Glue moisture control components for cardboard synthesis

Abstract

The present application relates to the field of cardboard synthesis processing, and discloses a glue humidity control component for cardboard synthesis, comprising a processing table, a support plate fixedly arranged on the upper surface of the processing table, a receiving plate fixedly arranged on the lower surface of the processing table, support columns fixedly arranged at the four corners of the lower surface of the receiving plate, a plurality of ventilation holes opened on the lower surface of the receiving plate, a plurality of heating holes opened on the outer surface of the support plate, a plurality of heating wires fixedly arranged inside the processing table, air sucked into the processing table through the ventilation holes can be heated by the heating wires, and then discharged through the heating holes, thereby improving the efficiency of removing glue humidity, thereby accelerating the solidification speed of cardboard synthesis glue, and preventing the cardboard synthesis from being skewed due to excessive glue humidity.

Description

Technical Field

[0001] The present application relates to the field of paperboard synthesis processing, in particular to a glue moisture control component used for paperboard synthesis. Background Art

[0002] Paperboard, also known as board paper, is a thick paper sheet made of various pulps and interwoven fibers. The difference between paperboard and paper is usually distinguished by basis weight and thickness. Generally, paperboard with a basis weight of more than 250g / m2 and a thickness greater than 0.5mm is called paperboard. It is usually made of various plant fibers as raw materials, and non-plant fibers are also mixed in. It is made on a paperboard machine. Some special paperboards are also mixed with animal fibers such as wool or mineral fibers such as asbestos.

[0003] Cardboard and cardboard synthesis are widely used in modern production and life. In the process of industrial production, cardboard needs to be processed by glue. During the processing, the humidity of the glue is high and it takes a long time to solidify. This makes it difficult to quickly synthesize and shape the cardboard during the synthesis. As a result, after the glue is bonded, the high humidity of the glue causes unstable bonding and skewed bonding of the cardboard.

[0004] In view of the above-mentioned related technologies, the inventor believes that the paperboard synthesis has the defect that the glue humidity is high and thus the bonding is unstable;

[0005] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In order to solve the problems raised in the background technology, the present application provides a glue moisture control component for paperboard synthesis.

[0007] The glue humidity control component for paperboard synthesis provided in this application adopts the following technical solution:

[0008] The invention discloses a glue humidity control component for cardboard synthesis, comprising a processing table, a support plate fixedly arranged on the upper surface of the processing table, a receiving plate fixedly arranged on the lower surface of the processing table, support columns fixedly arranged at the four corners of the lower surface of the receiving plate, a plurality of ventilation holes opened on the lower surface of the receiving plate, a plurality of heating holes opened on the outer surface of the support plate, and a plurality of heating wires fixedly arranged inside the processing table.

[0009] Preferably, a protective frame is fixedly installed inside the processing table above the plurality of heating wires, side baffles are fixedly connected to both sides of the upper surface of the protective frame, and the protective frame is fixedly connected to the lower surface of the support plate through the side baffles.

[0010] Preferably, the outer surface of the side baffle is provided with a plurality of ventilation holes penetrating the inside thereof, and the outer side wall of the side baffle is fixedly provided with a plurality of fans.

[0011] Preferably, a heat insulation protective plate is fixedly provided on the lower surface of the receiving plate.

[0012] Preferably, a plurality of protection boxes are fixedly provided on the lower surface of the heat-insulating protective plate outside the plurality of ventilation holes, and a plurality of side through holes are opened on the side wall of the protection box.

[0013] In summary, this application includes the following beneficial technical effects:

[0014] By providing a support plate, when the cardboard is supported and synthesized on the upper surface of the processing table by the support plate, air can be sucked in through the vent holes and then discharged through the heating holes, so that the cardboard is quickly air-dried and the humidity of the glue is reduced. Secondly, a plurality of heating wires are fixedly arranged inside the processing table, so that the air sucked into the processing table through the vent holes can be heated by the heating wires and then discharged through the heating holes, thereby improving the efficiency of removing the moisture of the glue, thereby accelerating the solidification speed of the glue synthesized on the cardboard, and preventing the cardboard synthesis from being skewed due to excessive moisture of the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the glue humidity control assembly of the application embodiment;

[0016] Figure 2 is a bottom structural schematic diagram of a glue humidity control assembly of an embodiment of the application;

[0017] Figure 3 is a schematic diagram of the internal structure of a processing table according to an embodiment of the application;

[0018] Figure 4 It is a schematic diagram of the internal bottom view of the processing table of the application embodiment.

[0019] Explanation of the accompanying drawings: 1. Processing table; 2. Support plate; 3. Support column; 4. Heating hole; 5. Receiving plate; 6. Ventilation hole; 7. Protection box; 8. Side through hole; 9. Protection frame; 10. Fan; 11. Ventilation hole; 12. Side baffle; 13. Heating wire; 14. Heat insulation protective plate. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-4 This application is described in further detail.

[0021] The present application embodiment discloses a glue moisture control component for paperboard synthesis. Figure 1 , Figure 2 and Figure 3, a glue humidity control component for cardboard synthesis, including a processing table 1, and a support plate 2 is fixedly arranged on the upper surface of the processing table 1, so that cardboard can be placed on the upper surface of the processing table 1 through the support plate 2 for synthesis processing, and secondly, a receiving plate 5 is fixedly arranged on the lower surface of the processing table 1, so that the receiving plate 5 cooperates with a plurality of support columns 3 to support the processing table 1;

[0022] At the same time, a plurality of heating holes 4 are provided on the outer surface of the support plate 2, and a plurality of ventilation holes 6 are provided on the outer surface of the receiving plate 5, so that when the cardboard is supported and synthesized by the support plate 2 on the upper surface of the processing table 1, air can be sucked in through the ventilation holes 6 and then discharged through the heating holes 4, so that the cardboard is quickly air-dried and the humidity of the glue is reduced. Secondly, a plurality of heating wires 13 are fixedly arranged inside the processing table 1, so that the air sucked into the processing table 1 through the ventilation holes 6 can be heated by the heating wires 13 and then discharged through the heating holes 4, so as to improve the efficiency of removing the moisture of the glue, thereby accelerating the solidification speed of the glue synthesized on the cardboard, and preventing the cardboard synthesis from being skewed due to excessive moisture of the glue.

[0023] Reference Figure 3 and Figure 4 A protective frame 9 is fixedly installed inside the processing table 1 above the plurality of heating wires 13, and side baffles 12 are fixedly connected to both sides of the upper surface of the protective frame 9, so that the protective frame 9 is fixedly connected to the lower surface of the support plate 2 through the two side baffles 12, so that when the cardboard or glue is processed on the upper surface of the support plate 2, any that falls through the heating holes 4 will be collected inside the protective frame 9.

[0024] Reference Figure 3 and Figure 4 A plurality of ventilation holes 11 penetrating the inside of the side baffle 12 are opened on the outer surface thereof, and a plurality of fans 10 are fixedly arranged on the outer side wall of the side baffle 12, so that the fans 10 can guide the air heated by the heating wire 13 to the inside of the protective frame 9 through the plurality of ventilation holes 11, and then discharge it to the upper surface of the support plate 2 through the plurality of heating holes 4, so as to quickly remove the moisture of the glue during the synthesis of the cardboard and assist the condensation of the glue.

[0025] Reference Figure 3 and Figure 4 A heat insulation guard plate 14 is fixedly installed on the lower surface of the receiving plate 5, so that the heat insulation guard plate 14 can reinforce the lower surface of the receiving plate 5, and provide high temperature protection to prevent the high temperature emitted by the heating wire 13 inside the processing table 1 from being transmitted to the outside from the receiving plate 5. At the same time, a protection box 7 is fixedly installed on the lower surface of the heat insulation guard plate 14 outside the vent 6, and a plurality of side through holes 8 are opened on the side of the protection box 7, so that the protection box 7 and the side through holes 8 can prevent debris from directly entering the interior of the processing table 1 from the vent 6.

[0026] The implementation principle of the glue humidity control component for cardboard synthesis in the embodiment of the present application is as follows: a processing table 1 is provided, and a support plate 2 is fixedly provided on the upper surface of the processing table 1, so that cardboard can be placed on the upper surface of the processing table 1 through the support plate 2 for synthesis processing, and then a receiving plate 5 is fixedly provided on the lower surface of the processing table 1, so that the receiving plate 5 can support the processing table 1 in conjunction with a plurality of support columns 3, and at the same time, a plurality of heating holes 4 are opened on the outer surface of the support plate 2, and a plurality of ventilation holes 6 are opened on the outer surface of the receiving plate 5, so that When the cardboard is supported and synthesized on the upper surface of the processing table 1 by the support plate 2, air can be sucked in through the vent holes 6 and then discharged through the heating holes 4, so that the cardboard is quickly air-dried and the humidity of the glue is reduced. Secondly, a plurality of heating wires 13 are fixedly arranged inside the processing table 1, so that the air sucked into the processing table 1 through the vent holes 6 can be heated by the heating wires 13 and then discharged through the heating holes 4, thereby improving the efficiency of removing the moisture of the glue, thereby accelerating the solidification speed of the glue synthesized on the cardboard, and preventing the cardboard synthesis from being skewed due to excessive moisture of the glue.

[0027] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0028] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0029] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0030] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A glue moisture control assembly for paperboard synthesis, comprising a processing table (1), characterized in that: A support plate (2) is fixedly provided on the upper surface of the processing table (1), a receiving plate (5) is fixedly provided on the lower surface of the processing table (1), and support columns (3) are fixedly provided at the four corners of the lower surface of the receiving plate (5); The lower surface of the receiving plate (5) is provided with a plurality of ventilation holes (6), the outer surface of the supporting plate (2) is provided with a plurality of heating holes (4), and the interior of the processing table (1) is fixedly provided with a plurality of heating wires (13).

2. The glue humidity control assembly for paperboard synthesis according to claim 1, characterized in that: A protective frame (9) is fixedly arranged inside the processing table (1) above the plurality of heating wires (13), and side baffles (12) are fixedly connected to both sides of the upper surface of the protective frame (9). The protective frame (9) is fixedly connected to the lower surface of the support plate (2) via the side baffles (12).

3. The glue humidity control assembly for paperboard synthesis according to claim 2, characterized in that: The outer surface of the side baffle (12) is provided with a plurality of ventilation holes (11) penetrating the inside thereof, and the outer side wall of the side baffle (12) is fixedly provided with a plurality of fans (10).

4. The glue humidity control assembly for paperboard synthesis according to claim 1, characterized in that: A heat insulation protective plate (14) is fixedly arranged on the lower surface of the receiving plate (5).

5. The glue humidity control assembly for paperboard synthesis according to claim 4, characterized in that: A plurality of protection boxes (7) are fixedly arranged on the lower surface of the heat-insulating protective plate (14) outside the plurality of ventilation holes (6), and a plurality of side through holes (8) are opened on the side wall of the protection box (7).

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