Antenna assembly and electric equipment
By designing multi-layer antenna components arranged in stacks and enabling feed connections through circuit boards, the problem of small coverage of existing antenna bands is solved, and the coverage of multi-bands is achieved, and functions and applicability are improved.
Patent Information
- Application Number
- CN202421568125.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-07-03
AI Technical Summary
The frequency band coverage of existing antennas is small, the functions are relatively single, and there are limitations in use, making it difficult to meet the needs of multi-bands.
An antenna assembly is designed, including a stacked top-layer antenna, an intermediate-layer antenna and a circuit board, and a circuit board, to achieve multi-band coverage through feed connections. The top-layer antenna covers the downlink S-band of Beidou short messages, the middle-layer antenna covers the GNSS high-frequency band and the uplink L-band of Beidou short messages, and the bottom-layer antenna covers the GNSS low-frequency band.
It realizes the coverage of antenna components to multiple frequency bands, has more comprehensive functions and a wider range of applications, and has the advantages of simple structure and high integration.
Smart Images

Figure CN222735352U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of antenna technology, and in particular, to an antenna assembly and an electrical device. Background Art
[0002] With the continuous development of communication technology, antennas are required to support more frequency bands. In related technologies, due to the limitations of the existing structure of the antenna, the existing antenna frequency band coverage is small, the function is relatively single, and there are certain limitations in use. Therefore, how to make the antenna cover more frequency bands and improve applicability has become the research goal of industry insiders. Utility Model Content
[0003] The purpose of the present disclosure is to provide an antenna assembly and an electrical device, wherein the antenna assembly can cover more frequency bands, has more comprehensive functions, a wider range of applications, and has the advantages of simple structure and high integration.
[0004] In order to achieve the above-mentioned purpose, the first aspect of the present disclosure provides an antenna assembly, including an antenna body, the antenna body including a top layer antenna, a middle layer antenna, a bottom layer antenna and a circuit board stacked along a first direction; the top layer antenna feed is connected to the circuit board, and the working frequency band of the top layer antenna covers a first transceiver frequency band, and the first transceiver frequency band includes the downlink S band of Beidou short messages; the middle layer antenna feed is connected to a first 3db bridge chip on the circuit board, and the working frequency band of the middle layer antenna covers a second transceiver frequency band, and the second transceiver frequency band includes a GNSS high frequency band and an uplink L band of Beidou short messages; the bottom layer antenna feed is connected to a second 3db bridge chip on the circuit board, and the working frequency band of the bottom layer antenna covers a third transceiver frequency band, and the third transceiver frequency band includes a GNSS low frequency band.
[0005] Optionally, the GNSS low frequency band includes an L5 frequency band and a B2 frequency band, and the GNSS high frequency band includes an L1 frequency band, a B1 frequency band and a G1 frequency band.
[0006] Optionally, a first feeding point is provided on the top layer antenna, and the first feeding point is connected to the single-point feeding of the circuit board; and / or two second feeding points are provided on the middle layer antenna, and the two second feeding points are connected to the dual-point feeding of the first 3db bridge chip; and / or two third feeding points are provided on the bottom layer antenna, and the two third feeding points are connected to the dual-point feeding of the second 3db bridge chip.
[0007] Optionally, the first feeding point is arranged coaxially with the central axis of the antenna body along the center line of the first direction, and the two second feeding points and the two third feeding points are arranged at circumferential intervals around the center line of the first feeding point.
[0008] Optionally, the top layer antenna includes a first radiating layer and a first dielectric substrate arranged in a stacked manner, the first radiating layer is provided with the first feeding point, and the first feeding point is connected to a single-point feeding connection with the lower surface of the circuit board through a first feeding probe that passes through the first dielectric substrate, the middle layer antenna, the bottom layer antenna and the circuit board.
[0009] Optionally, a plurality of cut-angle structures are provided on the first edge of the first radiation layer, and the plurality of cut-angle structures are symmetrically arranged about the center point of the first radiation layer; and / or a notch structure is formed on the first radiation layer, extending from the upper surface of the first radiation layer to the side where the lower surface of the first radiation layer is located.
[0010] Optionally, the middle layer antenna includes a second radiating layer and a second dielectric substrate arranged in a stacked manner, the second radiating layer is provided with the two second feeding points, and the two second feeding points are connected to a first 3db bridge chip dual-point feeding arranged on the lower surface of the circuit board through two second feeding probes that penetrate the second dielectric substrate, the bottom layer antenna and the circuit board.
[0011] Optionally, a plurality of groups of first tooth structures are provided on the second edge of the second radiation layer, and the plurality of groups of first tooth structures are symmetrically arranged about a center point of the second radiation layer.
[0012] Optionally, each group of the first tooth structures includes a plurality of first tooth monomers arranged at equal intervals along the second edge.
[0013] Optionally, the bottom layer antenna includes a third radiation layer and a third dielectric substrate arranged in a stacked manner, the two third feeding points are arranged on the third radiation layer, and the two third feeding points are connected to the second 3db bridge chip dual-point feeding arranged on the lower surface of the circuit board through two third feeding probes penetrating the third dielectric substrate and the circuit board.
[0014] Optionally, a plurality of groups of second tooth structures are provided on the third edge of the third radiation layer, and the plurality of groups of second tooth structures are symmetrically arranged about a center point of the third radiation layer.
[0015] Optionally, each group of the second tooth-like structures includes a plurality of second tooth-like monomers arranged at equal intervals along the third edge.
[0016] Optionally, the thickness of the antenna body along the first direction is 8-12 mm; the length of the antenna body along the second direction is 45-50 mm; the width of the antenna body along the third direction is 45-50 mm; wherein the second direction and the third direction are perpendicular to each other, and the plane in which the second direction and the third direction are located is perpendicular to the first direction.
[0017] Optionally, the top layer antenna, the middle layer antenna and the bottom layer antenna are all ceramic patch antennas.
[0018] A second aspect of the present disclosure provides an electric device, comprising the antenna assembly as described above.
[0019] Through the above technical solution, that is, the antenna assembly provided by the present disclosure, the antenna assembly has a higher degree of integration and is easy to install and manufacture by constructing the antenna body to include a stacked top layer antenna, a middle layer antenna, a bottom layer antenna and a circuit board. And because the top layer antenna feed is connected to the circuit board, signal processing and transceiver can be realized through, for example, a radio frequency chip on the circuit board, so that the working frequency band of the top layer antenna can cover the first transceiver frequency band including the downlink S frequency band of the Beidou short message; the middle layer antenna feed is connected to the first 3db bridge chip on the circuit board, and the first 3db bridge chip can output two high-precision signals of equal amplitude and a phase difference of 90°, so that the working frequency band of the middle layer antenna can cover the second transceiver frequency band including the GNSS high frequency band and the uplink L frequency band of the Beidou short message; the bottom layer antenna feed is connected to the second 3db bridge chip on the circuit board, and the second 3db bridge chip can also output high-precision signals, so that the working frequency band of the bottom layer antenna can cover the third transceiver frequency band including the GNSS low frequency band, so that the antenna assembly can not only support the high-precision navigation and positioning functions of the high and low frequency bands of GNSS (satellite navigation system), but also support the transceiver function of Beidou short messages, with more comprehensive functions and a wider range of applications. Therefore, the antenna assembly provided by the present disclosure can cover more frequency bands, has more comprehensive functions, a wider range of applications, and has the advantages of simple structure and high integration.
[0020] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0022] Figure 1 is a schematic structural diagram of an antenna assembly provided in an exemplary embodiment of the present disclosure;
[0023] Figure 2 is a top view of an antenna assembly provided in an exemplary embodiment of the present disclosure;
[0024] Figure 3 is a side view of an antenna assembly provided in an exemplary embodiment of the present disclosure;
[0025] Figure 4 is a schematic diagram of a circuit combining circuit of a second 3db bridge chip provided in an exemplary embodiment of the present disclosure;
[0026] Figure 5 is a schematic diagram of a circuit combining circuit of a first 3db bridge chip provided in an exemplary embodiment of the present disclosure;
[0027] Figure 6 is a diagram of the aperture phase error of the bottom antenna in the low frequency band (1176 MHz) provided in an exemplary embodiment of the present disclosure;
[0028] Figure 7 3 is a diagram of the aperture phase error of the intermediate layer antenna provided in the exemplary embodiment of the present disclosure in the high frequency band (1575 MHz).
[0029] Description of Reference Numerals
[0030] 1-antenna body; 110-top antenna; 111-first feeding point; 112-first radiating layer; 1121-first edge; 1122-corner structure; 1123-notch structure; 113-first dielectric substrate; 120-middle layer antenna; 121-second feeding point; 122-second radiating layer; 1221-second edge; 1222-first tooth structure; 1223-first tooth monomer; 123-second dielectric substrate; 130-bottom antenna; 131-third feeding point point; 132-third radiation layer; 1321-third edge; 1322-second tooth structure; 1323-second tooth monomer; 133-third dielectric substrate; 140-circuit board; 141-first 3db bridge chip; 1411-first input port; 1412-first output port; 142-second 3db bridge chip; 1421-second input port; 1422-second output port; 2-first feeding probe; 3-second feeding probe; 4-third feeding probe; 5-load. DETAILED DESCRIPTION
[0031] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0032] It should be noted that all actions of acquiring signals, information or data in the present disclosure are carried out in compliance with the relevant data protection laws and policies of the country where the device is located and with the authorization given by the owner of the corresponding device.
[0033] In the present disclosure, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the antenna assembly in space when the antenna assembly is in use. "Inside" and "outside" refer to the inside and outside relative to the outline of the component or structure itself. In addition, it should be noted that the terms used, such as "first" and "second", etc., are used to distinguish one element from another and do not have order or importance. In addition, in the description of the reference drawings, the same mark in different drawings represents the same element.
[0034] According to a first aspect of the present disclosure, there is provided an antenna assembly, referring to Figures 1 to 5 As shown, the antenna assembly includes an antenna body 1, which includes a top layer antenna 110, a middle layer antenna 120, a bottom layer antenna 130 and a circuit board 140 stacked along a first direction; the top layer antenna 110 is fed and connected to the circuit board 140, and the working frequency band of the top layer antenna 110 covers the first transceiver frequency band, and the first transceiver frequency band includes the downlink S band of the Beidou short message; the middle layer antenna 120 is fed and connected to the first 3db bridge chip 141 on the circuit board 140, and the working frequency band of the middle layer antenna 120 covers the second transceiver frequency band, and the second transceiver frequency band includes the GNSS high frequency band and the uplink L band of the Beidou short message; the bottom layer antenna 130 is fed and connected to the second 3db bridge chip 142 on the circuit board 140, and the working frequency band of the bottom layer antenna 130 covers the third transceiver frequency band, and the third transceiver frequency band includes the GNSS low frequency band.
[0035] Through the above technical solution, that is, the antenna assembly provided by the present disclosure, the antenna assembly is constructed by constructing the antenna body 1 to include a stacked top antenna 110, a middle antenna 120, a bottom antenna 130 and a circuit board 140, which has a higher degree of integration and is easy to install and manufacture. And because the top antenna 110 is fed and connected to the circuit board 140, the signal processing and transceiving can be realized through, for example, a radio frequency chip (not shown) on the circuit board 140, so that the working frequency band of the top antenna 110 can cover the first transceiver frequency band including the downlink S band of the Beidou short message; the middle antenna 120 is fed and connected to the first 3db bridge chip 141 on the circuit board 140, and the first 3db bridge chip 141 can output two high-precision signals of equal amplitude and 90° phase difference, so that the working frequency band of the middle antenna 120 can cover the G The bottom antenna 130 is fed with a second 3db bridge chip 142 connected to the circuit board 140, and can also output a high-precision signal through the second 3db bridge chip 142, so that the working frequency band of the bottom antenna 130 can cover the third transceiver frequency band including the GNSS low frequency band, so that the antenna assembly can not only support the high-precision navigation and positioning functions of the GNSS (satellite navigation system) high and low frequency bands, but also support the transceiver function of the Beidou short message, with more comprehensive functions and a wider range of applications. Therefore, the antenna assembly provided by the present disclosure can cover more frequency bands, has more comprehensive functions, a wider range of applications, and has the advantages of simple structure and high integration.
[0036] The first direction mentioned above can refer to Figure 3 The up and down direction of the middle figure. In addition, it should be noted that Beidou short message refers to the short message communication of the Beidou system, which means that the Beidou ground terminal and Beidou satellite and Beidou ground monitoring station can directly transmit information in both directions through satellite signals. The communication uses short messages (similar to mobile phone text messages) as the basic transmission unit, which is a functional feature of the Beidou satellite navigation system. And because Beidou short messages have the advantages of wide coverage area and high success rate, they are particularly suitable for use in places where ground mobile communications are difficult to cover. Based on the three basic services of location reporting, emergency search and rescue, and message communication, the application development focuses on SMS Internet of Things, mass consumption and life safety business directions. In addition, the frequency band range of the downlink (air-to-ground) S band of the Beidou short message is usually, for example, 2483.5~2500MHz or 2491.75±4.08MHz, and the frequency band range of the uplink (ground-to-air) L band of the Beidou short message is usually, for example, 1610~1626.5MHz or 1615.68±4.08MHz.
[0037] In addition, the above-mentioned GNSS low frequency band may include the L5 (also E5a or B2a) frequency band and the B2 (also E5b or B2b) frequency band, wherein the L5 frequency band is 1176MHz and the B2 frequency band is 1207MHz. In addition, the above-mentioned GNSS high frequency band may include the L1 (also E1 or B1C) frequency band, the B1 frequency band and the G1 frequency band, wherein the L1 frequency band is 1575MHz, the B1 frequency band is 1561MHz, and the G1 frequency band is 1602MHz, thereby ensuring that the antenna assembly can cover more frequency bands, with more comprehensive functions and a wider range of applications. Of course, it is not limited to the specific embodiments of the above-mentioned frequency bands. Those skilled in the art can adaptively design the specific shape profile or structural dimensions of the antenna body 1 according to actual application requirements to enable the antenna assembly to cover more frequency bands.
[0038] In some embodiments, reference Figures 1 to 3 As shown, the top layer antenna 110 may be provided with a first feeding point 111, and the first feeding point 111 is connected to the circuit board 140 for single-point feeding. For example, the top layer antenna 110 may include a first radiating layer 112 and a first dielectric substrate 113 stacked in a first direction, and the first radiating layer 112 is provided with a first feeding point 111, and the first feeding point 111 is connected to the lower surface of the circuit board 140 for single-point feeding through a first feeding probe 2 that penetrates the first dielectric substrate 113, the middle layer antenna 120, the bottom layer antenna 130, and the circuit board 140. For example, the first feeding probe 2 may be connected to the circuit board 140 for single-point feeding. For example, a single-point feeding connection is made to an RF chip on the lower surface of the board 140, and the functions of signal processing, receiving and transmitting, and amplification are realized through an active circuit arranged on the lower surface of the circuit board 140. Since the arrangement of the above-mentioned RF chip and the active circuit and the specific working principle can refer to the arrangement of the existing antenna active circuit, the present disclosure will not go into details here. The purpose is to ensure that after the top-layer antenna 110 is connected to the circuit board 140 with a single-point feeding connection, the working frequency band of the top-layer antenna 110 can cover the first receiving and transmitting frequency band including the downlink S band of the Beidou short message.
[0039] Optionally, in some embodiments, reference Figure 1 and Figure 2 As shown, a plurality of cut-angle structures 1122 may be provided on the first edge 1121 of the first radiation layer 112, and the plurality of cut-angle structures 1122 are symmetrically arranged about the center point of the first radiation layer 112. For example, as Figure 2 As shown, the cut-angle structure 1122 can be arranged into two and symmetrically arranged about the center point of the first radiation layer 112, so that the top-layer antenna 110 can receive right-hand circularly polarized signals with low axial ratio. This right-hand circularly polarized signal can be used for example in the downlink (air-to-ground) S band of the Beidou short message at 2492MHz.
[0040] It should be noted that the center point of the first radiation layer 112 may be, for example, the geometric center of the first radiation layer 112. In addition, the present disclosure does not specifically limit the structural characteristic dimensions of the above-mentioned cut-angle structure 1122, and those skilled in the art may design it adaptively according to actual application requirements. For example, by adjusting the structural characteristic dimensions of the cut-angle structure 1122, the working frequency band of the top antenna 110 can cover the downlink (air-to-ground) S band of the Beidou short message in different frequency bands. In addition, the above-mentioned cut-angle structure 1122 may be, for example, a chamfered structure or a rounded structure, and the present disclosure does not specifically limit such deformation methods, and those skilled in the art may design it adaptively according to actual application requirements.
[0041] In addition, in some embodiments, reference Figure 1 and Figure 2 As shown, a notch structure 1123 extending from the upper surface of the first radiation layer 112 to the side where the lower surface of the first radiation layer 112 is located can be formed on the first radiation layer 112 to adjust the coupling characteristics of the top-layer antenna 110, thereby increasing the bandwidth of the top-layer antenna 110 and enabling the working frequency band of the top-layer antenna 110 to cover a wider frequency band range, which is beneficial to improving the working efficiency and application scope of the antenna assembly.
[0042] Among them, the present disclosure does not specifically limit the structural characteristic size of the above-mentioned notch structure 1123, and those skilled in the art can adaptively design it according to actual application requirements. For example, by adjusting the structural characteristic size of the notch structure 1123, the working frequency band of the top antenna 110 can cover the downlink (air-to-ground) S band of the Beidou short message in different frequency bands. In addition, the above-mentioned notch structure 1123 can be, for example, a circular gap, a U-shaped gap, or a V-shaped gap, etc. The present disclosure does not specifically limit such deformation methods, and those skilled in the art can adaptively design it according to actual application requirements.
[0043] In some embodiments, reference Figures 1 to 3 As shown, two second feeding points 121 may be provided on the middle layer antenna 120, and the two second feeding points 121 are connected to the first 3db bridge chip 141 for dual-point feeding. For example, the middle layer antenna 120 may include a second radiation layer 122 and a second dielectric substrate 123 stacked along a first direction, and two second feeding points 121 are provided on the second radiation layer 122. The two second feeding points 121 are connected to the first 3db bridge chip 141 provided on the lower surface of the circuit board 140 for dual-point feeding through two second feeding probes 3 that penetrate the second dielectric substrate 123, the bottom layer antenna 130 and the circuit board 140, for example. Figure 5As shown, the two second feeding probes 3 can be respectively connected to the two first input ports 1411 of the first 3db bridge chip 141 on the lower surface of the circuit board 140 for feeding, so that the two second feeding probes 3 are combined through the first 3db bridge chip 141, so that two high-precision signals with equal amplitude and a phase difference of 90° can be output from the two first output ports 1412 of the first 3db bridge chip 141, that is, a right-hand circularly polarized signal and a left-hand circularly polarized signal, wherein the left-hand circularly polarized signal can be used for example in the uplink (ground-to-air) L-band of the Beidou short message of 1616MHz, and the right-hand circularly polarized signal can be used for example in the GNSS high frequency band of 1575MHz, and as shown Figure 7 It can be seen from the aperture phase error diagram of the intermediate layer antenna 120 in the high frequency band (1575MHz) that the high frequency band of the intermediate layer antenna 120 meets the requirements of a high-precision antenna, so that the working frequency band of the intermediate layer antenna 120 can cover the second transceiver frequency band including the GNSS high frequency band and the uplink L band of the Beidou short message.
[0044] Optionally, in some embodiments, reference Figure 1 and Figure 2 As shown, a plurality of groups of first tooth structures 1222 may be provided on the second edge 1221 of the second radiation layer 122, and the plurality of groups of first tooth structures 1222 are symmetrically arranged about the center point of the second radiation layer 122 (for example, the geometric center of the second radiation layer 122). Thus, by adding the first tooth structure 1222 on the second edge 1221 of the second radiation layer 122, the aperture phase accuracy of the intermediate layer antenna 120 can be improved, which is beneficial to ensure that the intermediate layer antenna 120 has a high positioning accuracy and improves the positioning accuracy of the antenna assembly. At the same time, by adding the first tooth structure 1222, the coupling characteristics of the intermediate layer antenna 120 can also be adjusted, thereby increasing the bandwidth of the intermediate layer antenna 120 and improving the axial ratio, so that the working frequency band of the intermediate layer antenna 120 can cover a wider frequency band range, which is beneficial to improving the working efficiency and application range of the antenna assembly.
[0045] In addition, in some embodiments, Figure 1 and Figure 2As shown, each group of first toothed structures 1222 may include a plurality of first toothed monomers 1223 arranged at equal intervals along the second edge 1221, which improves signal uniformity and improves the accuracy of positioning of the antenna assembly. Among them, the present disclosure does not specifically limit the specific arrangement number of the above-mentioned multiple first toothed monomers 1223 and the structural characteristic dimensions of the first toothed monomers 1223. Those skilled in the art can adaptively design according to actual application requirements, with the purpose of improving the positioning accuracy of the antenna assembly, improving the axial ratio and widening the bandwidth. In addition, the above-mentioned first toothed monomer 1223 can be rectangular or semicircular in shape, etc. The present disclosure does not specifically limit such deformation methods, and those skilled in the art can adaptively design according to actual application requirements.
[0046] In some embodiments, reference Figures 1 to 3 As shown, two third feeding points 131 may be provided on the bottom layer antenna 130, and the two third feeding points 131 are connected to the second 3db bridge chip 142 for dual-point feeding. For example, the bottom layer antenna 130 may include a third radiation layer 132 and a third dielectric substrate 133 stacked along a first direction, and two third feeding points 131 are provided on the third radiation layer 132, and the two third feeding points 131 are connected to the second 3db bridge chip 142 provided on the lower surface of the circuit board 140 for dual-point feeding through two third feeding probes 4 penetrating the third dielectric substrate 133 and the circuit board 140, for example, as Figure 4 As shown, the two third feeding probes 4 can be respectively connected to the two second input ports 1421 of the second 3db bridge chip 142 on the lower surface of the circuit board 140 for feeding, so that the two third feeding probes 4 are combined through the second 3db bridge chip 142, so that two high-precision signals with equal amplitude and a phase difference of 90° can be output from the two second output ports 1422 of the second 3db bridge chip 142, that is, a right-hand circularly polarized signal and a left-hand circularly polarized signal, wherein the right-hand circularly polarized signal can be used in the GNSS low frequency band of 1176MHz, for example, and as shown in FIG. Figure 6 It can be seen from the aperture phase error diagram of the bottom layer antenna 130 in the low frequency band (1176MHz) that the low frequency band of the bottom layer antenna 130 meets the requirements of a high-precision antenna. In this way, the working frequency band of the bottom layer antenna 130 can cover the third transceiver frequency band including the GNSS low frequency band, and the left-handed circularly polarized signal can be absorbed by a resistor of, for example, 50ohm as a load 5.
[0047] Optionally, in some embodiments, reference Figure 1 and Figure 2As shown, a plurality of groups of second tooth structures 1322 may be provided on the third edge 1321 of the third radiation layer 132, and the plurality of groups of second tooth structures 1322 are symmetrically arranged about the center point of the third radiation layer 132 (for example, the geometric center of the third radiation layer 132). Thus, by adding the second tooth structure 1322 on the third edge 1321 of the third radiation layer 132, the aperture phase accuracy of the bottom layer antenna 130 can be improved, which is beneficial to ensure that the bottom layer antenna 130 has a high positioning accuracy and improves the positioning accuracy of the antenna assembly. At the same time, by adding the second tooth structure 1322, the coupling characteristics of the bottom layer antenna 130 can also be adjusted, thereby increasing the bandwidth of the bottom layer antenna 130 and improving the axial ratio, so that the working frequency band of the bottom layer antenna 130 can cover a wider frequency band range, which is beneficial to improving the working efficiency and application range of the antenna assembly.
[0048] In addition, in some embodiments, Figure 1 and Figure 2 As shown, each group of second tooth structures 1322 may include a plurality of second toothed monomers 1323 arranged at equal intervals along the third edge 1321, which improves signal uniformity and improves the accuracy of positioning of the antenna assembly. Among them, the present disclosure does not specifically limit the specific arrangement number of the above-mentioned plurality of second toothed monomers 1323 and the structural characteristic dimensions of the second toothed monomers 1323. Those skilled in the art can adaptively design according to actual application requirements, with the purpose of improving the positioning accuracy of the antenna assembly, improving the axial ratio and widening the bandwidth. In addition, the above-mentioned second toothed monomer 1323 may be rectangular or semicircular in shape, etc. The present disclosure does not specifically limit such deformation methods, and those skilled in the art can adaptively design according to actual application requirements.
[0049] It should be noted that the present disclosure does not specifically limit the specific structures of the above-mentioned first 3db bridge chip 141, the second 3db bridge chip 142 and the corresponding combining circuits arranged on the circuit board 140. Those skilled in the art can adaptively design according to the actual application requirements in combination with the existing layout and working principle of the bridge chip and combining circuit. In addition, the present disclosure does not specifically limit the specific structure of the above-mentioned circuit board 140. For example, it can be a PCB board or an FPC board, etc. The purpose is to enable the antenna assembly to support the high-precision navigation and positioning functions of the high and low frequency bands of the GNSS (satellite navigation system), while also supporting the sending and receiving functions of Beidou short messages.
[0050] In some embodiments, reference Figure 2 and Figure 3As shown, the first feeding point 111 can be arranged coaxially with the central axis of the antenna body 1 along the center line of the first direction, and the two second feeding points 121 and the two third feeding points 131 are arranged at intervals around the circumferential direction of the center line of the first feeding point 111, and the structural arrangement is more compact and conducive to saving space. Among them, the present disclosure does not specifically limit the distance between the second feeding point 121 and the third feeding point 131 and the center line of the first feeding point 111, and those skilled in the art can design it adaptively according to actual application requirements.
[0051] In addition, it should be noted that feeding holes can be adaptively opened on the top layer antenna 110, the middle layer antenna 120, the bottom layer antenna 130 and the circuit board 140, so that the first feeding probe 2 welded on the first feeding point 111, the second feeding probe 3 on the second feeding point 121, and the third feeding probe 4 on the third feeding point 131 can pass through the corresponding feeding holes and be connected to the circuit board 140 or the 3db bridge chip on the circuit board 140 for feeding. The structure is simple and easy to install and manufacture.
[0052] In addition, if Figure 3 As shown, the top layer antenna 110, the middle layer antenna 120, the bottom layer antenna 130 and the circuit board 140 stacked along the first direction can be fixedly connected by, for example, adhesive, but the present disclosure is not limited thereto, and the purpose is to ensure stable connection between the layers.
[0053] Of course, it should be noted that the specific embodiment of the single-point feeding connection between the first feeding point 111 of the top-layer antenna 110 and the circuit board 140 is exemplary. In other embodiments not shown in the figure, the first feeding point 111 of the top-layer antenna 110 can also be connected to the circuit board 140 by dual-point feeding, so as to improve the signal accuracy. In addition, the dual-point feeding connection between the second feeding point 121 of the middle-layer antenna 120 and the first 3db bridge chip 141 and the dual-point feeding connection between the third feeding point 131 of the bottom-layer antenna 130 and the second 3db bridge chip 142 are also exemplary. Those skilled in the art can also use, for example, a four-point feeding connection to perform feeding connection according to actual application requirements to improve signal accuracy. The present disclosure is not limited to this.
[0054] In some embodiments, reference Figure 2 and Figure 3As shown, the thickness dimension of the antenna body 1 along the first direction can be 8-12mm, the length dimension of the antenna body 1 along the second direction can be 45-50mm, and the width dimension of the antenna body 1 along the third direction can be 45-50mm. By way of example, the thickness dimension of the antenna body 1 is, for example, 10mm, the length dimension is, for example, 48mm, and the width dimension is, for example, 48mm, so that the overall structural dimension of the antenna body 1 is small, space is saved, and the manufacturing cost is lower, so that the antenna assembly can be better arranged in antennas such as vehicle-mounted antennas, combined antennas, or shark fin antennas. Of course, the specific embodiments of the structural dimensions of the above-mentioned antenna body 1 are exemplary, and the present disclosure is not limited thereto. Those skilled in the art can adaptively design the specific structural dimensions of the antenna body 1 according to actual application requirements.
[0055] The second direction is perpendicular to the third direction, and the plane where the second direction and the third direction are located is perpendicular to the first direction. The second direction can refer to Figure 2 The left and right directions of the middle figure, the third direction can be referenced Figure 2 In addition, the present disclosure does not specifically limit the structural dimensions of the top layer antenna 110, the middle layer antenna 120, the bottom layer antenna 130 and the circuit board 140 of the antenna body 1, and those skilled in the art can adaptively design the structural dimensions of each layer according to actual application requirements.
[0056] In addition, in some embodiments, the top layer antenna 110, the middle layer antenna 120, and the bottom layer antenna 130 can all be ceramic patch antennas, which is beneficial to improving the signal quality and accuracy of the antenna assembly, and the overall structure is simple and easy to install and prepare. Of course, it is not limited to this, and the top layer antenna 110, the middle layer antenna 120, and the bottom layer antenna 130 can also be insulating patch antennas made of high dielectric constant materials such as polyimide or strontium aluminate.
[0057] According to a second aspect of the present disclosure, an electric device is provided, comprising the above-mentioned antenna assembly. In addition, the electric device also has all the beneficial effects of the above-mentioned antenna assembly, which will not be described in detail in the present disclosure.
[0058] Among them, it should be noted that the above-mentioned electrical equipment can be a vehicle, wherein the vehicle can be a fuel vehicle, a gas vehicle or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. In this way, the antenna component can be arranged in, for example, an on-board antenna or a combination antenna or a shark fin antenna on the vehicle, so as to achieve high-precision navigation positioning and short message functions of the vehicle, and can realize emergency communication and search and rescue under no communication conditions. The short message function can also be used to monitor the vehicle position under no communication signal conditions. Combined with a high-precision navigation antenna, rescue can be better completed, thereby improving the safety of users in the wild.
[0059] Of course, in other embodiments, the electrical device may also be a mobile phone, a portable device, a laptop computer, a ship, a spacecraft, etc., wherein the spacecraft may include an airplane, a rocket, a space shuttle, and a spacecraft, etc. The present disclosure is not limited thereto.
[0060] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0061] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0062] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.
Claims
1. An antenna assembly, characterized in that: The antenna body comprises a top layer antenna, a middle layer antenna, a bottom layer antenna and a circuit board which are stacked in a first direction; The top-layer antenna feed is connected to the circuit board, and the working frequency band of the top-layer antenna covers the first transceiver frequency band, and the first transceiver frequency band includes the downlink S band of the Beidou short message; The intermediate layer antenna feed is connected to the first 3db bridge chip on the circuit board, and the working frequency band of the intermediate layer antenna covers the second transceiver frequency band, and the second transceiver frequency band includes the GNSS high frequency band and the uplink L band of the Beidou short message; The bottom layer antenna feed is connected to the second 3db bridge chip on the circuit board. The working frequency band of the bottom layer antenna covers the third transceiver frequency band, and the third transceiver frequency band includes the GNSS low frequency band.
2. The antenna assembly according to claim 1, characterized in that: The GNSS low frequency band includes the L5 frequency band and the B2 frequency band, and the GNSS high frequency band includes the L1 frequency band, the B1 frequency band and the G1 frequency band.
3. The antenna assembly according to claim 1, characterized in that: A first feeding point is provided on the top layer antenna, and the first feeding point is connected to the single-point feeding of the circuit board; and / or The intermediate layer antenna is provided with two second feeding points, and the two second feeding points are connected to the first 3db bridge chip for double-point feeding; and / or Two third feeding points are arranged on the bottom layer antenna, and the two third feeding points are connected to the second 3db bridge chip for double-point feeding.
4. The antenna assembly according to claim 3, characterized in that: The first feeding point is arranged coaxially with the central axis of the antenna body along a center line of the first direction, and the two second feeding points and the two third feeding points are arranged at intervals around the circumference of the center line of the first feeding point.
5. The antenna assembly according to claim 3 or 4, characterized in that: The top layer antenna includes a first radiation layer and a first dielectric substrate arranged in a stacked manner. The first feeding point is arranged on the first radiation layer. The first feeding point is connected to a single-point feeding connection on the lower surface of the circuit board through a first feeding probe that penetrates the first dielectric substrate, the middle layer antenna, the bottom layer antenna and the circuit board.
6. The antenna assembly according to claim 5, characterized in that: A plurality of cut-angle structures are arranged on the first edge of the first radiation layer, and the plurality of cut-angle structures are symmetrically arranged about the center point of the first radiation layer; and / or A notch structure is formed on the first radiation layer and extends from the upper surface of the first radiation layer to the side where the lower surface of the first radiation layer is located.
7. The antenna assembly according to claim 3 or 4, characterized in that: The middle layer antenna includes a second radiation layer and a second dielectric substrate arranged in a stacked manner, the second radiation layer is provided with the two second feeding points, and the two second feeding points are connected to a first 3db bridge chip dual-point feeding arranged on the lower surface of the circuit board through two second feeding probes that penetrate the second dielectric substrate, the bottom layer antenna and the circuit board.
8. The antenna assembly according to claim 7, characterized in that: A plurality of groups of first tooth structures are disposed on the second edge of the second radiation layer, and the plurality of groups of first tooth structures are symmetrically arranged about a center point of the second radiation layer.
9. The antenna assembly according to claim 8, characterized in that: Each group of the first tooth structures includes a plurality of first tooth monomers arranged at equal intervals along the second edge.
10. The antenna assembly according to claim 3 or 4, characterized in that: The bottom layer antenna includes a third radiation layer and a third dielectric substrate arranged in a stacked manner, the two third feeding points are arranged on the third radiation layer, and the two third feeding points are connected to the second 3db bridge chip dual-point feeding arranged on the lower surface of the circuit board through two third feeding probes that penetrate the third dielectric substrate and the circuit board.
11. The antenna assembly according to claim 10, characterized in that: A plurality of groups of second tooth structures are disposed on the third edge of the third radiation layer, and the plurality of groups of second tooth structures are symmetrically arranged about the center point of the third radiation layer.
12. The antenna assembly according to claim 11, characterized in that: Each group of the second tooth-like structures includes a plurality of second tooth-like monomers arranged at equal intervals along the third edge.
13. The antenna assembly according to claim 1, characterized in that: The thickness of the antenna body along the first direction is 8-12 mm; The length of the antenna body along the second direction is 45-50 mm; The width of the antenna body along the third direction is 45-50 mm; The second direction is perpendicular to the third direction, and a plane where the second direction and the third direction are located is perpendicular to the first direction.
14. The antenna assembly according to claim 1, characterized in that The top layer antenna, the middle layer antenna and the bottom layer antenna are all ceramic patch antennas.
15. An electrical equipment, characterized in that: The antenna assembly comprises any one of claims 1-14.