Wafer transition device and wafer production equipment

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a wafer transition device and wafer production equipment. The wafer transition device is used for bearing non-functional wafers used in the operation process of wafer production equipment and comprises a transition shell and a bearing assembly. A transmission channel for a clamping mechanism for clamping wafers or non-functional wafers to pass through is arranged in the transition shell, one end of the transmission channel is communicated with a transfer station of the transfer device, and the other end of the transmission channel is communicated with the processing device; the bearing assembly is arranged in the transmission channel to bear the non-functional wafer clamped by the clamping mechanism. Therefore, when the wafer transition device is used, clamping and placing of the non-functional wafer do not need human intervention, extra space does not need to be occupied, only the clamping mechanism needs to be used for clamping or placing the non-functional wafer in the transmission channel, the possibility of interference to wafer transmission is effectively reduced, the transmission efficiency of the wafer is improved, and the wafer transition device is suitable for large-scale popularization and application. And the production efficiency of the wafer can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer transition device and wafer production equipment. Background Art

[0002] During the wafer production process, the simple wafer transmission process is to transfer the wafer from the vacuum box elevator to the cavity of the transfer station, and then send it into the cavity of the processing module for processing. It can be seen that efficient wafer transmission is very critical to improving production efficiency.

[0003] In the prior art, wafers are mainly transported by mechanical fingers to grip wafers and transport them through specific transmission channels, so that multiple wafers are transported to designated locations in sequence and in an orderly manner. When wafer production equipment is used, non-functional wafers are often needed to test and calibrate the performance of various devices.

[0004] Usually, non-functional wafers are manually delivered to the corresponding devices, or a non-functional wafer is placed on a specific workstation to occupy a specific workstation. Whether it is human intervention or additional occupation of space, it will interfere with the transmission of the wafer, resulting in reduced wafer transmission efficiency, thereby affecting the overall production efficiency of the wafer production equipment. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer transition device and wafer production equipment, which solves the problem in the prior art that when non-functional wafers are used, either human intervention is required or additional space is occupied, which causes interference with the transmission of the wafer and reduces the transmission efficiency of the wafer, thereby affecting the overall production efficiency of the wafer production equipment.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] In a first aspect, the utility model provides a wafer transition device, which is used to support non-functional wafers used in the operation process of wafer production equipment, and includes:

[0008] A transition shell, wherein the transition shell has a transmission channel for a clamping mechanism for clamping wafers or non-functional wafers to pass through, one end of the transmission channel is connected to a transfer station of a transfer device, and the other end is connected to a processing device;

[0009] The bearing assembly is arranged in the transmission channel to support the non-functional wafer clamped by the clamping mechanism.

[0010] Optionally, the bearing assembly includes:

[0011] The carrying platform has a first carrying area for carrying a non-functional wafer, and the edge of the first carrying area has a first limiting slope.

[0012] Optionally, the first limiting slope extends in an arc shape.

[0013] Optionally, the bearing assembly further includes:

[0014] A carrier plate has one side detachably connected to the carrier platform and the other side has a second carrier area for carrying non-functional wafers, the edge of the second carrier area has a second limiting slope, and the second limiting slope is located inside or outside the first limiting slope.

[0015] Optionally, a third bearing area is arranged at the periphery of the second limiting slope, and a third limiting slope is arranged at the edge of the third bearing area.

[0016] Optionally, a connection groove is provided in the supporting platform, and the supporting plate has a connection bar inserted in the connection groove.

[0017] Optionally, the connecting groove extends in an arc shape.

[0018] Optionally, the cross-section of the connecting groove is V-shaped.

[0019] Optionally, the transition shell is detachably connected to the transfer device and the processing device respectively.

[0020] In a second aspect, the utility model also provides a wafer production device, which includes:

[0021] A transfer device having a transfer station for storing wafers;

[0022] a processing device having a processing chamber for processing the wafer;

[0023] The wafer transition device as described in any one of the first aspects is arranged between the transfer device and the processing device; and

[0024] The transport device has a clamping mechanism for clamping a wafer or a non-functional wafer, and the transport device is used to drive the wafer to pass through the wafer transition device or transport the non-functional wafer into the wafer transition device.

[0025] Beneficial effects of the utility model:

[0026] On the one hand, a transmission channel is formed by setting a transition shell, so that the clamping mechanism can not only clamp the wafer and transport the wafer along a specific transmission path, but also store the non-functional wafer on the carrier assembly, and the carrier assembly storing the non-functional wafer will not interfere with the clamping mechanism, that is, the clamping mechanism can continue to clamp the wafer through the transmission channel to complete the transmission. When a certain structure needs to be tested, the clamping mechanism can directly clamp the non-functional wafer from the carrier assembly. In this way, when the wafer transition device is in use, the clamping and placement of non-functional wafers does not require human intervention, nor does it take up additional space. It only needs to use the clamping mechanism to clamp or place it in the transmission channel, which effectively reduces the possibility of interference with wafer transmission, thereby improving the transmission efficiency of the wafer, and then helping to improve the production efficiency of the wafer.

[0027] Secondly, when the wafer production equipment is in use, when testing various structures on non-functional wafers, the clamping and placement of non-functional wafers does not require human intervention or additional reserved space, thereby ensuring that the handling device can quickly complete the transfer of wafers, thereby effectively improving the transmission efficiency of the wafers, and then improving the working efficiency of the wafer production equipment, so as to improve the wafer production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural cross-sectional view of a wafer transition device in an embodiment of the utility model;

[0029] Figure 2 It is a structural cross-sectional view of a carrier platform of a wafer transition device in an embodiment of the utility model;

[0030] Figure 3 It is a structural cross-sectional view of a carrier plate and a clamping mechanism of a wafer transition device in an embodiment of the utility model;

[0031] Figure 4 It is a structural cross-sectional view of a carrier plate of a wafer transition device in an embodiment of the utility model;

[0032] Figure 5 It is a structural schematic diagram of a wafer production device in an embodiment of the utility model.

[0033] In the figure:

[0034] 1. Transition shell; 11. Transmission channel; 2. Carrying assembly; 21. Carrying platform; 211. First carrying area; 212. First limiting slope; 22. Carrying plate; 221. Second carrying area; 222. Second limiting slope; 223. Third carrying area; 224. Third limiting slope; 23. Connecting groove; 3. Clamping mechanism; 4. Transfer device; 5. Processing device. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0036] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0039] The utility model embodiment discloses a wafer transition device and wafer production equipment.

[0040] Reference Figures 1 to 5 The wafer transition device is used to support non-functional wafers used in the operation of wafer production equipment, and includes a transition shell 1 and a bearing assembly 2. The transition shell 1 has a transmission channel 11 for a clamping mechanism 3 for clamping wafers or non-functional wafers to pass through, one end of the transmission channel 11 is connected to the transfer station of the transfer device, and the other end is connected to the processing device 5; the bearing assembly 2 is arranged in the transmission channel 11 to support the non-functional wafer clamped by the clamping mechanism 3.

[0041] Specifically, the transition shell 1 can adopt a transition flange, the interior of which is hollow to form a transmission channel 11 for the clamping mechanism 3 to pass through, and the transmission channel 11 can be linear, so as to ensure that the moving distance of the clamping mechanism 3 is short. Both ends of the transition shell 1 can be fixedly connected to the corresponding chamber, and the fixed connection can be achieved by a non-detachable method such as welding or bonding, or by a detachable connection method such as bolt connection or clamping. The length of the transition shell 1 can be designed according to the spacing between the transfer device 4 and the processing device 5, and the utility model does not limit this.

[0042] A carrier component 2 is arranged in the transmission channel 11, and an area for accommodating non-functional wafers can be arranged on the top wall or inside of the carrier component 2. After the clamping mechanism 3 clamps the non-functional wafer close to the carrier component 2, the non-functional wafer can be placed in the area to temporarily store the non-functional wafer, and a certain space can be maintained above or below the carrier component 2 so that the clamping mechanism 3 can continue to clamp the wafer through without interfering with the carrier component 2.

[0043] By setting up the transition shell 1 to form the transmission channel 11, the clamping mechanism 3 can not only clamp the wafer and transport the wafer along a specific transmission path, but also store the non-functional wafer on the supporting component 2, and the supporting component 2 storing the non-functional wafer will not interfere with the clamping mechanism 3, that is, the clamping mechanism 3 can continue to clamp the wafer through the transmission channel 11 to complete the transmission. When a certain structure needs to be tested, the clamping mechanism 3 can directly clamp the non-functional wafer from the supporting component 2. In this way, when the wafer transition device is in use, the clamping and placement of the non-functional wafer does not require human intervention, and does not require additional space. It only needs to use the clamping mechanism 3 to clamp or place it in the transmission channel 11, which effectively reduces the possibility of interference with the wafer transmission, thereby improving the transmission efficiency of the wafer, and then helps to improve the production efficiency of the wafer.

[0044] Optionally, the carrying assembly 2 includes a carrying platform 21. The carrying platform 21 has a first carrying area 211 for carrying a non-functional wafer, and an edge of the first carrying area 211 has a first limiting slope 212.

[0045] Specifically, the supporting platform 21 includes two relatively arranged supporting parts, which maintain a certain interval and are respectively arranged on the two side walls in the width direction of the transmission channel 11. A supporting part that abuts against the non-functional wafer is formed at the top wall position where the two supporting parts are close to each other. The two supporting parts form a first supporting area 211, and a first limiting slope 212 is set at the edge of the first supporting area 211. The spacing between the two first limiting slopes 212 is just equal to the maximum diameter of a non-functional wafer.

[0046] By setting up the supporting platform 21 and the first limiting slope 212, when the non-functional wafer is clamped above the supporting platform 21, the clamping mechanism 3 can place it in the first supporting area 211, and the two sides of the non-functional wafer will be limited by the two first limiting slopes 212 and fixed in the first supporting area 211.

[0047] Optionally, the first limiting slope 212 extends in an arc shape.

[0048] Specifically, in this embodiment, the non-functional wafer is in the shape of a disc, and the first limiting slope 212 is adapted to the shape of the non-functional wafer and extends in an arc shape, thereby improving the limiting effect of the first limiting slope 212 on the non-functional wafer and ensuring that it can be stably supported in the first supporting area 211.

[0049] Optionally, the carrying assembly 2 further includes a carrying plate 22. One side of the carrying plate 22 is detachably connected to the carrying platform 21, and the other side has a second carrying area 221 for carrying non-functional wafers, and the edge of the second carrying area 221 has a second limiting slope 222, and the second limiting slope 222 is located inside or outside the first limiting slope 212.

[0050] Specifically, the bottom wall of the carrier plate 22 can be inserted into the top wall of the carrier platform 21 to form a detachable connection, and a second carrying area 221 is provided on the top wall of the carrier plate 22. The structure of the carrier plate 22 is the same as that of the carrier platform 21, and will not be described in detail here. In this embodiment, the second limiting slope 222 is located outside the first limiting slope 212 to carry larger non-functional wafers.

[0051] By detachably connecting the carrier plate 22 to the carrier platform 21, a carrier plate 22 can be added without changing other structures, so that the carrier assembly 2 can carry non-functional wafers of different sizes. Another carrier plate 22 can be set on the top wall of the carrier plate 22, and the other carrier plate 22 can carry non-functional wafers of larger sizes. The specific number of carrier plates 22 can be determined according to the types of non-functional wafers that need to be carried.

[0052] Optionally, a third bearing area 223 is disposed on the periphery of the second limiting slope 222 , and a third limiting slope 224 is disposed on the edge of the third bearing area 223 .

[0053] Specifically, a second carrying area 221 and a third carrying area 223 can be simultaneously provided on the carrying plate 22, so that the carrying plate 22 can be compatible with carrying two sizes of non-functional wafers, thereby reducing the number of the carrying plates 22 used while ensuring that the carrying capacity thereof is not weakened.

[0054] In this embodiment, the first carrying area 211 of the carrying platform 21 can carry a 4-inch non-functional wafer, and two carrying plates 22 are provided, wherein a second carrying area 221 and a third carrying area 223 are provided on the top wall of the carrying plate 22 which is detachably connected to the carrying platform 21, the second carrying area 221 can carry a 6-inch non-functional wafer, and the third carrying area 223 can carry an 8-inch non-functional wafer, and the other carrying plate 22 provided on the top wall of the carrying plate 22 has only one carrying area provided on the top wall, and the carrying area can carry a 12-inch non-functional wafer.

[0055] Optionally, a connection groove 23 is defined in the carrying platform 21 , and the carrying plate 22 has a connection bar inserted into the connection groove 23 .

[0056] Specifically, a connection groove 23 is provided on the top wall of the carrier 21, and a connection strip that can be plugged into the connection groove 23 is provided on the bottom wall of the carrier plate 22, so as to realize the detachable connection between the carrier plate 22 and the carrier 21 through plugging, and a connection groove 23 can also be provided on the carrier plate 22 to form a detachable connection with another carrier plate 22. In this embodiment, the connection groove 23 is provided on the inner side of the first limiting slope 212, and the connection groove 23 extends in an arc shape, and the cross section of the connection groove 23 can be V-shaped. In other embodiments, the connection groove 23 can also be in other curved shapes, and its cross-sectional shape is not limited to V-shaped.

[0057] By providing the connecting groove 23 and the connecting strip, while realizing the detachable connection of the carrier plate 22, the connecting groove 23 with a V-shaped cross-section and an arc-shaped extension can be utilized to increase the limiting effect between the connecting groove 23 and the connecting strip, thereby ensuring that the carrier plate 22 forms a stable installation effect through a simple plug-in structure and that it can stably receive non-functional wafers.

[0058] Optionally, the transition shell 1 is detachably connected to the transfer device 4 and the processing device 5 respectively.

[0059] Specifically, multiple bolts are provided at both ends of the transition shell 1 to form a detachable connection with the transfer device 4 and the processing device 5 . The specific number of the bolts can be selected according to the size of the transition shell 1 .

[0060] The detachable connection of the transition shell 1 is achieved by bolt connection, so that the installation and disassembly process of the transition shell 1 itself is simple and the manufacturing cost is also low, which can effectively reduce the overall assembly difficulty and manufacturing cost.

[0061] Reference Figure 5The wafer production equipment includes a transfer device 4, a processing device 5, a handling device and a wafer transition device as described above. The transfer device 4 has a transfer station for storing wafers; the processing device 5 has a processing chamber for processing wafers; the wafer transition device is arranged between the transfer device 4 and the processing device 5; the handling device has a clamping mechanism 3 for clamping wafers or non-functional wafers, and the handling device is used to drive the wafers through the wafer transition device or to transport the non-functional wafers into the wafer transition device.

[0062] A plurality of transfer stations can be preset on the transfer device 4 to store wafers, and a plurality of processing devices 5 can be distributed around the periphery of the transfer device 4 to form a plurality of processing chambers for processing wafers. A set of wafer transition devices can be set at the corresponding position of each station. In this way, when the wafer production equipment is in use, when the non-functional wafer is used to test various structures, the clamping and placement of the non-functional wafer does not require human intervention, and no additional reserved space is required, thereby ensuring that the handling device can quickly complete the transfer of the wafer, thereby effectively improving the transmission efficiency of the wafer, and then improving the working efficiency of the wafer production equipment, so as to improve the production efficiency of the wafer.

[0063] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer transition device, characterized in that: Used to support non-functional wafers used in the operation of wafer production equipment, including: A transition shell (1), wherein the transition shell (1) has a transmission channel (11) for a clamping mechanism (3) for clamping a wafer or a non-functional wafer to pass through, one end of the transmission channel (11) is connected to a transfer station of a transfer device (4), and the other end is connected to a processing device (5); The carrier component (2) is arranged in the transmission channel (11) to support the non-functional wafer clamped by the clamping mechanism (3).

2. The wafer transition device according to claim 1, characterized in that: The bearing assembly (2) comprises: A carrying platform (21), the carrying platform (21) having a first carrying area (211) for carrying a non-functional wafer, the edge of the first carrying area (211) having a first limiting slope (212).

3. The wafer transition device according to claim 2, characterized in that: The first limiting slope (212) extends in an arc shape.

4. The wafer transition device according to claim 2, characterized in that: The bearing assembly (2) further comprises: A carrier plate (22) has one side detachably connected to the carrier platform (21), and the other side has a second carrier area (221) for carrying non-functional wafers, the edge of the second carrier area (221) has a second limiting slope (222), and the second limiting slope (222) is located on the inside or outside of the first limiting slope (212).

5. The wafer transition device according to claim 4, characterized in that: A third bearing area (223) is arranged at the periphery of the second limiting slope (222), and a third limiting slope (224) is arranged at the edge of the third bearing area (223).

6. The wafer transition device according to claim 4, characterized in that: A connection groove (23) is provided in the carrying platform (21), and the carrying plate (22) has a connection strip inserted into the connection groove (23).

7. The wafer transition device according to claim 6, characterized in that: The connecting groove (23) extends in an arc shape.

8. The wafer transition device according to claim 6, characterized in that: The cross section of the connecting groove (23) is V-shaped.

9. The wafer transition device according to any one of claims 1 to 8, characterized in that: The transition shell (1) is detachably connected to the transfer device (4) and the processing device (5).

10. Wafer production equipment, characterized in that include: A transfer device (4) having a transfer station for storing wafers; A processing device (5) having a processing chamber for processing the wafer; The wafer transition device according to any one of claims 1 to 9, arranged between the transfer device (4) and the processing device (5); and The transport device has a clamping mechanism (3) for clamping a wafer or a non-functional wafer, and the transport device is used to drive the wafer to pass through the wafer transition device or transport the non-functional wafer into the wafer transition device.

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