Novel pre-plastic-packaged lead frame

Abstract

The utility model relates to the technical field of lead frames, and discloses a novel pre-plastic-packaged lead frame, a lead frame body is fixedly connected with a substrate, the substrate is provided with a heat dissipation hole I, the lead frame body is provided with a first pin, the lead frame body is provided with a middle side pin, and the middle side pin is provided with a second pin. The lead frame body is provided with a first pin, a middle side pin and a second pin, the lead frame body is provided with a transverse rib, and the transverse rib is communicated with the middle of the first pin, the middle side pin and the second pin. According to the utility model, the pull ring is pulled to enable the sliding block to move so as to extrude the spring, the lead frame body is placed on the placing plate, and the pulled pull ring is loosened to enable the sliding block to drive the clamping plate to move so as to clamp the lead frame body, so that the lead frame body is more convenient to clamp and position when plastic packaging is carried out on a chip; the lead frame body is prevented from falling off due to instability during chip installation, and the stability during chip installation of the pre-plastic-packaged lead frame can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a novel pre-plastic-sealed lead frame. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect to external wires. Plastic-encapsulated lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] The existing technology has the following deficiencies: the existing lead frame is not easy to fix when installing the chip, which makes the position of the chip easily deviate during installation, thereby affecting the stability of the chip installed on the pre-plastic lead frame. The traditional lead frame has poor corrosion resistance and does not have anti-static effect. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a novel pre-plastic-sealed lead frame.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a new type of pre-plastic-sealed lead frame, including a placement plate, characterized in that: a slide groove is provided on the placement plate, a sliding block is slidably connected in the slide groove, a spring is fixedly connected to one side of the sliding block, and the side of the spring away from the sliding block is fixedly connected in the slide groove, a clamping plate is fixedly connected to the sliding block, a pull ring is fixedly connected to the clamping plate, a lead frame body is fittedly connected to the clamping plate, two heat dissipation holes are provided on the lead frame body, a substrate is fixedly connected to the lead frame body, a heat dissipation hole is provided on the substrate, a first pin is provided on the lead frame body, a middle side pin is provided on the lead frame body, a second pin is provided on the lead frame body, and a transverse rib is provided on the lead frame body, and the transverse rib is communicated with the middle of the first pin, the middle side pin and the second pin.

[0006] As a further description of the above technical solution:

[0007] The slide grooves, the clamping plates and the pull rings are each provided with two groups and are symmetrically arranged, and the springs and the sliding blocks are each provided with four groups.

[0008] As a further description of the above technical solution:

[0009] The second heat dissipation holes are provided in two groups and are symmetrically arranged, the first heat dissipation holes are provided in two groups and are symmetrically arranged, and the first pins, the middle side pins, the second pins, and the transverse ribs are provided in two groups and are symmetrically arranged.

[0010] As a further description of the above technical solution:

[0011] The outermost layer of the substrate is provided with a solder layer.

[0012] As a further description of the above technical solution:

[0013] The lower surface of the placement plate is fixedly connected with support legs, and the support legs are provided in four groups and arranged around the lower surface of the placement plate.

[0014] As a further description of the above technical solution:

[0015] The lead frame body is composed of a conductive layer, an insulating layer, an antistatic layer, and an anticorrosion layer. The lower surface of the conductive layer is fixedly connected to the insulating layer, the lower surface of the insulating layer is fixedly connected to the antistatic layer, and the lower surface of the antistatic layer is fixedly connected to the anticorrosion layer.

[0016] As a further description of the above technical solution:

[0017] The insulating layer is arranged between the conductive layer and the antistatic layer, and the antistatic layer is arranged between the insulating layer and the anti-corrosion layer.

[0018] As a further description of the above technical solution:

[0019] The conductive layer is composed of a copper alloy material, the insulating layer is composed of a mixture of nylon and polyester materials, the antistatic layer is composed of a mixture of polyolefin materials, and the anti-corrosion layer is composed of a mixture of stainless steel and titanium alloy materials.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, the pull ring is pulled to move the sliding block to squeeze the spring, and the lead frame body is placed on the placement plate. The pulled pull ring is released to move the sliding block with the clamping plate to clamp the lead frame body, so that the lead frame body is easier to clamp and position when the chip is plastic-sealed, and the lead frame body is prevented from being unstable and falling off when the chip is installed, which can effectively improve the stability of the pre-plastic-sealed lead frame chip during installation.

[0022] 2. In the utility model, the antistatic layer is mixed with polyolefin materials, so that the placement board can absorb and conduct static charges to prevent static electricity from damaging electronic components. It can effectively isolate and absorb static charges to ensure the safe operation of electronic components, making it difficult for the placement board to generate static electricity and affect the chip, thereby improving the stability of chip operation.

[0023] 3. In the utility model, the anti-corrosion layer is made of a mixture of stainless steel and titanium alloy materials, so that the placement plate has excellent corrosion resistance, chemical stability and mechanical strength, and can protect the internal conductive layer from erosion by external corrosive media, thereby extending the service life of the placement plate and greatly improving the anti-corrosion performance of the placement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a three-dimensional structural schematic diagram of a novel pre-plastic-sealed lead frame proposed by the utility model;

[0025] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0026] Figure 3 An exploded view of a novel pre-plastic encapsulated lead frame proposed by the utility model;

[0027] Figure 4 This is a schematic diagram of the layer structure of the lead frame body proposed by the utility model.

[0028] Legend:

[0029] 1. Placement plate; 2. Lead frame body; 3. Slide groove; 4. Sliding block; 5. Spring; 6. Clamping plate; 7. Pull ring; 8. Substrate; 9. Heat dissipation hole 1; 10. Heat dissipation hole 2; 11. First pin; 12. Middle side pin; 13. Second pin; 14. Horizontal rib; 15. Support leg; 16. Conductive layer; 17. Insulation layer; 18. Antistatic layer; 19. Anti-corrosion layer. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Reference Figure 1-Figure 4The utility model provides an embodiment: a novel pre-plastic encapsulated lead frame, a placement plate 1, a slide groove 3 is provided on the placement plate 1, a sliding block 4 is slidably connected in the slide groove 3, a spring 5 is fixedly connected to one side of the sliding block 4, and the side of the spring 5 away from the sliding block 4 is fixedly connected in the slide groove 3, a clamping plate 6 is fixedly connected to the sliding block 4, a pull ring 7 is fixedly connected to the clamping plate 6, and a lead frame body 2 is attached to the clamping plate 6. By pulling the pull ring 7, the pull ring 7 brings the clamping plate 6 through the sliding block 4 and moves outward along the slide groove 3, and the sliding block 4 moves to squeeze the spring 5. , put the lead frame body 2 on the placement plate 1, release the pulled pull ring 7, the sliding block 4 moves inward along the slide groove 3 through the reverse thrust of the spring 5, and the sliding block 4 moves with the clamping plate 6 to clamp the lead frame body 2, so that the lead frame body 2 is more convenient to clamp and position when the chip is plastic-sealed, and the lead frame body 2 is prevented from being unstable and falling off when the chip is installed, which can effectively improve the stability of the pre-plastic lead frame chip installation, making the pre-plastic lead frame more convenient for chip installation. The lead frame body 2 is provided with a heat dissipation hole 10, and the lead frame The main body 2 is fixedly connected with a substrate 8, and the substrate 8 is provided with a heat dissipation hole 9, the lead frame main body 2 is provided with a first pin 11, the lead frame main body 2 is provided with a middle side pin 12, the lead frame main body 2 is provided with a second pin 13, the lead frame main body 2 is provided with a transverse rib 14, and the transverse rib 14 is communicated with the middle of the first pin 11, the middle side pin 12, and the second pin 13, the slide groove 3, the clamping plate 6, and the pull ring 7 are each provided with two groups and are symmetrically arranged, the spring 5 and the sliding block 4 are each provided with four groups, the heat dissipation hole 2 10 is provided with two groups and is symmetrically arranged, and the heat dissipation hole 9 is provided with two groups and is symmetrically arranged. The pre-plastic encapsulated lead frame is arranged so as to be easier to dissipate heat by providing heat dissipation hole 19 and heat dissipation hole 2 10, which can effectively improve the heat dissipation of the pre-plastic encapsulated lead frame. The first pin 11, the middle side pin 12, the second pin 13, and the transverse rib 14 are each provided with two groups and are symmetrically arranged. The outermost layer of the substrate 8 is provided with a solder layer. The outermost layer of the substrate 8 is provided with a solder layer so that the chip can be better welded and conductive. The lower surface of the placement plate 1 is fixedly connected with a support leg 15. The support leg 15 is provided with four groups and is arranged around the lower surface of the placement plate 1, so that the support leg 15 can provide better support.

[0032] The lead frame body 2 is composed of a conductive layer 16, an insulating layer 17, an antistatic layer 18, and an anticorrosion layer 19. The lower surface of the conductive layer 16 is fixedly connected with the insulating layer 17, the lower surface of the insulating layer 17 is fixedly connected with the antistatic layer 18, and the lower surface of the antistatic layer 18 is fixedly connected with the anticorrosion layer 19. The insulating layer 17 is arranged between the conductive layer 16 and the antistatic layer 18, and the antistatic layer 18 is arranged between the insulating layer 17 and the anticorrosion layer 19. The conductive layer 16 is composed of a copper alloy material, the insulating layer 17 is a mixture of nylon and polyester materials, the antistatic layer 18 is a mixture of polyolefin materials, and the anticorrosion layer 19 is a mixture of stainless steel and titanium alloy materials. The conductive layer 16 is composed of a copper alloy material, so that the placement board 1 has high conductivity, good mechanical strength and processing performance, which can ensure the effective connection between the chip and the external circuit. The insulating layer 17 is made of a mixture of nylon and polyester materials, so that the placement board 1 has good insulation performance, barrier performance and mechanical strength, and at the same time ensures electrical isolation between the layers, so that the insulation of the placement board 1 is stronger. The anti-static layer 18 is made of a mixture of polyolefin materials, so that the placement board 1 can absorb and conduct static electricity to prevent static electricity from damaging electronic components. It can effectively isolate and absorb static electricity to ensure the safe operation of electronic components, making it difficult for the placement board 1 to generate static electricity and affect the chip, thereby improving the stability of the chip operation. The anti-corrosion layer 19 is made of a mixture of stainless steel and titanium alloy materials, so that the placement board 1 has excellent corrosion resistance, chemical stability and mechanical strength, and can protect the internal conductive layer 16 from erosion by external corrosive media, thereby extending the service life of the placement board 1 and greatly improving the anti-corrosion performance of the placement board 1.

[0033] Working principle: pull the pull ring 7, the pull ring 7 moves outward along the slide groove 3 with the clamping plate 6 through the sliding block 4, the sliding block 4 moves to squeeze the spring 5, and the lead frame body 2 is placed on the placement plate 1, release the pulled pull ring 7, the sliding block 4 moves inward along the slide groove 3 through the reverse thrust of the spring 5, the sliding block 4 moves with the clamping plate 6 to clamp the lead frame body 2, so that the lead frame body 2 is easier to clamp and position when the chip is plastic-sealed, and the lead frame body 2 is prevented from being unstable and falling off when the chip is installed, which can effectively improve the stability of the pre-plasticized lead frame chip during installation, and make the pre-plasticized lead frame easier to install the chip. The heat dissipation hole 1 9 and the heat dissipation hole 2 10 are provided to make the pre-plasticized lead frame easier to dissipate heat, which can effectively improve the heat dissipation of the pre-plasticized lead frame, and the outermost layer of the substrate 8 is provided with a solder layer so that the chip can be better welded and conductive, and the conductive layer 16 is composed of a copper alloy material The placement board 1 is made of a mixture of nylon and polyester materials, so that the placement board 1 has high conductivity, good mechanical strength and processing performance, and can ensure the effective connection between the chip and the external circuit. The insulating layer 17 is made of a mixture of nylon and polyester materials, so that the placement board 1 has good insulation performance, barrier performance and mechanical strength, and at the same time ensures electrical isolation between the layers, so that the insulation of the placement board 1 is stronger. The anti-static layer 18 is made of a mixture of polyolefin materials, so that the placement board 1 can absorb and conduct static electricity to prevent static electricity from damaging electronic components. It can effectively isolate and absorb static electricity to ensure the safe operation of electronic components, and make it difficult for the placement board 1 to generate static electricity and affect the chip, thereby improving the stability of the chip operation. The anti-corrosion layer 19 is made of a mixture of stainless steel and titanium alloy materials, so that the placement board 1 has excellent corrosion resistance, chemical stability and mechanical strength, and can protect the internal conductive layer 16 from erosion by external corrosive media, thereby extending the service life of the placement board 1 and greatly improving the anti-corrosion performance of the placement board 1.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel pre-molded lead frame, comprising a placement plate (1), characterized in that: The placement plate (1) is provided with a slide groove (3), a sliding block (4) is slidably connected in the slide groove (3), a spring (5) is fixedly connected to one side of the sliding block (4), a side of the spring (5) away from the sliding block (4) is fixedly connected to the slide groove (3), a clamping plate (6) is fixedly connected to the sliding block (4), a pull ring (7) is fixedly connected to the clamping plate (6), a lead frame body (2) is attached to the clamping plate (6), and a heat dissipation hole (10) is provided on the lead frame body (2). ), a substrate (8) is fixedly connected to the lead frame body (2), a heat dissipation hole (9) is provided on the substrate (8), a first pin (11) is provided on the lead frame body (2), a middle side pin (12) is provided on the lead frame body (2), a second pin (13) is provided on the lead frame body (2), and a transverse rib (14) is provided on the lead frame body (2), and the transverse rib (14) is communicated with the middle of the first pin (11), the middle side pin (12), and the second pin (13).

2. The novel pre-plastic encapsulated lead frame according to claim 1, characterized in that: The slide groove (3), the clamping plate (6), and the pull ring (7) are each provided with two groups and are symmetrically arranged, and the spring (5) and the sliding block (4) are each provided with four groups.

3. The novel pre-plastic encapsulated lead frame according to claim 1, characterized in that: The second heat dissipation hole (10) is provided with two groups and is symmetrically arranged, the first heat dissipation hole (9) is provided with two groups and is symmetrically arranged, and the first tube pin (11), the middle side tube pin (12), the second tube pin (13), and the transverse rib (14) are all provided with two groups and are symmetrically arranged.

4. The novel pre-molded lead frame according to claim 1, characterized in that: The outermost layer of the substrate (8) is provided with a solder layer.

5. The novel pre-plastic encapsulated lead frame according to claim 1, characterized in that: The lower surface of the placement plate (1) is fixedly connected with support legs (15), and the support legs (15) are provided in four groups and arranged around the lower surface of the placement plate (1).

6. The novel pre-plastic encapsulated lead frame according to claim 1, characterized in that: The lead frame body (2) is composed of a conductive layer (16), an insulating layer (17), an antistatic layer (18), and an anticorrosion layer (19); the lower surface of the conductive layer (16) is fixedly connected to the insulating layer (17); the lower surface of the insulating layer (17) is fixedly connected to the antistatic layer (18); and the lower surface of the antistatic layer (18) is fixedly connected to the anticorrosion layer (19).

7. The novel pre-molded lead frame according to claim 6, characterized in that: The insulating layer (17) is arranged between the conductive layer (16) and the antistatic layer (18), and the antistatic layer (18) is arranged between the insulating layer (17) and the anticorrosion layer (19).

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