Semiconductor wafer film pasting platform deck

Abstract

The utility model discloses a semiconductor wafer film pasting platform deck which comprises an outer frame, an adjusting mechanism capable of adjusting the size of a wafer bearing surface is arranged in the outer frame, and an adsorption mechanism used for preventing a wafer from moving is arranged at the lower end of the adjusting mechanism. The platform deck is simple in structure and reasonable in design, the bearing area of the platform deck can be adjusted according to the size of wafers through the rotating disc driven by the motor and the matched movable bearing module, adaptation to the wafers of different sizes is achieved, and the flexibility and the production efficiency of equipment are improved. The adsorption mechanism uniformly distributes negative pressure to the adsorption hose through the main pipeline, so that the flatness of the wafer in the film pasting process is ensured, local deformation is effectively prevented, the film pasting quality is ensured, and the design not only optimizes the wafer processing flow, but also brings higher efficiency and better product quality to the semiconductor manufacturing industry.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a semiconductor wafer film mounting platform. Background Art

[0002] In today's rapidly developing semiconductor industry, wafers are the basic carriers of integrated circuit manufacturing. The precision and efficiency of their production process directly affect the performance and reliability of the final product. The production of semiconductor wafers involves many steps, including but not limited to photolithography, etching, ion implantation, metallization, chemical mechanical polishing, etc. Each step requires extremely high precision and repeatability to ensure that the circuit pattern can be accurately transferred to the wafer, thereby manufacturing microelectronic devices with stable performance. With the development of technology, the requirements for wafer diameter are increasing, and the requirements for material thickness and flatness are also increasing, which poses higher challenges to the handling and transmission of wafers. In order to meet these requirements, wafers must be precisely manipulated during the production process to prevent any form of physical or chemical damage and ensure that each wafer meets high standards of quality.

[0003] Deficiencies of existing technology:

[0004] In the production process of semiconductor wafers, the film-sticking step is an indispensable part. However, the existing film-sticking carriers often face adaptability problems, especially when processing wafers of different sizes and thicknesses. Due to the diverse requirements of the semiconductor manufacturing industry for wafer sizes and materials, film-sticking carriers of a single size or fixed structure often cannot meet the needs of various wafer processing on the production line. For example, when converting orders for the production of wafers of different sizes, it is necessary to replace or adjust the film-sticking carrier, which not only increases production costs, but also prolongs the production cycle and reduces production efficiency. In addition, when traditional film-sticking carriers adsorb wafers, it is often difficult to evenly distribute the adsorption force, which may cause local deformation or damage on the wafer surface, thereby affecting the quality of the film and the final performance of the wafer. Therefore, the development of a film-sticking carrier that can adapt to wafers of different sizes and can provide uniform adsorption force has become the key to improving semiconductor production efficiency and product quality. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wafer film mounting platform to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer film mounting stage, comprising an outer frame, an adjusting mechanism capable of adjusting the size of the wafer carrying surface is arranged inside the outer frame, and an adsorption mechanism for preventing the wafer from moving is arranged at the lower end of the adjusting mechanism;

[0007] The regulating mechanism comprises:

[0008] A motor, wherein the motor is arranged at the bottom of the outer frame;

[0009] A rotating disk, which is arranged at the output end of the motor, and has a plurality of movable grooves on its surface; the inner side of the movable groove is movably connected to a connecting rod via a ball bearing;

[0010] A plurality of mobile bearing modules, wherein the mobile bearing modules are fixedly connected to the connecting rod;

[0011] The slide bar is fixedly arranged on the outer frame, and the interior of the movable bearing module is connected to the slide bar by providing a slide hole.

[0012] Preferably, the adsorption mechanism includes:

[0013] A main pipeline, wherein the main pipeline is arranged on the inner side of the outer frame;

[0014] A plurality of adsorption hoses, one end of which is connected to the main pipeline, and the other end of which is arranged on the inner side of the mobile bearing module.

[0015] Preferably, the end of the adsorption hose is higher than the upper surface of the movable carrying module.

[0016] Preferably, a hard steel ring is provided at the end of the adsorption hose for enhancing its structural strength.

[0017] Preferably, a vertical pole for positioning the wafer is provided on the outer side of the movable carrying module.

[0018] Preferably, the upper end surface of the rotating disk is connected to a fixed bearing module.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] The semiconductor wafer film mounting stage is provided with an adjustment mechanism, which includes a motor, a rotating disk, a movable groove, a ball, a connecting rod, a movable bearing module, and a sliding rod. The rotating disk is driven by the motor to realize regular and progressive outward movement of the movable bearing module. The bearing area of ​​the stage can be adjusted according to wafers of different sizes, so that the same device can process wafers of different sizes, thereby improving the application range and efficiency of the device.

[0021] The semiconductor wafer film-mounting carrier is provided with an adsorption mechanism, which includes a main pipeline and an adsorption hose. The main pipeline serves as a unified supply source for the adsorption hoses, and can ensure that each adsorption hose receives a relatively equal negative pressure. This evenly distributed adsorption force can maintain the flatness of the wafer and prevent local deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a schematic diagram of the internal structure of the utility model;

[0023] Figure 2 It is a top view of the utility model when the bearing parts are combined;

[0024] Figure 3 It is a top view of the utility model when the bearing part is opened;

[0025] Figure 4 This is a schematic diagram of the structure of the rotating disk of the utility model;

[0026] Figure 5 This is a diagram showing the state changes of the contact portion between the adsorption hose and the wafer during adsorption of the utility model.

[0027] In the figure: 1. outer frame; 2. adjusting mechanism; 201. motor; 202. rotating disk; 203. movable groove; 204. ball bearing; 205. connecting rod; 206. movable bearing module; 207. sliding rod; 3. adsorption mechanism; 301. main pipeline; 302. adsorption hose; 4. hard steel ring; 5. vertical pole; 6. fixed bearing module. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0032] See also Figure 1-5 As shown, the utility model provides a semiconductor wafer film mounting stage technical solution: a semiconductor wafer film mounting stage, comprising an outer frame 1, an adjusting mechanism 2 for adjusting the size of the wafer carrying surface is arranged inside the outer frame 1, and an adsorption mechanism 3 for preventing the wafer from moving is arranged at the lower end of the adjusting mechanism 2;

[0033] The adjustment mechanism 2 includes a motor 201, a rotating disk 202, a plurality of movable bearing modules 206, and a slide bar 207. The motor 201 is installed at the bottom of the outer frame 1. The rotating disk 202 is arranged at the output end of the motor 201. The surface of the rotating disk 202 is provided with a plurality of movable grooves 203. The inner side of the movable groove 203 is movably connected to a connecting rod 205 by a ball bearing 204. The movable bearing module 206 is fixedly connected to the connecting rod 205. The slide bar 207 is fixed on the outer frame 1. The inside of the movable bearing module 206 is slidably connected to the slide bar 207 by a sliding hole. In this embodiment, the movable groove 203 on the rotating disk 202 has a structure as shown in FIG. Figure 4 As shown, its structure allows the internal connecting rod 205 to have an inward or outward tendency when moving. When the size of the carrier bearing part is adjusted, the rotating disk 202 is driven by the motor 201. At this time, the multiple mobile bearing modules 206 located on the top will move outward in a regular and progressive manner under the action of the connecting rod 205 and the sliding rod 207. During this process, the spacing between the mobile bearing modules 206 gradually increases, thereby achieving a larger bearing area.

[0034] The adsorption mechanism 3 includes a main pipeline 301 and a plurality of adsorption hoses 302. The main pipeline 301 is fixed on the inner side of the outer frame 1. One end of the adsorption hose 302 is connected to the main pipeline 301, and the other end of the adsorption hose 302 is arranged on the inner side of the mobile supporting module 206. In the specific implementation process, the end of the adsorption hose 302 can be higher than the upper surface of the mobile supporting module 206, so as to improve the adsorption force and improve the efficiency and quality of film pasting. In the adsorption process, the main pipeline 301 can be directly connected to an external negative pressure device (such as an air pump), and then the negative pressure device is started. At this time, the wafer located on the surface of the mobile supporting module 206 will be firmly adsorbed on the supporting module, providing conditions for subsequent film pasting and film cutting.

[0035] A hard steel ring 4 is provided at the end of the adsorption hose 302. The hard steel ring 4 can enhance the structural strength of the end of the adsorption hose 302, avoid air leakage during use, and ensure its stability during negative pressure adsorption.

[0036] The outer side of the movable carrying module 206 is provided with a vertical pole 5. The vertical pole 5 can improve the positioning accuracy of the wafer during the film lamination process, ensure the processing quality and efficiency, and reduce errors.

[0037] The upper end surface of the rotating disk 202 is connected to a fixed supporting module 6. By setting the fixed supporting module 6, additional support can be provided for the wafer, significantly enhancing the stability of the wafer during the film pasting process. In addition, an adsorption hose 302 can also be arranged inside the fixed supporting module 6 to enhance the adsorption force at the center of the wafer, thereby further improving the consistency and reliability of the wafer pasting effect.

[0038] The working principle of the utility model is as follows:

[0039] When the size of the carrier part of a semiconductor wafer laminating stage of the present embodiment is adjusted, the motor 201 drives the rotating disk 202 to rotate. At this time, a plurality of mobile carrying modules 206 located on the top will move outward in a regular and progressive manner under the action of the connecting rod 205 and the sliding rod 207. During this process, the spacing between the mobile carrying modules 206 gradually increases to achieve a larger carrying area. During the adsorption process, the main pipeline 301 needs to be connected to the external negative pressure device, and then the negative pressure device is started. At this time, the wafer located on the surface of the mobile carrying module 206 will be firmly adsorbed on the carrying module; the semiconductor wafer laminating stage adopts a This innovative design integrates the adjustment mechanism 2 and the adsorption mechanism 3 to improve applicability and work efficiency. The rotating disk 202 driven by the motor 201 and the matching mobile bearing module 206 enable the carrier to adjust the bearing area according to the size of the wafer, so as to adapt to wafers of different sizes and improve the flexibility and production efficiency of the equipment. In addition, the adsorption mechanism 3 evenly distributes negative pressure to the adsorption hose 302 through the main pipeline 301 to ensure the flatness of the wafer during the film pasting process, effectively prevent local deformation, and ensure the quality of film pasting. This design not only optimizes the wafer processing flow, but also brings higher efficiency and better product quality to the semiconductor manufacturing industry.

[0040] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor wafer film mounting platform, comprising an outer frame (1), characterized in that: An adjusting mechanism (2) capable of adjusting the size of the wafer bearing surface is arranged inside the outer frame (1); a suction mechanism (3) for preventing the wafer from moving is arranged at the lower end of the adjusting mechanism (2); The regulating mechanism (2) comprises: A motor (201), wherein the motor (201) is arranged at the bottom of the outer frame (1); A rotating disk (202), the rotating disk (202) being arranged at the output end of the motor (201), the surface of the rotating disk (202) being provided with a plurality of movable grooves (203); the inner sides of the movable grooves (203) being movably connected to connecting rods (205) via balls (204); A plurality of mobile bearing modules (206), wherein the mobile bearing modules (206) are fixedly connected to the connecting rod (205); A sliding rod (207), wherein the sliding rod (207) is fixedly arranged on the outer frame (1), and the interior of the movable bearing module (206) is connected to the sliding rod (207) by providing a sliding hole.

2. A semiconductor wafer film mounting stage according to claim 1, characterized in that: The adsorption mechanism (3) comprises: A main pipeline (301), wherein the main pipeline (301) is arranged on the inner side of the outer frame (1); A plurality of adsorption hoses (302), one end of each of the adsorption hoses (302) being connected to the main pipeline (301), and the other end of each of the adsorption hoses (302) being arranged on the inner side of the mobile bearing module (206).

3. A semiconductor wafer film attaching stage according to claim 2, characterized in that: The end of the adsorption hose (302) is higher than the upper surface of the movable bearing module (206).

4. The semiconductor wafer film mounting stage according to claim 2, characterized in that: The end of the adsorption hose (302) is provided with a hard steel ring (4) for enhancing its structural strength.

5. The semiconductor wafer film attaching stage according to claim 1, characterized in that: A vertical pole (5) for positioning a wafer is arranged on the outer side of the movable carrying module (206).

6. The semiconductor wafer film attaching stage according to claim 1, characterized in that: The upper end surface of the rotating disk (202) is connected to a fixed bearing module (6).

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