Wafer polishing fixture

Abstract

The utility model discloses a wafer polishing processing fixture, including a disc body, a clamping and limiting mechanism and a height adjustment mechanism. The clamping and limiting mechanism includes a polishing hole, a groove, a spring, a rubber clamping block and a guide mechanism. The disc body is surrounded by polishing holes, and four groups of polishing holes are provided. A groove is surrounded by the inner side of the polishing hole, and four groups of grooves are provided around the groove. A spring is fixedly provided in the groove, a rubber clamping block is fixedly provided in front of the spring, a guide mechanism is provided in the groove, and a height adjustment mechanism is provided below the disc body. The utility model utilizes the elasticity of the spring to drive the rubber clamping block to move inward to clamp and fix the edge of the wafer, thereby effectively fixing wafers of different sizes, solving the problem that the friction force of the fluff directly placed on the wafer has poor stability and cannot be compatible with wafers of different sizes. The height is adjusted and controlled by rotating the screw rod and the threaded hole to drive the lifting ring and the support disc to lift and lower.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer polishing processing fixture. Background Art

[0002] Wafer processing refers to the process of dissolving high-purity polysilicon, adding silicon crystal seeds, and then slowly pulling it out to form cylindrical single crystal silicon during the semiconductor manufacturing process. This process involves multiple steps, including grinding, polishing, slicing, etc., and finally forms a silicon wafer, that is, a wafer. The main purpose of wafer processing is to build integrated circuits on silicon wafers, which requires precise control and a highly clean environment to ensure the correctness and reliability of the circuit. Wafer polishing is a key step in the semiconductor manufacturing process. Its main purpose is to remove the damaged layer on the surface of the wafer and reduce the surface roughness, so as to obtain a smooth, flat and defect-free surface, providing a good foundation for subsequent micro-nano processing. Wafer polishing is crucial to the performance of semiconductor devices. If polishing is not done properly, scratches, dents or other defects may appear on the surface of the wafer, which may affect the electrical performance and reliability of the device. Therefore, wafer polishing requires precise control and high-quality materials to ensure the quality and performance of the final product;

[0003] A novel wafer polishing fixture is disclosed in the utility model with application number 202320379177.1. By arranging adsorption pads on both sides of the polishing pad, placing the wafer to be single-sided polished, and then placing it in a double polishing machine, single-sided polishing is performed on the wafers on the adsorption pads on both sides of the polishing pad at the same time on the upper and lower sides of the double polishing machine. This not only saves the cost of purchasing a single polishing machine, but also greatly improves the polishing efficiency. Two wafers can be polished at the same time. By arranging fluff on the surface of the adsorption pad, it is more conducive to adsorbing and protecting the wafer. By arranging two extension holes connected to the polishing holes on the disk body, it is convenient to take and place the polishing pad and discharge the polishing liquid and impurities in time.

[0004] However, the above-mentioned new type of wafer polishing fixture only relies on the friction between the wafer and the fluff on the adsorption pad to limit the wafer, which has a poor effect. The wafer is easily displaced on the adsorption pad, affecting the polishing effect. In addition, the polishing pad and the adsorption pad are fixed in size and cannot be compatible with the polishing requirements of wafers of different sizes. In the above-mentioned new type of wafer polishing fixture, the wafer is directly placed on the adsorption pad, and the polishing thickness of the wafer cannot be adjusted and controlled. Therefore, the utility model proposes a wafer polishing processing fixture to solve the problems existing in the prior art. Utility Model Content

[0005] In view of the above problems, the purpose of the utility model is to propose a wafer polishing processing fixture, which utilizes the elasticity of the spring to drive the rubber clamping block to move inward to clamp and fix the edge of the wafer, thereby effectively fixing wafers of different sizes, solving the problem that the wafer is directly placed on the adsorption pad and relies on the friction of the fluff, which has poor stability and is incompatible with wafers of different sizes. The height is adjusted by rotating the screw and the threaded hole to drive the lifting ring and the support plate to rise and fall, thereby realizing the control of the wafer polishing height according to needs.

[0006] To achieve the purpose of the utility model, the utility model is implemented through the following technical solutions: a wafer polishing processing fixture, including a disc body, a clamping and limiting mechanism and a height adjustment mechanism, the clamping and limiting mechanism including a polishing hole, a groove, a spring, a rubber clamping block and a guide mechanism, the disc body is surrounded by a polishing hole, the inner side of the polishing hole is surrounded by a groove, a spring is fixedly provided in the groove, a rubber clamping block is fixedly provided on the front side of the spring, a guide mechanism is provided in the groove, and a height adjustment mechanism is provided under the disc body.

[0007] A further improvement is that: the polishing holes are provided in four groups, and the grooves are provided in four groups around.

[0008] A further improvement is that the guiding mechanism comprises a guiding groove, a guiding strip, a limiting ring and a retaining ring; the guiding grooves are symmetrically provided on both sides of the rubber clamping block; the guiding strips are symmetrically fixedly provided at the front end of the inner side of the groove; the guiding strips correspond to the guiding grooves for guiding; a limiting ring is fixedly provided in the groove; and a retaining ring is fixedly provided at the rear end of the rubber clamping block.

[0009] A further improvement is that the limiting rings are arranged in two groups, and the retaining ring is located between the two groups of limiting rings.

[0010] Further improvements are: the height adjustment mechanism includes a bracket, a slide rail, a slider, a lifting ring, a screw, a threaded hole and a support plate, the bracket is fixedly provided around the bottom of the plate body, the bracket is provided with four groups, a slide rail is fixedly provided on the inner side of the bracket, a slider is slidably provided on the slide rail, a lifting ring is fixedly provided between the sliders, screws are symmetrically provided on both sides of the bottom of the plate body for rotation, threaded holes are symmetrically opened on the lifting ring, the screw thread fits through the threaded hole, and a support plate is fixedly provided around the lifting ring.

[0011] A further improvement is that: the support plates are provided with four groups around, and the support plates correspond to the upper and lower positions of the polishing holes.

[0012] A further improvement is that: a drainage hole is provided around the disc body, a guide groove is provided between the drainage hole and the polishing hole, and teeth are fixed around the outer periphery of the disc body.

[0013] The beneficial effects of the utility model are as follows: the utility model utilizes the elasticity of the spring to drive the rubber clamping block to move inward to clamp and fix the edge of the wafer, thereby effectively fixing wafers of different sizes, solving the problem that the wafer is directly placed on the adsorption pad and relies on the friction of the fluff, which has poor stability and is not compatible with wafers of different sizes. The height is adjusted by rotating the screw and the threaded hole to drive the lifting ring and the support plate to lift and lower, thereby realizing the control of the wafer polishing height according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is an overall top view of the utility model;

[0015] Figure 2 It is an enlarged top sectional view of point A of the utility model;

[0016] Figure 3 It is a partial side sectional view of the rubber clamping block of the utility model;

[0017] Figure 4 It is the overall front sectional view of the utility model;

[0018] Figure 5 It is a top view of the lifting ring of the utility model.

[0019] Among them: 1. disk body; 2. polishing hole; 3. groove; 4. spring; 5. rubber clamping block; 6. guide groove; 7. guide strip; 8. limit ring; 9. retaining ring; 10. bracket; 11. slide rail; 12. slider; 13. lifting ring; 14. screw; 15. threaded hole; 16. support plate; 17. drainage hole; 18. guide groove; 19. teeth. DETAILED DESCRIPTION

[0020] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with an embodiment. The embodiment is only used to explain the present invention and does not constitute a limitation on the protection scope of the present invention.

[0021] according to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5As shown, the present embodiment provides a wafer polishing fixture, including a disc body 1, a clamping and limiting mechanism and a height adjustment mechanism, the clamping and limiting mechanism including a polishing hole 2, a groove 3, a spring 4, a rubber clamping block 5 and a guide mechanism, the disc body 1 is surrounded by a polishing hole 2, and the polishing hole 2 is provided with four groups, the inner side of the polishing hole 2 is surrounded by a groove 3, and the groove 3 is provided with four groups, a spring 4 is fixedly provided in the groove 3, a rubber clamping block 5 is fixedly provided in front of the spring 4, a guide mechanism is provided in the groove 3, and a height adjustment mechanism is provided under the disc body 1. When in use, a wafer is placed in the polishing hole 2, the wafer is pressed down to squeeze the rubber clamping block 5, and the spring 4 is used to elastically drive the rubber clamping block 5 to clamp and fix the wafer, and at the same time, the support disc 16 is contacted and supported at the bottom of the wafer, thereby effectively improving the stability of the wafer during polishing, solving the problem that the limiting effect of the wafer is poor only by the friction force of the fluff on the adsorption pad during wafer polishing, and effectively avoiding the displacement of the wafer during polishing.

[0022] The guiding mechanism includes a guiding groove 6, a guiding strip 7, a limiting ring 8 and a retaining ring 9. The rubber clamping block 5 is symmetrically provided with guiding grooves 6 on both sides. The guide strips 7 are symmetrically fixed on the front end of the inner side of the groove 3. The guide strips 7 correspond to the guide groove 6 for guiding. A limiting ring 8 is fixed in the groove 3. A retaining ring 9 is fixed at the rear end of the rubber clamping block 5. Two groups of limiting rings 8 are arranged. The retaining ring 9 is located between the two groups of limiting rings 8. The limiting ring 8 is used to limit the retaining ring 9, so as to limit the moving range of the rubber clamping block 5, so as to effectively prevent the spring 4 from being over-compressed to generate a large rebound force to damage the wafer. When the rubber clamping block 5 moves under the elastic push of the spring 4, it slides along the guide strip 7 driven by the guiding groove 6, so that the rubber clamping block 5 remains stable.

[0023] The height adjustment mechanism includes a bracket 10, a slide rail 11, a slider 12, a lifting ring 13, a screw 14, a threaded hole 15 and a support plate 16. The bracket 10 is fixed around the bottom of the plate body 1. The bracket 10 is provided with four groups. The inner side of the bracket 10 is matched with a slide rail 11. The slide rail 11 is slidably provided with a slider 12. The lifting ring 13 is fixed between the sliders 12. The bottom of the plate body 1 is symmetrically rotated with screws 14. The lifting ring 13 is symmetrically provided with threaded holes 15. The screw 14 is threaded through the threaded hole 15. The lifting ring 13 is fixed with a support plate around it. 16, four groups of supporting plates 16 are arranged around, and the upper and lower positions of the supporting plates 16 correspond to the polishing holes 2. When polishing wafers of different thicknesses, the screws 14 on both sides of the bottom of the plate body 1 are rotated as needed, and the screws 14 and the threaded holes 15 cooperate to drive the lifting ring 13 to be lifted and adjusted. The lifting and lowering of the lifting ring 13 drives the slider 12 to slide along the slide rail 11 at the same time, so that the lifting ring 13 remains stable, and the lifting ring 13 drives the supporting plate 16 to be lifted and lowered to adjust the supporting position of the wafer, thereby solving the problem that the polishing thickness of the wafer cannot be adjusted when the wafer is placed on the adsorption pad.

[0024] A drainage hole 17 is arranged around the disk body 1, a guide groove 18 is arranged between the drainage hole 17 and the polishing hole 2, and teeth 19 are fixed around the outer periphery of the disk body 1. The guide groove 18 and the drainage hole 17 are effective for draining the polishing liquid to prevent the polishing edge from staying on the wafer for a long time and causing excessive corrosion.

[0025] When the wafer polishing fixture is in use, the screw rod is rotated according to the polishing height requirement to cooperate with the thread of the threaded hole to drive the lifting ring and the supporting plate to rise and fall and adjust. At the same time, the slider slides along the slide rail with the lifting ring to keep the lifting ring stable. After the adjustment is completed, the wafer is placed in the polishing hole and the wafer is pressed down to the top of the supporting plate to squeeze the rubber clamping block to compress the spring. The rebound force of the spring is used to clamp and fix the edge of the wafer. The movement of the rubber clamping block drives the retaining ring to move at the same time, and the limit ring cooperates with the retaining ring to limit the moving range of the rubber clamping block. When polishing, the guide groove guides excess polishing liquid to the drain hole for discharge.

[0026] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer polishing fixture, characterized in that: The invention comprises a disk body (1), a clamping and limiting mechanism and a height adjustment mechanism, wherein the clamping and limiting mechanism comprises a polishing hole (2), a groove (3), a spring (4), a rubber clamping block (5) and a guide mechanism, wherein the disk body (1) is provided with a polishing hole (2) around the top, a groove (3) is provided around the inner side of the polishing hole (2), a spring (4) is fixedly provided in the groove (3), a rubber clamping block (5) is fixedly provided in front of the spring (4), a guide mechanism is provided in the groove (3), and a height adjustment mechanism is provided below the disk body (1).

2. The wafer polishing fixture according to claim 1, characterized in that: The polishing holes (2) are provided in four groups, and the grooves (3) are provided in four groups around them.

3. The wafer polishing fixture according to claim 1, characterized in that: The guide mechanism comprises a guide groove (6), a guide strip (7), a limit ring (8) and a retaining ring (9); the guide grooves (6) are symmetrically provided on both sides of the rubber clamping block (5); the guide strips (7) are symmetrically fixedly provided at the front end of the inner side of the groove (3); the guide strips (7) and the guide grooves (6) are positioned correspondingly for guidance; a limit ring (8) is fixedly provided in the groove (3); and the retaining ring (9) is fixedly provided at the rear end of the rubber clamping block (5).

4. The wafer polishing fixture according to claim 3, characterized in that: The limiting rings (8) are arranged in two groups, and the retaining ring (9) is located between the two groups of limiting rings (8).

5. The wafer polishing fixture according to claim 1, characterized in that: The height adjustment mechanism comprises a bracket (10), a slide rail (11), a slider (12), a lifting ring (13), a screw (14), a threaded hole (15) and a support plate (16); the bracket (10) is fixedly provided around the bottom of the plate body (1); the bracket (10) is provided with four groups; a slide rail (11) is fixedly provided inside the bracket (10); a slider (12) is slidably provided on the slide rail (11); a lifting ring (13) is fixedly provided between the sliders (12); screw rods (14) are symmetrically provided on both sides of the bottom of the plate body (1) for rotation; threaded holes (15) are symmetrically provided on the lifting ring (13); the screw rods (14) are threadedly provided to pass through the threaded holes (15); and a support plate (16) is fixedly provided around the lifting ring (13).

6. The wafer polishing fixture according to claim 5, characterized in that: Four groups of the support plates (16) are arranged around the support plates (16), and the upper and lower positions of the support plates (16) correspond to the polishing holes (2).

7. The wafer polishing fixture according to claim 1, characterized in that: A drainage hole (17) is provided around the disk body (1), a guide groove (18) is provided between the drainage hole (17) and the polishing hole (2), and teeth (19) are fixed around the periphery of the disk body (1).

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