Packaging structure comprising optical device SIP (Session Initiation Protocol)

Abstract

The utility model relates to the field of optical device packaging, and provides a packaging structure comprising an optical device SIP, which comprises a packaging carrier plate on which an optical device and devices required by a peripheral circuit are attached; the first mold assembly used for plastic packaging comprises a transparent plastic packaging material special mold and a black plastic packaging mold, the transparent plastic packaging material special mold is only used for injection molding of a specific light-transmitting area, and the black plastic packaging mold is used for injection molding of areas outside the specific light-transmitting area; and the second mold assembly for plastic packaging comprises a transparent plastic packaging mold and a black plastic packaging material special mold, the black plastic packaging material special mold is used for reserving one or more cavities of a transparent plastic packaging area, and the transparent plastic packaging mold is used for plastic packaging of the cavities.

Description

Technical Field

[0001] The utility model relates to the field of optical device packaging, in particular to a packaging structure comprising an optical device SIP. Background Art

[0002] The statements in this section merely provide background technical information related to the present invention and do not necessarily constitute prior art.

[0003] Common optical device packaging uses transparent plastic or transparent cover. However, after the optical device packaging is completed, it needs to be connected to many peripheral functional circuits (such as signal gain part) to be applied to the product, which is often called SIP (system-level package). The traditional SIP packaging method containing optical devices is to use full transparent packaging or transparent cover, but all devices except optical devices are made of black plastic. Once full transparent plastic is used, there will be reliability problems due to poor combination with black plastic, and full transparent plastic also has a large warping problem. In addition, it is easy to expose the product BOM and cause leakage. Another way is to package the optical sensor chip separately and then weld it to the test circuit board, but this packaging form is too large and does not meet the requirements of modern product miniaturization and thinness. SIP has a very high degree of integration. Except for the optical sensor chip, that is, the optical device, which needs to be light-transmitting, other devices need black plastic protection. How to make the optical device light-transmitting is a difficult problem. Utility Model Content

[0004] In order to solve the technical problems existing in the above-mentioned background technology, the utility model provides a packaging structure including an optical device SIP. Compared with the traditional packaging form of fully transparent plastic packaging or transparent cover, the utility model adopts a combination of transparent plastic packaging and black plastic packaging. The traditional fully transparent packaging plastic packaging material has poor bonding with the black plastic packaging material of most devices. In the utility model, only the optical device area is transparent plastic packaging, which greatly improves the reliability of the SIP containing optical devices.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A first aspect of the utility model provides a packaging structure including an optical device SIP.

[0007] A packaging structure including an optical device SIP, comprising:

[0008] A packaging carrier board, on which the optical device and the devices required for the peripheral circuit are attached;

[0009] The first mold assembly for plastic encapsulation includes a mold for transparent plastic encapsulation material and a mold for black plastic encapsulation, wherein the mold for transparent plastic encapsulation material only injects a specific light-transmitting area, and the black plastic encapsulation mold injects an area other than the specific light-transmitting area;

[0010] The second mold assembly for plastic packaging includes a transparent plastic packaging mold and a special mold for black plastic packaging material. The special mold for black plastic packaging material is used to reserve one or more cavities in the transparent plastic packaging area, and the transparent plastic packaging mold is used for plastic packaging cavities.

[0011] Furthermore, after injection molding, the specific light-transmitting area is higher than the area outside the specific light-transmitting area.

[0012] Furthermore, an optical device is mounted in the cavity.

[0013] Furthermore, the optical device is connected to the packaging carrier via a connecting wire.

[0014] Furthermore, the connecting wire includes a gold wire, a lead wire, a copper wire or an alloy wire.

[0015] Furthermore, the specific light-transmitting area includes an optical sensor chip area, an LED area, and a lidar chip area.

[0016] Furthermore, the packaging carrier includes a metal frame, an organic printed circuit board or a ceramic substrate.

[0017] Furthermore, a bare chip is attached to the packaging carrier, and the bare chip and the packaging carrier are fixed by adhesive.

[0018] Furthermore, the bare chip includes a radio frequency product chip, a micro-electromechanical system chip or an optical filter.

[0019] Furthermore, the mounting method between the bare chip and the packaging carrier includes single chip mounting, multi-chip mounting and stacked chip mounting.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] The utility model adopts the combination of transparent plastic sealing and black plastic sealing, which solves the problem that the optical device in the traditional SIP cannot transmit light.

[0022] Compared with the traditional packaging forms of fully transparent plastic packaging or transparent cover, the utility model adopts a combination of transparent plastic packaging and black plastic packaging. The traditional fully transparent packaging plastic packaging material has poor bonding with the black plastic packaging material of most devices. In the utility model, only the optical device area is transparently plastic-sealed; the packaging with a transparent cover has a cavity inside, which is easy to trap air, so the utility model has greatly improved the reliability of the SIP containing optical devices.

[0023] Compared with the traditional packaging form of first plastic-sealing an optical device separately and then placing it on a test board, the packaging form described in the utility model greatly reduces the packaging size and can be directly applied to products.

[0024] The utility model can realize simultaneous exposure of multiple optical devices, prevent light scattering, and ensure that different optical devices can receive different light or emit light without interference.

[0025] The utility model solves the problem of product warping caused by full transparent plastic sealing.

[0026] The utility model solves the problem that the product cannot be marked when fully transparent plastic sealing or transparent cover is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0028] Figure 1 This is the schematic diagram of steps one, two, and three.

[0029] Figure 2 This is the schematic diagram for completing step 4;

[0030] Figure 3 This is the completion of step 5. Figure 1 , a package including one or more optical devices;

[0031] Figure 4 This is the completion of step 5. Figure 2 , a package including one or more optical devices;

[0032] Figure 5 This is the completion of step 6. Figure 1 ;

[0033] Figure 6 This is the completion of step 6. Figure 2 ;

[0034] Figure 7 This is the completion of step seven. Figure 1 , a package including one or more optical devices;

[0035] Figure 8 This is the completion of step seven. Figure 2 , a package including one or more optical devices;

[0036] Fig. 9 This is the completion of step seven. Figure 3 , a package including one or more optical devices;

[0037] Fig.10 This is the completion of step seven. Figure 4 , a package including one or more optical devices;

[0038] Fig.11 This is the completed schematic diagram of step eight;

[0039] Fig.12 This is the completion of step nine. Figure 1 ;

[0040] Fig.13 This is the completion of step nine. Figure 2 ;

[0041] Among them, 1. peripheral circuit SMT devices, 2. optical devices, 3. peripheral circuit bare cores, 4. packaging carrier boards, 5. welding wires, 6. the first transparent plastic encapsulation material special mold in mold combination ①, 7. the second transparent plastic encapsulation material special mold in mold combination ①, 8. transparent plastic encapsulation material, 9. black plastic encapsulation material, 10. the first black plastic encapsulation material special mold in mold combination ②, 11. the second black plastic encapsulation material special mold in mold combination ②. DETAILED DESCRIPTION

[0042] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0043] It should be noted that the following detailed descriptions are all exemplary and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0044] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0045] Embodiment 1

[0046] In order to solve the following problems existing in the prior art:

[0047] 1. The problem that optical devices cannot be exposed in traditional SIP can reduce the number of packaging times, reduce the packaging cycle, and reduce the packaging size;

[0048] 2. The reliability of the transparent cover of the traditional optical device packaging cover is low;

[0049] 3. Solve the problem of light scattering, so that the optical device can better focus and emit light;

[0050] 4. It can realize the integration of multiple optical devices and ensure that different optical devices can receive different types of light;

[0051] 5. The problem of warping of fully transparent plastic packaging.

[0052] This embodiment provides a packaging structure including an optical device SIP, including:

[0053] The package carrier is a metal frame, an organic printed circuit board or a ceramic substrate, and the optical device and the devices required for the peripheral circuit are attached to the package carrier. The optical device and the devices required for the peripheral circuit are all existing devices.

[0054] The mold combination for plastic encapsulation①, the special mold for transparent plastic encapsulation is an independent one or more cavity bosses, the mold for black plastic encapsulation is a flat mold with a specific height, the special mold for transparent plastic encapsulation only injects a specific light-transmitting area, and the black plastic encapsulation mold injects all areas outside the transparent plastic encapsulation area. The light-transmitting area includes but is not limited to all optical devices that need to be light-transmitting, such as the optical sensor chip area, LED area, and laser radar chip area.

[0055] The mold combination for plastic sealing ②, the transparent plastic sealing mold is a flat mold with a specific height, and the special mold for black plastic sealing material is a cavity mold that can reserve one or more transparent plastic sealing areas. After the special mold for black plastic sealing material is completed, the cavity of the transparent plastic sealing area is reserved, and then the transparent plastic sealing flat mold is used for plastic sealing.

[0056] In this embodiment, the shapes of the transparent molding compound mold, the black molding compound mold, the black molding compound mold and the transparent molding compound mold can all be square, rectangular, circular, etc., which is not limited in this embodiment.

[0057] A packaging method combining transparent plastic packaging and black plastic packaging, comprising the following steps:

[0058] Step 1: Use the SMT process to paste the components required for SIP on the package carrier; the components required for SIP include: chip capacitors, chip resistors, integrated IC chips, etc.

[0059] Step 2: Clean and bake the package carrier after SMT to prevent solder paste residue from affecting the subsequent bare chip connection wire bonding process. The bare chip is a radio frequency product chip, a micro-electromechanical system chip, a sensor chip or a filter. The connection wire is a gold wire, a lead wire, a copper wire or an alloy wire;

[0060] Step 3: Attach the bare chip to the package carrier. The bare chip and the package carrier are fixed by adhesive. This mounting can be single chip mounting, multi-chip mounting, or stacked chip mounting. The above mounting methods are all within the scope of protection of this utility model. Figure 1As shown, a peripheral circuit SMT device 1, an optical device 2 and a peripheral circuit bare core 3 are attached to a packaging carrier 4;

[0061] Among them, 1. peripheral circuit SMT device, 2. optical device, 3. peripheral circuit bare core, 4. package carrier, 5. welding wire, 6. first transparent plastic encapsulation material dedicated mold in mold combination ①, 7. second transparent plastic encapsulation material dedicated mold in mold combination ①, 8. transparent plastic encapsulation material, 9. black plastic encapsulation material, 10. first black plastic encapsulation material dedicated mold in mold combination ②, 11. second black plastic encapsulation material dedicated mold in mold combination ②. Among them, optical device 2 can be a semiconductor photosensitive device such as CCD, EMCCD, CMOS and sCMOS.

[0062] Step 4: Electrically interconnect the bare chip and the package substrate through wire bonding, such as Figure 2 As shown, the package carrier 4 and the optical device are connected via welding wires;

[0063] Step 5 (Use mold combination ①): Use a special plastic mold for transparent plastic molding to mold a boss protected by transparent plastic molding in the optical area. The transparent plastic molding completely wraps the optical device, such as Figure 3 , Figure 4 As shown, the first transparent plastic encapsulation material dedicated mold 6 in the mold combination ① and the second transparent plastic encapsulation material dedicated mold 7 in the mold combination ①;

[0064] Step 6 (Use mold combination ①): Use black plastic sealing flat mold to inject the area outside the transparent area. The transparent plastic sealing area is surrounded by black plastic sealing material. The height of the flat mold cannot be higher than the height of the transparent plastic sealing boss to ensure that the top of the transparent area is exposed. Figure 5 , Figure 6 As shown, transparent molding compound 8 and black molding compound 9.

[0065] Step 7 (Using mold combination ②): First, use the black plastic sealing material special mold for overall injection molding. After the injection molding is completed, one or more cavities in the transparent plastic sealing area will be reserved, such as Figure 7 , Figure 8 , Fig. 9 , Fig.10 , the first black plastic encapsulation material dedicated mold 10 in the mold combination ② and the second black plastic encapsulation material dedicated mold 11 in the mold combination ②;

[0066] Step 8 (Using mold assembly ②): Mount the optical device in the cavity area and perform wire bonding, such as Fig.11 shown.

[0067] Step 9 (Using mold combination ②): Then use the transparent plastic package flat mold for injection molding. After the injection molding is completed, fill the cavity reserved in the transparent area, such as Fig.12 , Fig.13 shown.

[0068] Step 10: Cut the plastic-sealed product into individual pieces;

[0069] Step 11: If the lower carrier adopts the BGA lead-out method, ball planting is required. If it adopts LGA or QFN, this step is not required.

[0070] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A packaging structure comprising an optical device SIP, characterized in that: include: A packaging carrier board, on which the optical device and the devices required for the peripheral circuit are attached; The first mold assembly for plastic encapsulation includes a mold for transparent plastic encapsulation material and a mold for black plastic encapsulation, wherein the mold for transparent plastic encapsulation material only injects a specific light-transmitting area, and the black plastic encapsulation mold injects an area other than the specific light-transmitting area; The second mold assembly for plastic packaging includes a transparent plastic packaging mold and a special mold for black plastic packaging material. The special mold for black plastic packaging material is used to reserve one or more cavities in the transparent plastic packaging area, and the transparent plastic packaging mold is used for plastic packaging cavities.

2. The packaging structure comprising an optical device SIP according to claim 1, characterized in that: After injection molding, the specific light-transmitting area is higher than the area outside the specific light-transmitting area.

3. The packaging structure comprising an optical device SIP according to claim 1, characterized in that: An optical device is mounted in the cavity.

4. The packaging structure comprising an optical device SIP according to claim 1, characterized in that: The optical device is connected to the packaging carrier through a connecting wire.

5. The packaging structure comprising an optical device SIP according to claim 4, characterized in that: The connecting wire includes a gold wire, a lead wire, a copper wire or an alloy wire.

6. The packaging structure comprising an optical device SIP according to any one of claims 1 to 5, characterized in that: The specific light-transmitting area includes an optical sensor chip area, an LED area, and a lidar chip area.

7. The packaging structure comprising an optical device SIP according to any one of claims 1 to 5, characterized in that: The packaging carrier includes a metal frame, an organic printed circuit board or a ceramic substrate.

8. The packaging structure comprising an optical device SIP according to claim 1, characterized in that: A bare chip is also attached to the packaging carrier, and the bare chip and the packaging carrier are fixed by a top adhesive.

9. The packaging structure comprising an optical device SIP according to claim 8, characterized in that: The bare chip includes a radio frequency product chip, a micro-electromechanical system chip or an optical filter.

10. The packaging structure comprising an optical device SIP according to claim 8, characterized in that: The mounting method between the bare chip and the packaging carrier includes single chip mounting, multi-chip mounting and stacked chip mounting.

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