Semiconductor element hot-pressing film-coating molding equipment equipped with docking station

Abstract

The utility model provides a semiconductor element hot-pressing film-covering molding device equipped with a docking station, which comprises a device main body rack, a plurality of hot press installation openings are formed by welding and assembling partition walls on a structural framework of the device main body rack, one side of each hot press installation opening is provided with an opening part, and the other side of each hot press installation opening is provided with a docking station. The hot press mounting opening forms a hollow part along the inner side of a frame of the opening part, and a plurality of hot presses which are arranged in parallel are mounted in the hollow part; a sealing plate supporting frame is arranged outside the opening part, and a butt joint part is arranged in the hot press installation opening. The laminating forming equipment can be positioned and mounted at the correct position of the mounting opening side of the hot press on the equipment main body rack, so that the precision of a semiconductor element in a forming process can be improved. Besides, the butt joint part is composed of the guide seat and the guide fixing component, when the hot press is pushed into the equipment main body rack, positioning errors can be reduced, and correct pushing and positioning installation can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to semiconductor element hot pressing and laminating molding equipment equipped with a docking station. Background Art

[0002] The manufacture of semiconductor components needs to be carried out in a clean room with high cleanliness requirements. The environment in which such semiconductor equipment is used is generally a clean room with a cleanliness level of 1000. Among the various semiconductor manufacturing equipment installed in the clean room, the multi-axis servo hot press is a machine tool that performs pressure processing on the workpiece. In the recent semiconductor component processing that requires high precision, the multi-axis servo hot press with synchronized axes is used to pressurize and complete the required shape of the film molding.

[0003] When the existing four-axis servo heat press is installed in a clean room, it is usually stacked on the main frame of the equipment that has been welded and fixed with bolts. However, the installation of this multi-axis servo heat press has the following problems: when the tons of equipment are inspected before and after operation, it is difficult to separate and remove the multi-axis servo heat press from the main frame of the equipment inside the clean room. Not only that, when there is a problem with the equipment, not only is it difficult to remove the equipment, but the equipment itself cannot operate, which significantly reduces production efficiency and ultimately increases the production cost of the product.

[0004] Therefore, in order to solve the above problems, the present invention provides a hot pressing film forming device. Utility Model Content

[0005] The utility model provides a semiconductor element hot pressing film laminating molding device equipped with a docking station, which solves the problem that it is difficult to move the hot pressing machine out of the equipment main body frame inside the dust-free workshop when the equipment needs to be inspected.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A semiconductor element hot pressing and laminating molding device equipped with a docking station comprises a main body frame of the device, on the structural frame of the main body frame of the device, partition walls are welded and assembled to form a plurality of hot press installation openings, one side of the hot press installation opening is set as an opening part, the hot press installation opening forms a hollow part along the inner side of the frame of the opening part, and a plurality of parallel hot presses are installed in the hollow part; a sealing plate support frame is arranged outside the opening part, and a docking part is arranged in the hot press installation opening.

[0008] Furthermore, the hollow portion is adapted to the size and shape of the hot press, and the hollow portion also includes a hot press wafer supply device, a wafer pick-up and placement conveying device, and a wafer loading and unloading device.

[0009] Furthermore, the docking portion includes a guide seat and a guide fixing bracket, the guide seat is arranged on the equipment main body frame on both sides of the hot press installation opening; the guide fixing bracket is arranged at the end of the hot press installation opening.

[0010] Furthermore, a plurality of the guide seats are arranged along the pushing-in and pushing-out direction of the hot press; and slopes are provided at both ends of the guide seats relative to the middle portion.

[0011] Furthermore, both ends of the guide fixing bracket are respectively recessed toward the middle to form an inverted bridge shape, and the guide wheel on one side of the hot press enters into the middle lower groove and contacts the tangent surface of the groove.

[0012] Furthermore, an electric control cabinet connected to the hot press is disposed on the inner wall of the sealing plate support frame, and the electric control cabinet includes a load sensor controller, a compressed air and vacuum controller, and a hot press electrical box.

[0013] Furthermore, the area of ​​the sealing plate supporting frame is larger than the area of ​​the opening.

[0014] The beneficial effects of the utility model are:

[0015] The film coating molding equipment of the utility model can be positioned and installed in the correct position on the side of the hot press installation opening on the main frame of the equipment, so as to improve the accuracy of the semiconductor components in the molding process. In addition, the docking part in the present invention is composed of a guide seat and a guide fixing member. When the hot press is pushed into the main frame of the equipment, the positioning error can be reduced, and the correct pushing and positioning installation can be achieved. When performing maintenance at the same time, if each servo hot press needs to be moved out separately, it is not necessary to move out the entire equipment, and it is easy to disassemble it separately. The electrical control cabinet related to the hot press can be removed from the hot press. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a stereoscopic diagram of the overall structure of the utility model.

[0018] Figure 2 It is a bottom view of the overall structure of the utility model.

[0019] Figure 3 It is a bottom-up stereogram of the overall structure of the utility model.

[0020] Figure 4 for Figure 3 Magnified image of .

[0021] Figure 5 This is a schematic diagram of the installation of the hot press in the utility model.

[0022] Figure 6 for Figure 5 Magnified image of .

[0023] Figure 7 It is a three-dimensional diagram of the moving direction and the docking part of the hot press in the utility model.

[0024] Figure 8 It is a stereoscopic view of the guide wheel and the guide fixing component in the utility model.

[0025] Fig. 9 It is a side view of the guide wheel and the guide fixing component in the utility model.

[0026] Fig.10 It is a rear perspective view of the sealing plate support frame and the hot press in the utility model.

[0027] Fig.11 It is a rear view of the sealing plate support frame and the hot press in the utility model.

[0028] Description of Figure Numbers:

[0029] 1. Hot-press laminating molding equipment equipped with a docking station; 10. Equipment main frame; 110. Opening; 20. Hot press installation opening; 30. Docking part; 310. Guide seat; 320. Guide fixing member; 40. Sealing plate support frame; 50. Hot press; 510. Guide wheel; 60. Load sensor controller; 70. Compressed air and vacuum controller; 80. Hot press electrical control cabinet. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0032] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0033] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the utility model. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0034] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present utility model: the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0035] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below their position devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0036] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0037] The utility model provides a technical solution: a semiconductor component hot pressing laminating molding device equipped with a docking station, such as Figure 1-11 As shown, multiple hot presses (PR) 50 can be pushed in and installed. The hot press (PR) 50 is used to process workpieces, specifically, to perform a laminating process. The hot press laminating equipment is equipped with a docking station, including an equipment main body frame, a hot press installation opening and a docking part, and also includes a sealing plate support frame 40.

[0038] like Figure 1-2 As shown, an opening 110 is formed on one side of the main frame 10 of the equipment, which can be shielded by a sealing plate support frame 40. The main frame 10 of the equipment can be moved into a dust-free workshop for installation in a state where a partition wall of a certain thickness is welded and assembled on the structural frame. In the main frame 10 of the equipment, a hot press installation opening 20 is arranged along the inner side, and a hot press (PR) 50 can be pushed into it in the semiconductor manufacturing equipment. In addition, in each hot press (PR) 50, a hot press wafer supply device (not shown), a wafer pick and place conveying device (not shown), and a wafer loading and unloading device (not shown) can be arranged inside the main frame 10 of the equipment. Each hot press (PR) 50 is arranged inside the main frame 10 of the equipment, and can be disassembled or positioned and installed in one direction through an opening 110 on one side.

[0039] like Figure 2-3As shown, in the heat press installation opening 20, the heat press (PR) 50 pushed in through the opening 110 can be removed and installed in one direction inside. The heat press installation opening 20 can be formed as a hollow portion, which is formed along the inner side of the frame of the opening 110 with a certain depth, corresponding to the size and shape of the heat press (PR) 50. That is, when the opening 110 is square in shape, the four edges of the heat press installation opening 20 are parallel to the edges of the opening 110 and have a certain depth.

[0040] A plurality of heat press machines (PR) 50 may be moved into the device main body frame 10 , and a plurality of heat press machine installation openings 20 may be arranged side by side at a certain interval along the opening portion 110 .

[0041] like Figure 4-6 As shown, the docking portion 30 can guide the moving direction when the heat press (PR) 50 moves into the heat press installation opening 20 , and the docking portion 30 includes a guide seat 310 and a guide fixing member 320 .

[0042] like Figure 7 As shown, the guide seat 310 is set on the side wall of the hot press installation opening 20. The guide seat 310 is formed on the equipment main body frame 10 on both sides of the hot press installation opening 20. One or more guide seats can be set to apply pressure on both sides of the hot press (PR) 50 moved in.

[0043] In addition, the guide seat 310 may form a slope with a certain angle at both ends corresponding to the moving-in direction. Since the guide seat 310 forms a slope corresponding to the moving-in direction, there is a certain gap when the moving-in starts, and the heat press (PR) 50 can be guided to enter smoothly. The two ends of the heat press (PR) 50 are restricted, and the first alignment can be performed at a specific position.

[0044] like Figure 8 and Fig. 9 As shown, the guide fixing member 320 is arranged at the end of the hot press installation opening 20, so that the guide roller (GR) 510 fixed on one side of the hot press (PR) 50 enters and is positioned therein, and the guide fixing member 320 can be formed to form a slope toward the left and right inner sides, and the guide roller contacts its tangent surface after entering, so that it is positioned and firmly located on its inner side.

[0045] The guide wheel (GR) 510 is rotatable with its shaft fixed to the heat press (PR) 50 , and is guided along the surface of the guide fixing member 320 to be positioned at the final positioning surface.

[0046] By providing the docking portion 30 composed of the guide seat 310 and the guide fixing member 320, when the heat press (PR) 50 enters the equipment main body frame 10, the positioning error can be reduced, so that accurate positioning and installation can be achieved.

[0047] like Figure 10-11 As shown, the sealing plate support frame 40 is used to shield the opening 110, and an electronic control cabinet EU (Electronic Units) related to the heat press (PR) 50 is arranged on one side thereof. In addition, the sealing plate support frame 40 can be connected to the heat press (PR) 50 and can be detached.

[0048] The sealing plate support frame 40 is formed in a plate shape having a larger area than the opening 110 and is arranged in front of the main frame 10 of the device, so that the opening 110 can be shielded from the front. In addition, when the sealing plate support frame 40 is fixed to the heat press (PR) 50, the heat press (PR) 50 can be separated and removed from the main frame 10 of the device, and the electric control cabinets 60, 70, 80 related to the heat press can also be separated together.

[0049] The electric control cabinet is a component relatively independent of the heat press (PR) 50 , and may include a load sensor controller 60 , a compressed air and vacuum controller 70 , a heat press electric control cabinet 80 , and the like.

[0050] The above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed by the present invention according to the technical solution and inventive concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor component hot pressing laminating molding device equipped with a docking station, characterized in that: The invention comprises a main frame of the equipment (10), on the structural frame of the main frame of the equipment (10) a plurality of hot press installation openings (20) are formed by welding and assembling partition walls, one side of the hot press installation opening (20) is provided as an opening portion (110), the hot press installation opening (20) forms a hollow portion along the inner side of the frame of the opening portion (110), and a plurality of hot presses (50) arranged in parallel are installed in the hollow portion; a sealing plate support frame (40) is provided outside the opening portion (110), and a docking portion (30) is provided inside the hot press installation opening (20).

2. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 1, characterized in that: The hollow part is adapted to the size and shape of the hot press (50), and the hollow part also includes a hot press wafer supply device, a wafer pick-up and placement conveying device, and a wafer loading and unloading device.

3. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 1, characterized in that: The docking portion (30) comprises a guide seat (310) and a guide fixing member (320), wherein the guide seat (310) is arranged on the equipment main body frame (10) on both sides of the hot press installation opening (20); and the guide fixing member (320) is arranged at the end of the hot press installation opening (20).

4. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 3, characterized in that: A plurality of the guide seats (310) are arranged in a row along the push-in and push-out direction of the hot press (50); and both ends of the guide seats (310) are provided with a slope relative to the middle portion.

5. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 3, characterized in that: The two ends of the guide fixing member (320) are respectively concave toward the middle to form an inverted bridge shape, and the guide wheel (510) on one side of the hot press (50) enters the middle lower groove and contacts the tangent surface of the groove.

6. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 1, characterized in that: The inner wall of the sealing plate support frame (40) is provided with an electric control cabinet connected to the hot press, and the electric control cabinet comprises a load sensor controller, a compressed air and vacuum controller, and a hot press electrical box.

7. The semiconductor element hot pressing lamination molding equipment equipped with a docking station according to claim 6, characterized in that: The area of ​​the sealing plate supporting frame (40) is larger than the area of ​​the opening (110).

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