.
5. The silicon wafer unloading device according to claim 2, characterized in that: The regular cylinder is connected to the bracket via an L-shaped support frame; The L-shaped support frame includes an adjustment plate connected to the bracket, and a mounting plate connected to the regular cylinder; The adjusting plate is provided with a strip hole, and a bolt passes through the strip hole to be connected with the bracket, so that the relative position of the adjusting plate and the bracket can be adjusted.
6. The silicon wafer unloading device according to claim 1, characterized in that: The translation mechanism includes a translation track, a slider and a material support bearing plate; The translation track is arranged on the platform along a direction parallel to the bearing surface of the platform, the material tray bearing plate is parallel to the bearing surface of the platform, and the material tray bearing plate is installed on the translation track through the slider, and the material tray bearing plate is provided with a hollow opening for the jacking mechanism to pass through.
7. The silicon wafer unloading device according to claim 1, characterized in that: The lifting mechanism comprises: a telescopic member and a top plate arranged at the end of the telescopic member; A clamping groove is provided on a side of the material tray away from the silicon wafer bearing surface; a clamping block matching the clamping groove is provided on a side of the top plate used for bearing the material tray; A buffer pad is also provided on one side of the top plate for supporting the material tray.
8. A silicon wafer unloading and circulation system, characterized in that: The system comprises: A first transmission device, a second transmission device, and a silicon wafer unloading device as claimed in any one of claims 1 to 7; The first transmission device has a transmission surface, and the transmission surface of the first transmission device is used to transmit silicon wafers; The second conveying device includes a movable adsorption component, one end of which is connected to the discharge port of the first conveying device, and the other end of the second conveying device is aligned with the unloading opening of the unloading device for the silicon wafer; the adsorption component is used to grab the silicon wafer transmitted by the first conveying device and transport the silicon wafer to the unloading opening.
9. The system according to claim 8, characterized in that When the lifting mechanism of the silicon wafer unloading device is lifted to the unloading position, a preset distance is provided between the lifting mechanism and the target silicon wafer, and the target silicon wafer is the silicon wafer carried by the adsorption member aligned with the unloading opening; The preset distance is 0.3-0.5 mm.
10. The system according to claim 8, characterized in that The system also includes: a mechanical gripper; The mechanical gripper is used to grab the material tray; A transmission direction of the first transmission device is perpendicular to a transmission direction of the second transmission device.