Film cutting device for wafer film mounting machine

Abstract

The utility model discloses a film cutting device for a wafer film sticking machine, comprising a top cover, a connecting rod rotatably connected to the inner side of the top cover, a handle is arranged on the upper end of the connecting rod, a telescopic mechanism is arranged on the lower end of the connecting rod, a protective mechanism is arranged on the end of the telescopic mechanism, and a cutting knife is connected to the side of the protective mechanism. The utility model has a simple structure and a reasonable design. The adaptability of the device to wafers of different sizes can be improved through the cooperation of two screw rods, and the whole adjustment operation is relatively simple. The operator can quickly learn to adjust without too much training, which reduces the difficulty of operation, shortens the adjustment time, and improves the versatility and competitiveness of the device. The adjustment of the angle of the cutter head is realized through the cooperation of the slip ring, the bearing part and the connecting rod, so that the operator can ensure that the back of the cutter head faces the operator when adjusting the length of the telescopic mechanism, thereby reducing the possibility of cutting and making the operation safer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film pasting equipment, in particular to a film pasting and cutting device of a wafer film pasting machine. Background Art

[0002] Wafers are the core substrate in semiconductor manufacturing and are usually made of high-purity single-crystal silicon. These wafers are finally transformed into integrated circuit chips through complex manufacturing processes such as lithography, etching, ion implantation, etc. The diameter of wafers has a variety of specifications, the common ones include 200 mm (8 inches), 300 mm (12 inches) and the emerging 450 mm (18 inches). With the advancement of technology, the increase in wafer diameter can make more chips on the same wafer, thereby effectively reducing costs. In the production process of wafers, precision and cleanliness are crucial, and any tiny defect may cause the failure of the entire batch of products. Therefore, wafer manufacturing requires extremely high technical precision and environmental control, including performing most operations in clean rooms to prevent particulate contamination.

[0003] During the wafer processing, the film laminating and cutting steps are key links to protect and accurately separate the wafers. Wafer laminating machines are generally divided into automated and semi-automated types. Automated laminating machines can complete the film laminating and cutting processes without human intervention, significantly improving production efficiency and process repeatability, and are very suitable for large-scale production environments. However, although automated equipment greatly reduces operating errors and improves production capacity, their initial investment and maintenance costs are relatively high. Relatively speaking, the purchase cost of semi-automatic laminating machines is relatively low, making them a viable option under limited budgets, but existing semi-automatic laminating machines often need to replace cutting equipment of corresponding sizes when processing wafers of different diameters, which have low adaptability and cannot meet the needs of different production lines. Utility Model Content

[0004] The utility model aims to provide a film cutting device for a wafer film mounting machine to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: a film cutting device for a wafer film mounting machine, comprising a top cover, a connecting rod rotatably connected to the inner side of the top cover, a handle is arranged at the upper end of the connecting rod, a telescopic mechanism is arranged at the lower end of the connecting rod, a protective mechanism is arranged at the end of the telescopic mechanism, and a cutting knife is connected to the side of the protective mechanism;

[0006] The telescopic mechanism comprises:

[0007] An outer rod, the outer rod is arranged at the lower end of the connecting rod, a first chamber is formed inside the outer rod, and both ends of the first chamber are formed with internal threads;

[0008] The inner rod is slidably arranged on the inner side of the outer rod, and the end of the inner rod is provided with an outer thread matching the inner thread.

[0009] Preferably, the protection mechanism includes:

[0010] a second chamber, the second chamber being opened inside the inner rod;

[0011] A slip ring, wherein the slip ring is slidably connected to the second chamber, a bearing member is disposed inside the slip ring, a connecting rod is disposed inside the bearing member, an end of the connecting rod is connected to the cutting knife, the connecting rod comprises a main body and a reduced diameter portion having a smaller diameter than the main body, and a convex portion is disposed on the surface of the main body;

[0012] The concave portion is arranged at the end of the inner rod, and the concave portion matches the convex portion.

[0013] Preferably, the top cover is provided with an observation window for the operator to observe the cutting status.

[0014] Preferably, a linear bearing is provided between the outer rod and the inner rod, and the linear bearing is used to assist the sliding of the axis of the inner rod.

[0015] Preferably, a weighted portion is provided at the bottom of the connecting rod for improving operational stability.

[0016] Preferably, the outer rod and the inner rod are both made of alloy material.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The film cutting device of the wafer film mounting machine is provided with a telescopic mechanism, which includes an outer rod, a first chamber, an inner thread, an inner rod, and an outer thread. The cooperation of two screws can improve the adaptability of the device to wafers of different sizes, and the entire adjustment operation is relatively simple. The operator can quickly learn to adjust without too much training, which reduces the difficulty of operation, shortens the adjustment time, and improves the versatility and competitiveness of the device.

[0019] The film cutting device of the wafer film mounting machine is provided with a protection mechanism, which includes a second chamber, a slip ring, a bearing component, a connecting rod, a main body, a reduced diameter portion, a convex portion, and a concave portion. The angle of the cutter head is adjusted through the cooperation of the slip ring, the bearing component, and the connecting rod, so that the operator can ensure that the back of the cutter head faces the operator when adjusting the length of the telescopic mechanism, thereby reducing the possibility of cuts and making the operation safer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the top structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the bottom structure of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the connecting rod portion of the utility model;

[0023] Figure 4 This is a schematic diagram of the internal structure of the telescopic mechanism of the utility model;

[0024] Figure 5 It is a schematic diagram of the structure of the movable part of the inner rod and the connecting rod of the utility model;

[0025] Figure 6 It is a schematic structural diagram of the end of the connecting rod reducing portion of the utility model.

[0026] In the figure: 1. top cover; 2. connecting rod; 3. handle; 4. telescopic mechanism; 401. outer rod; 402. first chamber; 403. internal thread; 404. inner rod; 405. external thread; 5. protection mechanism; 501. second chamber; 502. slip ring; 503. bearing member; 504. connecting rod; 5041. main body; 5042. reducing portion; 505. convex portion; 506. concave portion; 6. cutting knife; 7. observation window; 8. linear bearing; 9. weighting portion. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0031] See also Figure 1-6 As shown, the utility model provides a technical solution of a film cutting device for a wafer film mounting machine: a film cutting device for a wafer film mounting machine, comprising a top cover 1, a connecting rod 2 is rotatably connected to the inner side of the top cover 1, a handle 3 is connected to the upper end of the connecting rod 2, a telescopic mechanism 4 is installed at the lower end of the connecting rod 2, a protective mechanism 5 is installed at the end of the telescopic mechanism 4, and a cutting knife 6 is connected to the side of the protective mechanism 5;

[0032] The telescopic mechanism 4 includes an outer rod 401 and an inner rod 404. The outer rod 401 is fixedly connected to the lower end of the connecting rod 2. A first chamber 402 is provided inside the outer rod 401. Both ends of the first chamber 402 are provided with internal threads 403. The inner rod 404 is slidably connected to the inner side of the outer rod 401. The end of the inner rod 404 is provided with an external thread 405 matching the internal thread 403. In the specific implementation process, the outer rod 401 can be multiple. If the number of the outer rods 401 is two, the diameter of the second outer rod 401 can be reduced, and an external thread 405 matching the internal thread 403 of the first outer rod 401 can be provided on the outside of the second outer rod 401. Then, this threaded portion is restricted inside the first chamber 402 of the first outer rod 401, and finally, the inner rod 404 is set inside the first chamber 402 of the second outer rod 401. That is, in order to adapt to the film cutting of more wafers of different sizes. In addition, the distance between the internal threads 403 in the first chamber 402 can be designed according to actual conditions. For example, when the external thread 405 is connected to the internal thread 403 near the inner side of the first chamber 402 to ensure the film cutting of 8-inch wafers, we can set the distance between the two internal threads 403 to 50mm. At this time, when the external thread 405 is connected to the internal thread 403 near the outer side of the first chamber 402, the cutting condition of 12-inch wafers is met. When it is necessary to adjust the application length of the cutting knife 6, rotate the inner rod 404 to disconnect the external thread 405 from the connecting internal thread 403 of the first chamber 402, and then establish a connection with the internal thread 403 at the other end. This design allows the cutting device to adapt to wafers of different sizes and increases production flexibility.

[0033] The protection mechanism 5 includes a second chamber 501, a slip ring 502, and a recess 506. The second chamber 501 is opened inside the inner rod 404. The slip ring 502 is slidably connected to the second chamber 501. A bearing 503 is installed on the inner side of the slip ring 502. A connecting rod 504 is connected to the inner side of the bearing 503. The end of the connecting rod 504 is connected to the cutter 6. The connecting rod 504 includes a main body 5041 and a reduced diameter portion 5042 with a smaller diameter than the main body 5041. The surface of the main body 5041 is designed with a convex portion 505. The recess 506 is opened at the end of the inner rod 404. The concave portion 506 matches the convex portion 505. When adjusting the telescopic When adjusting the length of the telescopic mechanism 4, the top cover 1 needs to be erected on the film laminating machine. At this time, the tip of the cutting knife 6 is facing the operator, and there is a risk of accidental injury during adjustment. In this case, the operator can pull out the cutting knife 6, and when the convex portion 505 is disengaged from the concave portion 506, the cutting knife 6 will be affected by its own gravity, so that the blade head is facing downward and the back of the blade is facing the operator. At this time, the length of the telescopic mechanism 4 can be adjusted. After adjusting the length of the telescopic mechanism 4, the operator rotates the cutting knife 6 and inserts the convex portion 505 into the concave portion 506 again until the slip ring 502 moves to the innermost side of the second chamber 501. This design can reduce potential risks and improve operational safety.

[0034] The top cover 1 is provided with an observation window 7, and the observation window 7 allows the operator to observe the inside of the top cover 1 when cutting the film, thereby managing the production process more efficiently.

[0035] A linear bearing 8 is arranged between the outer rod 401 and the inner rod 404. The linear bearing 8 can ensure that the inner rod 404 can move linearly along the axis of the outer rod 401. On the other hand, the linear bearing 8 can provide a smooth sliding surface, reduce movement friction, make the length adjustment smoother, and reduce mutual wear between the rods.

[0036] A weighted portion 9 is provided at the bottom of the connecting rod 2. The weighted portion 9 can provide a certain degree of balance during operation and enhance the stability of the operation.

[0037] The outer rod 401 and the inner rod 404 are both made of alloy. This design can improve the durability of the two rods, especially the threaded portion, reduce wear, and improve the tightness and precision of the threaded connection.

[0038] The working principle of the utility model is as follows:

[0039] When the application length of the cutting knife 6 of the film cutting device of a wafer film mounting machine of the present embodiment needs to be adjusted, the cutting knife 6 can be pulled out. When the protrusion 505 is disengaged from the recess 506, the cutting knife 6 will be affected by its own gravity, so that the cutting head is downward and the back of the knife is facing the operator. Then the inner rod 404 is rotated to disengage the external thread 405 from the connecting internal thread 403 of the first chamber 402, and then establish a connection with the internal thread 403 at the other end. After adjusting the length of the telescopic mechanism 4, the operator rotates the cutting knife 6 and inserts the protrusion 505 into the recess 506 again until the slip ring 502 moves to the innermost side of the second chamber 501.

[0040] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A film cutting device for a wafer film mounting machine, comprising a top cover (1), characterized in that: The top cover (1) is rotatably connected to a connecting rod (2) on the inside, a handle (3) is provided at the upper end of the connecting rod (2), a telescopic mechanism (4) is provided at the lower end of the connecting rod (2), a protective mechanism (5) is provided at the end of the telescopic mechanism (4), and a cutting knife (6) is connected to the side of the protective mechanism (5); The telescopic mechanism (4) comprises: An outer rod (401), the outer rod (401) being arranged at the lower end of the connecting rod (2), a first chamber (402) being provided inside the outer rod (401), and both ends of the first chamber (402) being provided with internal threads (403); An inner rod (404) is slidably disposed on the inner side of the outer rod (401), and an end of the inner rod (404) is provided with an outer thread (405) matching the inner thread (403).

2. The film cutting device of a wafer film mounting machine according to claim 1, characterized in that: The protection mechanism (5) comprises: A second chamber (501), the second chamber (501) being opened inside the inner rod (404); a slip ring (502), the slip ring (502) being slidably connected to the second chamber (501), a bearing member (503) being arranged on the inner side of the slip ring (502), a connecting rod (504) being arranged on the inner side of the bearing member (503), an end of the connecting rod (504) being connected to the cutting knife (6), the connecting rod (504) comprising a main body (5041) and a reducing portion (5042) having a smaller diameter than the main body (5041), and a convex portion (505) being arranged on the surface of the main body (5041); A recessed portion (506) is provided at the end of the inner rod (404), and the recessed portion (506) matches the convex portion (505).

3. The film cutting device of a wafer film mounting machine according to claim 1, characterized in that: The top cover (1) is provided with an observation window (7) for an operator to observe the cutting status.

4. The film cutting device of a wafer film mounting machine according to claim 1, characterized in that: A linear bearing (8) is provided between the outer rod (401) and the inner rod (404), and the linear bearing (8) is used to assist the axial sliding of the inner rod (404).

5. The film cutting device of a wafer film mounting machine according to claim 1, characterized in that: The bottom of the connecting rod (2) is provided with a weighted portion (9) for improving operational stability.

6. The film cutting device of a wafer film mounting machine according to claim 1, characterized in that: The outer rod (401) and the inner rod (404) are both made of alloy material.

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