A wafer-level packaging structure of a resonator

Abstract

The utility model relates to a wafer-level packaging structure of a resonator, comprising a substrate layer, a resonator is arranged on the upper surface of the substrate layer, solder pads are arranged on both sides of the resonator on the upper surface of the substrate layer, a support layer is arranged at positions corresponding to the solder pads on the upper surface of the substrate layer, a first conductive channel electrically connected to the solder pad is arranged in the support layer; a cover plate located above the resonator is arranged on the upper surface of the support layer, a second conductive channel electrically connected to the first conductive channel is arranged in the cover plate; a wiring layer is arranged on the upper surface of the cover plate, a metal lead segment electrically connected to the second conductive channel is arranged in the wiring layer, and the metal lead segment is electrically connected to a conductive bump; a sealing layer is arranged on the upper surface of the wiring layer to enclose the wiring layer, the cover plate and the support layer, the lower surface of the sealing layer is in contact with the upper surface of the substrate layer and is connected through a sealing bonding layer, which effectively improves the packaging reliability while ensuring a small packaging size, and ensures good performance and a compact structure.

Description

Technical Field

[0001] The utility model relates to the technical field of resonator packaging, and more specifically, to a wafer-level packaging structure of a resonator. Background Art

[0002] The miniaturization of electronic components is the current development trend of electronic equipment applications, and resonators are indispensable electronic components that also need miniaturized design. Resonators refer to electronic components that generate resonant frequencies. They are stable and have good anti-interference performance, and are widely used in various electronic equipment products. The packaging structure of the resonator is an important factor affecting the performance of the resonator. The packaging structure of existing resonators usually adopts a wafer-level packaging process. For example, by stacking dielectric layers in sequence to form an interconnection structure between the substrate and the wafer cover, the size of the wafer-level package can be effectively reduced to meet the miniaturization requirements of terminal equipment. However, although the interconnection layers in the wafer-level packaging structure of the existing resonator are connected layer by layer, the mechanical strength of the overall package still needs to be improved, otherwise it will easily affect the reliability of the package, which may in turn affect the performance of the resonator. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a wafer-level packaging structure of a resonator in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a wafer-level packaging structure of a resonator, comprising a substrate layer, a resonator is arranged on the upper surface of the substrate layer, solder pads are arranged on both sides of the resonator on the upper surface of the substrate layer, a support layer is arranged at positions corresponding to the solder pads on the upper surface of the substrate layer, a first conductive channel electrically connected to the solder pad is arranged in the support layer; a cover plate located above the resonator is arranged on the upper surface of the support layer, a second conductive channel electrically connected to the first conductive channel is arranged in the cover plate; a wiring layer is arranged on the upper surface of the cover plate, a metal lead segment electrically connected to the second conductive channel is arranged in the wiring layer, and the metal lead segment is electrically connected to a conductive bump; a sealing layer enclosing the wiring layer, the cover plate and the support layer is arranged on the upper surface of the wiring layer, and the lower surface of the sealing layer is in contact with the upper surface of the substrate layer and connected through a sealing bonding layer.

[0005] In some embodiments, the upper surface of the substrate layer and the lower surface of the cover plate each have a groove at a position corresponding to the resonator, and the two grooves form a resonant cavity.

[0006] In some embodiments, the upper surface of the substrate layer has first recesses on both sides of the resonator, and the pad is disposed in the first recess.

[0007] In some embodiments, the second conductive path has the same shape as the first conductive path.

[0008] In some embodiments, a first metal bonding layer is disposed on the upper surface of the substrate layer outside the support layer.

[0009] In some embodiments, a second metal bonding layer corresponding to the first gold bonding layer is disposed on the lower surface of the sealing layer.

[0010] In some embodiments, the cover is an organic cover.

[0011] In some embodiments, the substrate layer is a glass layer.

[0012] The beneficial effect of the utility model is that, different from the prior art, in the wafer-level packaging structure of the resonator of the utility model, the sealing layer, wiring layer, cover plate, support layer and substrate layer are reasonably arranged, the wiring layer, cover plate and the like are enclosed by the sealing layer, and the lower surface of the sealing layer and the upper surface of the substrate layer are connected by the sealing bonding layer to form a stable interconnection structure, which effectively improves the packaging reliability while ensuring a small package size, ensuring good performance and a compact structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of a wafer-level packaging structure of a resonator in an embodiment of the utility model;

[0014] Figure 2 is another schematic diagram of the wafer-level packaging structure of the resonator in an embodiment of the utility model;

[0015] The names and serial numbers in the figure are: substrate layer-1; resonator-2; pad-3; support layer-4; first conductive channel-401; cover plate-5; second conductive channel-501; wiring layer-6; metal lead segment-601; conductive bump-7; sealing layer-8; first metal bonding layer-11; second metal bonding layer-81. DETAILED DESCRIPTION

[0016] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the utility model and the drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0017] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0018] "Multiple" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the related objects are in an "or" relationship.

[0019] Moreover, the terms "up, down, front, back, left, right, upper end, lower end" etc. indicating directions are all based on the posture and position of the device or equipment described in this solution during normal use.

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the following will be described clearly and completely in combination with the technical solution in the embodiments of the utility model. Obviously, the described embodiments are partial embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.

[0021] The utility model is implemented as follows Figure 1 and Figure 2 As shown in, a wafer-level packaging structure of a resonator includes a substrate layer 1, a resonator 2 is provided on the upper surface of the substrate layer 1, solder pads 3 are provided on the upper surface of the substrate layer 1 at both sides of the resonator 2, a support layer 4 is provided on the upper surface of the substrate layer 1 at positions corresponding to the solder pads 3, and a first conductive channel 401 electrically connected to the solder pads 3 is provided in the support layer 4; a cover plate 5 located above the resonator 2 is provided on the upper surface of the support layer 4, and a second conductive channel 501 electrically connected to the first conductive channel 401 is provided in the cover plate 5; a wiring layer 6 is provided on the upper surface of the cover plate 5, and a metal lead segment 601 electrically connected to the second conductive channel 501 is provided in the wiring layer 6, and the metal lead segment 601 is electrically connected to a conductive bump 7; a sealing layer 8 is provided on the upper surface of the wiring layer 6, which encloses the wiring layer 6, the cover plate 5 and the support layer 4, and the lower surface of the sealing layer 8 is in contact with the upper surface of the substrate layer 1 and is connected through a sealing bonding layer.

[0022] Specifically, in this embodiment, the resonator 2 is electrically connected to the pad 3. The upper surface of the substrate layer 1 and the lower surface of the cover plate 5 have a groove at a position corresponding to the resonator 2, and the size of the groove is adapted to the size of the positive projection of the resonator 2. The groove is usually formed at the relative position of the upper surface of the substrate layer 1 and the lower surface of the cover plate 5 by a photolithography process, so as to increase the space required for the resonator 2, and the formed resonant cavity is used as a vacuum cavity.

[0023] Wherein, the substrate layer 1 and / or the cover plate 5 are thinned by using a thinning process according to different applicable groove depths.

[0024] Specifically, in this embodiment, the upper surface of the substrate layer 1 has a first depression on both sides of the resonator 2, and the pad 3 is disposed in the first depression. In order to form the first depression on the upper surface of the substrate layer 1, an etching process is used to form the first depression that matches the size of the pad 3 based on the pattern setting, and then the pad 3 is fixed in the first depression by welding or bonding.

[0025] Among them, the pad 3 is made of copper. In order to prevent the copper pad from being oxidized and contaminated before welding, a protective layer can be coated (plated) on the surface of the copper pad. Specifically, a solderable coating containing nickel and gold components is used to improve the corrosion resistance and solderability of the coating.

[0026] Specifically, in this embodiment, through holes are first formed in the support layer 4 and the cover plate 5, and then conductive materials such as copper, polysilicon, etc. are filled in the through holes to form corresponding conductive channels. Among them, the shape of the first conductive channel 401 is a positive T shape. The shape of the second conductive channel 501 is the same as the first conductive channel 401 but is an inverted T shape.

[0027] The wiring layer 6 is formed with a second recess by etching, and the metal lead segment 601 is arranged in the second recess. The metal lead is made of copper wire, silver wire, etc.

[0028] Specifically, in this embodiment, a first metal bonding layer 11 is provided on the upper surface of the substrate layer 1 outside the support layer 4. A second metal bonding layer 81 corresponding to the first metal bonding layer 11 is provided on the lower surface of the sealing layer 8. The thickness range of the first metal bonding layer 11 and the second metal bonding layer 81 is 150 μm-180 μm. The bonding surfaces of the first metal bonding layer 11 and the second metal bonding layer 81 can be polished by a planarization process, and an interconnection structure is formed by the first metal bonding layer 11 and the second metal bonding layer 81. Among them, the cover plate 5 is an organic cover plate, and the organic cover plate is made of polyimide. The substrate layer 1 is a glass layer.

[0029] It should be noted that the structure shown in the drawings is only an example and is one of the implementations provided in this embodiment. In other embodiments, the outer side of the support layer 4 can be in contact with the inner side of the sealing layer 8 .

[0030] It should be understood that ordinary technical workers in the field can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A wafer-level packaging structure of a resonator, characterized in that: It comprises a substrate layer, wherein a resonator is arranged on the upper surface of the substrate layer, solder pads are arranged on both sides of the resonator on the upper surface of the substrate layer, a support layer is arranged at positions corresponding to the solder pads on the upper surface of the substrate layer, and a first conductive channel electrically connected to the solder pad is arranged in the support layer; a cover plate located above the resonator is arranged on the upper surface of the support layer, and a second conductive channel electrically connected to the first conductive channel is arranged in the cover plate; a wiring layer is arranged on the upper surface of the cover plate, and a metal lead segment electrically connected to the second conductive channel is arranged in the wiring layer, and the metal lead segment is electrically connected to a conductive bump; a sealing layer is arranged on the upper surface of the wiring layer to enclose the wiring layer, the cover plate and the support layer, and the lower surface of the sealing layer is in contact with the upper surface of the substrate layer and is connected through a sealing bonding layer.

2. The wafer-level packaging structure of the resonator according to claim 1, characterized in that: The upper surface of the substrate layer and the lower surface of the cover plate each have a groove at a position corresponding to the resonator, and the two grooves form a resonant cavity.

3. The wafer-level packaging structure of the resonator according to claim 1, characterized in that: The upper surface of the substrate layer has first recesses on both sides of the resonator, and the pads are arranged in the first recesses.

4. The wafer-level packaging structure of the resonator according to any one of claims 1 to 3, characterized in that: The second conductive path has the same shape as the first conductive path.

5. The wafer-level packaging structure of the resonator according to claim 1, characterized in that: A first metal bonding layer is provided on the upper surface of the substrate layer outside the support layer.

6. The wafer-level packaging structure of the resonator according to claim 5, characterized in that: A second metal bonding layer corresponding to the first gold bonding layer is provided on the lower surface of the sealing layer.

7. The wafer-level packaging structure of the resonator according to any one of claims 1 to 3, 5 and 6, characterized in that: The cover plate is an organic cover plate.

8. The wafer-level packaging structure of the resonator according to any one of claims 1 to 3, 5 and 6, characterized in that: The substrate layer is a glass layer.

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